Mini LED backlight circuit board and display screen

Abstract

The utility model discloses a Mini LED backlight circuit board and a display screen, the circuit board comprises an insulation substrate, an LED positive electrode power supply circuit, a negative electrode circuit and a driving chip bonding pad, one surface of the insulation substrate is a bonding pad circuit arrangement surface, a plurality of Mini LED chip bonding pads are arranged on the bonding pad circuit arrangement surface, and the Mini LED chip bonding pads are arranged on the bonding pad circuit arrangement surface. The LED positive electrode power supply circuit and the LED negative electrode circuit are both arranged on the bonding pad circuit arrangement face, the driving chip bonding pad is arranged on the bonding pad circuit arrangement face or the outer portion of the insulating substrate, a driving chip is welded to the driving chip bonding pad, and all the Mini LED chip bonding pads are arranged along the LED positive electrode power supply circuit and / or the LED negative electrode circuit. And each circuit is connected with the bonding pad through a single-sided circuit technology, so that the usage amount of materials is reduced, and the production process is simplified. And the single-sided circuit technology is adopted, so that the manufacturing cost is saved, the manufacturing process is simplified, and the production efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a Mini LED backlight circuit board and a display screen. BACKGROUND

[0002] With the progress of display technology, Mini LED backlight technology, as a new backlight technology, has shown significant advantages in the application of LCD display. Compared with traditional side-in or direct backlight technology, Mini LED backlight technology realizes multi-zone dimming, which not only improves display brightness and contrast, but also reduces energy consumption and provides better color performance. However, in order to achieve these advantages, Mini LED backlight technology faces some challenges in the manufacturing process, especially the increase in cost and complexity.

[0003] Currently, Mini LED backlight technology mainly relies on a double-layer substrate structure. This is because Mini LED chips, driving ICs and other electronic components need to have their own space for installation, which is difficult to achieve on a single-layer board and requires a double-layer structure to carry separately, and in order to ensure electrical safety and signal integrity, sufficient isolation measures are needed to prevent interference between different functional components, so Mini LED chips and driving chip ICs and other electronic components usually need to be arranged on different layers. This off-plane arrangement increases the manufacturing difficulty, resulting in high material costs. In addition, as the number of partitions increases, the complexity of the control system also rises. SUMMARY

[0004] In order to overcome at least one of the deficiencies of the prior art described above, the present application provides a Mini LED backlight circuit board and a display screen, which can solve the problem of high manufacturing difficulty and high cost caused by off-plane arrangement of components and circuits.

[0005] The technical scheme adopted by the present application to solve the problems is:

[0006] A Mini LED backlight circuit board, comprising:

[0007] An insulating substrate, one side of the insulating substrate is a pad circuit arrangement surface, a plurality of Mini LED chip pads are provided on the pad circuit arrangement surface, and all the Mini LED chip pads are arranged on the pad circuit arrangement surface;

[0008] An LED anode power circuit, provided on the pad circuit arrangement surface;

[0009] A negative electrode circuit, provided on the pad circuit arrangement surface;

[0010] a driving chip pad arranged outside the pad circuit arrangement surface or the insulating substrate, and a driving chip welded on the driving chip pad;

[0011] The LED anode power supply circuit is electrically connected with the cathode circuit, all the Mini LED chip pads are arranged along the LED anode power supply circuit and / or the cathode circuit, and all the Mini LED chip pads are electrically connected with the driving chip.

[0012] By adopting the above scheme, the LED anode power supply circuit, the cathode circuit and the Mini LED chip pads are all arranged on the pad circuit arrangement surface, thereby avoiding the need for a double-layer board structure, reducing material costs. The single-sided circuit technology orderly connects the driving chip pads and the Mini LED chip pads according to the wiring requirements, thereby reducing the amount of material used and simplifying the production process. The single-sided circuit technology not only saves manufacturing costs, but also simplifies the manufacturing process and improves production efficiency.

[0013] Moreover, the LED anode power supply circuit is connected with the Mini LED chip pads and then connected to the cathode circuit, so that a closed loop is not formed on the insulating substrate, thereby avoiding electromagnetic coupling, further reducing the risk of electromagnetic interference in the system and ensuring the quality of signal transmission, thereby providing a basis for the integration of high-density Mini LED chips.

[0014] Further, the LED branch circuit and the driving chip relative to the electrical connection mode of the LED anode power supply circuit and the cathode circuit include one or a combination of the following:

[0015] (1) one end of the LED branch circuit is electrically connected with the LED anode power supply circuit, the other end is electrically connected with the driving chip, and the driving chip is electrically connected with the cathode circuit;

[0016] (2) one end of the LED branch circuit is electrically connected with the cathode circuit, and the other end is electrically connected with the driving chip;

[0017] The LED branch circuit is arranged along at least part of the Mini LED chip pads, so as to supply power to the conductive parts arranged on the Mini LED chip pads arranged along the LED branch circuit.

[0018] By adopting the above scheme, the LED branch circuit is used to connect part or all of the Mini LED chip pads in series / parallel, the wiring is more free, the mutual interference of the circuit branch lines is further reduced, and the arrangement of the LED anode power supply circuit can also be optimized.

[0019] Further, the driving chip pads are arranged on the pad circuit arrangement surface, the pad circuit arrangement surface is divided into a plurality of Mini LED chip pad arrangement partitions, and each Mini LED chip pad arrangement partition is independently arranged, each Mini LED chip pad arrangement partition is provided with the driving chip pad, and each Mini LED chip pad arrangement partition is divided into a plurality of Mini LED chip pad arrangement sub-partitions according to the LED branch circuit electrically connected to the driving chip, the range of each Mini LED chip pad arrangement sub-partition is the arrangement position of the corresponding LED branch circuit of each Mini LED chip pad arrangement sub-partition, and each Mini LED chip pad arrangement sub-partition is independently arranged.

[0020] By adopting the above scheme, the pad circuit arrangement surface is divided into a plurality of Mini LED chip pad arrangement partitions, and each arrangement partition is further divided into a plurality of Mini LED chip pad arrangement sub-partitions, and each is independently arranged, which effectively avoids the crossing of the circuit. Since each partition and sub-partition is independently arranged, the process of punching and other complex processes is not required when designing the wiring, and single-sided wiring can be achieved. In addition, the single-sided wiring design avoids the closed loop existing in the multi-layer circuit board, thereby reducing the electromagnetic coupling phenomenon, ensuring the signal transmission quality, and improving the electromagnetic compatibility of the system.

[0021] Further, one or more branch circuits are arranged between the LED branch circuit and the driving chip.

