Silicon wafer feeding mechanism
By using the structure of base, substrate and alignment push plate in the silicon wafer loading mechanism, combined with the signal notification system of multiple sensors, automatic regularization of silicon wafers of various types and sizes is achieved, solving the problem of fragility of silicon wafers during the sampling inspection process, and improving the quality and production efficiency of silicon wafers.
Patent Information
- Application Number
- CN202420037963.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-08
- Publication Date
- 2025-03-21
- Estimated Expiration
- 2034-01-08
AI Technical Summary
The existing silicon wafer loading mechanism cannot automatically regulate silicon wafers of multiple types and sizes, resulting in bumps and fragments that are prone to occur during the sampling inspection of the silicon wafers.
A silicon wafer feeding mechanism is designed, adopting a structure of a base, substrate and aligning push plate. Multiple sensors are provided on the substrate. The sensor turns on the signal when replacing the silicon wafer, informing the alignment push plate to move simultaneously to achieve the regularization of the silicon wafer.
The mechanism can automatically identify and sort silicon wafers of different shapes and sizes, ensuring that the silicon wafers are not fragile during the regularization process, and improving the quality and production efficiency of the silicon wafers.
Smart Images
Figure CN222647117U_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the technical field of silicon wafer loading, and in particular, relates to a silicon wafer loading mechanism. Background Art
[0002] Existing silicon wafer loading mechanisms are mostly used to regularize silicon wafers of a single size and shape, such as all square or all rectangular silicon wafers. Existing silicon wafers are square or rectangular in various sizes. In order to improve production efficiency, each production line will not produce silicon wafers of a certain size alone, but will process silicon wafers of various types and sizes. Existing loading mechanisms cannot adapt to the regularization of silicon wafers of various sizes.
[0003] The existing sampling inspection equipment is also unable to adapt to the sampling inspection of silicon wafers of different sizes. At the same time, before taking out the material or after the sampling inspection is completed, the silicon wafers placed in the sampling inspection bin are placed in bulk, which makes the silicon wafers easy to bump and cause fragments. Although the sampling inspection itself is to improve its yield rate and reduce fragments, the fragments of the silicon wafers placed directly in bulk directly affect the effect of the sampling inspection. Summary of the invention
[0004] The present application provides a silicon wafer feeding mechanism, which solves the technical problems in the prior art that silicon wafers of various types and sizes cannot be automatically sorted, and that random inspection results in fragments due to the inability to sort.
[0005] In order to solve at least one of the above technical problems, the technical solution adopted in this application is:
[0006] A silicon wafer feeding mechanism, comprising:
[0007] Base,
[0008] A substrate, placed on the base, for carrying the silicon wafer;
[0009] The alignment push plates are placed on the base and arranged on both sides of the base plate, and can move towards / backward synchronously;
[0010] A plurality of sensors are arranged on the substrate, and the sensors at different positions can start signals when the silicon wafer is replaced to notify the corresponding alignment push plates to move in the first direction and / or the second direction on both sides of the substrate.
[0011] Furthermore, the positions of all the sensors are different;
[0012] Preferably, the periphery of the substrate is provided with two groups of alignment grooves, and the alignment grooves are all stepped grooves;
[0013] Preferably, the length and depth of one set of alignment grooves are smaller than the length and depth of the other set of alignment grooves;
[0014] Preferably, the alignment grooves with smaller length and depth are arranged along the first direction.
[0015] Furthermore, a pad matched with the structure of the substrate is provided on the substrate, and a through hole corresponding to the position of the sensor is constructed on the pad.
[0016] Furthermore, the alignment push plate is connected via a connecting assembly arranged on the base and pivotally connected to the base; a cylinder for driving the alignment push plate to move is arranged on one side of the base close to the base plate, and the cylinder is slidably connected to the connecting assembly;
[0017] Preferably, the connection components connected to the two sets of alignment push plates are disposed on the upper and lower sides of the base.
