Waveguide antenna assembly and radar

Abstract

The utility model relates to a waveguide antenna assembly and radar, the waveguide antenna assembly comprises a plurality of stacked antenna laminates, the antenna laminates are integrally molded injection parts, the surface of each antenna laminate is provided with a metal coating, at least one side of each antenna laminate is provided with a connecting rib surface protruding out of the surface, and the connecting rib surface is provided with a metal coating. The shapes of the connecting rib surfaces of the two adjacent antenna laminates correspond to each other, the metal coatings on the connecting rib surfaces of the two adjacent antenna laminates are welded through a welding flux or bonded through a conductive adhesive, and during welding, the two antenna laminates and the welding flux are stacked together to press the two antenna laminates to pass through a heating area in a reflow oven; the welding flux is heated so that the welding flux can be melted between the connecting rib faces of the two antenna laminates, conducting glue is spot-sprayed on the connecting rib faces through dispensing equipment during conducting glue bonding, and then high-temperature heating is conducted through hot-pressing equipment. The antenna has the beneficial effects that the antenna layer plates are tightly attached, the signal transmission is good, the size is small, and the weight is light.

Description

Technical Field

[0001] The utility model relates to the technical field of antennas, in particular to a waveguide antenna component and a radar. Background Art

[0002] With the rapid development of ADAS, the requirements for radar's ranging and angle measurement accuracy are getting higher and higher, and the radar product form is developing towards broadband imaging radar. The cascade solution has become the new main solution. Although the cascade solution improves the ranging and angle measurement accuracy of the radar, it also brings the problem of increased PCB size. Some waveguide antenna structures in the market are mostly made of metal materials, which increases the weight of the entire product. Automotive radar hopes to be miniaturized and lightweight, while the narrow bandwidth, insufficient aperture efficiency, and large feeder insertion loss of microstrip antennas require better antenna solutions. Surface metallization through plastic metallization technology can also reduce product weight, but the existing traditional plastic connection method also lacks an effective and stable structure. Utility Model Content

[0003] The utility model aims to provide a waveguide antenna assembly and a radar with close fit between antenna layers, good signal transmission, small size and light weight.

[0004] A waveguide antenna assembly comprises a plurality of stacked antenna layers, wherein the antenna layers are integrally formed injection molded parts, the surfaces of the antenna layers are provided with a metal coating, at least one side of the antenna layers is provided with a connecting rib surface protruding from the surface, the shapes of the connecting rib surfaces of two adjacent antenna layers correspond to each other, and the metal coatings on the connecting rib surfaces of two adjacent antenna layers are welded with solder or bonded with conductive adhesive.

[0005] In the above scheme, the antenna assembly is used to convert electromagnetic waves into electrical signals or convert electrical signals into electromagnetic waves. The antenna layer is integrally formed of plastic material, and a metal coating is plated on the surface of the antenna layer. In this way, the waveguide antenna assembly can ensure the lightweight of the product while being metallized. Connecting ribs are formed on several antenna layers. When welding is adopted, the solder is coated on the connecting ribs. Two antenna layers and solder are stacked together. The temperature is increased in the heating area of ​​the reflow furnace to melt the solder between the connecting ribs of the two antenna layers. The shapes of the connecting ribs of two adjacent antenna layers correspond to each other. In this way, a reliable welding connection is formed between the two antenna layers. The conductive adhesive bonding is achieved by spraying conductive adhesive on the connecting ribs through a dispensing device, and then high-temperature heating is performed through a hot pressing device to achieve a mechanical connection between the antenna layers. The conductivity in the vertical direction ensures the close fit between the antenna layers, improves the signal transmission capability, and thus improves the product reliability. Multiple antenna layers are stacked together to avoid the increase in product size caused by the increase in PCB area due to multi-chip cascading.

[0006] Furthermore, the metal plating layer includes a transition layer, an intermediate layer and a welding layer, the transition layer is in contact with the antenna layer plate, the intermediate layer is located between the transition layer and the welding layer, and the solder or conductive adhesive is coated on the surface of the welding layer of the connecting rib surface.