[0022] When the Mini LED chip pads are arranged on the branch circuit, each branch circuit arranged with the Mini LED chip pads is a Mini LED chip pad arrangement sub-partition.

[0023] By adopting the above scheme, the flexibility of Mini LED chip pad arrangement can be further improved by branch circuit arrangement, and all Mini LED chip pads in the corresponding Mini LED chip pad arrangement sub-partition can be electrically connected by more subdivided branch circuits, thereby achieving independent power supply and control.

[0024] Further, it further comprises:

[0025] A driving chip power circuit is arranged on the pad circuit arrangement surface.

[0026] A driving chip control signal line circuit is arranged on the pad circuit arrangement surface.

[0027] The driving chip pad is arranged on the pad line layout surface, the driving chip power line and the driving chip control signal line are electrically connected with the driving chip, and the driving chip pad is located on the LED branch line.

[0028] By adopting the above scheme, the driving chip pad is arranged on the pad line layout surface, the driving chip power line and the driving chip control signal line are arranged on the pad line layout surface, and the driving chip power line and the driving chip control signal line are connected to the driving chip. In particular, in the AM backlight scheme, only one or two signal lines are required to control multiple Mini LED chips, greatly simplifying the layout difficulty of the driving chip power line and the control signal line, reducing the line complexity, avoiding the electromagnetic interference problem caused by complex wiring, and simplifying the line design to help reduce the mutual interference between signals, improve the stability and reliability of the system.

[0029] Moreover, the driving chip power line and the driving chip control signal line are also arranged on the pad line layout surface. By integrating the driving chip power line and the control signal line on the same surface substrate, the overall circuit design is simplified, the layout of the Mini LED backlight circuit board is more compact and orderly, and the wiring complexity is reduced. Moreover, the single-layer circuit board technology avoids the double-layer board structure, reduces the use of materials, and further reduces the manufacturing cost. At the same time, the simplified design also helps to improve the production efficiency and further reduce the cost.

[0030] Further, the driving chip pad is arranged on the pad line layout surface, the pad line layout surface is divided into a plurality of Mini LED chip pad layout sub-zones, each Mini LED chip pad layout sub-zone is independently arranged, each Mini LED chip pad layout sub-zone is provided with the driving chip pad, and the driving chip power line and the driving chip control signal line are connected in series to all the driving chips.

[0031] By adopting the above scheme, each Mini LED chip pad layout sub-zone is independently arranged, which means that each sub-zone of Mini LED chip can be independently controlled, thereby realizing more delicate local dimming effect and improving the contrast and clarity of the display picture. Each sub-zone is independently provided with the driving chip pad and the corresponding driving chip, the driving chip power line and the control signal line are connected in series to all the driving chips, the circuit design is simplified, and the wiring is more concise.

[0032] Further, the driving chip pad is arranged on the pad line layout surface, the negative electrode line is provided with an extension line, the extension line is connected to the driving chip pad, and is electrically connected with the driving chip.

[0033] By adopting the above scheme, by connecting the same number of Mini LED chip pads of the plurality of LED branch lines to the driving chip pad, uniform current distribution can be ensured, hot spot problems caused by current concentration can be avoided, and the reliability of the system can be improved. Moreover, since the plurality of LED branch lines finally converge at the driving chip pad, if a fault occurs, the problem can be quickly located by detecting the driving chip pad, simplifying the troubleshooting process.

[0034] Further, the insulating substrate comprises:

[0035] a plate body, which is a glass plate, a BT resin substrate, an epoxy resin plate, a silicone resin plate, a polyphthalamide plate, or an ABF plate;

[0036] a pad layer, wherein the driving chip pad and the Mini LED chip pad are arranged on the pad layer;

[0037] a circuit layer, wherein the LED anode power circuit, the cathode circuit, and the LED branch circuit are arranged on the circuit layer;

[0038] wherein one side of the plate body is the pad circuit arrangement surface, and the pad layer and the circuit layer are arranged on the pad circuit arrangement surface.

[0039] By adopting the above scheme, through single-sided circuit design, the manufacturing process can be simplified, the complexity in the manufacturing process can be reduced, thereby improving the production efficiency and reducing the cost. Moreover, more options are provided for the insulating substrate.

[0040] Further, the driving chip pad is arranged outside the insulating substrate, and one end of the cathode circuit is connected with a driving chip constant current output port.

[0041] By adopting the above scheme, since the driving chip pad is not arranged on the insulating substrate, the wiring complexity on the insulating substrate is reduced, the design inside the insulating substrate is simplified, and the layout of the Mini LED chip pad is more flexible. Arranging the driving chip pad outside the substrate helps to reduce electromagnetic interference, ensure the quality of signal transmission, and improve the electromagnetic compatibility of the system.

[0042] Further, the pad circuit arrangement surface of the insulating substrate is provided with a windowing position, and the windowing position is provided with an identification point window or a test point window.

[0043] By adopting the above scheme, the windowing position is arranged on the pad circuit arrangement surface, and the windowing position is provided with an identification point window or a test point window, which can be used as a test point and an identification point.

[0044] Further, multiple windowing positions are arranged along the LED anode power supply line, and / or multiple windowing positions are arranged along the LED branch line, and / or the windowing position is arranged on one side of the driving chip pad.

[0045] By adopting the above scheme, multiple windowing positions are arranged on the LED anode power supply line, which facilitates the testing of the anode power supply line and ensures the correct connection and working state of the power supply line.

[0046] Arranging the windowing position on one side of the driving chip pad not only provides clear position identification during subsequent driving chip installation, but also helps to identify the correct polarity direction, ensuring the correct installation of the driving chip, thereby improving installation precision and efficiency.

[0047] The application also provides a Mini LED display screen, which comprises the above Mini LED backlight circuit board, the Mini LED chip pad is welded with a Mini LED chip, and the driving chip pad is welded with a driving chip.

[0048] By adopting the above scheme, the single-layer circuit board technology not only reduces the material cost, but also reduces the manufacturing cost by simplifying the design, so that the Mini LED display screen is more competitive in price.