[0018] Furthermore, the connecting assembly arranged along the first direction is placed on the side of the base close to the base plate, and includes a pivot member 1 and a connecting rod 1 hinged to both ends of the pivot member 1, and the other end of the connecting rod 1 is respectively connected to the alignment push plate;
[0019] Preferably, the connecting assembly arranged along the second direction is placed on a side of the base away from the base plate, and comprises a second pivot member and a second connecting rod hinged to both ends of the second pivot member, and the other end of the second connecting rod passes through a guide groove arranged on the base and is connected to the alignment push plate arranged along the second direction;
[0020] Preferably, the connecting assembly for driving the alignment push plate arranged along the second direction can move along the length direction of the guide groove;
[0021] Preferably, the first pivot member and the second pivot member are coaxially connected to the base and are cross-arranged.
[0022] Furthermore, a cylinder for distinguishing between a whole piece and a half piece is provided on the side of the base close to the second connecting rod. The cylinder extends or contracts along the first direction through the third connecting rod to adjust the length of the second connecting rod moving along the guide groove close to its nearest side, thereby adjusting the movement displacement of the counter-positioning push plate moving along the second direction toward / away from each other.
[0023] Furthermore, the alignment push plates are all constructed as U-shaped structures, and elastic pads are provided on their inner sides;
[0024] A plurality of long holes are also provided on the alignment push plate along the second direction, which are connected to a vacuum generator provided on the base for extracting air from inside the silicon wafer through a pipeline;
[0025] Preferably, a limiting rod for adjusting the first direction alignment push plate and the second direction alignment push plate is also provided on the base.
[0026] A silicon wafer loading mechanism designed by the present application is used to regularize silicon wafers of different shapes and sizes. It can regularize based on the shape requirements of different silicon wafers, identify silicon wafers and automatically adjust, and can regularize on one side or both sides. It has a simple structure and is easy to control, has a good and stable regularization effect, and can also ensure the quality of the silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] Figure 1 is a three-dimensional diagram of a feeding mechanism according to an embodiment of the present application;
[0028] Figure 2 is a top view of a feeding mechanism according to an embodiment of the present application;
[0029] Figure 3 is a schematic diagram of the distribution of sensor positions on a substrate according to an embodiment of the present application;
[0030] Figure 4 It is a schematic diagram of connecting components in the first direction and the second direction of an embodiment of the present application.
[0031] In the figure:
[0032] 10. base 20, substrate 21, groove
[0033] 22, sensor 23, pad 30, alignment push plate 1
[0034] 31. Cylinder 1 32. Pivot 1 33. Connecting rod 1
[0035] 34, slider 1, 35, limit rod 1, 40, alignment push plate 2
[0036] 41. Cylinder 2 42. Pivot 2 43. Connecting rod 2
[0037] 44. Vertical rod 45. Slider 2 46. Guide rail
[0038] 47. Guide groove 48. Cylinder three 49. Connecting rod three
[0039] 410, limit rod 2 411, speed regulating valve 412, long hole
[0040] 413. Vacuum generator DETAILED DESCRIPTION
[0041] The present application is described in detail below with reference to the accompanying drawings and specific embodiments.
[0042] This embodiment provides a silicon wafer loading mechanism, such as Figure 1As shown, there is a base 10, a substrate 20 for carrying silicon wafers and an alignment push plate for aligning silicon wafers, wherein the substrate 20 and the alignment push plate are both arranged on the base 10. The alignment push plate includes an alignment push plate 1 30 moving along a first direction and an alignment push plate 2 40 moving along a second direction, which are respectively arranged on both sides of the substrate 20 and can move synchronously toward / backward. A plurality of sensors 22 are arranged on the substrate 10, and the sensors 22 at different positions can turn on signals when replacing silicon wafers to notify the corresponding alignment push plates to move in the first direction and / or the second direction on both sides of the substrate 10. In this embodiment, the first direction is set along the length direction of the base 10; the second direction is set along the width direction of the base 10; and the third direction is set along the direction of the stacking height of the silicon wafers, that is, the direction perpendicular to the plane of the substrate 20.
[0043] Furthermore, the substrate 20 is a flat surface, and two groups of alignment grooves 21 are formed on its periphery. The alignment grooves 21 are all stepped grooves. The stepped groove structure can facilitate the movement of the alignment push plate, and also facilitate the robot to load and unload silicon wafers onto the substrate 20.