[0007] In the above scheme, the metal plating layer is a multi-layer structure, which includes a transition layer, an intermediate layer and a welding layer. The transition layer is in contact with the antenna layer, which can enhance the adhesion and connectivity between the metal and the plastic material. The intermediate layer is located between the transition layer and the welding layer, and acts as a dielectric. The design and material selection of the intermediate layer can optimize the electromagnetic characteristics of the antenna, such as increasing the frequency bandwidth of the antenna and improving the radiation efficiency; the welding layer of the connecting rib surface is in contact with the solder to achieve the welding connection between the antenna layers, and the welding layer of the connecting rib surface is in contact with the conductive glue to achieve the bonding connection between the antenna layers. The rationality of the design and material selection of the welding layer can ensure the stability, reliability and durability of the welding.

[0008] Furthermore, the transition layer is a nickel layer or a titanium layer, the intermediate layer is a nickel layer or a copper layer, and the welding layer is a gold layer, a silver layer or a copper layer.

[0009] In the above scheme, the nickel layer or titanium layer has high activity and can enhance the bonding force between the metal plating and the plastic. The nickel layer or copper layer has good conductivity and can improve the transmission efficiency and radiation effect of the antenna. The gold layer, silver layer or copper layer serves as a welding layer and can provide better conductivity and connection stability.

[0010] Furthermore, the antenna layer plate is provided with a plurality of through holes, and the through holes are round holes or waist-shaped holes.

[0011] In the above scheme, the circular holes or waist-shaped holes added to the antenna layer can help dissipate heat during reflow soldering, thereby preventing the metal plating from falling off due to excessively high temperature during reflow soldering, ensuring the stability and reliability of welding, and further ensuring the stability of connection and conductivity between the antenna layers. The antenna layer is made of PPS plastic material or PEI. PPS or PEI has good high temperature resistance and can withstand higher temperatures during reflow soldering, which helps to ensure the stability and reliability of the antenna layer during the welding process.

[0012] Furthermore, the antenna layer plate includes a radiation layer, a coupling layer, a waveguide layer and a feeding layer, and the feeding layer, the waveguide layer, the coupling layer and the radiation layer are stacked in sequence.

[0013] In the above scheme, the feeding layer is the power supply layer of the antenna assembly, which is used to provide power supply and driving signals. Its function is to transmit and distribute electrical energy to ensure the normal operation of the antenna; the waveguide layer is used to guide and control the propagation of electromagnetic waves inside the antenna. Its function is to transmit the electromagnetic wave energy input by the feeding layer to the coupling layer and control the transmission characteristics of the electromagnetic waves; the coupling layer is used to realize the energy transmission and conversion between the waveguide layer and the radiation layer, and provide sufficient radiation energy for the radiation layer; the radiation layer converts the electromagnetic waves into identifiable radiation signals in free space. The feeding layer, waveguide layer, coupling layer and radiation layer are stacked in sequence to reduce the size of the antenna assembly.

[0014] Furthermore, a plurality of the antenna layer plates are provided with a plurality of positioning holes, and the positioning holes between the feeding layer, the waveguide layer, the coupling layer and the radiation layer correspond to each other.

[0015] In the above scheme, the positioning holes are used to facilitate the positioning between the antenna layers. The solder is coated on the connecting rib surface of the feed layer. The fixture is first positioned through the positioning holes, and the waveguide layer is placed on top of the feed layer. After the fixture is crimped, it is placed in a reflow oven for welding. After that, the coupling layer and the radiation layer are welded in the same process in turn.

[0016] Furthermore, it also includes a PCB, and the PCB is connected to the radiation layer.

[0017] In the above scheme, the connection between PCB and the radiation layer can provide a reliable power supply to ensure that the electronic components in the circuit can work normally. Through direct connection, the length and resistance of the power line can be minimized, reducing power noise and power loss, which helps to ensure stable power transmission and provide the power performance required by electronic equipment.

