Cooking utensil

Abstract

The utility model discloses a cooking utensil which comprises a circuit board assembly and a cooling fan, the cooling fan blows cooling air to the circuit board assembly, the circuit board assembly comprises a support and a circuit board, and the circuit board comprises a substrate and a high-power component fixed on the substrate through pins. Pins of the high-power component are located on the back surface of the substrate, the support comprises a mounting plate used for fixing the circuit board, a patch NTC is further arranged in the area, corresponding to the high-power component, of the back surface of the substrate, and a wind shielding surrounding rib surrounding the outer side of the patch NTC is arranged between the mounting plate and the back surface of the substrate. According to the cooking utensil, the number of parts can be reduced, automatic production of the circuit board can be achieved, the manufacturing cost of products is further reduced, and the temperature accuracy of high-power components can be effectively improved.

Description

[Technical field]

[0001] The utility model relates to the technical field of kitchen appliances, in particular to a cooking utensil. [Background technology]

[0002] The cooking appliance in the prior art includes a circuit board assembly and a cooling fan, the cooling fan blows cooling air to the circuit board assembly, the circuit board assembly includes a bracket and a circuit board mounted on the bracket, the circuit board includes a substrate and high-power components fixed to the substrate by pins, the pins of the high-power components are located on the back of the substrate, because the high-power components will generate huge heat during operation, the temperature rise of the high-power components will be relatively high, when the temperature rise of the high-power components is higher than the preset value, it will affect its life and even cause failure and damage. Therefore, how to quickly and accurately detect the temperature of the high-power components is particularly important.

[0003] The prior art discloses a method for detecting high-power components, that is, a glass-sealed NTC is provided between the high-power component and the front of the circuit board, and a heat conductive sheet is sandwiched between the glass-sealed NTC and the high-power component. The heat generated by the high-power component during operation is first transferred to the heat conductive sheet, and then transferred to the glass-sealed NTC through the heat conductive sheet. This solution has certain requirements on the material of the heat conducting plate and has high requirements on the installation process of the heat conducting plate. Therefore, it not only increases the material cost, but also leads to an increase in the number of parts and a decrease in assembly efficiency, thereby increasing the manufacturing cost of the product; in addition, when the heat dissipation fan blows cooling air to the circuit board assembly, part of the cooling air will flow to the glass-sealed NTC and exchange heat with the surface of the glass-sealed NTC. After the glass-sealed NTC is affected by the ambient temperature, the temperature measurement of the glass-sealed NTC will be inaccurate. In order to reduce the influence of the cooling air on the temperature measurement accuracy of the glass-sealed NTC, the prior art also provides a wind shield between the air outlet side of the heat dissipation fan and the circuit board. The wind shield can prevent the heat dissipation fan from blowing directly to the glass-sealed NTC. However, since the cooling air flows in an disorderly manner, other parts of the cooling air will still flow to the glass-sealed NTC, which will cause the glass-sealed NTC to be unable to accurately measure the temperature of high-power components due to the influence of the ambient temperature. [Utility Model Content]

[0004] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide a cooking utensil, which can not only reduce the number of parts and realize the automated production of circuit boards, thereby reducing the manufacturing cost of the product, but also effectively improve the temperature accuracy of high-power components.

[0005] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0006] A cooking appliance comprises a circuit board assembly and a cooling fan, wherein the cooling fan blows cooling air toward the circuit board assembly, wherein the circuit board assembly comprises a bracket and a circuit board, wherein the circuit board comprises a substrate and high-power components fixed to the substrate by pins, wherein the pins of the high-power components are located on the back of the substrate, wherein the bracket comprises a mounting plate for fixing the circuit board, wherein a patch NTC is also provided in an area on the back of the substrate corresponding to the high-power components, and wherein a wind shielding rib surrounding the outside of the patch NTC is provided between the mounting plate and the back of the substrate.

[0007] In the above cooking utensil, the mounting plate is provided with a cavity for accommodating the circuit board, the wind shielding ribs are provided between the bottom wall of the cavity and the back side of the base plate, and the bottom of the cavity is provided with a heat dissipation port open downward.