[0044] In this embodiment, the length and depth of one group of alignment grooves 21 are smaller than the length and depth of the other group of alignment grooves 21, that is, the length and depth of the grooves 21 corresponding to the alignment push plate 1 30 are smaller than the length and depth of the grooves 21 corresponding to the alignment push plate 2 40; that is, the length and depth of the grooves 21 arranged along the width direction of the base 10 are greater than the length and depth of the grooves 21 arranged along the length direction of the base 10. Based on the above structure, the substrate 20 is an "X"-shaped structure as a whole, so that platforms are provided in the middle position of the substrate 20 and at its four ends, while ensuring the stability of the placement of the silicon wafer, the area on the substrate 20 can be minimized to avoid the robot.
[0045] like Figure 2 As shown, the depth of the groove 21 corresponding to the second alignment push plate 40, i.e., its depth along the second direction, is less than 1 / 2 of the maximum length of the substrate 20 along the second direction, and is also greater than its minimum width along the second direction. The length of the groove 21 corresponding to the second alignment push plate 40, i.e., its length along the first direction, is less than the maximum length of the substrate 20 along the second direction, and is greater than 1 / 2 of the maximum length of the substrate 20 along the second direction.
[0046] The depth of the groove 21 corresponding to the positioning push plate 30, that is, its length along the first direction, is less than 1 / 3 of the maximum length of the substrate 20 along the first direction; the depth of the groove 21 corresponding to the positioning push plate 30, that is, its length along the second direction, is less than the maximum length of the substrate 20 along the second direction and greater than 1 / 3 of the maximum length of the substrate 20 along the second direction.
[0047] like Figure 3As shown, at least two sensors 22 are provided on the substrate 20, and the positions of all sensors 22 are different. Of course, more positions for installing sensors 22 can also be provided. The combination mode can be arranged based on the number of sensors 22, and then silicon wafers of different silicon wafer sizes can be matched with sensors 22 of different combination modes, so that different numbers of sensors 22 can correspond to silicon wafers of different sizes. When the silicon wafer needs to be replaced, the corresponding program is selected from the system (omitted in the figure) that controls the feeding mechanism to control the start of a certain combination of sensors 22. After the system receives the start signal of the combined sensor 22, it notifies the corresponding alignment push plate to start regularizing the silicon wafer, and continues to regularize the silicon wafer of this type and size repeatedly until the silicon wafer of the next type and size is replaced.
[0048] In this embodiment, four sensors 22 are provided. If they are numbered, sensors 22 No. 1 and No. 2 are provided at the middle position of the substrate 20, and sensors 22 No. 3 and No. 4 are provided at two corner ends of one side along the first direction of the substrate 20. Sensors 22 with different serial numbers can be flexibly provided to form a combination to correspond to silicon wafers of different sizes and types, and the size of the silicon wafer can be preset in advance, so as to preset and adjust the clamping position of the alignment push plate in advance, so that the alignment push plate can be used to accurately clamp and regularize the silicon wafer, and the technical purpose of regularizing square or rectangular silicon wafers of different sizes and specifications on the same substrate 20 can be achieved.
[0049] The types and sizes of silicon wafers corresponding to different combinations of sensors 22 are shown in Table 1. As can be seen from Table 1, sensors 22 No. 1, 2 and 4 form a group, and the corresponding silicon wafer size is 210mm×210mm in square specifications; sensors 22 No. 1, 2, 3 and 4 form a group, and the corresponding silicon wafer size is 182mm×182mm in square specifications; sensors 22 No. 1, 2 and 3 form a group, and the corresponding silicon wafer size is 210mm×182mm in rectangular specifications; sensors 22 No. 1 and 2 form a group, and the corresponding silicon wafer size is 210mm×105mm in rectangular specifications; sensor 22 No. 1 independently forms a group, and the corresponding silicon wafer size is 210mm×91mm in rectangular specifications; sensor 22 No. 2 independently forms a group, and the corresponding silicon wafer size is 182mm×91mm in rectangular specifications. Of course, there are more combinations formed by different numbers of sensors 22 corresponding to different silicon wafer sizes. This combination formed by the number of sensors 22 to correspond to different silicon wafer sizes will not only prevent program errors, but also ensure the accuracy of all tooling work. The corresponding program is preset in the system control program in advance. When the silicon wafer needs to be regularized, the corresponding program corresponding to the silicon wafer size is switched and called out in the system in advance. The sensor group corresponding to the silicon wafer size specification preset in the program will automatically trigger the corresponding combination of sensors 22 to synchronize the start signal and display the indicator light on when the silicon wafer is placed on the pad 23 on the substrate 20. If the sensors 22 of other serial numbers are started, the system will default to an error signal.
