Integrated piezoresistor with double-layer structure

Abstract

The utility model relates to the technical field of piezoresistors, and discloses an integrated double-layer structure piezoresistor which comprises a piezoresistor body, a cooling heat dissipation device is arranged on the outer surface of the piezoresistor body, and the cooling heat dissipation device comprises a semiconductor chilling plate. A semiconductor chilling plate is arranged on one side of the piezoresistor body, a device convenient to disassemble is arranged between one side of the semiconductor chilling plate and the outer surface of the piezoresistor body, and when the piezoresistor body is installed on a circuit board to be used, after the semiconductor chilling plate on one side is powered on, the semiconductor chilling plate on the other side of the piezoresistor body can be cooled. When surge current absorbed in the piezoresistor body is too large, one side of the piezoresistor body absorbs heat on the surfaces of the piezoresistor body and the aluminum frame to cool the piezoresistor body, then the aluminum frame increases surface contact with the piezoresistor body to enable the piezoresistor body to perform heat exchange, the temperature of the surface of the piezoresistor body is reduced, and the surge current absorbed in the piezoresistor body is too large. And the piezoresistor main body cannot be damaged due to overheating, so that the service life of the piezoresistor main body is prolonged.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of pressure sensitive resistor especially a integrated double -layer structure pressure sensitive resistor. BACKGROUND

[0002] The pressure sensitive resistor is also called as a pressure sensitive resistor, and it is a kind of resistance element with the nonlinear relationship between voltage-current characteristic and voltage. Its resistance value changes with the change of applied voltage, and usually the resistance is larger when the voltage is lower, and when the voltage exceeds certain threshold, the resistance sharply reduces, which can effectively protect the circuit from overvoltage damage.

[0003] The integrated double -layer structure pressure sensitive resistor is composed of two layers of electrodes, one layer is inner electrode, and the other layer is outer electrode. The two layers of electrodes are in contact with electrode through pressure sensitive resistor material such as zinc oxide, and form nonlinear resistance characteristic. Inner and outer electrodes make the voltage can act on the whole surface of pressure sensitive resistor material, and the structure between these electrodes ensures that when overvoltage, current can quickly disperse and protect the circuit, when the pressure sensitive resistor body is installed on the circuit board and used, the pressure sensitive resistor body will absorb overvoltage, and convert excessive electric energy into heat, if the inrush current is too large, it may cause its temperature to be too high, so that the pressure sensitive resistor body is damaged by overheat, and the service life of the pressure sensitive resistor body is reduced. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a integrated double -layer structure pressure sensitive resistor, which aims at solving the problem that when the pressure sensitive resistor body is installed on the circuit board and used, the pressure sensitive resistor body will absorb overvoltage, and convert excessive electric energy into heat, if the inrush current is too large, it may cause its temperature to be too high, so that the pressure sensitive resistor body is damaged by overheat, and the service life of the pressure sensitive resistor body is reduced.

[0005] The utility model is realized in this way, a integrated double -layer structure pressure sensitive resistor, including pressure sensitive resistor body, the outer surface of pressure sensitive resistor body is provided with cooling heat dissipation device, the cooling heat dissipation device can be cooled to aluminium frame through semiconductor refrigerating piece, then the surface of pressure sensitive resistor body is contacted with aluminium frame and exchanges heat, so that it reaches the effect of cooling and heat dissipation.

[0006] Preferably, the cooling heat dissipation device comprises a semiconductor refrigerating piece, and a convenient dismounting device is arranged between one side of the semiconductor refrigerating piece and the outer surface of the pressure sensitive resistor body.

[0007] A plurality of aluminium frames, wherein one end of the aluminium frame is fixedly installed on one side of the semiconductor refrigerating piece, the outer surface of the pressure sensitive resistor body is inserted between the plurality of aluminium frames, and the outer surface is tightly attached to one side of the aluminium frame and the semiconductor refrigerating piece.

[0008] The limiting mechanism is arranged on both sides of the piezoresistor body and is used for limiting and fixing the outer surface of the aluminum frame.

[0009] Preferably, one end of the aluminum frame is fixedly provided with an extension block, and the extension block is tightly combined with the outer surface of the semiconductor refrigeration sheet and the piezoresistor body respectively.

[0010] Preferably, the limiting mechanism comprises a U-shaped block, two ends of the U-shaped block are fixedly provided on one side of the piezoresistor body, the inner wall of one end of the U-shaped block is provided with chamfers on both sides, and one end of the aluminum frame is inserted into the inner wall of the U-shaped block.

[0011] Preferably, the inner wall of the U-shaped block is fixedly provided with an anti-skid block, and the anti-skid block is made of rubber.

