Solar cell conductive assembly

By applying a conductive adhesive connecting conductor layer on the lower surface of the cover plate of the solar cell conductive assembly and setting multiple welding position points on the upper surface of the cover plate, the problems of uneven conductivity and poor durability are solved, and more uniform conductivity and longer service life are achieved.

CN222638996UActive Publication Date: 2025-03-18DONGFANG HUANSHENG PHOTOVOLTAIC (JIANGSU) CO LTD
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Patent Information

Application Number
CN202421205398.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-29
Publication Date
2025-03-18
Estimated Expiration
2034-05-29

AI Technical Summary

Technical Problem

During the electroplating process, existing solar cell conductive covers have poor contact with the battery cells, resulting in uneven conductivity, and the metal material is easily corroded by the electrolyte, making it poor durability.

Method used

A solar cell conductive component is designed, including a cover plate and a conductor layer. The bottom surface of the cover plate is coated with conductive glue and connected to the conductor layer. The bottom surface of the conductor layer is in full contact with the cell. A plurality of position points for welding with the conductor wires are provided on the upper surface of the cover plate to enhance mechanical strength and improve conductivity uniformity.

Benefits of technology

Improve the conductivity uniformity through sufficient contact, extend the service life of the assembly, avoid electrolyte corrosion to damage the conductor layer only without affecting the cover plate, reduce replacement costs, and improve the uniformity of the metallization of the battery cell.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a solar cell conductive assembly, which comprises a cover plate and a conductor layer, the lower surface of the conductor layer is used for being contacted with the upper surface of a cell, and the lower surface of the cover plate is connected with the conductor layer through coated conductive adhesive; the upper surface of the cover plate is provided with a plurality of position points used for being welded with a wire, one position point is located at a first center point of the upper surface of the cover plate, and the rest position points are distributed around the first center point. By adopting the conductive cover plate, the problems that the phenomenon of nonuniform conduction is easy to occur and the durability is poor when the existing conductive cover plate works can be solved.
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Description

Technical Field

[0001] The utility model relates to the technical field of solar cells, in particular to a solar cell conductive component. Background Art

[0002] There are many ways to remove silver from Topcon solar cells, and electroplating is one of them. The device used in its small-batch experiments involves a cell conductive cover plate, which plays a role in evenly supplying power to the cell during the electroplating process. The existing conductive cover plate is a single-layer metal plate hard structure, and only the middle point is welded to the wire, which has poor contact with the cell and is prone to uneven conductivity during operation. In addition, the metal material is easily corroded by the electrolyte and lacks durability. Utility Model Content

[0003] The utility model aims to provide a solar cell conductive component to alleviate the problem that the existing conductive cover plate is prone to uneven conductivity and poor durability during operation.

[0004] The utility model provides a solar cell conductive component, comprising a cover plate and a conductor layer, wherein the lower surface of the conductor layer is used to contact the upper surface of the solar cell, and the lower surface of the cover plate is connected to the conductor layer through a coated conductive adhesive; the upper surface of the cover plate is provided with a plurality of position points for welding with the wires, one of the position points is located at a first center point on the upper surface of the cover plate, and the remaining position points are distributed around the first center point.

[0005] As a possible implementation, the coating range of the conductive adhesive covers all position points set on the upper surface of the cover plate.

[0006] As a possible implementation, the inner surface of the cover plate is divided into multiple target areas of equal area by its first center point, and the first center point is a point common to the multiple target areas; one of the position points is located at the first center point, and at least one position point is arranged in each target area.

[0007] As a possible implementation, a location point is arranged in each target area.

[0008] As a possible implementation, a position point is arranged at the second center point of each target area.

[0009] As a possible implementation, the upper surface of the cover plate is divided into four target areas of equal area by its first center point, each target area is a rectangular area, and the four corner points of each target area are respectively the first center point, the intersection of two adjacent sides of the upper surface of the cover plate, and the midpoint of each of the two adjacent sides; one of the position points is located at the first center point, and the remaining different position points are located in different target areas.