[0050] Table 1 Silicon wafers of different sizes corresponding to different sensor combinations
[0051]
[0052] The substrate 20 is also provided with a pad 23 that matches its structure, and a through hole corresponding to the position of the sensor 22 is constructed on the pad 23. The size of the through hole on the pad 23 is slightly larger than the size used for the sensor 22, which is not only convenient for observation but also for installation. Accordingly, in order to better regulate silicon wafers of various specifications, the position of the through hole on the pad 23 can be avoided at the position where the sensor 22 may be installed on the substrate 20. As shown in the figure in this embodiment, it can be seen that the number of through holes on the pad 23 is greater than the number of sensors 22. The pad 23 is a partition made of resin material to separate the silicon wafer from the metal substrate 20 to avoid metal particle contamination of the silicon wafer.
[0053] like Figure 4As shown, since the base 10 is a rectangular bottom plate, the installation space of the driving assembly for controlling the movement of the alignment push plate is very limited, which requires the design of a flexible and highly accurate connecting assembly to connect the cylinder 1 31 and the alignment push plate 1 30 together, and to connect the cylinder 2 32 and the alignment push plate 2 40 together, and the two sets of connecting assemblies do not interfere with each other and can be coaxially pivoted with the base 10. At the same time, the connecting assemblies connected to the two sets of alignment push plates are respectively placed on the upper and lower sides of the base 10, that is, the connecting assemblies connected to the alignment push plate 1 30 and the connecting assemblies connected to the alignment push plate 2 40 are respectively placed on the upper and lower sides of the base 10.
[0054] Furthermore, the two groups of alignment push plates are connected through connection components independently arranged on the base 10 and coaxially pivoted with the base 10; and two cylinders for driving the two groups of alignment push plates to move are provided on one side of the base 10 close to the base plate 20, namely, cylinder 1 31 and cylinder 2 41, which are respectively used to control the alignment push plate 1 30 and the alignment push plate 2 40. Cylinder 1 31 is slidably connected to the connection component connected to the pivot 1 32, and cylinder 2 41 is slidably connected to the connection component connected to the pivot 2 42, wherein cylinder 1 31 is a sliding table cylinder, and cylinder 2 41 is a cylindrical cylinder.
[0055] The connection assembly arranged along the first direction is placed on the side of the base 10 close to the base plate 20, that is, the alignment push plate 30 arranged along the length direction of the base 10, and the connection assembly connected thereto is also arranged along the length direction of the base 10, and the connection assembly connected to the alignment push plate 30 is arranged above the base 10. The connection assembly includes a pivot 32 and two connecting rods 33 hinged at both ends of the pivot 32, and the other ends of the two connecting rods 33 away from the pivot 32 are respectively hinged to the fixed plate 1 or the slider 34 for mounting the alignment push plate 30, the cylinder 31 is arranged just below the fixed plate 1 and fixed to the upper end surface of the base 10; the slider 34 is arranged on the side away from the cylinder 31 and fixed to the base block arranged on the upper end surface of the base 10. That is, one of the single-sided push plates drives the fixed plate 1 to move along the first direction through the cylinder 1 31; the cylinder 1 31 then drives the connecting rod 1 33 hinged thereto to rotate through the fixed plate 1, and then drives the other connecting rod 1 33 to rotate through the pivot 1 32 to drive the slider 1 34 to slide, thereby driving the other single-sided push plate to move, thereby realizing the synchronous movement of the positioning push plate 1 30.
[0056] The cylinder 131 drives the alignment push plate 130 synchronously through the fixed plate 1 and the slider 134 along the first direction to drive the two connecting rods 133 through the pivot 132 along the axial direction of the pivot 132 and the base 10 to rotate synchronously in opposite directions, so as to drive the alignment push plate 130 to move synchronously toward one side of the silicon wafer, shrink the horizontal distance in the first direction, and regularize the silicon wafer. Alternatively, the cylinder 131 drives the alignment push plate 130 through the fixed plate 1 along the first direction to drive the two connecting rods 133 through the pivot 132 along the axial direction of the pivot 132 and the base 10 to rotate synchronously in the opposite direction, so as to drive the alignment push plate 130 to move away from the silicon wafer, expand the horizontal distance in the first direction, and loosen the silicon wafer.