[0008] In the above-mentioned cooking appliance, the circuit board assembly is installed vertically, the cooling fan is placed horizontally below the circuit board assembly, and a wind shield is provided between the bottom of the circuit board and the bottom of the bottom wall, below the wind shield rib. The wind shield blocks part of the heat dissipation port to prevent the cooling fan from blowing cooling air toward the wind shield rib.

[0009] In the above cooking utensil, the wind shield ribs and the mounting plate are integrally formed by injection molding.

[0010] In the above cooking utensil, the wind shielding ribs are independently processed and formed, and the wind shielding ribs are clamped and fixed between the mounting plate and the back side of the base plate.

[0011] In the above cooking utensil, a positioning groove is provided on the side of the mounting plate facing the circuit board, and one end of the wind shielding rib is inserted and fixed in the positioning groove.

[0012] In the above cooking appliance, the wind shielding ribs abut against the back side of the base plate, and the pins of the high-power components located on the back side of the base plate are all located in the area surrounded by the wind shielding ribs.

[0013] In the above cooking appliance, there is an installation gap between the inner circumference of the wind shielding rib and the edge of the patch NTC.

[0014] In the above cooking appliance, the high-power components include IGBT modules and / or thyristors.

[0015] In the above cooking appliance, the cooking appliance further comprises a shell and an outer pot, the circuit board assembly is vertically installed between the shell and the outer pot, and the circuit board is installed on a side of the mounting plate away from the outer pot.

[0016] Beneficial effects of the utility model:

[0017] In the utility model, a chip NTC is also provided in the area corresponding to the high-power components on the back side of the substrate. By using the chip NTC to measure the temperature of the high-power components, the heat conductive sheet can be omitted to reduce the number of parts of the circuit board assembly; in addition, the chip NTC can also be welded on the back side of the substrate by an automatic chip mounter, so as to realize the automatic production of the circuit board, thereby reducing the manufacturing cost of the product; finally, a wind shield rib surrounding the outside of the chip NTC is provided between the mounting plate and the back side of the substrate in the utility model. The chip NTC is surrounded by the wind shield rib for 360°, which can effectively block the cooling wind blown by the cooling fan from flowing through the chip NTC, and can also prevent the cooling wind from blowing toward the chip NTC when it flows disorderly, thereby improving the blocking effect of the wind shield rib on the cooling wind, preventing the chip NTC from being affected by the cooling wind, and thus effectively improving the temperature accuracy of the chip NTC for high-power components.

[0018] The mounting plate is provided with a cavity for accommodating the circuit board, and the wind shielding ribs are provided between the bottom wall of the cavity and the back of the base plate, and the bottom of the cavity is provided with a heat dissipation port that is open downward. With such a design, the cooling air blown by the cooling fan can enter the cavity through the heat dissipation port, and the cooling air can flow back under the blocking of the side wall of the cavity, thereby achieving sufficient heat dissipation on the back of the circuit board; in addition, since the wind shielding ribs are surrounded by the outside of the SMD NTC, the refluxed cooling air can be prevented from blowing toward the SMD NTC, thereby avoiding the influence of the reflux of the cooling air on the temperature measurement.

[0019] The circuit board assembly is installed vertically, the cooling fan is placed horizontally below the circuit board assembly, and a windshield is provided between the bottom of the circuit board and the bottom of the bottom wall below the windshield ribs. The windshield blocks part of the heat dissipation opening to prevent the cooling fan from blowing cooling air toward the windshield ribs. With this design, the windshield can prevent the cooling fan from blowing cooling air toward the windshield ribs, thereby reducing the temperature difference between the wafer of the high-power component and the pin of the high-power component, and further improving the detection accuracy of the SMD NTC.

[0020] The windshield ribs and the mounting plate are integrally formed by injection molding. Such a design can not only increase the connection reliability between the windshield ribs and the mounting plate, but also save the assembly steps of the windshield ribs and the mounting plate, thereby improving the assembly efficiency and further reducing the manufacturing cost.

[0021] The windshield ribs are independently processed and formed, and are clamped and fixed between the mounting plate and the back of the base plate. Such a design can simplify the structure of the mounting plate to reduce the difficulty of injection molding of the mounting plate.