[0012] Preferably, the convenient dismounting device comprises two clamping rods, one end of the clamping rod is fixedly provided on one side of the end of the semiconductor refrigeration sheet;

[0013] two clamping blocks, one end of the clamping block is rotatably provided in the inner wall of one end of the clamping rod;

[0014] two clamping hole blocks, one side of the clamping hole block is fixedly provided on the outer surface of the piezoresistor body, and the clamping rod and the clamping block are inserted into the inner wall of the clamping hole block.

[0015] Preferably, the outer surface of one end of the clamping block is sleeved with a torsion spring, and two ends of the torsion spring are fixedly provided on one side of the clamping block and one side of the inner wall of the clamping rod respectively.

[0016] Preferably, the outer surface of one end of the clamping block is fixedly provided with a bearing in the inner part of the torsion spring, and the outer ring of the bearing is fixedly connected with one side of the inner wall of the clamping rod.

[0017] The integrated double-layer structure piezoresistor has the beneficial effects that: the cooling and heat dissipation device is arranged, when the piezoresistor body is installed on the circuit board and used, the semiconductor refrigeration sheet on one side is electrified, the semiconductor refrigeration sheet absorbs the heat on the surface of the piezoresistor body and the aluminum frame, so that the piezoresistor body is cooled, then the aluminum frame increases the surface contact with the piezoresistor body, so that heat exchange occurs, the temperature of the piezoresistor body surface is reduced, and when the surge current absorbed in the piezoresistor body is too large, the piezoresistor body will not be overheated and damaged, and the service life of the piezoresistor body is prolonged. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is a schematic diagram of the integrated double-layer structure piezoresistor provided by the utility model;

[0019] Figure 2It is a main body schematic diagram of an integrated double-layer structure piezoresistor provided by the embodiment of the utility model.

[0020] Figure 3 It is a main body schematic diagram of an integrated double-layer structure piezoresistor provided by the embodiment of the utility model. Figure 2

[0021] Figure 4 It is a semiconductor refrigerating sheet schematic diagram of an integrated double-layer structure piezoresistor provided by the embodiment of the utility model.

[0022] Figure 5 It is a main body schematic diagram of an integrated double-layer structure piezoresistor provided by the embodiment of the utility model. Figure 4

[0023] Marking explanation:

[0024] 1, piezoresistor main body;2, cooling and radiating device;3, convenient to detach device;

[0025] 21, semiconductor refrigerating sheet;22, aluminum frame;23, extension block;24, limiting mechanism;

[0026] 241, U-shaped block;242, chamfer;243, anti-skid block;

[0027] 31, clamping hole block;32, clamping rod;33, clamping block;34, torsional spring;35, bearing. Specific implementation

[0028] In order to make the purpose, technical scheme and advantage of the utility model more clear and obvious, the following is combined with the drawing and embodiment, and the utility model is further described in detail.It should be understood that the specific embodiments described here are only used to explain the utility model, and are not used to limit the utility model.

[0029] The same or similar signs in the drawing of the embodiment correspond to the same or similar parts;In the description of the utility model, it should be understood that if the orientation or position relationship indicated by the terms "upper", "lower", "left", "right" and the like is based on the orientation or position relationship shown in the drawing, it is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, therefore the terms describing the position relationship in the drawing are only used for example, and cannot be understood as limiting the utility model, for ordinary skilled in the art, the specific meaning of the above terms can be understood according to the specific situation.

[0030] The implementation of the utility model is described in detail in combination with specific embodiments.

[0031] In the embodiment,​​

[0032] Referring to Figures 1-5 The utility model provides a preferable embodiment.

[0033] The integrated double-layer structure pressure sensitive resistor of the embodiment comprises a pressure sensitive resistor body 1, and a cooling and heat dissipation device 2 is arranged on the outer surface of the pressure sensitive resistor body 1; the cooling and heat dissipation device 2 can cool the aluminum frame 22 through the semiconductor refrigeration sheet 21, and then heat exchange occurs between the aluminum frame 22 and the surface of the pressure sensitive resistor body 1, so that the cooling and heat dissipation effect is achieved.