[0057] Long strip mounting holes are provided on the fixed plate 1 and the slider 1 35 along the first length direction for adjusting the mounting position of the alignment push plate 1 30 to adjust the length of its movement toward / away from each other, thereby adapting to the movement dimensions of different silicon wafer sizes.
[0058] At the same time, a limit rod 35 for adjusting the position of the alignment push plate 30 is also provided on the side close to the cylinder 31. The limit rod 35 is arranged along the first direction and moves toward the side close to the alignment push plate 30 and is arranged outside one side of the cylinder 31. It is fixed to the tail of the fixed plate 1 connected to the cylinder 31. Before the feeding mechanism is used, the position of the alignment push plate 30 needs to be positioned and adjusted. The movement of the cylinder 31 drives the limit rod 35 to move together, and then the limit rod 35 pushes against the position of the push plate on the same side to adjust the accurate position of the push plate. The cylinder 31 controls the extension and retraction speed of the cylinder 31 through the airflow size in the speed regulating valve 411 arranged near the limit rod 35.
[0059] Correspondingly, the connection assembly arranged along the second direction is placed on the side of the base 10 away from the base 20, that is, the connection assembly for connecting the alignment push plate 2 40 is arranged below the base 10, wherein the cylinder 2 41 for driving the alignment push plate 2 40 is arranged above the base 10. The cylinder 2 41 is arranged on the base 10 away from the cylinder 1 31 along the second direction, and is arranged close to the slider 1 34, and is located between the slider 1 34 and the base 20, and is located below the alignment push plate 1 30 to avoid interfering with the working movement of the alignment push plate 1 30.
[0060] The connecting assembly connected to the alignment push plate 2 40 includes a pivot 2 42 and a connecting rod 2 43 hinged at both ends of the pivot 2 42. The end of the connecting rod 2 43 away from the pivot 2 42 is connected to a slider 2 45 for fixing the alignment push plate 2 40 through a vertical rod 44 penetrating a guide groove 47 configured on the base 10. The guide groove 47 arranged for alignment is arranged in the width direction of the base 10, and the vertical rod 44 passes through the guide groove 47 and can move along the length direction thereof. The vertical rod 44 is fixedly connected to the slider 2 45, which is hinged to the connecting rod 2 43. The alignment push plate 2 40 is fixed to the front end of the slider 2 45, and the slider 2 45 slides along a guide rail 46 arranged on the base 10. The guide rail 46 is arranged along the width direction of the base 10, and the guide rails 46 on both sides are arranged relative to each other in a staggered manner.
[0061] The output end of the second cylinder 41 is fixed to a fixed block integrally connected to the second slider 45 through a connecting folding block, and the vertical rod 44 is also fixed to the fixed block through a folding plate. The second cylinder 41 is extended and retracted to directly drive the second slider 45 connected thereto to slide along the guide rail 46, and at the same time drive the vertical rod 44 on the same side to drive the second connecting rod 43 to rotate, and then drive the other second connecting rod 43 through the second pivot 42 to rotate around the axial direction of the pivot 42 and the base 10 as the axis, so that the other second connecting rod 43 drives the other second slider 45 to slide along the guide rail 46 where it is located through the other vertical rod 44, so as to drive the two side alignment push plates 40 to move away from or towards each other synchronously.
[0062] Preferably, the first pivot member 32 and the second pivot member 42 are coaxially connected to the base 10 and are arranged crosswise. That is, the first pivot member 32 is arranged along the second direction, and drives the first connecting rods 33 on both sides to reciprocate with the connecting axis between the first pivot member 32 and the base 10 as the center and the second direction as the center line; the second pivot member 42 is arranged along the first direction, and drives the second connecting rods 43 on both sides to reciprocate with the connecting axis between the first pivot member 32 and the base 10 as the center and the first direction as the center line, and the second connecting rods 43 on both sides are guided and moved along the length direction of the guide groove 47 respectively.