[0022] A positioning groove is provided on the side of the mounting plate facing the circuit board, and one end of the windshield reinforcement is inserted and fixed in the positioning groove. During assembly, one end of the windshield reinforcement is first inserted and fixed in the positioning groove to assemble the windshield reinforcement and the mounting plate, and then the circuit board is fixed on the mounting plate, thereby reducing the difficulty of assembling the windshield reinforcement, the circuit board and the mounting plate.

[0023] The windshield ribs are against the back of the substrate, and the pins of the high-power components on the back of the substrate are all located in the area surrounded by the windshield ribs. Since the heat of the wafer of the high-power component is transferred to the SMD NTC through its pins, the windshield ribs are against the back of the substrate to prevent the cooling air blown by the cooling fan from blowing to the pins of the high-power component, thereby reducing the temperature difference between the wafer of the high-power component and the pins of the high-power component, thereby improving the temperature measurement accuracy of the SMD NTC; in addition, it can also prevent insects from crawling in and damaging the SMD NTC patch.

[0024] There is an installation gap between the inner circumference of the windshield rib and the edge of the SMD NTC. This design makes it easier for the windshield rib to be smoothly mounted on the outside of the SMD NTC during assembly, thereby reducing the difficulty of assembling the circuit board assembly.

[0025] These features and advantages of the present invention will be disclosed in detail in the following specific implementation manners and drawings.

Brief Description of the Drawings

[0026] The utility model is further described below in conjunction with the accompanying drawings:

[0027] Figure 1 This is a schematic diagram of the explosion structure of the pot body in the first embodiment of the utility model;

[0028] Figure 2 This is a schematic diagram of the structure of the circuit board assembly and the heat dissipation fan in the first embodiment of the utility model;

[0029] Figure 3 This is a cross-sectional view of the circuit board assembly and the heat dissipation fan after being assembled in the first embodiment of the utility model;

[0030] Figure 4 This is an exploded schematic diagram of a circuit board assembly in Embodiment 1 of the present utility model;

[0031] Figure 5 This is a schematic diagram of the structure of the circuit board in the first embodiment of the utility model;

[0032] Figure 6 This is a schematic diagram of the structure of the bracket in the first embodiment of the utility model.

[0033] Reference numerals:

[0034] 100, bracket; 110, mounting plate; 111, cavity; 112, buckle; 113, supporting ribs; 120, fan frame; 200, circuit board; 210, substrate; 220, high-power components; 300, SMD NTC; 400, windshield ribs; 500, housing; 600, outer pot; 700, middle ring; 800, cooling fan; 900, windshield. [Specific implementation method]

[0035] The utility model provides a cooking appliance, comprising a circuit board assembly and a cooling fan, wherein the cooling fan blows cooling air to the circuit board assembly, wherein the circuit board assembly comprises a bracket and a circuit board, wherein the circuit board comprises a substrate and high-power components fixed on the substrate by pins, wherein the pins of the high-power components are located on the back of the substrate, wherein the bracket comprises a mounting plate for fixing the circuit board, wherein a patch NTC is further arranged in an area on the back of the substrate corresponding to the high-power components, and wherein a windproof rib surrounding the outside of the patch NTC is arranged between the mounting plate and the back of the substrate.

[0036] In the utility model, a chip NTC is also provided in the area corresponding to the high-power components on the back side of the substrate. By using the chip NTC to measure the temperature of the high-power components, the heat conductive sheet can be omitted to reduce the number of parts of the circuit board assembly; in addition, the chip NTC can also be welded on the back side of the substrate by an automatic chip mounter, so as to realize the automatic production of the circuit board, thereby reducing the manufacturing cost of the product; finally, a wind shield rib surrounding the outside of the chip NTC is provided between the mounting plate and the back side of the substrate in the utility model. The chip NTC is surrounded by the wind shield rib for 360°, which can effectively block the cooling wind blown by the cooling fan from flowing through the chip NTC, and can also prevent the cooling wind from blowing toward the chip NTC when it flows disorderly, thereby improving the blocking effect of the wind shield rib on the cooling wind, preventing the chip NTC from being affected by the cooling wind, and thus effectively improving the temperature accuracy of the chip NTC for high-power components.