[0049] The application also provides a Mini LED backlight circuit board preparation method for preparing the above Mini LED backlight circuit board, comprising the following steps:

[0050] S1, one of a glass plate, a BT resin substrate, an epoxy resin plate, a silicon resin plate, a polyphthalamide plate or an ABF plate is used as the insulating substrate;

[0051] S2, a metal layer is arranged on the pad line arrangement surface of the insulating substrate;

[0052] S3, the LED anode power supply line, the negative line and the LED branch line are arranged on the pad line arrangement surface of the insulating substrate to form a circuit layer;

[0053] S4, multiple Mini LED chip pads are arranged on the pad line arrangement surface, or the Mini LED chip pads and the driving chip pads are arranged at the same time;

[0054] S5, a gold finger area is arranged on the pad line arrangement surface of the insulating substrate for connecting the LED anode power supply line and the negative line of the insulating substrate;

[0055] S6, covering an ink layer above the pad layer and the circuit layer, and ink windows are provided at the LED positive power circuit, the negative circuit, and the LED branch circuit, the Mini LED chip pad, the driving chip pad, and the gold finger area.

[0056] By adopting the above scheme, through the above steps, the manufacturing process of the Mini LED backlight circuit board is simplified, the production difficulty is reduced, and the production efficiency is improved. And by optimizing the circuit design and covering the ink layer, the electromagnetic interference is reduced, and the quality of signal transmission is ensured.

[0057] Further, when the driving chip pad is arranged on the pad layer in the S4 step, the driving chip power circuit and the driving chip control signal line circuit are etched on the circuit layer, and the driving chip power circuit and the driving chip control signal line circuit are connected to the driving chip pad.

[0058] By adopting the above scheme, by arranging the driving chip pad on the pad layer and etching the driving chip power circuit and the control signal line circuit on the circuit layer, the overall layout can be simplified, the circuit is more regular, unnecessary cross-wiring is reduced, and the intermediate link is reduced, improving the reliability and stability of signal transmission. And on the basis of arranging the driving chip pad on the pad layer, the wiring of the designed LED branch circuit can be reduced to reduce electromagnetic interference, ensure the purity of signal transmission, and improve the electromagnetic compatibility of the system.

[0059] In summary, the Mini LED backlight circuit board and display screen provided by the application have the following technical effects:

[0060] 1. The LED positive power circuit, negative circuit, and Mini LED chip pad are arranged on the pad circuit layout surface, avoiding the need for a double-layer board structure, thereby reducing material costs;

[0061] 2. The single-sided circuit technology orderly connects the driving chip pad and the Mini LED chip pad according to the wiring requirements, reducing the amount of material used and simplifying the production process. And using the single-sided circuit technology not only saves manufacturing costs, but also simplifies the manufacturing process and improves production efficiency;

[0062] 3. The LED positive power circuit is connected to the Mini LED chip pad and then connected to the negative circuit, and no closed loop is formed on the insulating substrate, so there is no electromagnetic coupling phenomenon, thereby further reducing the risk of electromagnetic interference in the system and ensuring the quality of signal transmission, thereby providing a basis for the integration of high-density Mini LED chips. BRIEF DESCRIPTION OF DRAWINGS

[0063] Figure 1 This is a schematic diagram of the first wiring layout of the circuit board of the present invention;

[0064] Figure 2 This is a schematic diagram of the second wiring layout of the circuit board of the present invention;

[0065] Figure 3 This is a schematic diagram of the third trace layout on the circuit board of the present invention;

[0066] Figure 4 This is a schematic diagram of the fourth trace layout on the circuit board of the present invention;

[0067] Figure 5 For the present invention Figure 4 Enlarged view of part A;

[0068] Figure 6 This is a schematic diagram of the fifth trace layout on the circuit board of the present invention;

[0069] Figure 7 For the present invention Figure 6 Enlarged view of part B.

[0070] The meanings of the reference numerals in the attached drawings are as follows: 1. Insulating substrate; 11. Mini LED chip pad arrangement zone; 12. Mini LED chip pad arrangement sub-zone; 2. LED positive power supply line; 3. Negative line; 4. Mini LED chip pad; 5. Driver chip pad; 6. LED branch line; 61. Branch line; 7. Driver chip power supply line; 8. Driver chip control signal line; 9. Extension line; 10. Window position. Detailed Implementation

[0071] To better understand and implement this invention, the technical solutions in the embodiments of this invention will be clearly and completely described and discussed below with reference to the accompanying drawings. Obviously, what is described here is only a part of the examples of this invention, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the protection scope of this invention.

[0072] To facilitate understanding of the embodiments of the present invention, further explanations and descriptions will be provided below with reference to the accompanying drawings and specific embodiments. Furthermore, these embodiments do not constitute a limitation on the embodiments of the present invention.

[0073] In the description of the present application, it should be noted that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0074] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein only for the purpose of describing specific embodiments and is not intended to limit the application.

[0075] Referring to Figures 1-3 The present application discloses a Mini LED backlight circuit board, comprising an insulating substrate 1, an LED anode power supply circuit 2, a cathode circuit 3 and a driving chip pad 5, one side of the insulating substrate 1 is a pad circuit arrangement surface, a plurality of Mini LED chip pads 4 are arranged on the pad circuit arrangement surface, and all the Mini LED chip pads 4 are arranged on the pad circuit arrangement surface, the LED anode power supply circuit 2 is arranged on the pad circuit arrangement surface, the cathode circuit 3 is arranged on the pad circuit arrangement surface, the driving chip pad 5 is arranged on the pad circuit arrangement surface or outside the insulating substrate 1, and a driving chip is welded on the driving chip pad 5, wherein the LED anode power supply circuit 2 is electrically connected with the cathode circuit 3, all the Mini LED chip pads 4 are arranged along the LED anode power supply circuit 2 and / or the cathode circuit 3, and all the Mini LED chip pads 4 are electrically connected with the driving chip.

[0076] Specifically, one side of the insulating plate is a pad circuit arrangement surface, a plurality of Mini LED chip pads 4 are arranged on the pad circuit arrangement surface, and all the Mini LED chip pads 4 are arranged on the pad circuit arrangement surface. As an optional arrangement mode, all the Mini LED chip pads 4 can be arranged in a matrix, a regular quadrilateral, a circle, and a polygon, such as a rectangle, a rhombus, and a parallelogram, that is, adjacent Mini LED chip pads 4 are arranged in the shape of a rectangle, a rhombus, or a parallelogram. The positive electrode power supply circuit 2 of the LED is arranged on the pad circuit arrangement surface, and the negative electrode circuit 3 is arranged on the pad circuit arrangement surface. Specifically, the positive electrode power supply circuit 2 and the negative electrode circuit 3 can be arranged on the pad circuit arrangement surface by 3D printing technology, mask plate technology, or etching technology. The driving chip pad 5 can be arranged on the pad circuit arrangement surface or outside the insulating substrate 1 according to the specific circuit board, which adopts an AM backlight scheme or a PM backlight scheme. When the AM backlight scheme is adopted, the driving chip pad 5 is arranged on the pad circuit arrangement surface, which is the best for precisely controlling a single or multiple Mini LED chips. When the PM backlight scheme is adopted, the driving chip pad 5 can be arranged outside the insulating substrate 1, and the corresponding driving chip is arranged outside the insulating substrate 1. The driving chip transmits a control signal to the conductive part arranged on the pad circuit arrangement surface. The positive electrode power supply circuit 2 of the LED is electrically connected to the negative electrode circuit 3. All the Mini LED chip pads 4 are arranged along the positive electrode power supply circuit 2 and / or the negative electrode circuit 3. Specifically, the Mini LED chip pad 4 is arranged on the positive electrode power supply circuit 2 and / or the negative electrode circuit 3, which can be arranged according to specific requirements and can meet the imaging requirements of a normal Mini LED backlight circuit board. All the Mini LED chip pads 4 are electrically connected to the driving chip to control all the Mini LED chips or other conductive parts mounted on the Mini LED chip pads 4.

