On-board optical port heat dissipation structure

Abstract

The utility model discloses an onboard optical port heat radiation structure. The structure comprises a cabinet; the control panel is arranged in the case; the optical port is arranged on the control panel; the heat dissipation plate is fixedly arranged on the case and located above the optical port, and a heat conduction piece is arranged between the heat dissipation plate and the optical port; and the heat dissipation fan is arranged on the heat dissipation plate and faces the control plate. According to the utility model, the purposes of transferring heat generated by the optical port to the heat dissipation plate by using the heat conduction piece, carrying out large-area heat dissipation by using the heat dissipation plate, and blowing air to the control panel and the optical port by using the heat dissipation fan to greatly reduce the temperature of the optical port after working are achieved, so that the heat dissipation effect of optimizing the high-density optical port is achieved, and the service life of the optical port is prolonged. The technical effects of reducing the temperature after long-time operation and prolonging the service life of the optical port are achieved, and the problems that the heat dissipation condition is poor after a high-density optical port starts to work and the temperature is ultrahigh after long-time operation in the related technology, and the optical port may be damaged are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of optical port heat dissipation, in particular to a board-mounted optical port heat dissipation structure. Background Art

[0002] With the continuous iteration and update of market product forms, users have more and more demands for low-price, multi-network interfaces. To meet the needs of users, some products can have up to 42 onboard optical ports, including 18 electrical ports, 8 10 Gigabit network ports, and 16 Gigabit optical ports. When the 16 Gigabit optical ports are plugged in optical modules and optical fiber cables and start working, the heat increases sharply. The current existing solutions have poor heat dissipation for high-density optical ports after they start working. After long-term operation, the temperature is too high, which may cause damage to the optical ports. Utility Model Content

[0003] The main purpose of the utility model is to provide a board-mounted optical port heat dissipation structure to solve the problem in the related art that the heat dissipation of high-density optical ports is poor after starting to work, and the temperature is too high after long-term operation, which may cause damage to the optical ports.

[0004] In order to achieve the above object, the utility model provides a board-mounted optical port heat dissipation structure, comprising:

[0005] Chassis;

[0006] A control panel, arranged in the chassis;

[0007] An optical port, provided on the control panel;

[0008] A heat sink is fixed on the chassis and located above the optical port, and a heat conducting member is provided between the heat sink and the optical port;

[0009] A heat dissipation fan is arranged on the heat dissipation plate and faces the control board.

[0010] Furthermore, a heat dissipation fan is arranged on a side of the heat dissipation plate close to the light port.

[0011] Furthermore, the heat dissipation fans are arranged in plurality and distributed along the length direction of the heat dissipation plate.

[0012] Furthermore, the heat conducting member includes heat conducting silicone, one side of which is in contact with the surface of the light port, and the other side of which is in contact with the heat dissipation plate.

[0013] Furthermore, a connecting column is provided in the chassis, and the connecting column passes through the control board. The heat sink is provided at the end of the connecting column and is fixed to the connecting column by connecting screws.

[0014] Furthermore, the connecting columns are provided in plurality and distributed along the length direction of the heat sink.

[0015] Furthermore, a heat dissipation fin is arranged on a side of the heat dissipation plate away from the light port.

[0016] Furthermore, the heat dissipation fan is configured to draw the airflow toward the rear end of the optical port.

[0017] Furthermore, a heat dissipation port is provided on the heat dissipation plate, and the heat dissipation fan corresponds to the heat dissipation port. Under the action of the heat dissipation fan, the airflow in the upper space of the heat dissipation plate flows into the lower space of the heat dissipation plate through the heat dissipation port.

[0018] Furthermore, the heat sink is made of copper or aluminum.

[0019] In an embodiment of the utility model, a chassis is provided; a control board is arranged in the chassis; an optical port is arranged on the control board; a heat sink is fixedly arranged on the chassis and located above the optical port, a heat conductor is arranged between the heat sink and the optical port; a cooling fan is arranged on the heat sink and faces the control board, so as to achieve the purpose of transferring the heat generated by the optical port to the heat sink by utilizing the heat conductor, dissipating the heat over a large area by utilizing the heat sink, and at the same time, blowing air to the control board and the optical port by utilizing the cooling fan, thereby greatly reducing the temperature of the optical port after work, thereby achieving the technical effect of optimizing the heat dissipation effect of the high-density optical port, reducing the temperature after long-term operation, and increasing the service life of the optical port, thereby solving the problem in the related art that the heat dissipation of the high-density optical port after starting to work is poor, the temperature is too high after long-term operation, and the optical port may be damaged. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The drawings constituting a part of the present invention are used to provide a further understanding of the present invention, so that other features, purposes and advantages of the present invention become more obvious. The drawings and descriptions of the schematic embodiments of the present invention are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0021] Figure 1 It is a schematic diagram of the explosion structure according to an embodiment of the utility model;