[0037] The technical scheme of the embodiment of the utility model is explained and illustrated below in conjunction with the drawings of the embodiment of the utility model, but the following embodiments are only preferred embodiments of the utility model, not all. Based on the embodiments in the implementation mode, other embodiments obtained by those skilled in the art without making creative work all belong to the protection scope of the utility model. In addition, it should be understood that the following words indicating orientation or position relationship such as "up", "down", "left", "right", "longitudinal", "lateral", "inside", "outside", "vertical", "horizontal", "top", "bottom", etc. are only based on the orientation or position relationship shown in the drawings, only for the convenience of describing the utility model and simplifying the description, rather than indicating or implying that the device / element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the utility model.

[0038] Embodiment 1

[0039] Reference Figures 1 to 6As shown, the cooking utensil in this embodiment includes a pot body and a pot cover, the pot body includes an outer shell 500, an outer pot 600, a middle ring 700, a circuit board assembly, and a cooling fan 800, the circuit board assembly includes a bracket 100 and a circuit board 200, the circuit board assembly is vertically installed between the outer shell 500 and the outer pot 600 and the circuit board 200 is vertically arranged, wherein the middle ring 700 is installed on the top of the outer shell 500, the bracket 100 is connected to the screw column of the middle ring 700 by screws, and the circuit board 200 is arranged on the side of the mounting plate 110 away from the outer pot 600, and the cooling fan 800 is horizontally placed below the circuit board assembly and blows cooling air to the circuit board assembly to dissipate heat from electronic components on the circuit board. The circuit board 200 includes a substrate 210 and a high-power component 220 fixed on the substrate 210 by pins, the high-power component 220 includes an IGBT module and / or a thyristor, the pins of the high-power component 220 are located on the back of the substrate 210, the bracket 100 includes a mounting plate 110 for fixing the circuit board 200, a patch NTC 300 is also provided in the area on the back of the substrate 210 corresponding to the high-power component 220, and a windshield rib 400 is provided between the mounting plate 110 and the back of the substrate 210 and surrounding the outside of the patch NTC 300.

[0040] In this embodiment, a patch NTC300 is also provided in the area corresponding to the high-power component 220 on the back side of the substrate 210. The patch NTC300 is used to measure the temperature of the high-power component 220, and the heat conducting sheet can be omitted to reduce the number of components of the circuit board assembly. In addition, the patch NTC300 can also be welded on the back side of the substrate 210 by an automatic chip mounter, so as to realize the automatic production of the circuit board 200, thereby reducing the manufacturing cost of the product. Finally, a surrounding wall is provided between the mounting plate 110 and the back side of the substrate 210 in this embodiment. The windshield ribs 400 wrapped around the outside of the patch NTC300 can surround the patch NTC300 360°, which can effectively block the cooling wind blown by the cooling fan 800 from flowing through the patch NTC300, and can also prevent the cooling wind from blowing towards the patch NTC300 when it flows disorderly, thereby improving the cooling wind blocking effect of the windshield ribs 400, preventing the patch NTC300 from being affected by the cooling wind, and effectively improving the temperature accuracy of the patch NTC300 for the high-power component 220.

[0041] Specifically, Figures 4 to 6As shown, the mounting plate 110 in this embodiment is provided with a cavity 111 for accommodating the circuit board 200, a buckle 112 protruding into the cavity is provided on the side wall of the cavity 111, a supporting rib 113 is provided on the bottom wall of the cavity, the edge of the substrate 210 is defined between the supporting rib 113 and the buckle 112, and a heat dissipation gap can be formed between the substrate 210 and the bottom wall of the cavity 111 through the supporting rib 113, and the bottom side edge of the side wall of the cavity 111 is missing, so that the bottom of the cavity 111 is provided with a heat dissipation gap open downward. The heat outlet is designed in this way, which can not only effectively protect the back side of the circuit board 200, but also allow the cooling air blown by the cooling fan 800 to enter the cavity 111 through the heat outlet, and the cooling air can flow back under the obstruction of the side wall of the cavity 111, thereby achieving sufficient heat dissipation on the back side of the circuit board; in addition, because the wind shielding rib 400 is surrounded by the outside of the patch NTC300, the reflux cooling air can be prevented from blowing toward the patch NTC300, thereby avoiding the influence of the reflux of cooling air on temperature measurement.