[0077] In the PM scheme, the negative electrode circuit 3 is an LED chip negative electrode circuit, and in the AM scheme, the negative electrode circuit is a power supply ground circuit.

[0078] It should be noted that the PM backlight scheme (Passive Matrix) is a PM drive, which is a Mini LED backlight technology driving mode. In this scheme, the Mini LED chips are arranged in a matrix or other shapes, and the Mini LED chips are lit by a control circuit row by row. The AM backlight scheme (Active Matrix) is an AM drive, which is a more advanced Mini LED backlight technology driving mode. It realizes precise control of backlight by providing an independent driving circuit for each Mini LED chip pixel partition.

[0079] The working principle of the above structure:

[0080] External power is transmitted from the LED positive power line 2 to the negative power line 3. After powering all the Mini LED chip pads 4, the power flows into the low-potential negative power line 3, and is then guided to the outside by the negative power line 3. The driver chip is electrically connected to the Mini LED chip pads 4. The specific electrical connection method can be achieved by etching circuitry or by using other flying wires, ensuring that the driver chip mounted on the driver chip pad 5 can control all the Mini LED chips. The lines on the entire pad layout do not form closed circuits on the insulating substrate 1, thus preventing electromagnetic coupling and further reducing the risk of electromagnetic interference within the system. This ensures the quality of signal transmission and provides a foundation for the integration of high-density Mini LED chips.

[0081] In some embodiments, the Mini LED backlight circuit board further includes LED branch lines 6, and the electrical connection between the LED branch lines 6 and the driver chip relative to the LED positive power line 2 and negative power line 3 includes one or a combination of the following:

[0082] (1) One end of the LED branch line 6 is electrically connected to the LED positive power supply line 2, and the other end is electrically connected to the driver chip. The driver chip is electrically connected to the negative line 3.

[0083] (2) One end of the LED branch line 6 is electrically connected to the negative line 3, and the other end is electrically connected to the driver chip;

[0084] LED branch lines 6 are disposed along at least a portion of the Mini LED chip pads 4 for supplying power to conductive elements disposed on the Mini LED chip pads 4 along the LED branch lines 6.

[0085] The above part or all of the Mini LED chip pads 4 are connected in series / parallel through the LED branch line 6, the wiring is more free, the mutual interference of the line branch lines is further reduced, and the setting of the LED anode power line can also be optimized. The Mini LED chip pads 4 not arranged on the LED branch line 6 can be arranged on the LED anode power line 2. In this embodiment, all the Mini LED chip pads 4 are arranged along the LED branch line 6. Specifically, at least one LED branch line 6 is arranged between the LED anode power line 2 and the cathode line 3. One end of the LED branch line 6 is electrically connected to the LED anode power line 2, and the other end is electrically connected to the cathode line 3. The LED branch line 6 is arranged along all the Mini LED chip pads 4 to supply power to the conductive parts arranged on all the Mini LED chip pads 4. The specific number and line direction of the LED branch line 6 can be selected according to specific needs, which is not limited here, as long as it is not affected by electromagnetic interference and meets the heat dissipation requirements. The conductive part can be a Mini LED chip. When it is not necessary to arrange a Mini LED chip or it is necessary to arrange other functional parts, other conductive parts that do not affect the normal conduction of the circuit or have other functions can be arranged on the Mini LED chip pad 4. In the arrangement of mode (2), one pin of the driving chip can be selected to supply power to the LED branch line 6, that is, the LED anode power line 2 sends power to the LED branch line 6 through one pin of the driving chip. In addition, based on the structure of the driving chip power line 7, the driving chip power line 7 can also be used to supply power to the LED branch line 6.

[0086] In some embodiments, in order to facilitate the arrangement of multiple Mini LED chip pads 4, the driving chip pads are arranged on the pad line arrangement surface. The pad line arrangement surface is divided into multiple Mini LED chip pad arrangement partitions 11, and each Mini LED chip pad arrangement partition 11 is independently arranged, that is, the adjacent Mini LED chip pad arrangement partitions 11 do not intersect. Each Mini LED chip pad arrangement partition 11 is provided with a driving chip pad 5. Each Mini LED chip pad arrangement partition 11 is divided into multiple Mini LED chip pad arrangement sub-partitions 12 according to the LED branch line 6 electrically connected to the driving chip. The range of each Mini LED chip pad arrangement sub-partition 12 is the setting position of the corresponding LED branch line 6 of each Mini LED chip pad arrangement sub-partition 12, and each Mini LED chip pad arrangement sub-partition 12 is independently arranged, that is, the adjacent Mini LED chip pad arrangement partitions 11 do not intersect.

[0087] In some embodiments, in order to further facilitate the arrangement of the Mini LED chip pads 4, one or more branch lines 61 are arranged between the LED branch lines 6 and the driving chip according to requirements, and one or more branch lines 61 are arranged between the LED branch lines 6 and the driving chip. When the Mini LED chip pads 4 are arranged on the branch lines 61, each branch line 61 arranged with the Mini LED chip pads 4 is a Mini LED chip pad arrangement sub-area 12.

[0088] It should be noted that in Figure 1 、 2 In 4 and 5, in order to clearly express the circuit diagram, only one Mini LED chip pad arrangement sub-area 12 is marked in each figure, and the actual Mini LED chip pad arrangement sub-area 12 is divided into one or more according to the above division standard. Due to the limitation of the drawing size, it is not marked one by one.