[0010] As a possible implementation, the second center point is the intersection of two diagonals of the corresponding target area; the coating range of the conductive adhesive also covers at least one of the following: the four edges of the lower surface of the cover plate, the two diagonals of the lower surface of the cover plate, the first position corresponding to at least one edge where part or all of the target area intersects with the first center point, and the second position corresponding to at least one diagonal of at least one target area.

[0011] As a possible implementation, the conductor layer is made of conductive foam, and the thickness of the conductor layer is 0-2 mm.

[0012] As a possible implementation, the coating thickness of the conductive adhesive is 0.5 to 3 mm.

[0013] As a possible implementation, the coating width of the conductive adhesive is 0.5 to 3 mm.

[0014] The utility model provides a solar cell conductive component. By coating a conductive glue on the lower surface of the cover plate to connect the conductor layer so that the conductor layer is in full contact with the battery cell, the problem of uneven conductivity of the conductive cover plate due to poor contact with the battery cell can be improved. Since the contact portion with the battery cell is easily corroded by the electrolyte, the conductor layer is provided so that the electrolyte only corrodes the conductor layer but not the cover plate, so that after the conductor layer is corroded, only the conductor layer needs to be replaced without replacing the entire cover plate, thereby increasing the durability of the cover plate. By providing a plurality of position points for welding with wires on the upper surface of the cover plate, the non-battery contact surface of the cover plate can be welded with the wires through the plurality of position points, thereby increasing the mechanical strength and improving the problem of uneven conductivity of the cover plate, thereby ensuring that the wire current is transmitted to the conductor layer and then to the battery cell through each position point, thereby facilitating improving the uniformity of metallization of the battery cell. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 This is a schematic structural diagram of a solar cell conductive component in an embodiment of the utility model;

[0017] Figure 2 This is a schematic diagram of the conductive adhesive coating position on the lower surface of the cover plate in the embodiment of the utility model;

[0018] Figure 3This is a schematic diagram of one of the layout positions of the upper surface of the cover plate in the embodiment of the utility model;

[0019] Figure 4 This is a schematic diagram of one of the layout positions of the upper surface of the cover plate in the embodiment of the utility model;

[0020] Figure 5 This is a schematic diagram of one of the layout positions of the upper surface of the cover plate in the embodiment of the utility model;

[0021] Figure 6 This is an example diagram of the conductive adhesive coating pattern in the embodiment of the utility model;

[0022] Figure 7 This is an example diagram of the connection between the solar cell conductive component and the wire in the embodiment of the utility model;

[0023] Figure 8 This is an example diagram of a solar cell conductive component in an embodiment of the present utility model.

[0024] Icons: 1-cover; 11-target area; 2-conductive glue; 3-conductor layer; 4-location point; 5-conducting wire. DETAILED DESCRIPTION

[0025] The technical solution of the utility model will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] See also Figure 1 As shown, a solar cell conductive component provided by an embodiment of the utility model may include a cover plate 1 and a conductor layer 3, wherein the lower surface of the conductor layer 3 is used to contact the upper surface of the cell, and the lower surface of the cover plate 1 is connected to the conductor layer 3 via a coated conductive adhesive 2; a plurality of position points 4 for welding with the wires are provided on the upper surface of the cover plate 1, wherein one of the position points 4 is located at the first center point of the upper surface of the cover plate 1, and the remaining position points 4 are distributed around the first center point.

[0027] The utility model provides a solar cell conductive component. By coating a conductive glue on the lower surface of the cover plate to connect the conductor layer so that the conductor layer is in full contact with the cell, the problem of uneven conductivity of the conductive cover plate due to poor contact with the cell can be improved. Since the contact portion with the cell is easily corroded by the electrolyte, the conductor layer is provided so that the electrolyte only corrodes the conductor layer but not the cover plate, so that after the conductor layer is corroded, only the conductor layer needs to be replaced without replacing the entire cover plate, thereby increasing the durability of the cover plate. By providing a plurality of positions for welding with wires on the upper surface of the cover plate, the non-cell contact surface of the cover plate can be welded with the wires through the plurality of positions, thereby increasing the mechanical strength and improving the problem of uneven conductivity of the cover plate, thereby ensuring that the wire current is transmitted to the conductor layer and then to the cell through each position point, thereby facilitating improving the uniformity of metallization of the cell.

