Detection head structure for manual test of semiconductor module

Abstract

The utility model provides a detection head structure for a manual test of a semiconductor module, and the structure comprises a hinge seat and a clamping seat, the hinge seat and the clamping seat are located at two sides of a first direction at an interval, at least one to-be-detected position is formed between the hinge seat and the clamping seat, and the to-be-detected position is used for placing a to-be-detected semiconductor module; one end of the supporting frame is hinged to the hinge seat, and the other end of the supporting frame is detachably connected with the clamping seat; the at least one pressing detection assembly is arranged on the supporting frame, and the pressing detection assembly comprises a plurality of detection joints; the pressing detection assembly leaves the position above the to-be-detected position or is suspended above the to-be-detected position through overturning of the supporting frame. And the pressing detection assembly suspended above the to-be-detected position is used for moving downwards and contacting the functional pin of the semiconductor module. The problems of long time consumption and low detection efficiency caused by the fact that an operator needs to connect each functional pin in sequence in the prior art are solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor module detection, in particular to a detection head structure for manual testing of semiconductor modules. BACKGROUND

[0002] A power semiconductor module is a combination of certain functions and modes. The power semiconductor module is a large power electronic power device that is combined according to certain functions and then encapsulated into one. The power semiconductor module can realize different functions according to different encapsulated components, such as semiconductor field effect transistors, insulated gate bipolar transistors, and power integrated circuits. The power semiconductor module has various shapes, and one of the commonly used modules has conductive pins parallel to the bottom plate.

[0003] The existing module test fixture is mainly for modules with conductive sheets parallel to the bottom plate. During testing, the semiconductor module is usually placed on the cooling plate and positioned, and then the detection connectors are connected to the functional pins of the semiconductor module in sequence, and then power detection is performed. Generally, the functional pins on the semiconductor module are more, and many have more than 4 functional pins. When the operator connects the functional pins of the semiconductor module, each functional pin needs to be connected in sequence, which results in long time consumption and low detection efficiency.

[0004] Therefore, the prior art still needs to be improved and developed. CONTENT OF THE INVENTION

[0005] The present application aims to provide a detection head structure for manual testing of semiconductor modules, which solves the problem of long time consumption and low detection efficiency caused by the need for operators to connect each functional pin in sequence in the prior art.

[0006] To achieve the above-mentioned purpose, the technical solution adopted by the present application is:

[0007] The present application provides a detection head structure for manual testing of semiconductor modules, comprising: a hinged seat and a clamping seat, the hinged seat and the clamping seat are respectively located on both sides of the first direction and are spaced apart, and at least one detection position is formed between the hinged seat and the clamping seat, the detection position is used for placing the semiconductor module to be detected;

[0008] A support frame, one end of the support frame is hinged to the hinged seat, and the other end is detachably connected to the clamping seat;

[0009] At least one lower pressing detection assembly, the lower pressing detection assembly is arranged on the support frame, and the lower pressing detection assembly comprises a plurality of detection connectors;

[0010] The lower pressing detection assembly is separated from the upper side of the detection position or suspended above the detection position by turning over of the support frame;

[0011] The downward pressing detection assembly suspended above the detection position is used to move downward and contact the functional pins of the semiconductor module.

[0012] In an alternative embodiment, the support frame comprises: a crossbeam, which is arranged to extend along a first direction;

[0013] A first leg is fixed at one end of the crossbeam and is hingedly connected to the hinge seat.

[0014] A second leg is fixed at the other end of the crossbeam and is insertably connected to the clamping seat.

[0015] In an alternative embodiment, the clamping seat comprises: a clamping base;

[0016] Side blocks are arranged on both sides of the clamping base along a second direction, and a clamping opening is formed between the two side blocks.

[0017] The second leg is embedded in the clamping opening by turning over.

[0018] In an alternative embodiment, the second leg is provided with a clamping portion, and the clamping seat is provided with a clamping assembly, which is located in the clamping opening and is used to cooperate with the clamping portion to lock the second leg.

[0019] In an alternative embodiment, the clamping portion comprises an open slot, and a slot opening of the open slot is formed on a side of the clamping portion along a first direction.

[0020] The clamping assembly comprises: a clamping column, which is movably arranged on the side block along the first direction;

[0021] A resilient member is connected at one end to the clamping column and at the other end to the side block, and the clamping column is embedded in the open slot by the elastic force of the resilient member.