[0089] In order to prevent the electrical problems caused by the large pressure difference between adjacent circuits, such as electromagnetic interference problems, thermal management problems, etc., the number of Mini LED chip pads 4 arranged in adjacent Mini LED chip pad arrangement sub-areas 12 can be set to be similar or the same, so as to balance the pressure difference between adjacent circuits.

[0090] In some embodiments, the Mini LED backlight circuit board further comprises a driving chip power line 7 and a driving chip control signal line 8, the driving chip power line 7 is arranged on the pad line arrangement surface, and the driving chip control signal line 8 is arranged on the pad line arrangement surface, wherein the driving chip pad 5 is arranged on the pad line arrangement surface, the driving chip power line 7 and the driving chip control signal line 8 are connected to the driving chip pad 5, and the driving chip pad 5 is located on the LED branch line 6.

[0091] Specifically, in the AM backlight scheme, the driving chip pad 5 is arranged on the pad circuit layout surface to facilitate subsequent precise control of the Mini LED chip by the driving chip. The driving chip power circuit 7 and the driving chip control signal line circuit 8 are arranged on the pad circuit layout surface to facilitate the transmission of driving chip signals and power. The driving chip power circuit 7 and the driving chip control signal line circuit 8 can be arranged on the pad circuit layout surface by 3D printing technology, mask plate technology or etching technology. The driving chip is powered by the driving chip power circuit 7, and the driving chip receives the corresponding signals through the driving chip control signal line circuit 8. The received signals control the current size and the on-off time of the Mini LED chip. When there are many Mini LED chip pads 4, multiple driving chip pads 5 are arranged in the AM backlight scheme. When multiple driving chip pads 5 are arranged, all the driving chip pads 5 can be connected in series through the driving chip power circuit 7 and the driving chip control signal line circuit 8, thereby realizing power supply and driving of multiple driving chips by two circuits. This greatly simplifies the layout difficulty of the driving chip power circuit 7 and the driving chip control signal line circuit 8, reduces the complexity of the circuit, and avoids the electromagnetic interference problem caused by complex wiring.

[0092] The driving chip control signal line circuit 8 in this embodiment is arranged in a combination of a clock signal line and a data signal line. The clock signal line provides a synchronization signal for the driving chip to ensure the accurate timing of data transmission. The data signal line carries the data information to be transmitted to the driving chip to regulate the brightness of the Mini LED chip. The combination of the two can ensure the synchronization and accuracy of signal transmission and improve the stability and consistency of the display effect.

[0093] In some embodiments, the driving chip pad 5 is arranged on the pad circuit layout surface to facilitate the transmission of signals processed by the driving chip after the driving chip is installed on the driving chip pad 5. The negative line 3 is provided with an extension line 9 connected to the driving chip. After the plurality of LED branch lines 6 are connected to the same number or similar number of Mini LED chip pads 4, the plurality of LED branch lines 6 are connected to the driving chip pad 5. The plurality of LED branch lines 6 finally converge at the driving chip pad 5, which can improve the control effect of the Mini LED chip by the driving chip. If a fault occurs, the problem can be quickly located by detecting the driving chip pad 5, which simplifies the troubleshooting process.

[0094] In some embodiments, all the Mini LED chip pads 4 are arranged in series on the LED branch line 6, or the LED branch line 6 is provided with a plurality of branch lines 61, and all the Mini LED chip pads 4 are arranged on the branch lines 61.

[0095] The specific setup methods for LED branch lines 6 and sub-line 61 mainly include the following three types:

[0096] 1. See reference Figure 1 As shown, the LED positive power line 2 is arranged along three adjacent sides of the pad line arrangement surface, and the negative line 3 is located in the middle of the pad line arrangement surface. This facilitates the connection between the driver chip pads 5 located on both sides of the negative line 3 and the negative line 3. Furthermore, with the negative line 3 located in the middle of the pad line arrangement surface, more regular and ample arrangement space is reserved for the matrix-arranged Mini LED chip pads 4, which is beneficial for the single-sided routing design of the circuit board. Multiple LED branch lines 6 extend from the LED positive power lines 2 on opposite sides of the pad line arrangement surface. Each LED branch line 6 has two branch lines 61, and the two branch lines 61 can be routed as separately as possible between the LED positive power lines 2 and the negative line 3, thereby avoiding line crossing and facilitating the single-sided design of the circuit board. Each branch line 61 has a MiniLED chip pad 4 connected in series. After the Mini LED chip pad 4 is connected in series, the branch line 61 is connected to the driver chip pad 5, so that the driver chip can control the Mini LED chip. The above structure is mainly set up in parallel for Mini LEDs. Since the driver chip pad 5 is connected to the negative line 3, the corresponding driver chip power line 7 and driver chip control signal line 8 are arranged around the edge of the negative line 3. This can save space and connect all driver chip pads 5 in series, thereby avoiding line crossing and achieving the effect of single-sided routing. In this circuit layout, the LED positive power line 2 is arranged along the three adjacent sides of the pad circuit layout surface, and the negative line 3 is located in the middle of the pad circuit layout surface. When multiple channels are required, the above circuit layout is arranged side by side. Since the LED positive power lines 2 are arranged along the three adjacent sides of the pad circuit layout surface, the LED positive power lines 2 in adjacent circuit layouts are arranged adjacent to each other. Because they are all positive lines, the voltage difference between them is small, and there will be no electrical problems caused by voltage difference between the lines, thereby reducing the line spacing between multiple channels. Of course, the LED positive power lines 2 can also be arranged in various ways, such as setting one LED positive power line 2 on each of the two opposite sides of the pad circuit layout surface to power the Mini LED chip, which will not be elaborated here.

[0097] 2. See reference Figure 2As shown, the LED positive power supply line 2 is arranged along one side of the pad line arrangement surface, the negative line 3 is arranged on the pad line arrangement surface, and on the side opposite to the LED positive power supply line 2, a plurality of LED branch lines 6 are arranged along the arrangement direction of the LED positive power supply line 2 and conveniently extend towards the negative line 3, and after passing through the Mini LED chip pad 4, they are connected to the driving chip pad 5. In this embodiment, each LED branch line 6 is connected in series with four Mini LED chip pads 4 to ensure that the current of each Mini LED chip is consistent, thereby realizing the consistency of brightness. The driving chip pad 5 is connected to the negative line 3 through the extension line 9, so as to adapt to the position of the driving chip pad 5 by adjusting the length and direction of the extension line 9. The corresponding driving chip power supply line 7 and driving chip control signal line 8 are arranged along the edge of the negative line 3, so as to save space and connect all the driving chip pads 5, thereby avoiding line crossing and achieving the effect of single-sided wiring. When more Mini LED chip pads 4 need to be arranged, the above structure can be translated and copied on the pad line arrangement surface to increase the number of Mini LED chip pads 4. In this line layout, the current can flow smoothly back to the power supply, thereby maintaining the stable operation of the circuit, and the negative can realize the full-surface series connection of the negative line 3, which can significantly reduce this asymmetry, thereby reducing the level of interference and noise. Of course, the LED positive power supply line 2 also has various layout modes, for example, one LED positive power supply line 2 is arranged on each side of the pad line arrangement surface, which is used for power supply of the Mini LED chip, which is not described here.