[0028] As a possible implementation, see Figure 2 As shown, the coating range of the conductive adhesive 2 can cover all the position points 4 set on the upper surface of the cover plate 1. With this operation mode, since the coating range of the conductive adhesive 2 between the conductor layer 3 and the cover plate 1 has covered all the position points 4, the efficiency and accuracy of the wire current being transmitted to the cover plate 1 through each position point 4 and then transmitted to the conductor layer 3 through the conductive adhesive 2 can be further ensured, thereby further improving the conductive performance of the solar cell conductive component.

[0029] As a possible implementation, see Figure 3 As shown, the upper surface of the cover plate 1 is divided into a plurality of target areas 11 of equal area by its first center point, and the first center point is a point common to the plurality of target areas 11 (such as a corner point, a point on a curve, a point on a straight line, etc.); one of the position points 4 is located at the first center point, and at least one position point 4 is arranged in each target area 11. For example Figure 3 , the upper surface of the cover plate 1 is divided into three target areas 11 of equal area by its center point, one of the position points 4 is located at the center point of the upper surface of the cover plate 1, two position points 4 are arranged in one of the target areas 11, and one position point 4 is evenly arranged in each of the remaining two target areas 11. By dividing the upper surface of the cover plate 1 into multiple target areas 11 of equal area to arrange multiple position points for welding with wires, the non-battery contact surface of the cover plate 1 can be welded with the wires through the multiple position points 4 arranged at the center point of the upper surface of the cover plate 1 and its surrounding areas, which can improve the problem of uneven conductivity of the cover plate while increasing the mechanical strength.

[0030] As a possible implementation, see Figure 4As shown, the upper surface of the cover plate 1 is divided into a plurality of target areas 11 of equal area by its center point, one of the position points 4 is located at the first center point (i.e., the center point of the upper surface of the cover plate 1), and a position point 4 is arranged in each target area 11. By dividing the upper surface of the cover plate 1 into a plurality of target areas 11 of equal area and respectively arranging the position points 4 in the center point of the upper surface of the cover plate 1 and each target area 11 around it, the non-battery contact surface of the cover plate 1 can be welded to the wire through the position points 4 arranged in the center point and different areas around it, thereby improving the problem of uneven conductivity of the cover plate while increasing the mechanical strength.

[0031] As a possible implementation, see Figure 4 As shown, the upper surface of the cover plate 1 is divided into a plurality of target areas 11 of equal area by its center point, wherein one position point 4 is located at the first center point (i.e., the center point of the upper surface of the cover plate 1), and a position point 4 is arranged at the second center point of each target area 11.

[0032] The second center point mentioned above may be the incenter (ie, the center of the inscribed circle), the circumcenter (ie, the center of the circumscribed circle), the centroid, the orthocenter, etc. of the corresponding target area, and is not limited thereto.

[0033] By dividing the upper surface of the cover plate 1 into multiple target areas 11 of equal area and arranging position points 4 at the center point of the upper surface of the cover plate 1 and the center point of each target area 11 around it, the non-battery contact surface of the cover plate 1 can be welded to the wire through the position points 4 arranged at the center point of the upper surface of the cover plate 1 and the center points of different areas around it, thereby increasing the mechanical strength and improving the problem of uneven conductivity of the cover plate.