[0022] In an alternative embodiment, a locking waist-shaped hole is formed on the side block on both sides and extends along the first direction.

[0023] The clamping column is arranged in the locking waist-shaped hole of the side block on both sides, and both ends of the clamping column protrude out of the surface of the side block to form protruding ends.

[0024] The protruding ends at both ends are respectively connected to the resilient members, and the resilient members on both sides are respectively connected to the mounting columns of the side blocks on both sides.

[0025] In an alternative embodiment, a handle portion is arranged on the side of the clamping column away from the open slot, and the handle portion is located in the clamping opening to drive the handle portion to move.

[0026] In an alternative embodiment, the downward pressing detection assembly comprises: a detection support seat, which is arranged on the support frame;

[0027] The push-pull presser is arranged on the detection support base;

[0028] The pressing plate is connected to the push-pull presser and moves up and down by the driving of the push-pull presser;

[0029] The detection connectors are arranged on the pressing plate and contact the functional pins of the semiconductor module by the movement of the pressing plate.

[0030] In an alternative embodiment, the detection support base comprises a support vertical plate arranged on the support frame, and the push-pull presser is connected to the support vertical plate;

[0031] The support horizontal plate is connected perpendicularly to the support vertical plate, and a through hole is formed in the support horizontal plate, the push rod of the push-pull presser is arranged in the through hole, and the pressing plate below the support horizontal plate is connected to the push rod.

[0032] In an alternative embodiment, a guide sliding rod is arranged on the pressing plate;

[0033] A guide sliding sleeve is arranged on the support horizontal plate, and the guide sliding rod is movably arranged in the guide sliding sleeve in the up and down direction.

[0034] The detection head structure for manual testing of the semiconductor module provided in the application has at least the following beneficial effects: the to-be-tested position is arranged between the hinged seat and the clamping seat, one end of the support frame is hinged to the hinged seat, the other end is detachably connected to the clamping seat, and the downward pressing detection assembly is arranged on the support frame. When testing is to be performed, the support frame is clamped on the clamping seat, so that the downward pressing detection assembly is located above the to-be-tested position, the multiple detection connectors on the downward pressing detection assembly are opposite to the functional pins of the to-be-tested semiconductor module below, all the detection connectors are moved downward by pushing the downward pressing detection assembly downward, and the functional pins of the semiconductor module are contacted, so that the electrical connection with the semiconductor module is realized to perform the functional testing. Since the downward movement of the multiple detection connectors is completed by one-time pushing, the manual butt joint of the pins is not required, the installation efficiency is greatly improved, and the testing efficiency is improved. After the testing is completed, the downward pressing detection assembly is moved upward to the original position, all the detection connectors are moved upward to be separated from the functional pins of the semiconductor module, the support frame is lifted upward, the downward pressing detection assembly is separated from the to-be-tested position above by the turning of the support frame, the space above the to-be-tested position is opened, and the tested semiconductor module can be conveniently taken out. BRIEF DESCRIPTION OF DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or prior art description will be briefly introduced. Obviously, the drawings in the following description only constitute some embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative effort.

[0036] Figure 1 A structural schematic diagram of a detection head structure for manual testing of a semiconductor module provided by an embodiment of the present application;

[0037] Figure 2 An exploded view of a detection head structure for manual testing of a semiconductor module provided by an embodiment of the present application;

[0038] Figure 3 An exploded view of a support frame part of a detection head structure for manual testing of a semiconductor module provided by an embodiment of the present application;

[0039] Figure 4 A structural schematic diagram of a lower pressing detection assembly of a detection head structure for manual testing of a semiconductor module provided by an embodiment of the present application.

[0040] In the drawings, various reference signs represent:

[0041] 10, semiconductor module; 100, hinged seat; 200, clamping seat; 210, clamping chassis; 220, side block; 221, locking waist-shaped hole; 222, mounting column; 230, bayonet; 300, to-be-inspected position; 310, positioning block; 400, support frame; 410, cross beam; 420, first supporting leg; 430, second supporting leg; 431, clamping part; 432, open slot; 440, clamping assembly; 441, clamping column; 442, handle part; 443, elastic member; 500, lower pressing detection assembly; 510, detection support seat; 511, supporting vertical plate; 512, supporting horizontal plate; 513, positioning protrusion; 520, push-pull presser; 530, pressing plate; 531, detection connector; 540, guide sliding rod; 541, guide sliding sleeve. DETAILED DESCRIPTION

[0042] In order to make the technical problems, technical solutions and beneficial effects of the present application more clearly understood, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, and are not used to limit the present application.