[0098] 3. Refer to Figure 3 As shown, the LED positive power supply line 2 is arranged along the length direction of the pad line arrangement surface, and a plurality of LED branch lines 6 are extended at equal intervals along the arrangement direction of the LED positive power supply line 2. The LED branch line 6 is connected to the negative line 3 after bending around the Mini LED chip pad 4, and is connected to the driving chip constant current output port after being connected to the negative line 3. The driving chip pad 5 is arranged outside the insulating substrate 1. Since the driving chip pad 5 is not on the insulating substrate 1, the wiring complexity on the substrate is reduced, the design inside the substrate is simplified, and the layout of the Mini LED chip pad 4 is more flexible. Arranging the driving chip pad 5 outside the substrate helps to reduce electromagnetic interference, ensure the quality of signal transmission, and improve the electromagnetic compatibility of the system.

[0099] 4. Refer to Figure 4 and Figure 5As shown, the LED positive power supply lines 2 are arranged along three adjacent edges of the pad line arrangement surface, and the negative lines 3 are arranged in the middle of the pad line arrangement surface, so that the drive chip pads 5 arranged on both sides of the negative lines 3 are connected to the negative lines 3, and in the case that the negative lines 3 are arranged in the middle of the pad line arrangement surface, more regular and sufficient arrangement space is also reserved for the matrix arranged Mini LED chip pads 4, which is beneficial to the single-sided wiring design of the circuit board. The LED positive power supply lines 2 extending from the opposite edges of the pad line arrangement surface extend a plurality of LED branch lines 6, each of which is connected to the drive chip after being connected in series with the Mini LED chip pads 4 arranged in a three-by-three matrix, so as to facilitate the subsequent drive chip to control the Mini LED chip. The above structure is mainly arranged in a series connection mode of the Mini LED chip pads 4. Since the drive chip pads 5 are connected to the negative lines 3, the corresponding drive chip power supply lines 7 and drive chip control signal lines 8 are arranged around the edge of the negative lines 3, so as to achieve the purpose of saving space and connecting all drive chip pads 5, thereby avoiding line crossing and achieving single-sided wiring. In this line layout, the LED positive power supply lines 2 are arranged along three adjacent edges of the pad line arrangement surface, and the negative lines 3 are arranged in the middle of the pad line arrangement surface. When multiple channels are required, the above line layout is arranged side by side. Since the LED positive power supply lines 2 are arranged along three adjacent edges of the pad line arrangement surface, the respective LED positive power supply lines 2 are arranged adjacent to each other in the adjacent line layout, and since they are both positive lines, the voltage difference between them is small, and there will be no electrical problems caused by the pressure difference between the lines, thereby reducing the line distance between multiple channels. Of course, the LED positive power supply lines 2 also have a variety of layout modes, for example, one LED positive power supply line 2 is arranged on each of the opposite edges of the pad line arrangement surface for powering the Mini LED chip, which will not be described here.

[0100] 5. Refer to Figure 6 and Figure 7As shown, the LED positive power supply line 2 is arranged along three adjacent edges of the pad line arrangement surface, and the negative line 3 is arranged in the middle of the pad line arrangement surface, so that the drive chip pads 5 arranged on both sides of the negative line 3 are connected to the negative line 3, and in the case that the negative line 3 is arranged in the middle of the pad line arrangement surface, more regular and sufficient arrangement space is also reserved for the matrix arranged Mini LED chip pads 4, which is beneficial to the single-sided wiring design of the circuit board. The LED positive power supply line 2 extending from the opposite edges of the pad line arrangement surface extends a plurality of LED branch lines 6, each of which is connected to six Mini LED chip pads 4 in series, and each adjacent three LED branch lines 6 are connected to a branch line 61, and then connected to the drive chip through the branch line 61, so as to facilitate the subsequent drive chip to control the Mini LED chip. The above structure is mainly arranged in the series connection mode of the Mini LED chip pad 4. Since the drive chip pad 5 is connected to the negative line 3, the corresponding drive chip power supply line 7 and drive chip control signal line 8 are arranged around the edge of the negative line 3, so as to save space and connect all drive chip pads 5, thereby avoiding line crossing and achieving single-sided wiring. In this line layout, the LED positive power supply line 2 is arranged along three adjacent edges of the pad line arrangement surface, and the negative line 3 is arranged in the middle of the pad line arrangement surface. When multiple channels are required, the above line layout is arranged side by side. Since the LED positive power supply line 2 is arranged along three adjacent edges of the pad line arrangement surface, the LED positive power supply line 2 of each adjacent line layout is arranged adjacent to each other. Since they are both positive lines, the voltage difference between them is small, and there will be no electrical problems caused by the pressure difference between the lines, thereby reducing the line distance between multiple channels. Of course, the LED positive power supply line 2 also has a variety of layout methods, for example, one LED positive power supply line 2 is arranged on each of the opposite edges of the pad line arrangement surface for power supply of the Mini LED chip, which will not be described here.

[0101] In the above five wiring methods, the third wiring method is best applied to the PM backlight scheme, and the Mini LED chip is lit by the drive chip constant current output port row by row scanning. The remaining four are best applied to the AM backlight scheme, and the drive chip can individually control a predetermined number of Mini LED chips to achieve precise control of the backlight.

[0102] It should be noted that the above five wiring methods are for illustration only and do not limit the circuit of the present application.

[0103] In some embodiments, the insulating substrate 1 comprises a plate body, a pad layer and a circuit layer, the plate body is a glass plate, a BT resin substrate, an epoxy resin plate, a silicone resin plate, a polyphthalamide plate or an ABF plate. The driving chip pad 5 and the Mini LED chip pad 4 are arranged on the pad layer. The LED positive power circuit 2, the negative circuit 3 and the LED branch circuit 6 are arranged on the circuit layer. The pad layer and the circuit layer are arranged on the pad circuit layout surface.