[0034] As a possible implementation, see Figure 4 As shown, the upper surface of the cover plate 1 is divided into four target areas 11 of equal area by its first center point, each target area 11 is a rectangular area, and the four corner points of each target area 11 are the first center point, the intersection of two adjacent sides of the upper surface of the cover plate 1, and the midpoints of the two adjacent sides; one of the position points 4 is located at the first center point, and the remaining different position points 4 are located in different target areas 11. For example Figure 4, the line connecting the midpoints of the front and rear sides of the upper surface of the cover plate 1 intersects with the line connecting the midpoints of the left and right sides of the upper surface of the cover plate 1, so as to divide the upper surface of the cover plate 1 into four rectangular target areas 11 with equal areas. A position point 4 can be arranged at the center point of the upper surface of the cover plate 1, and only one corresponding position point 4 can be arranged in each target area 11, so that the remaining four different position points 4 except the position point 4 arranged at the center point of the upper surface of the cover plate 1 are respectively located in four different target areas 11. By dividing the upper surface of the cover plate 1 into four rectangular areas with equal areas and arranging different position points 4 at the center point of the upper surface of the cover plate 1 and in different rectangular areas, the non-battery contact surface of the cover plate 1 can be welded to the wire through the position points 4 arranged at the center point of the upper surface of the cover plate 1 and in four different rectangular areas around it, which can improve the problem of uneven conductivity of the cover plate while increasing the mechanical strength.

[0035] As a possible implementation, see Figure 5 As shown, the second center point may be the intersection of two diagonal lines of the corresponding target area 11. Figure 5 , the upper surface of the cover plate 1 is divided into four rectangular target areas 11 of equal area, and the four corner points of each target area 11 are respectively the center point of the upper surface of the cover plate 1, the intersection of two adjacent sides of the upper surface of the cover plate 1, and the midpoints of the two adjacent sides. A position point 4 can be arranged at the center point of the upper surface of the cover plate 1, and only one corresponding position point 4 is arranged at the intersection of two diagonals of each target area 11 (i.e., the second center point at this time), so that the remaining four different position points 4 except the position point 4 arranged at the center point of the upper surface of the cover plate 1 are respectively located at the intersection of the diagonals of four different target areas 11. By dividing the upper surface of the cover plate 1 into four rectangular areas of equal area and arranging position points at the center point of the upper surface of the cover plate 1 and the intersection of the diagonals of the four rectangular areas around it, the non-battery contact surface of the cover plate 1 can be welded to the wire through five different position points 4, which can improve the problem of uneven conductivity of the cover plate while increasing the mechanical strength.

[0036] In practical applications, in order to further improve the uniformity of conductivity, see Figure 6 As shown, in addition to covering all the position points 4, the coating range of the conductive adhesive 2 can also cover at least one of the following: four edges of the upper surface of the cover plate 1, two diagonals of the upper surface of the cover plate 1, a first position corresponding to at least one edge where at least one target area 11 intersects with the first center point, and a second position corresponding to at least one diagonal of part or all of the target area.

[0037] For example Figure 6 The upper surface of the cover plate 1 has been divided into four rectangular target areas 11 (with Figure 6The rectangles abEh, bcdE, Edef, and hEfg in the figure correspond to each other), and the center point of the upper surface of the cover plate 1 (corresponding to Figure 6 E in the figure) and the center points of the four target areas 11 (corresponding to Figure 6 The positions of the conductive adhesive 2 may include the four edges of the lower surface of the cover plate 1 (i.e. Figure 6 ac, ce, eg, ga), two diagonals (i.e. Figure 6 ae, cg in), six midpoint connecting lines (i.e. Figure 6 bd, df, fh, hb, hd, bf).

[0038] In actual application, in order to ensure the conductive performance of the solar cell conductive component and control the production cost of the solar cell conductive component, the conductor layer 3 can be made of conductive foam, and the thickness of the conductor layer 3 can be set to 0-2 mm. In addition, the coating thickness of the conductive glue 2 can be set to 0.5-3 mm.

[0039] For ease of understanding, the above-mentioned solar cell conductive component is described as follows by taking a specific application as an example.