[0018] Furthermore, the radiation layer is provided with a plurality of waveguide emitting ports and a plurality of waveguide receiving ports.

[0019] In the above scheme, the waveguide transmitting port is used to transmit the radiation signal converted from the electromagnetic wave into the external free space, and the waveguide receiving port is used to effectively guide the electromagnetic waves received from the outside into the waveguide layer of the antenna for reception and processing. The radiation layer, coupling layer, waveguide layer and feeding layer are tightly fitted to each other, so as to realize efficient antenna communication and wireless transmission.

[0020] Furthermore, the solder is solder paste.

[0021] In the above scheme, solder paste has good reliability and connection performance as a solder. It can form a solid solder joint to ensure a stable connection between adjacent antenna layers. This helps to improve the overall reliability of the antenna system and maintain good signal transmission and electrical performance; solder paste has a lower resistance, which makes the resistance of the soldering point also lower, which helps to reduce the power loss of the signal at the connection and improve the efficiency and performance of the antenna system.

[0022] A radar comprises a waveguide antenna assembly as described in any one of the above schemes.

[0023] The beneficial effects of the waveguide antenna assembly and radar of the utility model are that the antenna layers can be closely fitted, the signal transmission is good, the volume is small and the weight is light. The antenna assembly is used to convert electromagnetic waves into electrical signals or convert electrical signals into electromagnetic waves. The antenna layer is integrally formed of plastic material, and a metal coating is plated on the surface of the antenna layer. In this way, the waveguide antenna assembly can ensure the lightweight of the product while being metallized. Connecting ribs are formed on several antenna layers. When welding is used, the solder is coated on the connecting ribs. Two antenna layers and solder are stacked together. The temperature is increased in the heating area of ​​the reflow furnace to melt the solder between the connecting ribs of the two antenna layers. The shapes of the connecting ribs of two adjacent antenna layers correspond to each other, so that a reliable welding connection is formed between the two antenna layers. Conductive adhesive bonding is achieved by spraying conductive adhesive on the connecting ribs through a dispensing device, and then high-temperature heating is performed through a hot pressing device to achieve mechanical connection between the antenna layers. Conductive conductivity in the vertical direction ensures close fit between the antenna layers, improves the signal transmission capability, and thus improves product reliability. Multiple antenna layers are stacked together to avoid the increase in product size caused by the increase in PCB area due to multi-chip cascading. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 An exploded view of a waveguide antenna assembly according to an embodiment

[0025] Figure 2 Schematic diagram of the antenna layer structure according to an embodiment.

[0026] Figure 3 Schematic diagram of a solder coating structure according to an embodiment.

[0027] Figure 4 FIG. 4 is a schematic diagram of a radiation layer structure according to an embodiment.

[0028] Figure 5 Schematic diagram of a circular hole structure on an antenna layer board according to an embodiment.

[0029] Description of Figure Numbers:

[0030] 1. Antenna layer; 11. Feed layer; 12. Waveguide layer; 13. Coupling layer; 14. Radiation layer; 2. Solder; 3. Connecting rib surface; 4. Positioning hole; 5. Waveguide transmitting port; 6. Waveguide receiving port; 7. Through hole. DETAILED DESCRIPTION

[0031] The waveguide antenna assembly and the radar of the utility model will be further described in detail below in conjunction with specific embodiments and drawings.