[0104] Specifically, the insulating substrate 1 has a variety of materials to choose from. If good thermal stability and backlight effect are required, a glass plate can be selected. For applications requiring low dielectric constant and good thermal conductivity, a BT resin substrate is preferred. An epoxy resin plate has good mechanical properties and cost-effectiveness, which can be selected according to requirements. A silicone resin plate is suitable for occasions requiring high temperature resistance and flexibility. A polyphthalamide plate is suitable for environments requiring high strength and dimensional stability. And the ABF plate becomes an ideal choice for light and thin and environmentally friendly design due to its lightness, high thermal conductivity and environmental friendliness.

[0105] In some embodiments, in order to facilitate the testing and identification of various circuits or components, the pad circuit layout surface of the insulating substrate 1 is provided with a windowing position 10, and the windowing position 10 is provided with an identification point window or a test point window.

[0106] As an optional solution, a plurality of windowing positions 10 are arranged along the LED positive power circuit 2, and / or a plurality of windowing positions 10 are arranged along the LED branch circuit 6, and / or the windowing positions 10 are arranged on one side of the driving chip pad 5.

[0107] Among them, a plurality of windowing positions 10 are arranged on the LED positive power circuit 2, and test point windows are arranged at the windowing positions 10, which can facilitate the testing of the positive power circuit and ensure the correct connection and working state of the power circuit. Similarly, the windowing positions 10 are arranged on the LED branch circuit 6, and test point windows are arranged at the windowing positions 10, which also facilitate the testing of the LED branch circuit 6. The windowing positions 10 are arranged on one side of the driving chip pad 5, and identification point windows are arranged at the windowing positions 10, which not only provide clear position identification during subsequent driving chip installation, but also help to identify the correct polarity direction, ensuring the correct installation of the driving chip, thereby improving the installation precision and efficiency.

[0108] Of course, according to specific requirements, the windowing positions 10 on the LED positive power circuit 2 or the LED branch circuit 6 can be set as identification points, and the windowing positions 10 on one side of the driving chip pad 5 can be set as test points. The specific functions, arrangement positions and numbers of the windowing positions 10 can be set according to specific requirements, which are not limited herein.

[0109] In this embodiment, the windowing positions 10 are set by white oil windowing.

[0110] The application also provides a Mini LED display screen, comprising the Mini LED backlight circuit board, a Mini LED chip is welded on the Mini LED chip pad 4, and a driving chip is welded on the driving chip pad 5, and the driving chip is used for controlling the brightness of the Mini LED chip. Optionally, a liquid crystal panel, a polaroid, a filter, a touch panel, a diffusion sheet, a brightness enhancement film, a prism sheet, a connector, a control circuit board, a shell and a signal processing chip and the like can also be arranged according to requirements, and the above optional components can be selected and assembled according to specific requirements, and the specific arrangement mode is not described here.

[0111] The application also provides a Mini LED backlight circuit board preparation method, which is used for preparing the Mini LED backlight circuit board and comprises the following steps:

[0112] S1. One of a glass plate, a BT resin substrate, an epoxy resin plate, a silicon resin plate, a polyphthalamide plate or an ABF plate is used as an insulating substrate 1;

[0113] S2. A metal layer is arranged on the pad circuit arrangement surface of the insulating substrate 1;

[0114] S3. The LED anode power circuit 2, the cathode circuit 3 and the LED branch circuit 6 are arranged on the pad circuit arrangement surface of the insulating substrate 1 to form a circuit layer;

[0115] S4. A plurality of Mini LED chip pads 4 are arranged on the pad circuit arrangement surface, or the Mini LED chip pads 4 and the driving chip pads 5 are arranged at the same time;

[0116] S5. A gold finger area is arranged on the pad circuit arrangement surface of the insulating substrate 1, and is used for connecting the LED anode power circuit 2 and the cathode circuit 3 of the insulating substrate 1;

[0117] S6. An ink layer is arranged above the pad layer and the circuit layer, and the ink layer is provided with ink windows at the LED anode power circuit 2, the cathode circuit 3, the LED branch circuit 6, the Mini LED chip pad 4, the driving chip pad 5 and the gold finger area.

[0118] Specifically, different insulating substrate materials are provided in the S1 step for users to select, so that the performance requirements can be met and the cost can be controlled.

[0119] In some embodiments, before the S2 step, an insulating primer layer can be arranged on the pad circuit arrangement surface of the insulating substrate 1 to improve the adhesion of the metal layer in the S2 step.

[0120] In the S2 step, a metal layer is arranged on the pad circuit layout surface of the insulating substrate, wherein the metal layer includes but is not limited to copper, an alloy layer, and a copper protective layer. In addition, if it is necessary to further improve the service life of the circuit, a copper alloy or other copper protective layer can be further arranged on the ink layer. In addition, as an option, the material of the copper protective layer includes but is not limited to one or a combination of a nickel layer, a nickel-copper alloy layer, a nickel-silver layer, a nickel-gold layer, a nickel-silver-gold layer, a nickel-palladium-gold layer, a Sn layer, or an organic solderability preservative (OSP). The protective layer can be realized by PVD film forming, CVD deposition, chemical plating, electroplating, etc. By adding one or more metal protective layers on the pad layer and the circuit layer, the conductivity can be significantly improved, and the stability and reliability of current transmission can be ensured.

[0121] It should be noted that PVD film forming includes PVD sputtering, which is a method of depositing materials on the surface of a substrate, suitable for depositing high-purity thin films. Of course, PVD film forming also includes other various ways, which are not described here.

[0122] CVD deposition is a method of forming a thin film on the surface of a substrate by gas reaction, suitable for depositing complex compound thin films.

[0123] Chemical plating is a method of forming a metal plating layer on the surface of a substrate by chemical reaction.

[0124] Electroplating is a method of depositing a metal plating layer on the surface of a substrate by an electrolytic process.

[0125] In the S3 step, the etching of the LED positive power circuit 2, the negative circuit 3, and the LED branch circuit 6 can be arranged in the above-described wiring manner to achieve the effect of reducing electromagnetic interference and improving the stability of signal transmission.

[0126] In the S4 step, the Mini LED chip pad 4 and the driving chip pad 5 can be arranged according to the setting position of the driving chip, and the driving chip pad 5 can be arranged on the pad layer. Correspondingly, all the driving chip pads 5 and the Mini LED chip pads 4 are concentrated on the same layer, the integration degree is improved, and the design is simplified.

[0127] In addition, as an option, a non-metal protective layer can be arranged on the alloy layer or the copper protective layer to achieve the effect of protecting the internal metal layer, the circuit layer, and the Mini LED chip pad 4 and the driving chip pad 5 from water and oxygen.