[0043] It should be noted that when a component is referred to as being "fixed" or "set" on another component, it can be directly or indirectly on the other component. When a component is referred to as being "connected" to another component, it can be directly or indirectly connected to the other component. The terms "upper", "lower", "left", "right", "front", "back", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate the orientation or position shown in the drawings, and are only for the convenience of description, and cannot be understood as a limitation on the technical solutions. The terms "first", "second" are only for the convenience of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "a plurality of" is two or more, unless otherwise specifically limited.

[0044] In the prior art, the functional pins of the semiconductor module are manually connected, which not only causes a long connection time, but also, if a pressing structure is used to directly press the detection connector to connect with the functional pins of the semiconductor module, the pressing structure usually needs to be supported by a support structure, and the support structure is relatively fixed, so that when the semiconductor module is placed, the support structure is easy to block the semiconductor module, making it inconvenient to take and place the semiconductor module. Therefore, to solve the above problems, the following embodiments are proposed in the present application:

[0045] As shown in Figure 1 The present embodiment proposes a detection head structure for manual testing of a semiconductor module 10, which is used for detecting the semiconductor module 10. For the convenience of structural description, the detection head structure for manual testing of the semiconductor module 10 is placed on a workbench, wherein the left-right direction of the workbench is the first direction, the direction facing and facing away from the operator is the second direction, and the up-down direction of the workbench is the up-down direction of the structural description. All components of the present embodiment are described in the above directions as a reference for structural description.

[0046] As shown in Figure 1 , Figure 2As shown, the detection head structure of the embodiment specifically comprises: a hinged seat 100 and a clamping seat 200, a support frame 400, and at least one downward pressing detection assembly 500. The hinged seat 100 and the clamping seat 200 are respectively arranged at intervals on both sides in the first direction (left-right direction), and at least one detection position 300 is formed between the hinged seat 100 and the clamping seat 200, which is used to place the semiconductor module 10 to be detected. For example, three detection positions 300 are arranged in parallel at intervals in the left-right direction in the embodiment, and three semiconductor modules 10 to be detected can be placed at the same time. The detection position 300 is usually provided with a positioning block 310 (L-shaped) corresponding to it, which is used to limit the placement position of the semiconductor module 10, facilitating testing. One end of the support frame 400 is hinged to the hinged seat 100, and the other end is detachably connected to the clamping seat 200. The left and right ends of the support frame 400 are respectively connected to the hinged seat 100 and the clamping seat 200, so that the middle part is supported and suspended above the at least one detection position 300. The downward pressing detection assembly 500 is arranged on the support frame 400. In the embodiment, three corresponding downward pressing detection assemblies 500 can be arranged. Through the support of the support frame 400, the downward pressing detection assembly 500 is located above the detection position 300. Each downward pressing detection assembly 500 comprises a plurality of detection connectors 531 corresponding to the functional pins on the semiconductor module 10 to be detected, and is used to connect an external detector through a wire to conduct an electrical signal to the detector for functional testing, so as to detect whether the semiconductor module 10 is qualified.

[0047] The downward pressing detection assembly 500 in the embodiment has an open state and a detection state through the overturning of the support frame 400. In the open state, the support frame 400 is turned upward so that one end is away from the clamping seat 200, so that the support frame 400 is away from the upper side of the detection position 300, and the space above the detection position is cleared, so as to facilitate the taking and placing of the semiconductor module 10. In the detection state, the support frame is turned downward so that one end is connected to the clamping seat 200, so that the support frame 400 is suspended above the detection position 300, and the downward pressing detection assembly 500 is opposite to the semiconductor module 10 to be detected. The downward pressing detection assembly 500 suspended above the detection position 300 is used to move downward and contact the functional pins of the semiconductor module 10.