[0032] like Figure 1 and Figure 2 As shown, in a preferred embodiment, a waveguide antenna assembly of the utility model includes a plurality of stacked antenna layer plates 1, the antenna layer plates 1 are integrally formed injection molded parts, the surface of the antenna layer plates 1 is provided with a metal coating, at least one side of the antenna layer plates 1 is provided with a connecting rib surface 3 protruding from the surface, the shapes of the connecting rib surfaces 3 of two adjacent antenna layer plates 1 correspond to each other, and the metal coatings on the connecting rib surfaces 3 of two adjacent antenna layer plates 1 are welded by solder 2. The antenna assembly is used to convert electromagnetic waves into electrical signals or convert electrical signals into electromagnetic waves. The antenna layer 1 is integrally formed of plastic material, and a metal coating is plated on the surface of the antenna layer 1. In this way, the waveguide antenna assembly can ensure the lightweight of the product while being metallized. A connecting rib surface 3 is formed on a plurality of antenna layers 1. When welding is adopted, the solder 2 is coated on the connecting rib surface 3. Two antenna layers 1 and the solder 2 are stacked together, and the two antenna layers 1 are pressed with a fixture and placed in a reflow oven. The temperature is increased through the heating area in the reflow oven to melt the solder 2 between the connecting rib surfaces 3 of the two antenna layers 1. The shapes of the connecting rib surfaces 3 of the two adjacent antenna layers 1 correspond to each other, so that a reliable welding connection is formed between the two antenna layers 1.

[0033] Conductive adhesive bonding is achieved by spraying conductive adhesive on 3 points of the connecting rib surface using a dispensing device, crimping the multi-layer antenna layer 1 using a crimping fixture, and then heating it at high temperature using a hot pressing device. The conductive adhesive diffuses and solidifies while baking to complete the connection, thereby achieving mechanical connection between the antenna layers 1 and conductivity in the vertical direction, thereby ensuring close fit between the antenna layers 1 and improving the signal transmission capability, thereby improving product reliability. Multiple antenna layers 1 are stacked together to avoid the increase in product size caused by the increase in PCB area due to multi-chip cascading.

[0034] In some embodiments, the metal plating layer includes a transition layer, an intermediate layer and a welding layer. The transition layer contacts the antenna layer 1, the intermediate layer is located between the transition layer and the welding layer, and the solder 2 or the conductive adhesive is coated on the surface of the welding layer of the connecting rib surface 3. The metal plating layer is a multi-layer structure, which includes a transition layer, an intermediate layer and a welding layer. The transition layer of the connecting rib surface 3 contacts the antenna layer 1, which can enhance the adhesion and connectivity between the metal and the plastic material. The intermediate layer is located between the transition layer and the welding layer and plays the role of a dielectric. The design and material selection of the intermediate layer can optimize the electromagnetic characteristics of the antenna, such as increasing the frequency bandwidth of the antenna and improving the radiation efficiency. The welding layer contacts the solder 2 and is used to realize the welding connection between the antenna layers 1. The welding layer of the connecting rib surface contacts the conductive adhesive and is used to realize the bonding connection between the antenna layers 1. The rationality of the design and material selection of the welding layer can ensure the stability, reliability and durability of welding.

[0035] In the above embodiment, the multiple antenna layer boards 1 formed integrally can be prepared with a metal coating by PVD. In the PVD process, the high-purity metal material is first heated to a certain temperature to convert it into a vapor state, and then the vapor deposition conditions are controlled to allow the vapor to be deposited on the surface of the antenna layer board 1 to be coated. The deposited metal vapor condenses into a thin film and forms a metal coating with the surface of the antenna layer board 1.

[0036] In some embodiments, the antenna layer 1 may also be prepared by chemical plating to form a metal coating. During the chemical plating process, the metal precursor gas will chemically react with the surface of the antenna layer 1 in the reaction chamber under atmospheric pressure to produce a solid metal deposition layer. Unlike PVD, which is carried out under gas phase conditions, the deposition of metal or non-metal materials by chemical reaction can be achieved at a lower temperature.

[0037] like Figures 1 to 3 As shown, in some embodiments, the transition layer is a nickel layer or a titanium layer, the intermediate layer is a nickel layer or a copper layer, and the welding layer is a gold layer, a silver layer or a copper layer. The nickel layer or the titanium layer has high activity and can enhance the bonding force between the metal plating layer and the plastic. The nickel layer or the copper layer has good electrical conductivity and can improve the transmission efficiency and radiation effect of the antenna. The gold layer, the silver layer or the copper layer as the welding layer can provide better electrical conductivity and connection stability. The metals such as gold, silver and copper have excellent oxidation resistance and chemical stability, high electrical conductivity and are easily wetted by the solder 2.