[0022] Figure 2 It is a schematic diagram of the structure after the heat dissipation plate and the heat dissipation fan are assembled according to the embodiment of the utility model;

[0023] Figure 3 It is a bottom view structural schematic diagram of the heat dissipation plate and the heat dissipation fan after being assembled according to the embodiment of the utility model;

[0024] Among them, 1 chassis, 2 control board, 3 optical port, 4 connecting column, 5 cooling fan, 6 heat sink, 7 heat conductor. DETAILED DESCRIPTION

[0025] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0026] It should be noted that the terms "first", "second", etc. in the specification and claims of the utility model and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so as to describe the embodiments of the utility model described here.

[0027] In the present invention, the directions or positional relationships indicated by the terms "upper", "lower", "inner", etc. are based on the directions or positional relationships shown in the accompanying drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific direction, or to be constructed and operated in a specific direction.

[0028] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in this utility model can be understood according to specific circumstances.

[0029] In addition, the terms "disposed", "provided with", "connected", "fixed" and the like should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements or components. For those of ordinary skill in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0030] In addition, the term "plurality" shall mean two or more.

[0031] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0032] The existing solutions have poor heat dissipation for high-density optical ports after they start working. After long-term operation, the temperature is too high, which may cause damage to the optical ports.

[0033] To solve the above technical problems, Figures 1 to 3 As shown, the embodiment of the utility model provides a board-mounted optical port heat dissipation structure, including:

[0034] Chassis 1;

[0035] A control panel 2 is arranged in the chassis 1;

[0036] Optical port 3, provided on control board 2;

[0037] The heat sink 6 is fixed on the chassis 1 and is located above the optical port 3. A heat conducting member 7 is provided between the heat sink 6 and the optical port 3.

[0038] The cooling fan 5 is disposed on the cooling plate 6 and faces the control board 2 .

[0039] In this embodiment, the chassis 1 is mainly composed of a plurality of panels, the control board 2 may be a PCB board on which electronic devices are arranged, the control board 2 may be fixed on the inner side of the chassis 1, and the optical port 3 is fixedly connected to the control board 2 and maintains electrical connection with the control board 2. In this embodiment, the optical port 3 is set to be multiple, and the multiple optical ports 3 are distributed according to their types, and the overall distribution trend is to be distributed in sequence along the lateral direction of the control board 2. At some positions, in order to meet the use requirements, some optical ports 3 are arranged in a stacked manner. In this embodiment, there is no restriction on the specific distribution form of the optical ports 3, and those skilled in the art can arrange them according to actual use requirements.

[0040] The heat sink 6 and the cooling fan 5 are mainly used as the heat dissipation structure for the optical port 3. Among them, the heat sink 6 is roughly a plate-like structure with a large area. It is fixed in the chassis 1 and is located above the control board 2. There is a certain distance between the heat sink 6 and the control board 2. The heat sink 6 is made of copper or aluminum. In order to enable the heat generated by the operation of the optical port 3 to be efficiently transferred to the heat sink 6, a heat conductor 7 is arranged between the heat sink 6 and the optical port 3 in this embodiment. The heat conductor 7 is a kind of heat-conducting medium, which can adopt a solid heat-conducting medium, such as thermally conductive glue, thermally conductive silica gel or other liquid heat-conducting medium, etc. The arrangement of the heat conductor 7 can fill the gap between the heat sink 6 and the optical port 3, so that the heat generated by the optical port 3 can be better transferred to the heat sink 6, thereby utilizing the larger surface area of ​​the heat sink 6 for heat dissipation.

[0041] On this basis, in order to further increase the heat dissipation effect in this embodiment, a heat dissipation fan 5 is also installed on the heat dissipation plate 6. After being arranged toward the control board 2, the heat dissipation fan 5 can accelerate the flow of the airflow near the control board 2 and the optical port 3. For example, the heat dissipation fan 5 can be set as a blowing fan, which can blow air to the optical port 3 and the position connected to the optical port 3 on the control board 2, thereby reducing the temperature of the optical port 3. For another example, the heat dissipation risk can be set as an exhaust fan, which can extract the hot air near the optical port 3 and allow the external cold air to enter, thereby reducing the temperature of the optical port 3. The specific heat dissipation risk of this embodiment is not limited here, and those skilled in the art can design it according to actual needs.

[0042] In one arrangement embodiment of the cooling fan 5, the cooling fan 5 is arranged on a side of the heat sink 6 close to the optical port 3. When the optical port 3 has a high density, the cooling fan 5 is arranged in plurality and distributed along the length direction of the heat sink 6 to further improve the cooling effect.