[0063] The base 10 is also provided with a limit rod 2 410 for adjusting the alignment push plate 2 40. The limit rod 2 410 is arranged near the side where the limit rod 1 35 is located, and is arranged perpendicular to the limit rod 1 35 along the second direction. A vertical adjustment block is arranged on the fixed block on the side of the slider 2 45 arranged on the same side thereof, and the slider 2 45 drives the alignment push plate 2 40 to move toward the side close to the substrate 20, thereby driving the adjustment block to move together, so that it can cooperate with the limit rod 2 410 to adjust the position of the alignment push plate 2 40. That is, before the feeding mechanism is used, the position of the alignment push plate 2 40 needs to be positioned and adjusted, and the cylinder 2 41 moves through the connecting assembly to drive the push plate and the adjustment block arranged on the same side of the limit rod 2 410 to move toward the side close to the substrate 20, and then the limit rod 2 410 abuts against the adjustment block arranged for alignment, thereby indirectly adjusting the position of the alignment push plate 2 40, so as to ensure that the alignment push plate 2 40 is accurately aligned with the width size of the silicon wafer to be measured.
[0064] A cylinder 3 48 for distinguishing a whole piece or a half piece is also provided on the side of the base 10 close to the connecting rod 2 43. The cylinder 3 48 extends or contracts along the first direction through the connecting rod 3 49 to adjust the length of the connecting rod 2 43 near the nearest side thereof moving along the guide groove 47, thereby adjusting the displacement of the positioning push plate 2 40 moving toward / away from each other. The cylinder 3 48 is provided on the side of the base 10 close to the cylinder 2 41, and the cylinder 3 48 is controlled by the speed regulating valve 411 to drive the connecting rod 3 49 to extend and retract along the first direction.
[0065] When the silicon wafer to be regulated is of the whole size, the length of the silicon wafer is set along the first direction, and correspondingly, the width of the silicon wafer is set along the second direction, so the size of the silicon wafer along the width direction of the base 10 is larger. In the initial stage, the distance between the two alignment push plates 40 needs to be increased. In the regulation, although the two cylinders 41 cooperate with the two pivots 42, the two connecting rods 43, the vertical rods 44 and the two sliders 45 to position and fix the two alignment push plates 40, in order to prevent it from inertial sliding, it is necessary to synchronously control the extension of the three cylinders 48 and pass through the gap between the two connecting rods 43 and the base 10 through the three connecting rods 49, and block the two connecting rods 43 at the outermost side of the guide groove 47, so as to ensure the width size range between the two alignment push plates 40.
[0066] When the silicon wafer to be regulated is half the size of the wafer, its length is still set along the first direction, and the width of the silicon wafer is reduced by half or part, and the size of the silicon wafer along the width direction of the base 10 is narrowed accordingly. At the beginning, the distance between the two alignment push plates 40 needs to be reduced compared with the original size of the whole wafer. When regulating, it is only necessary to control the two pivot parts 42, the two connecting rods 43, the vertical rods 44 and the two sliders 45 through the two cylinders 41 to cooperate with each other to position and fix the two alignment push plates 40, and control the three cylinders 48 to withdraw and drive the three connecting rods 49 to stay in place, that is, not to block the moving position of the two connecting rods 43 along the length direction of the guide groove 47, so as to ensure the accuracy of the adjustment of the reduced width size between the two alignment push plates 40.
[0067] All the alignment push plates are constructed as U-shaped structures and are equipped with elastic pads on their inner sides. The purpose is to prevent the metal push plates from directly contacting the side surfaces of the silicon wafers to prevent metal particle contamination.
[0068] Furthermore, in order to improve the fit between adjacent silicon wafers along the height direction of the silicon wafer stack when the silicon wafers are regularized, a plurality of long holes 412 are also provided along the height direction on the alignment push plate 40, which are connected to the vacuum generator 413 provided on the base 10 through a pipeline. The vacuum generator 413 controls the size of the vacuum airflow through the speed regulating valve 411 provided on the side of the alignment push plate 40 away from the substrate 20, and is used to extract the air inside the silicon wafers to make the silicon wafers fit more closely. Accordingly, the width of the U-shaped alignment push plate 40 is larger than that of the alignment push plate 1 30, and the four vertical plates on the alignment push plate 40 are provided with long holes 412, and all the long holes 412 are symmetrically arranged, in order to ensure the stability and consistency of vacuum extraction.