[0038] Selecting a nickel layer or a titanium layer as a transition layer, a nickel layer or a copper layer as an intermediate layer, and a gold layer, a silver layer or a copper layer as a welding layer has good adhesion and connection stability, helps to optimize the electromagnetic performance of the antenna, and provides anti-oxidation and corrosion resistance, which can improve the performance, reliability and service life of the product.

[0039] like Figure 1 Hehe Figure 5 As shown, in some embodiments, the antenna layer 1 is provided with a plurality of through holes 7, and the through holes 7 are round holes or waist-shaped holes. The through holes 7 added to the antenna layer 1 can help to disperse the heat during reflow soldering, thereby preventing the metal plating from falling off due to excessively high temperature during reflow soldering, ensuring the stability and reliability of soldering, and further ensuring the stability of the connection and conductivity between the antenna layers 1. In addition to being processed into round holes, the through holes 7 can also be processed into waist-shaped holes. The antenna layer 1 is made of PPS plastic material or PEI. PPS or PEI has good high temperature resistance and can withstand high temperatures during reflow soldering, thereby helping to ensure the stability and reliability of the antenna layer 1 during soldering.

[0040] Specifically, the PPS plastic material has excellent heat resistance and can maintain high stability and mechanical strength in a high temperature environment, so that the antenna layer 1 will not be deformed when entering the reflow soldering heating soldering, and can also ensure that the antenna component has good reliability and performance in a high temperature working environment. Moreover, the PPS plastic material is relatively light, which can effectively reduce the overall weight of the antenna component and realize the lightweight design of the product. The feed layer 11, waveguide layer 12, coupling layer 13 and radiation layer 14 are stacked in sequence to reduce the area of ​​two-chip and four-chip cascade PCBs.

[0041] like Figure 1 and Figure 2 As shown, in some embodiments, a plurality of antenna layers 1 include a radiation layer 14, a coupling layer 13, a waveguide layer 12 and a feed layer 11, and the feed layer 11, the waveguide layer 12, the coupling layer 13 and the radiation layer 14 are stacked in sequence. The feed layer 11 is the power supply layer of the antenna assembly, which is used to provide power supply and drive signals, and its function is to transmit and distribute electrical energy to ensure the normal operation of the antenna; the waveguide layer 12 is used to guide and control the propagation of electromagnetic waves inside the antenna, and its function is to transmit the electromagnetic wave energy input by the feed layer 11 to the coupling layer 13 and control the transmission characteristics of the electromagnetic waves; the coupling layer 13 is used to realize the energy transmission and conversion between the waveguide layer 12 and the radiation layer 14, and provide sufficient radiation energy for the radiation layer 14; the radiation layer 14 converts the electromagnetic waves into identifiable radiation signals in free space, and the feed layer 11, the waveguide layer 12, the coupling layer 13 and the radiation layer 14 are stacked in sequence to reduce the size of the antenna assembly.

[0042] like Figure 1 and Figure 2As shown, in some embodiments, a plurality of antenna layers 1 are provided with a plurality of positioning holes 4, and the positioning holes 4 between the feed layer 11, the waveguide layer 12, the coupling layer 13 and the radiation layer 14 correspond. The positioning holes 4 are provided to facilitate positioning between the antenna layers 1. The solder 2 is coated on the connecting rib surface 3 of the feed layer 11. The fixture is first positioned through the positioning holes 4, and the waveguide layer 12 is placed above the feed layer 11. After the fixture is crimped, it is placed in a reflow oven for welding. After that, the coupling layer 13 and the radiation layer 14 are welded in the same process in turn.