[0040] See also Figures 6 to 8 As shown, a layer of conductive foam is bonded to the lower surface of the single-layer hard metal cover plate 1 by conductive glue as a conductor layer 3, and the lower surface of the conductor layer 3 can be used to fully contact the upper surface of the battery cell; the upper surface of the cover plate 1 (i.e., the non-battery contact surface) has been divided into four rectangular target areas 11 with equal areas, and the positions of the four rectangular target areas 11 correspond to Figure 6 A position point is arranged at the center point of the upper surface of the cover plate 1, and a corresponding position point 4 is arranged at the intersection of the diagonals of each target area 11, so that a total of five position points 4 are arranged on the upper surface of the cover plate 1, and the arrangement positions of these five position points 4 are respectively located at Figure 6 Each position point 4 can be used for welding with the wire 5 directly above A, B, C, D, and E in order to facilitate the transmission of current between the wire 5 and the upper surface of the cover plate 1; the conductive glue 2 can be used according to Figure 6 The designated coating pattern shown is coated on the lower surface of the cover plate 1, so that the coating range of the conductive adhesive 2 includes Figure 6 The shape of the cover plate 1 can be rectangular, and the size of the cover plate 1 can be adaptively defined according to the size of the required conductive battery cell. For example, the size of the cover plate 1 can be set to match any current mainstream battery cell size (such as 210, 182, 210R, etc.), and the size of the cover plate 1 is not limited here.

[0041] By adopting the above-mentioned solar cell conductive component, a layer of conductive foam is bonded with conductive glue on the lower surface of the cover plate to fully contact the battery cell, thereby improving the problem of uneven conductivity of the conductive cover plate due to poor contact with the battery cell; it is also convenient to replace only the conductive foam after the conductive foam is corroded by the electrolyte without replacing the entire cover plate, thereby increasing the durability of the cover plate; since the conductive foam and the cover plate are connected by conductive glue with a specific coating pattern, the uniformity of the wire current transmitted to the conductive foam and then to the battery cell through the welding point can be guaranteed, thereby ensuring the uniformity of the metallization of the battery cell; by arranging multiple welding points on the non-battery contact surface of the cover plate so that the cover plate can be welded to the wire through multiple welding points, the problem of uneven conductivity of the cover plate can be improved while increasing the mechanical strength.

[0042] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the utility model.

Claims

1. A solar cell conductive component, characterized in that: It includes a cover plate and a conductor layer, the lower surface of the conductor layer is used to contact the upper surface of the battery cell, and the lower surface of the cover plate is connected to the conductor layer through a coated conductive adhesive; the upper surface of the cover plate is provided with a plurality of position points for welding with the wires, one of the position points is located at the first center point of the upper surface of the cover plate, and the remaining position points are distributed around the first center point.

2. The solar cell conductive component according to claim 1, characterized in that: The coating range of the conductive adhesive covers all positions arranged on the upper surface of the cover plate.

3. The solar cell conductive component according to claim 1, characterized in that: The upper surface of the cover plate is divided into a plurality of target areas of equal area by a first center point thereof, and the first center point is a point common to the plurality of target areas; One of the position points is located at the first center point, and at least one position point is arranged in each target area.

4. The solar cell conductive component according to claim 3, characterized in that: A location point is arranged in each target area.

5. The solar cell conductive component according to claim 3, characterized in that: A position point is arranged at the second center point of each target area.

6. The solar cell conductive component according to claim 3, characterized in that: The upper surface of the cover plate is divided into four target areas of equal area by its first center point, each target area is a rectangular area, and the four corner points of each target area are respectively the first center point, the intersection of two adjacent sides of the upper surface of the cover plate and the midpoints of the two adjacent sides; one of the position points is located at the first center point, and the remaining different position points are located in different target areas.

7. The solar cell conductive component according to claim 3, characterized in that: The coating range of the conductive adhesive also covers at least one of the following: the four edges of the lower surface of the cover plate, the two diagonals of the lower surface of the cover plate, the first position corresponding to at least one edge of at least one target area intersecting with the first center point, and the second position corresponding to at least one diagonal of at least one target area.

8. The solar cell conductive component according to any one of claims 1 to 7, characterized in that: The conductor layer is made of conductive foam, and the thickness of the conductor layer is 0-2 mm.

9. The solar cell conductive component according to any one of claims 1 to 7, characterized in that: The coating thickness of the conductive adhesive is 0.5 to 3 mm.

10. The solar cell conductive component according to any one of claims 1 to 7, characterized in that: The coating width of the conductive adhesive is 0.5 to 3 mm.