[0048] As Figure 1As shown, the detection head structure of the manual test of the semiconductor module 10 of the embodiment is provided by setting the to-be-tested position 300 between the hinged seat 100 and the clamping seat 200, hinging one end of the support frame 400 to the hinged seat 100 and detachably connecting the other end of the support frame 400 to the clamping seat 200, and setting the downward pressing detection assembly 500 on the support frame 400. When the detection is to be performed, the support frame 400 is clamped to the clamping seat 200, so that the downward pressing detection assembly 500 is located above the to-be-tested position 300, so that the multiple detection contacts 531 on the downward pressing detection assembly 500 are opposite to the functional pins of the semiconductor module 10 below, all the detection contacts 531 are moved downward by pushing the downward pressing detection assembly 500 downward, and the functional pins of the semiconductor module 10 are contacted, so that the electrical connection with the semiconductor module 10 is realized to perform the functional detection. Since the downward movement of the multiple detection contacts 531 is completed by one-time pushing, the manual butt joint of the pins is not required, the installation efficiency is greatly improved, and the detection efficiency is improved. When the detection is completed, the downward pressing detection assembly 500 is moved upward to the original position, all the detection contacts 531 are moved upward to be separated from the functional pins of the semiconductor module 10, and the support frame 400 is further lifted, so that the downward pressing detection assembly 500 is separated from the to-be-tested position 300 by the overturning of the support frame 400, the space above the to-be-tested position 300 is opened, and the semiconductor module 10 after the detection is conveniently taken out.

[0049] As shown in Figure 1 , Figure 2 , Figure 3 As shown, further, the support frame 400 of the embodiment specifically comprises: a cross beam 410, a first supporting leg 420, and a second supporting leg 430. The cross beam 410 is arranged to extend along a first direction, and is in a long strip shape arranged along a left-right direction. The cross beam 410 is provided with multiple mounting holes, such as long strip holes, which can be used as mounting positions of the downward pressing detection assembly 500. The first supporting leg 420 is fixed to one end of the cross beam 410 and is hinged to the hinged seat 100. The second supporting leg 430 is fixed to the other end of the cross beam 410 and can be inserted into the clamping seat 200. The first supporting leg 420 and the second supporting leg 430 are integrally formed at the left and right ends of the cross beam 410, respectively, and can extend downward perpendicularly to the cross beam 410. The first supporting leg 420 and the second supporting leg 430 can be in a plate shape. A hinge rod is arranged through the first supporting leg 420 on the left side, and the hinge rod is also arranged through the hinged seat 100, so that the cross beam 410 can be overturned around the hinge rod. The second supporting leg 430 can be clamped to or separated from the clamping seat 200.

[0050] As shown in Figure 2 , Figure 3As shown, further, the clamping seat 200 of the embodiment includes a clamping base 210 and side blocks 220 arranged on both sides of the clamping base 210 in the second direction, and a clamping opening 230 formed between the side blocks 220. The second leg 430 is embedded in the clamping opening 230 by flipping. In the specific structure, the clamping base 210 can be used as a support seat on the right side to lock the position of the entire detection head structure. The second leg 430 in the clamping opening 230 is limited by the side blocks 220 on the front and rear sides of the top surface of the clamping base 210. During the flipping of the support frame 400, the second leg 430 is in and out of the clamping opening 230 to realize the conversion between the opening state and the detection state.

[0051] As shown in Figure 2 , Figure 3 As shown, further, the second leg 430 of the embodiment is provided with a clamping portion 431, and the clamping seat 200 is provided with a clamping assembly 440 located in the clamping opening 230 and used to cooperate with the clamping portion 431 to lock the second leg 430. In the detection state, the second leg 430 needs to be clamped in the clamping opening 230, so that when the lower pressing detection assembly 500 is lowered and contacts the functional pins of the semiconductor module 10, the connection is more stable.