[0043] Specifically, the solder 2 is coated on the feed layer 11 through a steel mesh, and the feed layer 11 and the waveguide layer 12 are first positioned through the positioning holes 4 so that the connection rib surface 3 of the waveguide layer 12 is aligned with the connection rib surface 3 of the feed layer 11 and contacts with the solder 2. The waveguide layer 12 is stacked on the feed layer 11, and then crimped through a fixture, and then transferred to a reflow oven for medium-temperature reflow or high-temperature reflow. The medium-temperature reflow can effectively form reliable solder joints and provide good welding strength and durability. The high-temperature reflow uses lead-free solder, which meets environmental protection requirements and provides more reliable welding connections. After welding, the feed layer 11 and the waveguide layer 12 are naturally cooled to room temperature. This natural cooling process can gradually eliminate the thermal stress in the welding area and avoid possible damage caused by thermal stress caused by excessive cooling. Then, the solder 2 is coated on the waveguide layer 12 to achieve the connection between the waveguide layer 12 and the coupling layer 13. Finally, the radiation layer 14 is welded, thereby achieving the connection of the multi-layer antenna layer 1 and improving the reliability and standardization of the product.

[0044] In the above embodiment, the positioning holes 4 can ensure the accurate alignment between the antenna layer boards 1. Through the corresponding positioning holes 4 between each layer, the tooling fixture can accurately position and align the antenna layer boards 1, ensuring the correctness of the position and geometric relationship between the layers, making the welding process more precise and controllable, which helps to improve the performance and reliability of the product.

[0045] like Figure 1 As shown, in some embodiments, a PCB is further included, and the PCB is connected to the radiation layer 14. The connection between the PCB and the radiation layer 14 can provide a reliable power supply to ensure that the electronic components in the circuit can work normally. Through direct connection, the length and resistance of the power line can be minimized, reducing power noise and power consumption loss, which helps to ensure stable power transmission and provide the power performance required by the electronic device.

[0046] like Figure 4As shown, in some embodiments, a plurality of waveguide transmitting ports 5 and a plurality of waveguide receiving ports 6 are provided on the radiation layer 14. The waveguide transmitting ports 5 are used to transmit the radiation signals converted from the electromagnetic waves to the external free space, and the waveguide receiving ports 6 are used to effectively guide the electromagnetic waves received from the outside to the waveguide layer 12 of the antenna for reception and processing. The radiation layer 14, the coupling layer 13, the waveguide layer 12 and the feeding layer 11 are closely attached to each other, so that efficient antenna communication and wireless transmission can be realized.

[0047] The radiation layer 14 is provided with a plurality of waveguide transmitting ports 5 and waveguide receiving ports 6, which makes the antenna multifunctional and flexible. By properly selecting and configuring different transmitting ports and receiving ports, a variety of antenna modes and directivities can be achieved to meet different communication and transmission requirements.

[0048] like Figure 1 and Figure 3 As shown, in some embodiments, the solder 2 is solder paste. As the solder 2, solder paste has good reliability and connection performance, and it can form a solid solder joint to ensure a stable connection between adjacent antenna layers 1. This helps to improve the overall reliability of the antenna system and maintain good signal transmission and electrical performance; solder paste has a lower resistance, so that the resistance of the soldering point is also lower, which helps to reduce the power loss of the signal at the connection and improve the efficiency and performance of the antenna system.

[0049] In the above embodiment, the working temperature of the solder paste is between 180°C and 245°C.

[0050] A radar includes a waveguide antenna assembly as in any one of the above embodiments. The antenna layer 1 in the waveguide antenna assembly is surface metallized by a plastic metallization process, which ensures the lightweight of the antenna assembly and further reduces the weight of the radar. The solder 2 is coated on the connection rib surface 3 of the antenna layer 1. The two antenna layers 1 and the solder 2 are stacked together, and the two antenna layers 1 are pressed by a fixture and placed in a reflow oven. The temperature is increased through the heating area in the reflow oven to melt the solder 2 between the connection rib surfaces 3 of the two antenna layers 1. In this way, a reliable welding connection is formed between the two antenna layers 1, avoiding the problem of poor signal transmission caused by the assembly gap caused by the traditional connection method, achieving close fit between the antenna layers, improving the reliability of the radar, and reducing the area of ​​the two-chip and four-chip cascade PCB, avoiding the increase in product size caused by the increase in PCB area due to multi-chip cascading.