[0034] The cooling and heat dissipation device 2 of the pressure sensitive resistor comprises a semiconductor refrigeration sheet 21, a convenient dismounting device 3 arranged between one side of the semiconductor refrigeration sheet 21 and the outer surface of the pressure sensitive resistor body 1; a plurality of aluminum frames 22, wherein one end of the aluminum frame 22 is fixedly installed on one side of the semiconductor refrigeration sheet 21, the outer surface of the pressure sensitive resistor body 1 is inserted between the plurality of aluminum frames 22, and the outer surface is tightly attached to one side of the aluminum frame 22 and the semiconductor refrigeration sheet 21; a limiting mechanism 24, wherein the limiting mechanism 24 is arranged on both sides of the pressure sensitive resistor body 1 and is used for limiting and fixing the outer surface of the aluminum frame 22. The integrated double-layer structure pressure sensitive resistor is composed of two electrodes, one of which is an inner electrode, and the other of which is an outer electrode. The two electrodes are in contact with the electrode through the pressure sensitive resistor material such as zinc oxide, forming a nonlinear resistance characteristic. The inner and outer electrodes enable the voltage to act on the entire surface of the pressure sensitive resistor material, and the structure between the electrodes ensures that the current can be quickly dispersed and the circuit is protected when an overvoltage occurs. When the pressure sensitive resistor body 1 is installed on the circuit board for use, the semiconductor refrigeration sheet 21 on one side is energized to absorb the heat on the surface of the pressure sensitive resistor body 1 and the aluminum frame 22, so as to cool them down, and then the aluminum frame 22 increases the contact with the surface of the pressure sensitive resistor body 1 to cause heat exchange, thereby reducing the temperature on the surface of the pressure sensitive resistor body 1. When the surge current absorbed in the pressure sensitive resistor body 1 is too large, the pressure sensitive resistor body 1 will not be damaged due to overheating, and the service life of the pressure sensitive resistor body 1 is improved. One end of the aluminum frame 22 is fixedly installed with an extension block 23, and the two sides of the extension block 23 are tightly attached to the outer surface of the semiconductor refrigeration sheet 21 and the pressure sensitive resistor body 1 respectively. By arranging the extension block 23, the contact area between the aluminum frame 22 and one side of the semiconductor refrigeration sheet 21 can be increased, so as to facilitate the reduction of the temperature on the surface of the aluminum frame 22 and improve the cold conduction effect of the aluminum frame 22.

[0035] The limiting mechanism 24 of the pressure sensitive resistor comprises a U-shaped block 241, two ends of the U-shaped block 241 are fixedly installed on one side of the pressure sensitive resistor body 1, the inner wall of one end of the U-shaped block 241 is provided with chamfers 242 on both sides, and one end of the aluminum frame 22 is inserted into the inner wall of the U-shaped block 241. When the semiconductor refrigeration sheet 21 and the aluminum frame 22 are installed on the outer surface of the pressure sensitive resistor body 1, one end of the aluminum frame 22 is inserted into the end of the U-shaped block 241 provided with the chamfer 242, so that the U-shaped block 241 can limit the outer surface of the aluminum frame 22, so that the aluminum frame 22 is more attached to the surface of the pressure sensitive resistor body 1 during use, and the cooling and heat dissipation effect is improved. The inner wall of the U-shaped block 241 is fixedly installed with an anti-skid block 243 made of rubber. By arranging the anti-skid block 243, the contact friction of the inner wall of the U-shaped block 241 can be increased, so that the aluminum frame 22 is not easy to shake after being clamped into the inner wall of the U-shaped block 241.

[0036] The convenient dismounting device 3 of the pressure sensitive resistor comprises two clamping rods 32, one end of the clamping rod 32 is fixedly installed on one side of the end of the semiconductor refrigeration sheet 21; two clamping blocks 33, one end of the clamping block 33 is rotatably installed in the inner wall of one end of the clamping rod 32; two clamping hole blocks 31, one side of the clamping hole block 31 is fixedly installed on the outer surface of the pressure sensitive resistor body 1, and the clamping rod 32 and the clamping block 33 are inserted into the inner wall of the clamping hole block 31. When the semiconductor refrigeration sheet 21 needs to be replaced, the clamping block 33 can be manually rotated to a certain angle in the inner wall of the clamping rod 32, and then the semiconductor refrigeration sheet 21 can be pulled upward, so that the clamping rod 32 and the clamping block 33 can be dismounted from the inner wall of the clamping hole block 31, facilitating replacement.

[0037] One end of the clamping block 33 is provided with a torsional spring 34, and the other end of the torsional spring 34 is fixedly installed on one side of the clamping block 33 and one side of the inner wall of the clamping rod 32. By arranging the torsional spring 34, after the clamping block 33 is rotated to a certain angle in the inner wall of the clamping rod 32, the torsional spring 34 will be deformed, then the clamping block 33 is released after being clamped into the inner wall of the clamping hole block 31, the torsional spring 34 will reset and be clamped on one side of the clamping hole block 31, limiting it, avoiding the clamping block 33 and the clamping rod 32 from sliding out of the inner wall of the clamping hole block 31, and the limiting is more firm. A bearing 35 is fixedly installed on the outer surface of one end of the clamping block 33 in the inner part of the torsional spring 34, and the outer ring of the bearing 35 is fixedly connected with one side of the inner wall of the clamping rod 32. By arranging the bearing 35, the rotating wear between the inner wall of the clamping rod 32 and one end of the clamping block 33 can be reduced, the clamping block 33 can be conveniently rotated, and the service life is improved.