[0052] As shown in Figure 2 , Figure 3 As shown, further, the clamping portion 431 of the embodiment specifically includes an open slot 432, and the slot opening of the open slot 432 is arranged on the side surface of the clamping portion 431 in the first direction. Correspondingly, the clamping assembly 440 specifically includes a clamping column 441 and an elastic member 443. The clamping column 441 is movably arranged on the side block 220 in the first direction, and the elastic member 443 is connected to the clamping column 441 at one end and to the side block 220 at the other end. The clamping column 441 is embedded in the open slot 432 by the elastic force of the elastic member 443. In the specific structure, the clamping seat 200 is located on the right side of the entire structure, the open slot 432 is arranged on the right outer wall of the second leg 430, and the clamping column 441 is located on the right side of the second leg 430. The left end of the elastic member 443 is connected to the side block 220, and the right end is connected to the clamping column 441. The elastic member 443 pulls the clamping column 441 from right to left, so that the clamping column 441 can be pulled and clamped into the open slot 432 to realize locking. When an external force pulls the clamping column 441 from left to right, the clamping column 441 can be separated from the open slot 432 to realize unlocking. In this way, the locking and unlocking processes are very convenient, and the detection efficiency is improved.

[0053] As shown in Figure 2 , Figure 3As shown, further, the two side blocks 220 of the embodiment are provided with locking waist-shaped holes 221, which extend along the first direction. The clamping columns 441 are inserted into the locking waist-shaped holes 221 of the two side blocks 220, and the two ends of the clamping columns 441 protrude out of the surface of the side blocks 220 to form protruding ends; the protruding ends of the two ends are respectively connected with elastic members 443, and the two elastic members 443 are respectively connected to the mounting columns 222 of the two side blocks 220. In the specific structure, the mounting columns 222 are arranged on the outer sides of the front and rear side blocks 220, the elastic members 443 are arranged on the mounting columns 222 of the front and rear sides, and the elastic members 443 of the front and rear sides are respectively connected to the front and rear ends of the clamping columns 441. Thus, the two ends of the clamping columns 441 can be elastically applied, the clamping columns 441 can move left and right along the locking waist-shaped holes 221, the force is more uniform, the clamping columns 441 are not easy to be pulled out of the opening slot 432, and the locking stability is stronger.

[0054] As shown in Figure 2 , Figure 3 , further, the clamping column 441 of the embodiment is provided with a handle portion 442 on the side away from the opening slot 432, and the handle portion 442 is located in the clamping opening 230 to drive the handle portion 442 to move. The handle portion 442 can facilitate the operator to pull the clamping column 441 by hand, so that the unlocking process of the support frame 400 is more convenient.

[0055] As shown in Figure 1 , Figure 2 , Figure 4 , further, the down-pressing detection assembly 500 of the embodiment specifically includes a detection support seat 510, a push-pull pressure device 520, and a pressing plate 530. The detection support seat 510 is arranged on the support frame 400, the push-pull pressure device 520 is arranged on the detection support seat 510, the pressing plate 530 is connected to the push-pull pressure device 520 and moves up and down through the driving of the push-pull pressure device 520, and a plurality of detection connectors 531 are arranged on the pressing plate 530 and contact the functional pins of the semiconductor module 10 through the movement of the pressing plate 530. The push-pull pressure device 520 is fixed by the detection support seat 510, so that the pressing plate 530 can be suspended above the semiconductor module 10, and the push-pull pressure device 520 can adopt a WDC301 push-pull pressure type quick clamp, which can drive the pressing plate 530 to move up and down.

[0056] As shown in Figure 2 , Figure 4As shown, further, the detection support base 510 of the embodiment specifically comprises a support vertical plate 511 and a support horizontal plate 512. The support vertical plate 511 is arranged on the support frame 400, and the push-pull pressure device 520 is connected to the support vertical plate 511; the support horizontal plate 512 is connected perpendicularly to the support vertical plate 511, and a through hole is formed in the support horizontal plate 512, the push rod of the push-pull pressure device 520 is arranged in the through hole, and the push rod is connected to the pressing plate 530 below the support horizontal plate 512. A positioning protrusion 513 is arranged on the back of the support vertical plate 511, and the positioning protrusion 513 and the lower region of the back of the support vertical plate 511 form a mounting step. In the process of fixing the support vertical plate 511 to the support frame 400, the positioning protrusion 513 is abutted against the upper surface of the cross beam 410, the mounting step is attached to the front surface of the cross beam 410, the position of the detection support base 510 is positioned, and then the detection support base 510 is fixed through a screw, so that the mounting precision of the detection support base 510 is high, and the detection support base 510 is convenient to disassemble and assemble.