[0069] A silicon wafer loading mechanism designed by the present application is used to regularize silicon wafers of different shapes and sizes. It can regularize based on the shape requirements of different silicon wafers, identify silicon wafers and automatically adjust, and can regularize on one side or both sides. It has a simple structure and is easy to control, has a good and stable regularization effect, and can also ensure the quality of the silicon wafers.
[0070] The above detailed description of the embodiments of the present application is only a preferred embodiment of the present application and cannot be considered to limit the scope of implementation of the present application. All equivalent changes and improvements made within the scope of the present application should still fall within the scope of the patent coverage of the present application.
Claims
1. A silicon wafer feeding mechanism, characterized in that: have: Base, A substrate, placed on a base, for carrying a silicon wafer; The alignment push plates are placed on the base and arranged on both sides of the base plate, and can move towards / backward synchronously; A plurality of sensors are arranged on the substrate, and the sensors at different positions can start signals when the silicon wafer is replaced to notify the corresponding alignment push plates to move in the first direction and / or the second direction on both sides of the substrate.
2. A silicon wafer feeding mechanism according to claim 1, characterized in that: The positions of all said sensors are different.
3. A silicon wafer feeding mechanism according to claim 1 or 2, characterized in that: The periphery of the base plate is provided with two groups of alignment grooves, and the alignment grooves are all stepped grooves.
4. A silicon wafer feeding mechanism according to claim 3, characterized in that: The length and depth of one set of alignment grooves are smaller than the length and depth of the other set of alignment grooves.
5. A silicon wafer loading mechanism according to claim 4, characterized in that: The alignment grooves with smaller length and depth are arranged along the first direction.
6. The silicon wafer feeding mechanism according to claim 1, characterized in that: A pad matched with the structure of the substrate is also provided on the substrate, and a through hole corresponding to the position of the sensor is constructed on the pad.
7. A silicon wafer loading mechanism according to any one of claims 1-2, 4-6, characterized in that: The alignment push plate is connected via a connecting assembly arranged on the base and pivotally connected to the base; a cylinder for driving the alignment push plate to move is arranged on one side of the base close to the base plate, and the cylinder is slidably connected to the connecting assembly.
8. The silicon wafer loading mechanism according to claim 7, characterized in that: The connecting components connected with the two sets of alignment push plates are respectively arranged on the upper and lower sides of the base.
9. A silicon wafer feeding mechanism according to claim 8, characterized in that: The connecting assembly arranged along the first direction is placed on the side of the base close to the base plate, and includes a pivot member 1 and a connecting rod 1 hinged to both ends of the pivot member 1, and the other end of the connecting rod 1 is respectively connected to the alignment push plate.
10. The silicon wafer loading mechanism according to claim 9, characterized in that: The connecting assembly arranged along the second direction is placed on the side of the base away from the base plate, including a second pivot member and a second connecting rod hinged to both ends of the second pivot member. The other end of the second connecting rod passes through a guide groove configured on the base and is connected to an alignment push plate arranged along the second direction.
11. A silicon wafer loading mechanism according to claim 9 or 10, characterized in that: The connecting assembly used for driving the alignment push plate arranged along the second direction can move along the length direction of the guide groove.
12. A silicon wafer loading mechanism according to claim 11, characterized in that: The first pivot member and the second pivot member are coaxially connected to the base and are cross-arranged.
13. A silicon wafer loading mechanism according to claim 12, characterized in that: A cylinder for distinguishing between a whole piece and a half piece is also provided on the side of the base close to the second connecting rod. The cylinder extends or contracts along the first direction through the third connecting rod to adjust the length of the second connecting rod moving along the guide groove close to its nearest side, thereby adjusting the movement displacement of the counter-positioning push plate moving along the second direction toward / away from each other.
14. A silicon wafer loading mechanism according to any one of claims 8-10, 12-13, characterized in that: The alignment push plates are all constructed as U-shaped structures, and elastic pads are provided on their inner sides; A plurality of long holes are also arranged on the alignment push plate along the second direction, which are connected to a vacuum generator arranged on the base for extracting air inside the silicon wafer through a pipeline.
15. A silicon wafer loading mechanism according to claim 14, characterized in that: A limiting rod for adjusting the first direction alignment push plate and the second direction alignment push plate is also provided on the base.