Quick dismounting device for integrated circuit chip

Abstract

The utility model relates to the technical field of chip quick dismounting equipment, in particular to an integrated circuit chip quick dismounting device which comprises a working frame, guide rods are fixedly connected to the top of the working frame in a central symmetry mode, movable blocks are connected to the surfaces of the guide rods in a sliding mode, and a screw shaft is rotatably connected to the center of each movable block. The surface of the wire shaft is in threaded connection with a movable frame, guide rails are fixedly connected to the front side and the rear side of the top of the movable frame correspondingly, sliding blocks are slidably connected to the two sides of the guide rails correspondingly, supports are fixedly connected to the centers of the bottoms of the sliding blocks correspondingly, rolling wheels are rotatably connected to the bottoms of the supports in an embedded mode, and metal wires are connected to the surfaces of the rolling wheels in a rolling mode. The two sides of the metal wire are both sleeved with electric heating sleeves, and the electric heating sleeves are fixed to the support. The utility model aims to provide the rapid dismounting device for the integrated circuit chip, so as to solve the problem that the chip cannot be rapidly dismounted because various tools are needed when the chip is dismounted at present.

Description

Technical Field

[0001] The utility model relates to the technical field of chip rapid disassembly equipment, in particular to an integrated circuit chip rapid disassembly device. Background Art

[0002] An integrated circuit is a miniature electronic device or component. Using a certain process, the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit are interconnected and made on a small piece or several small pieces of semiconductor wafers or dielectric substrates, and then packaged in a tube shell to become a miniature structure with the required circuit function; all the components have formed a whole in structure, making electronic components a big step forward in miniaturization, low power consumption, intelligence and high reliability.

[0003] Integrated circuit boards are generally equipped with chips. When replacing or repairing chips, the chips need to be removed from the integrated circuit boards. The existing practice is generally to first use a heating tool to heat the pins on the chip, and then use tweezers to remove the chip from the integrated circuit board after the tin on the pins melts. This operation has many steps and requires the use of different tools to achieve, and the purpose of quick disassembly cannot be achieved. Utility Model Content

[0004] The utility model aims to provide a device for quickly disassembling an integrated circuit chip, so as to solve the problem that a plurality of tools are needed to disassemble the chip, thereby preventing the chip from being disassembled quickly.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A device for quickly disassembling integrated circuit chips, comprising a work frame, wherein a guide rod is symmetrically fixedly connected to the top center of the work frame, a movable block is slidably connected to the surface of the guide rod, the center of the movable block is rotatably connected to a wire shaft, the surface of the wire shaft is threadedly connected to the movable frame, the front and rear sides of the top of the movable frame are fixedly connected to guide rails, both sides of the guide rails are slidably connected to sliders, the bottom center of the slider is fixedly connected to a bracket, the bottom of the bracket is embedded and rotatably connected to a roller, the surface of the roller is rollingly connected to a metal wire, both sides of the metal wire are sleeved with electric heating sleeves, the electric heating sleeves are fixed on the bracket, both ends of the metal wire are fixedly connected to tension springs, the top ends of the tension springs are respectively fixedly connected to the sliders on both sides, one side of the slider is threadedly connected to a screw, and the spiral directions of the threads on both sides of the screw are opposite.

[0007] Preferably, the surface of the movable frame and both sides of the wire shaft are slidably connected with guide pillars, the bottom of the guide pillars is fixedly connected with a control switch, and the control switch is electrically connected to the electric heating sleeves on both sides.

[0008] Preferably, a knob is fixedly connected to the top of the thread shaft, and a handle is fixedly connected to the center of the threaded rod.

[0009] Preferably, movable grooves are provided on the surface of the movable frame and at positions corresponding to the brackets.

[0010] Compared with the prior art, the beneficial effects of the utility model are:

[0011] 1. In the utility model, the working frame is covered on the integrated circuit board of the chip to be removed, and then the wire shaft is adjusted to drive the movable frame to move downward, thereby driving the metal wire to move downward to be close to the surface of the integrated circuit board, and then the metal wire is heated by the electric heating sleeve, and then the movable block is pushed horizontally along the guide rail in the disassembly direction, so that the heated metal wire slowly passes between the chip and the integrated circuit board, so that the heated metal wire continuously melts the chip pin solder. The operation is simple, the steps are few, and the purpose of rapid chip disassembly can be achieved.

[0012] 2. In the utility model, the distance between the sliders can be relatively adjusted by the reverse threads on both sides of the screw rod, and the metal wire is pre-tightened by the tension spring, thereby realizing flexible adjustment of the distance between the two brackets according to the size of the disassembled chip, so as to increase the flexibility of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is an upper axis view of a device for quickly disassembling an integrated circuit chip according to the utility model;

[0014] Figure 2 This is a lower axis view of a device for quickly disassembling an integrated circuit chip according to the utility model;

[0015] Figure 3 for Figure 2 A schematic diagram of the enlarged structure of region A;

[0016] Figure 4 The utility model is a chip quick disassembly application state diagram of an integrated circuit chip quick disassembly device.