[0051] The utility model discloses a waveguide antenna assembly and a radar working principle and process. A metal coating is prepared on the surfaces of a plastic integrally molded feed layer 11, a waveguide layer 12, a coupling layer 13 and a radiation layer 14. During welding, a solder 2 is firstly coated on a connection rib surface 3 of the feed layer 11 through a steel mesh, and then the feed layer 11 and the waveguide layer 12 are positioned through positioning holes 4, so that the connection rib surface 3 of the waveguide layer 12 is aligned with the connection rib surface 3 of the feed layer 11 and in contact with the solder 2. The waveguide layer 12 is stacked on the feed layer 11, and then crimped through a fixture, and then transferred to a reflow oven for medium-temperature reflow. After welding, the feed layer 11 and the waveguide layer 12 are naturally cooled to room temperature, and then the solder 2 is coated on the waveguide layer 12 to achieve connection between the waveguide layer 12 and the coupling layer 13, and finally the radiation layer 14 is welded.

[0052] When conductive adhesive is used for bonding, firstly, the conductive adhesive is sprayed on 3 points on the connecting rib surface by means of glue dispensing equipment, and then the multi-layer antenna layer 1 is crimped using a crimping fixture, and then heated at high temperature by means of hot pressing equipment, and the conductive adhesive diffuses and solidifies while being baked to complete the connection, thereby realizing the mechanical connection between the antenna layers 1.

[0053] In the description of the present invention, it should be understood that terms such as "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0054] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0055] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0056] Although the utility model is described in conjunction with the above specific embodiments, it is obvious that those skilled in the art can make many substitutions, modifications and changes based on the above content. Therefore, all such substitutions, improvements and changes are included in the spirit and scope of the appended claims.

Claims

1. A waveguide antenna assembly, characterized in that: It comprises a plurality of stacked antenna layers, each of which is an integrally formed injection molded part, a metal coating being provided on the surface of the antenna layer, a connecting rib surface protruding from the surface being provided on at least one side of the antenna layer, the connecting rib surfaces of two adjacent antenna layer plates having corresponding shapes, and the metal coatings on the connecting rib surfaces of two adjacent antenna layer plates being welded with solder or bonded with conductive adhesive.

2. The waveguide antenna assembly according to claim 1, characterized in that: The metal plating layer includes a transition layer, an intermediate layer and a welding layer, the transition layer is in contact with the antenna layer plate, the intermediate layer is located between the transition layer and the welding layer, and the solder or conductive adhesive is coated on the surface of the welding layer of the connecting rib surface.

3. The waveguide antenna assembly according to claim 2, characterized in that: The transition layer is a nickel layer or a titanium layer, the intermediate layer is a nickel layer or a copper layer, and the welding layer is a gold layer, a silver layer or a copper layer.

4. The waveguide antenna assembly according to claim 1, characterized in that: The antenna layer plate is provided with a plurality of through holes, and the through holes are round holes or waist-shaped holes.

5. The waveguide antenna assembly according to claim 1, characterized in that: The antenna layer plate comprises a radiation layer, a coupling layer, a waveguide layer and a feeding layer, and the feeding layer, the waveguide layer, the coupling layer and the radiation layer are stacked in sequence.

6. The waveguide antenna assembly according to claim 5, characterized in that: A plurality of positioning holes are provided on the plurality of antenna layer plates, and the positioning holes between the feeding layer, the waveguide layer, the coupling layer and the radiation layer correspond to each other.

7. The waveguide antenna assembly according to claim 5, characterized in that: Also included is a PCB, wherein the PCB is connected to the radiation layer.

8. The waveguide antenna assembly according to claim 6, characterized in that: The radiation layer is provided with a plurality of waveguide emitting ports and a plurality of waveguide receiving ports.

9. The waveguide antenna assembly according to claim 1, characterized in that: The solder is solder paste.

10. A radar, characterized in that: The radar comprises the waveguide antenna assembly according to any one of claims 1 to 9.

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