[0042] In addition, the windshield rib 400 in this embodiment is disposed between the bottom wall of the cavity and the back of the base plate 210. Preferably, the windshield rib 400 and the mounting plate 110 are integrally formed by injection molding, that is, the windshield rib 400 and the bottom wall of the cavity 111 are integrally formed by injection molding, and the height of the windshield rib 400 is not higher than the height of the support rib 113. Such a design can not only increase the connection reliability between the windshield rib 400 and the mounting plate 110, but also save the assembly steps of the windshield rib 400 and the mounting plate 110, thereby improving the assembly efficiency and further reducing the manufacturing cost.

[0043] Preferably, in this embodiment, the height of the windshield rib 400 is equal to the height of the support rib 113, so that the windshield rib 400 abuts against the back of the substrate 210, and the pins of the high-power component 220 located on the back of the substrate 210 are all located in the area surrounded by the windshield rib 400. In such a design, since the heat of the wafer of the high-power component 220 is transferred to the patch NTC300 through its pins, the windshield rib 400 abuts against the back of the substrate 210, which can prevent the cooling wind blown by the heat dissipation fan 800 from blowing toward the pins of the high-power component 220, so as to reduce the temperature difference between the wafer of the high-power component 220 and the pins of the high-power component 220, thereby improving the temperature measurement accuracy of the patch NTC300.

[0044] During assembly, the patch NTC300 is first soldered to the area corresponding to the high-power component 220 on the back of the substrate 210 by an automatic patch machine, and then the circuit board 200 is snapped into the cavity 111 to realize assembly with the mounting plate 110, and the windshield ribs 400 are surrounded by the outside of the patch NTC300. In order to facilitate the windshield ribs 400 to be sleeved on the outside of the patch NTC300, in this embodiment, there is an installation gap between the inner circumference of the windshield ribs 400 and the edge of the patch NTC300, that is, the windshield ribs 400 and the patch NTC300 are gap-matched, wherein the shape of the windshield ribs 400 can be rectangular, circular, elliptical, etc. Such a design facilitates the windshield ribs 400 to be smoothly sleeved on the outside of the patch NTC300 during assembly, thereby reducing the difficulty of assembling the circuit board assembly.

[0045] Furthermore, in order to realize that the heat dissipation fan 800 is horizontally placed below the circuit board assembly, the bracket 100 in this embodiment further includes a fan frame 120 disposed at the bottom of the mounting plate 110, the fan frame 120 is through from top to bottom, the fan frame 120 is located on the side of the mounting plate away from the outer pot 600 and is horizontally arranged, the heat dissipation fan 800 is horizontally placed below the circuit board 200, and part of the heat dissipation fan 800 is installed in the fan frame 120, and the remaining part of the heat dissipation fan 800 is placed on the side of the mounting plate facing the outer pot 600. With such a design, part of the cooling air blown out by the heat dissipation fan 800 can flow toward the circuit board 200, and part of it can flow toward the outer pot 600 to cool the outer pot 600. With such a design, not only can the effective heat dissipation of the high-power components 220 be realized to reduce the temperature rise of the high-power components 220, but also the manufacturing cost of the product can be reduced, and the temperature accuracy of the high-power components 220 can be effectively improved.

[0046] Finally, if Figure 2 and Figure 3 As shown, in order to further reduce the impact of ambient temperature on the patch NTC300, a windshield 900 is provided between the bottom of the circuit board 200 and the bottom of the bottom wall in this embodiment. The windshield 900 is located below the windshield rib 400, and the length of the windshield 900 is less than the length of the mounting plate, so that the windshield 900 blocks part of the heat dissipation opening below the windshield rib 400, and the windshield 900 can block the cooling fan 800 from blowing cooling air toward the windshield rib 400, thereby reducing the temperature difference between the wafer of the high-power component 220 and the pin of the high-power component 220, and further improving the detection accuracy of the patch NTC300.

[0047] In another embodiment of the utility model, the height of the windshield rib may be slightly lower than the height of the supporting rib, so that there is a first gap between the windshield rib and the back side of the substrate, and the first gap is smaller than the thickness of the patch NTC, so as to ensure that the windshield rib can block the cooling air blown by the cooling fan from flowing through the surface of the patch NTC away from the substrate. Setting the first gap can also prevent the windshield rib from being too high due to processing errors or installation errors, thereby interfering with the assembly of the circuit board and the mounting plate.