[0017] In the figure: 1. working frame; 2. guide rod; 3. movable block; 4. wire shaft; 5. movable frame; 6. guide rail; 7. slider; 8. bracket; 9. roller; 10. metal wire; 11. electric heating sleeve; 12. tension spring; 13. screw rod; 14. guide column; 15. control switch; 16. knob; 17. handle; 18. movable slot; 19. integrated circuit board; 20. chip. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0019] See also Figure 1-4 , the utility model provides a technical solution:

[0020] A device for quickly disassembling an integrated circuit chip comprises a work frame 1 for supporting and fixing the device; a guide rod 2 is symmetrically fixedly connected to the top center of the work frame 1, and a movable block 3 is slidably connected to the surface of the guide rod 2 for guiding and pushing a metal wire horizontally, so that the metal wire can sequentially heat-cut the solder of the chip pins; a wire shaft 4 is rotatably connected to the center of the movable block 3, and a movable frame 5 is threadedly connected to the surface of the wire shaft 4 for adjusting the lifting and lowering of the movable frame, so that the metal wire can be closely attached to the integrated circuit board for chip cutting and disassembly; guide rails 6 are fixedly connected to the front and rear sides of the top of the movable frame 5, and sliders 7 are slidably connected to the two sides of the guide rails 6, and a bracket 8 is fixedly connected to the bottom center of the slider 7, and the bottom of the bracket 8 is rotatably connected to The roller 9 is used for guiding the metal wire; the surface of the roller 9 is rollingly connected with a metal wire 10 for hot-melt cutting of chip pin solder to facilitate chip disassembly; both sides of the metal wire 10 are sleeved with electric heating sleeves 11 for heating the metal wire; the electric heating sleeves 11 are fixed on the bracket 8, and both ends of the metal wire 10 are fixedly connected with tension springs 12, and the top ends of the tension springs 12 are respectively fixedly connected to the sliders 7 on both sides for tightening the tension of the metal wire; one side of the slider 7 is threadedly connected with a screw rod 13, and the screw threads on both sides of the screw rod 13 have opposite spiral directions, which are used for relative movement control of the sliders on both sides, which is convenient for adjusting the cutting length of the metal wire and can be flexibly adjusted according to the size of the chip, thereby improving the flexibility of the device.

[0021] In this embodiment, please refer to Figure 2 The surface of the movable frame 5 and both sides of the wire shaft 4 are slidably connected with guide pillars 14 to guide the movement of the movable frame and ensure the stability of the movement; the bottom of the guide pillars 14 is fixedly connected with a control switch 15, and the control switch 15 is electrically connected to the electric heating sleeves 11 on both sides, and is used for synchronous switch control of the electric heating sleeves on both sides and connection to an external power supply.

[0022] In this embodiment, please refer to Figure 1 A knob 16 is fixedly connected to the top of the thread shaft 4 for rotating the thread shaft; a handle 17 is fixedly connected to the center of the screw rod 13 for rotating the screw rod.

[0023] In this embodiment, please refer to Figure 1The surface of the movable frame 5 and the position corresponding to the bracket 8 are provided with movable grooves 18 to meet the design requirements of the movable structure of the bracket.

[0024] The working principle of the utility model is as follows: when in use, the working frame 1 is placed on the integrated circuit board 19 and covered on the outside of the chip 20, and then the handle 17 is rotated according to the size of the chip to be disassembled, and the handle 17 drives the screw rod 13 to rotate, and then the two sides of the screw rod 13 are synchronously driven to move relative to each other along the guide rail 6 by means of the opposite rotation of the threads on both sides of the screw rod 13, so as to adjust the length of the metal wire 10. After the adjustment is completed, the wire shaft 4 can be driven to rotate by the knob 16, and the wire shaft 4 drives the movable frame 5 to move downward, thereby synchronously driving the metal wire 10 to move downward until it is in contact with the surface of the integrated circuit board 19, and then the external power supply of the control switch 15 is turned on, and the control switch 15 is started to make the electric heating sleeves 11 on both sides work to heat the metal wire 10, and then the movable block 3 is slowly pushed horizontally along the guide rod 2 to move the heated metal wire 10 from one end of the chip 20 to the other end, so that the solder on the bottom pin of the chip 20 is hot-melted and separated by the heated metal wire 10, so as to achieve the purpose of rapid disassembly of the chip to be disassembled.

[0025] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions. The sentence "includes an element defined by ... does not exclude the existence of other identical elements in the process, method, article or device including the element".

[0026] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A device for quickly disassembling an integrated circuit chip, comprising a work frame (1), characterized in that: The top center of the working frame (1) is symmetrically fixedly connected with a guide rod (2), the surface of the guide rod (2) is slidably connected with a movable block (3), the center of the movable block (3) is rotatably connected with a threaded shaft (4), the surface of the threaded shaft (4) is threadedly connected with a movable frame (5), the front and rear sides of the top of the movable frame (5) are fixedly connected with guide rails (6), both sides of the guide rails (6) are slidably connected with sliders (7), the bottom center of the slider (7) is fixedly connected with a bracket (8), and the bottom of the bracket (8) is embedded with a rotating A roller (9) is movably connected, a metal wire (10) is rollingly connected to the surface of the roller (9), both sides of the metal wire (10) are sleeved with electric heating sleeves (11), the electric heating sleeves (11) are fixed on the bracket (8), both ends of the metal wire (10) are fixedly connected with tension springs (12), the top ends of the tension springs (12) are respectively fixedly connected to sliders (7) on both sides, one side of the slider (7) is threadedly connected with a screw rod (13), and the spiral directions of the threads on both sides of the screw rod (13) are opposite.

2. The integrated circuit chip quick disassembly device according to claim 1, characterized in that: The surface of the movable frame (5) and both sides of the wire shaft (4) are slidably connected with guide pillars (14), and the bottom of the guide pillars (14) is fixedly connected with a control switch (15), and the control switch (15) is electrically connected to the electric heating sleeves (11) on both sides.

3. The integrated circuit chip quick disassembly device according to claim 1, characterized in that: The top of the thread shaft (4) is fixedly connected with a knob (16), and the center of the threaded rod (13) is fixedly connected with a handle (17).

4. The integrated circuit chip quick disassembly device according to claim 1, characterized in that: Movable grooves (18) are provided on the surface of the movable frame (5) at positions corresponding to the bracket (8).

Images