[0057] As shown in Figure 2 , Figure 4 As shown, further, the pressing plate 530 of the embodiment is arranged with a guide sliding rod 540, the support horizontal plate 512 is arranged with a guide sliding sleeve 541, and the guide sliding rod 540 is movably arranged in the guide sliding sleeve 541 in the up-down direction. In the process of pushing and pressing the pressing plate 530 by the push-pull pressure device 520, the guide sliding rod 540 is directionally slid in the guide sliding sleeve 541, so that the up-down movement of the pressing plate 530 is more stable.

[0058] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement and improvement within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A probe head structure for manual testing of semiconductor modules, characterized by The utility model relates to a semiconductor module detection device, including: Hinge seat and card seat, hinge seat and card seat are located first direction both sides interval arrangement respectively, and form at least one to be examined position between hinge seat and card seat, the position for placing the semiconductor module of to be detected for being examined, Support frame, one end of support frame is hinged on hinge seat, the other end is detachable connection card seat, At least one down pressure detection assembly, down pressure detection assembly is arranged on support frame, down pressure detection assembly includes a plurality of detection joints, Down pressure detection assembly is driven by the turning of support frame and is away from the top of to be examined position or is suspended in the top of to be examined position, The down pressure detection assembly suspended in the top of to be examined position is used to move down and contact the functional pin of semiconductor module.

2. The test head structure for manual testing of semiconductor modules of claim 1, wherein, Support frame includes: crossbeam, crossbeam is arranged along the first direction, First support leg, first support leg is fixed in one end of crossbeam and is hinged on hinge seat, Second support leg, second support leg is fixed in the other end of crossbeam and can be inserted in card seat.

3. The test head structure for manual testing of semiconductor modules of claim 2, wherein, Card seat includes: card base plate, Side stopper, side stopper is arranged in the second direction both sides of card base plate, and the side stopper between both sides forms the card mouth, Second support leg is embedded in the card mouth by turning.

4. The test head structure for manual testing of semiconductor modules of claim 3, wherein Second support leg is provided with card part, and the card part is provided with the carding assembly on the card seat, the carding assembly is located in the card mouth and is used to cooperate with the card part to lock second support leg.

5. The test head structure for manual testing of semiconductor modules of claim 4, wherein, The card part includes an open slot, and the slot opening of the open slot is formed on the side of the card part in the first direction; The carding assembly includes: a card column, the card column is movably arranged on the side stopper along the first direction; Elastic member, one end of elastic member is connected with the card column, and the other end is connected with the side stopper, and the card column is embedded in the open slot by the elastic force of the elastic member.

6. The test head structure for manual testing of semiconductor modules of claim 5, wherein, Locking waist-shaped holes are formed on the side stoppers on both sides and extend along the first direction; The card column is arranged in the locking waist-shaped holes of the side stoppers on both sides, and both ends of the card column protrude from the surface of the side stoppers to form protruding ends; Both ends of the protruding ends are connected with the elastic members, and the elastic members on both sides are connected with the mounting columns of the side stoppers on both sides.

7. The test head structure for manual testing of semiconductor modules of claim 5, wherein, A handle part is arranged on the side of the card column away from the open slot, and the handle part is located in the card mouth to drive the movement of the handle part.

8. A test head structure for manual testing of semiconductor modules according to any one of claims 1 to 7, characterized in that The down pressure detection assembly includes: a detection support seat arranged on the support frame, A push-pull presser arranged on the detection support seat, A pressing plate connected with the push-pull presser and movable up and down by the driving of the push-pull presser, The detection joints are arranged on the pressing plate and contact the functional pins of the semiconductor module by the movement of the pressing plate.

9. The test head structure for manual testing of semiconductor modules of claim 8, wherein, The detection support seat includes: a support vertical plate arranged on the support frame, and the push-pull presser is connected with the support vertical plate, Supporting horizontal plate, which is connected perpendicularly with the supporting vertical plate, and a through hole is formed in the supporting horizontal plate, a push rod of the push-pull pressure device is arranged in the through hole and connected with the pressing plate below the supporting horizontal plate.

10. The test head structure for manual testing of semiconductor modules of claim 9, wherein, A guide sliding rod is arranged on the pressing plate. A guide sliding sleeve is arranged on the supporting horizontal plate, and the guide sliding rod is movably arranged in the guide sliding sleeve in the up-down direction.

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