[0048] In another embodiment of the utility model, the windshield ribs can also be independently processed and formed, and the windshield ribs are clamped and fixed between the mounting plate and the back of the base plate. Such a design can simplify the structure of the mounting plate to reduce the difficulty of injection molding of the mounting plate.

[0049] In order to facilitate the assembly of the windshield ribs, a positioning groove is provided on the side of the mounting plate facing the circuit board (i.e., the bottom wall of the cavity) in this embodiment, and one end of the windshield rib is inserted and fixed in the positioning groove. During assembly, one end of the windshield rib is first inserted and fixed in the positioning groove to assemble the windshield ribs and the mounting plate, and then the circuit board is fixed on the mounting plate, thereby reducing the difficulty of assembling the windshield ribs, the circuit board, and the mounting plate.

[0050] In another embodiment of the utility model, the windshield ribs can also be independently processed and formed, and the windshield ribs are bonded and fixed to the bottom wall of the cavity, and then the circuit board and the mounting plate are assembled so that the windshield ribs surround the outside of the SMD NTC. Such a design can also simplify the structure of the mounting plate to reduce the difficulty of injection molding of the mounting plate.

[0051] In another embodiment of the utility model, the windshield ribs can also be independently processed and fixed on the outside of the patch NTC. The windshield ribs are silicone sleeves. Such a design can not only fix the windshield ribs and the patch NTC by interference fit, but also avoid damage to the patch NTC during installation.

[0052] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Those skilled in the art should understand that the utility model includes but is not limited to the contents described in the drawings and the above specific implementation. Any modification that does not deviate from the functional and structural principles of the utility model will be included in the scope of the claims.

Claims

1. A cooking appliance, comprising a circuit board assembly and a cooling fan, wherein the cooling fan blows cooling air to the circuit board assembly, wherein the circuit board assembly comprises a bracket and a circuit board, wherein the circuit board comprises a substrate and a high-power component fixed to the substrate by pins, wherein the pins of the high-power component are located on the back of the substrate, wherein: The bracket includes a mounting plate for fixing the circuit board, a patch NTC is also provided in the area corresponding to the high-power components on the back of the substrate, and a windproof rib surrounding the outside of the patch NTC is provided between the mounting plate and the back of the substrate.

2. A cooking utensil according to claim 1, characterized in that: The mounting plate is provided with a cavity for accommodating the circuit board, the wind shielding ribs are arranged between the bottom wall of the cavity and the back side of the base plate, and the bottom of the cavity is provided with a heat dissipation port which is open downwards.

3. A cooking utensil according to claim 2, characterized in that: The circuit board assembly is installed vertically, the cooling fan is placed horizontally below the circuit board assembly, and a wind shield is provided between the bottom of the circuit board and the bottom of the bottom wall, below the wind shield ribs. The wind shield blocks part of the heat dissipation outlet to prevent the cooling fan from blowing cooling air toward the wind shield ribs.

4. A cooking utensil according to claim 1, characterized in that: The windshield ribs and the mounting plate are integrally formed by injection molding.

5. The cooking utensil according to claim 1, characterized in that: The windshield ribs are independently processed and formed, and the windshield ribs are clamped and fixed between the mounting plate and the back side of the base plate.

6. A cooking utensil as claimed in claim 5, characterized in that: A positioning groove is provided on one side of the mounting plate facing the circuit board, and one end of the wind shielding rib is inserted and fixed in the positioning groove.

7. A cooking utensil according to any one of claims 1 to 6, characterized in that: The wind-shielding ribs abut against the back side of the substrate, and the pins of the high-power components located on the back side of the substrate are all located within the area surrounded by the wind-shielding ribs.

8. A cooking utensil according to any one of claims 1 to 6, characterized in that: There is an installation gap between the inner circumference of the windshield rib and the edge of the patch NTC.

9. A cooking utensil according to any one of claims 1 to 6, characterized in that: The high-power components include IGBT modules and / or thyristors.

10. A cooking utensil according to any one of claims 1 to 6, characterized in that: The cooking appliance further comprises a shell and an outer pot, the circuit board assembly is vertically mounted between the shell and the outer pot, and the circuit board is mounted on a side of the mounting plate away from the outer pot.

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