[0038] Working principle: integrated double-layer structure pressure sensitive resistor is composed of two layers of electrodes, one layer is inner electrode, the other layer is outer electrode. The two layers of electrodes are in contact with electrode through pressure sensitive resistor material such as zinc oxide, forming nonlinear resistance characteristic. Inner and outer electrodes make voltage can act on the entire surface of pressure sensitive resistor material, and the structure between the electrodes ensures that when overvoltage, current can quickly disperse and protect the circuit, when the pressure sensitive resistor body 1 is installed on the circuit board for use, first the semiconductor refrigeration piece 21 is fixedly installed on the outer surface of the pressure sensitive resistor body 1 by means of the convenient dismounting device 3, then the one end of the aluminum frame 22 is inserted in the inside of the U-shaped block 241, then when the pressure sensitive resistor body 1 is used, the semiconductor refrigeration piece 21 on one side can be electrified, one side will absorb the heat on the surface of the pressure sensitive resistor body 1 and the aluminum frame 22, so as to cool down, then through the aluminum frame 22, the surface contact with the pressure sensitive resistor body 1 is increased, so that heat exchange occurs, to reduce the temperature of the surface of the pressure sensitive resistor body 1, so that when the surge current absorbed in the pressure sensitive resistor body 1 is too large, the pressure sensitive resistor body 1 will not be damaged due to overheating, and the service life of the pressure sensitive resistor body 1 is improved.

[0039] When the semiconductor refrigeration piece 21 needs to be damaged, the clamping block 33 can be manually rotated to a certain angle in the inner wall of the clamping rod 32, then the semiconductor refrigeration piece 21 can be pulled upward, the clamping rod 32 and the clamping block 33 can be dismounted from the inner wall of the clamping hole block 31, so as to facilitate replacement processing.

[0040] The above only describes the preferred embodiments of the present application, and does not limit the present application, any modification, equivalent replacement and improvement within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. An integrated dual-layer structure varistor comprising a varistor main body, characterized by, The outer surface of the pressure sensitive resistance body is provided with a cooling and heat dissipation device, which can cool the aluminum frame through a semiconductor refrigeration sheet, and then exchange heat through the contact between the aluminum frame and the surface of the pressure sensitive resistance body, so as to achieve the effect of cooling and heat dissipation.

2. The integrated dual-layer structure varistor according to claim 1, wherein, The cooling and heat dissipation device comprises a semiconductor refrigeration sheet, and a convenient dismounting device is arranged between one side of the semiconductor refrigeration sheet and the outer surface of the pressure sensitive resistance body. A plurality of aluminum frames, wherein one end of the aluminum frame is fixedly installed on one side of the semiconductor refrigeration sheet, the outer surface of the pressure sensitive resistance body is inserted between the plurality of aluminum frames, and the outer surface is tightly attached to the aluminum frame and one side of the semiconductor refrigeration sheet. A limiting mechanism is arranged on both sides of the pressure sensitive resistance body, which is used for limiting and fixing the outer surface of the aluminum frame.

3. An integrated dual layer structure varistor as defined in claim 2, wherein, One end of the aluminum frame is fixedly installed with an extension block, and the two sides of the extension block are tightly attached to the semiconductor refrigeration sheet and the outer surface of the pressure sensitive resistance body.

4. The integrated dual-layer structure varistor according to claim 2, wherein, The limiting mechanism comprises a U-shaped block, wherein the two ends of the U-shaped block are fixedly installed on one side of the pressure sensitive resistance body, the inner wall of one end of the U-shaped block is provided with chamfers on both sides, and one end of the aluminum frame is inserted into the inner wall of the U-shaped block.

5. An integrated dual layer structure varistor as defined in claim 4, wherein, The inner wall of the U-shaped block is fixedly installed with an anti-skid block made of rubber.

6. The integrated dual-layer structure varistor as claimed in claim 2, wherein, The convenient dismounting device comprises two clamping rods, wherein one end of the clamping rod is fixedly installed on one side of the end of the semiconductor refrigeration sheet. Two clamping blocks are provided, wherein one end of the clamping block is rotatably installed in the inner wall of one end of the clamping rod. Two clamping hole blocks are provided, wherein one side of the clamping hole block is fixedly installed on the outer surface of the pressure sensitive resistance body, and the clamping rod and the clamping block are inserted into the inner wall of the clamping hole block.

7. An integrated dual layer structure varistor as defined in claim 6, wherein, One end of the clamping block is externally provided with a torsion spring, wherein the two ends of the torsion spring are fixedly installed on one side of the clamping block and one side of the inner wall of the clamping rod.

8. An integrated dual layer structure varistor as defined in claim 7, wherein, One end of the clamping block is externally provided with a bearing inside the torsion spring, and the outer ring of the bearing is fixedly connected to one side of the inner wall of the clamping rod.

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