[0128] Further, when the driving chip pad 5 is arranged on the pad layer in the S4 step, the driving chip power line 7 and the driving chip control signal line 8 are etched on the line layer, and the driving chip power line 7 and the driving chip control signal line 8 are connected to the driving chip pad 5.

[0129] Specifically, the arrangement mode of the driving chip power line 7 and the driving chip control signal line 8 can be arranged in the wiring mode in the Mini LED backlight line board. Of course, other wiring modes can also be used, as long as the integration of various lines and pads on the pad line arrangement surface is not affected.

[0130] The technical means disclosed in the present application scheme is not limited to the technical means disclosed in the above-mentioned embodiments, but also includes the technical solutions composed of any combination of the above technical features. It should be pointed out that for ordinary skilled in the art, without departing from the principles of the present application, a number of improvements and refinements can also be made, which are considered to be within the scope of protection of the present application.

Claims

1. A Mini LED backlight circuit board, characterized by, The application relates to an insulating substrate (1), one side of the insulating substrate (1) being a pad circuit arrangement surface, a plurality of Mini LED chip pads (4) being arranged on the pad circuit arrangement surface, and all the Mini LED chip pads (4) being arranged on the pad circuit arrangement surface; an LED anode power circuit (2) arranged on the pad circuit arrangement surface; a cathode circuit (3) arranged on the pad circuit arrangement surface; a driving chip pad (5) arranged on the pad circuit arrangement surface or outside the insulating substrate (1), the driving chip pad (5) being welded with a driving chip; wherein the LED anode power circuit (2) is electrically connected with the cathode circuit (3), all the Mini LED chip pads (4) are arranged along the LED anode power circuit (2) and / or the cathode circuit (3), and all the Mini LED chip pads (4) are electrically connected with the driving chip. The application further comprises an LED branch circuit (6), the electric connection mode of the LED branch circuit (6) and the driving chip relative to the electric connection mode of the LED anode power circuit (2) and the cathode circuit (3) comprising one or a combination of the following two modes: (1) one end of the LED branch circuit (6) is electrically connected with the LED anode power circuit (2), the other end is electrically connected with the driving chip, and the driving chip is electrically connected with the cathode circuit (3); (2) one end of the LED branch circuit (6) is electrically connected with the cathode circuit (3), the other end is electrically connected with the driving chip; The LED branch circuit (6) is arranged along at least part of the Mini LED chip pads (4) to supply power to the conductive member arranged on the Mini LED chip pad (4) arranged along the LED branch circuit (6). The driving chip pad (5) is arranged on the pad circuit arrangement surface, the pad circuit arrangement surface is divided into a plurality of Mini LED chip pad arrangement sub-zones (11), each Mini LED chip pad arrangement sub-zone (11) is independently arranged, each Mini LED chip pad arrangement sub-zone (11) is provided with the driving chip pad (5), each Mini LED chip pad arrangement sub-zone (11) is divided into a plurality of Mini LED chip pad arrangement sub-sub-zones (12) according to the LED branch circuit (6) electrically connected with the driving chip, the range of each Mini LED chip pad arrangement sub-sub-zone (12) is the arrangement position of the corresponding LED branch circuit (6) of each Mini LED chip pad arrangement sub-sub-zone (12), and each Mini LED chip pad arrangement sub-sub-zone (12) is independently arranged.

2. The Mini LED backlight circuit board of claim 1, wherein, One or more branch circuits (61) are arranged between the LED branch circuit (6) and the driving chip. ​ ​ ​ 3. The Mini LED backlight circuit board of claim 2, wherein, ​ 4. The Mini LED backlight circuit board of claim 3, wherein, ​ When the Mini LED chip pads (4) are arranged on the shunt lines (61), each shunt line (61) on which the Mini LED chip pad (4) is arranged is a Mini LED chip pad arrangement sub-area (12).

5. The Mini LED backlight circuit board of claim 2, wherein, Also includes: A driving chip power supply line (7) is arranged on the pad line arrangement surface; A driving chip control signal line line (8) is arranged on the pad line arrangement surface; The driving chip pad (5) is arranged on the pad line arrangement surface, the driving chip power supply line (7) and the driving chip control signal line line (8) are electrically connected with the driving chip, and the driving chip pad (5) is located on the LED branch line (6).

6. The Mini LED backlight circuit board of claim 5, wherein, The driving chip pad (5) is arranged on the pad line arrangement surface, the pad line arrangement surface is divided into a plurality of Mini LED chip pad arrangement sub-areas (11), and each Mini LED chip pad arrangement sub-area (11) is independently arranged, each Mini LED chip pad arrangement sub-area (11) is provided with the driving chip pad (5), and the driving chip power supply line (7) and the driving chip control signal line line (8) are connected in series with all the driving chips.

7. The Mini LED backlight circuit board of claim 3, wherein, The negative line (3) is provided with an extension line (9) connected to the driving chip pad (5) and electrically connected with the driving chip.

8. The Mini LED backlight circuit board of claim 2, wherein, The insulating substrate (1) comprises: A plate body, which is a glass plate, a BT resin substrate, an epoxy resin plate, a silicon resin plate, a polyphthalamide plate or an ABF plate; A pad layer, the driving chip pad (5) and the Mini LED chip pad (4) are arranged on the pad layer; A line layer, the LED positive power supply line (2), the negative line (3) and the LED branch line (6) are arranged on the line layer; The pad layer and the line layer are arranged on the pad line arrangement surface.

9. The Mini LED backlight circuit board of claim 1, wherein, The driving chip pad (5) is arranged outside the insulating substrate (1), and one end of the negative line (3) is connected with a driving chip constant current output port.

10. The Mini LED backlight circuit board of claim 2, wherein, The pad line arrangement surface of the insulating substrate (1) is provided with a windowing position (10), and the windowing position (10) is provided with an identification point windowing or a test point windowing.

11. The Mini LED backlight circuit board of claim 10, wherein, The windowing positions (10) are arranged along the LED positive power supply line (2), and / or the windowing positions (10) are arranged along the LED branch line (6), and / or the windowing positions (10) are arranged on one side of the driving chip pad (5).

12. A Mini LED display screen, characterized in that, The Mini LED backlight circuit board comprises the Mini LED chip pad (4) and the driving chip pad (5), the Mini LED chip pad (4) is welded with the Mini LED chip, and the driving chip pad (5) is welded with the driving chip, and the driving chip is used for controlling the brightness of the Mini LED chip.

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