[0043] In one embodiment of the heat conducting member 7, the heat conducting member 7 includes heat conducting silicone, one side of which is in contact with the surface of the optical port 3, and the other side of which is in contact with the heat dissipation plate 6. In this embodiment, the heat conducting silicone can completely cover the upper end surface of the optical port 3, thereby maximizing the heat transfer efficiency.

[0044] In order to improve the installation stability of the heat sink 6, a connecting column 4 is provided in the chassis 1 in this embodiment, the connecting column 4 passes through the control board 2, and the heat sink 6 is provided at the end of the connecting column 4 and fixed to the connecting column 4 by connecting screws. Further, the connecting column 4 is provided in plurality and distributed along the length direction of the heat sink 6.

[0045] In order to improve the heat dissipation effect of the heat dissipation plate 6 , a heat dissipation fin is provided on the side of the heat dissipation plate 6 away from the light port 3 in this embodiment.

[0046] In an implementation manner of the heat dissipation fan 5 , the heat dissipation fan 5 is configured as a blowing fan, that is, the heat dissipation fan 5 is configured to be able to draw the airflow toward the rear end of the optical port 3 .

[0047] On the basis that the heat dissipation fan 5 is set as a blowing fan, the heat dissipation fan 5 can be a structure with lateral air intake and axial air outlet, so that the optical port 3 can be blown to dissipate heat. In another embodiment, the heat dissipation fan 5 can be set as an axial flow risk, that is, an axial air intake and axial air outlet are adopted. Specifically, in this embodiment, a heat dissipation port is opened on the heat dissipation plate 6, and the heat dissipation fan 5 corresponds to the heat dissipation port. Under the action of the heat dissipation fan 5, the airflow in the upper space of the heat dissipation plate 6 flows into the lower space of the heat dissipation plate 6 through the heat dissipation port.

[0048] In this embodiment, when the heat sink 6 blocks the top of the light port 3, the temperature of the lower space of the heat sink 6 will be higher than the temperature of the upper space of the heat sink 6. Therefore, in this embodiment, a heat dissipation port is opened on the heat sink 6. Under the action of the heat dissipation fan 5, the cold air in the upper space of the heat sink 6 can enter the lower space of the heat sink 6 through the heat dissipation port, that is, enter the area near the light port 3, so that the light port 3 can be better cooled.

[0049] The above description is only the preferred embodiment of the utility model and is not intended to limit the utility model. For those skilled in the art, the utility model may have various modifications and changes. Within the spirit and principle of the utility model, any modification, equivalent replacement, improvement, etc. made shall be included in the protection scope of the utility model.

Claims

1. A board-mounted optical port heat dissipation structure, characterized in that: include: Chassis; A control panel, arranged in the chassis; An optical port, provided on the control panel; A heat sink is fixed on the chassis and located above the optical port, and a heat conducting member is provided between the heat sink and the optical port; A heat dissipation fan is arranged on the heat dissipation plate and faces the control board.

2. The onboard optical port heat dissipation structure according to claim 1, characterized in that: The heat dissipation fan is arranged on a side of the heat dissipation plate close to the light port.

3. The board-mounted optical port heat dissipation structure according to claim 2, characterized in that: The heat dissipation fans are arranged in plurality and distributed along the length direction of the heat dissipation plate.

4. The board-mounted optical port heat dissipation structure according to claim 1, characterized in that: The heat-conducting component includes heat-conducting silica gel, one side of which is in contact with the surface of the light port, and the other side of which is in contact with the heat dissipation plate.

5. The board-mounted optical port heat dissipation structure according to claim 1, characterized in that: A connecting column is arranged in the chassis, and the connecting column passes through the control board. The heat sink is arranged at the end of the connecting column and is fixed on the connecting column by connecting screws.

6. The board-mounted optical port heat dissipation structure according to claim 5, characterized in that: The connecting columns are arranged in plurality and distributed along the length direction of the heat dissipation plate.

7. The board-mounted optical port heat dissipation structure according to claim 1, characterized in that: A heat dissipation fin is arranged on a side of the heat dissipation plate away from the light port.

8. The board-mounted optical port heat dissipation structure according to claim 1, characterized in that: The heat dissipation fan is configured to draw airflow toward the rear end of the optical port.

9. The board-mounted optical port heat dissipation structure according to claim 8, characterized in that: The heat dissipation plate is provided with a heat dissipation port, and the heat dissipation fan corresponds to the heat dissipation port. Under the action of the heat dissipation fan, the airflow in the upper space of the heat dissipation plate flows into the lower space of the heat dissipation plate through the heat dissipation port.

10. The board-mounted optical port heat dissipation structure according to any one of claims 1 to 9, characterized in that: The heat sink is made of copper or aluminum.

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