Copper embedding device for printed circuit board

Abstract

The utility model provides a printed circuit board copper embedding device which comprises a supporting column and a hanging plate rotationally connected to the top end of the supporting column, a rotating assembly is arranged below the hanging plate, and an adsorption assembly used for driving a copper block to move so that the copper block can be embedded into a circuit board is arranged below the hanging plate. The adsorption assembly comprises electric push rods annularly arranged on the bottom face of the hanging plate, the telescopic ends of one set of electric push rods are jointly provided with a circular plate, a vacuum pump is arranged above the circular plate, and the input end of the vacuum pump communicates with a telescopic pipe. Through the arranged adsorption assembly, the upper surface of the copper block can be adsorbed, when the copper block descends, the copper block can be smoothly embedded into the groove, excessive extrusion on resin in the groove can be avoided, the resin can be prevented from overflowing from the groove, and it is ensured that uniform and reliable mechanical connection and electrical contact are formed between the bottom face of the copper block and a resin layer and between the bottom face of the copper block and a circuit board bonding pad.

Description

Technical Field

[0001] This utility model relates to the field of printed circuit board processing equipment technology, and in particular to a copper embedding device for printed circuit boards. Background Technology

[0002] As a key component of electronic devices, printed circuit boards play a vital role in connecting and supporting electronic components. To meet the ever-increasing performance demands of electronic products, copper materials need to be embedded in printed circuit boards. By optimizing the copper foil thickness, improving the copper wire pattern design, and adopting advanced copper filling technology, the electrical and mechanical properties of the circuit board can be significantly improved.

[0003] In the production process of printed circuit boards, in order to achieve the copper embedding process, copper embedding grooves need to be pre-processed on the surface of the circuit board. Then, molten resin is filled into the groove. With the help of the adhesive and curing properties of the resin, the copper block and the circuit board are tightly bonded. When using traditional clamping tools, since they can only clamp the outer side of the copper block, once the copper block needs to be embedded into a copper embedding groove with a deep depth and narrow opening, the structure of the clamping tool itself will interfere with the opening of the groove. This not only hinders the copper block from reaching the bottom of the groove smoothly, but also causes the resin to be over-compressed, causing it to overflow from the groove in large quantities, thus affecting the bonding effect between the copper block, the resin, and the circuit board. To address this, we provide a copper embedding device for printed circuit boards. Utility Model Content

[0004] This utility model provides a copper embedding device for printed circuit boards to solve the technical problems existing in the background art.

[0005] The purpose and effect of this utility model for a copper embedding device for printed circuit boards are achieved by the following specific technical means: A copper embedding device for printed circuit boards includes a support column and a hanging plate rotatably connected to the top of the support column. A rotating component is provided below the hanging plate, and an adsorption component for moving a copper block to embed it into the circuit board is provided below the hanging plate. The adsorption component includes an electric push rod arranged in a ring on the bottom surface of the hanging plate. A circular plate is installed on the telescopic ends of a group of electric push rods. A vacuum pump is provided above the circular plate. The input end of the vacuum pump is connected to a telescopic tube. The bottom end of the telescopic tube is connected to a connecting pipe. The bottom end of the connecting pipe passes through the circular plate and is connected to two sets of symmetrically arranged suction tubes. A suction cup is provided at the bottom end of each suction tube.

[0006] Preferably, the rotating assembly includes a motor mounted on the bottom surface of the suspended platform, a rotating rod mounted on the output end of the motor, a gear fixedly connected to the bottom end of the rotating rod, a gear meshing with a toothed ring on the outside of the gear, and the inner ring of the toothed ring being connected to the outer surface of the support column.

[0007] Preferably, a reinforcing collar is rotatably connected to the outer surface of the rotating rod, and the inner ring of the reinforcing collar is rotatably connected to the outer surface of the support column.

[0008] Preferably, a pressure relief valve is provided on the outside of the connecting pipe, and the pressure relief valve is equipped with a visual pressure display dial.

[0009] Preferably, each of the suction tubes has a connecting ring fixedly connected to its outer surface, and a cross rod is fixedly connected between the two sets of connecting rings.

[0010] Preferably, the outer surface of the vacuum pump is fixedly connected with an L-shaped plate arranged in a ring, and the top of each L-shaped plate is connected to the bottom surface of the hanging plate.

[0011] Preferably, the outer surface of the circular plate is fixedly connected with a ring of reinforcing rods, and the bottom end of each reinforcing rod is connected to the outer surface of the suction tube.

[0012] Preferably, the bottom end of the support column is fixedly connected to a mounting base, and the upper surface of the mounting base is provided with mounting holes arranged in a ring.

[0013] Beneficial effects:

[0014] 1. The adsorption components can adsorb the upper surface of the copper block, allowing it to be smoothly embedded in the groove when the copper block descends. This also avoids excessive compression of the resin in the groove, preventing the resin from overflowing and ensuring a uniform and reliable mechanical connection and electrical contact between the bottom surface of the copper block, the resin layer, and the circuit board pads.

[0015] 2. The connection between the bottom of the suction tube and the cross rod is reinforced by the connecting ring, ensuring stability when the suction cup adsorbs the copper block. The reinforcement rod connects the top of the suction tube to the circular plate, further enhancing the stability when the suction tube pushes the copper block downward. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall three-dimensional structure of this utility model.

[0017] Figure 2 This is a three-dimensional structural diagram of the rotating component of this utility model.

[0018] Figure 3 This is a three-dimensional structural diagram of the circular plate of this utility model.

[0019] Figure 4 This is a three-dimensional structural diagram of the suction tube of this utility model.

[0020] Figure 1-4 In the diagram, the correspondence between component names and drawing numbers is as follows:

[0021] 1. Support column; 2. Hanging plate; 3. Rotating assembly; 301. Motor; 302. Rotating rod; 303. Gear; 304. Gear ring; 305. Reinforcing collar; 4. Adsorption assembly; 401. Electric push rod; 402. Circular plate; 403. Vacuum pump; 404. Telescopic pipe; 405. Connecting pipe; 406. Suction pipe; 407. Suction cup; 408. Pressure relief valve; 409. Connecting ring; 410. Cross rod; 411. L-shaped plate; 412. Reinforcing rod; 5. Mounting base. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0023] As attached Figure 1 As shown: A copper embedding device for printed circuit boards includes a support column 1 and a hanging plate 2 rotatably connected to the top of the support column 1. The bottom end of the support column 1 is fixedly connected to a mounting base 5. The upper surface of the mounting base 5 is provided with a ring of mounting holes, which facilitates the worker to fix the support column 1 and the hanging plate 2.

[0024] As attached Figure 1 With appendix Figure 2 As shown: A rotating assembly 3 is provided below the hanging plate 2. The rotating assembly 3 includes a motor 301 installed on the bottom surface of the hanging plate 2. A rotating rod 302 is installed at the output end of the motor 301. A gear 303 is fixedly connected to the bottom end of the rotating rod 302. A gear ring 304 meshes with the outside of the gear 303. The inner ring of the gear ring 304 is connected to the outer surface of the support column 1. The operation of the motor 301 can drive the gear 303 to rotate through the rotating rod 302. The gear 303 will rotate around the gear ring 304. At the same time, the hanging plate 2 will deflect synchronously, which facilitates the movement of the copper block. A reinforcing collar 305 is rotatably connected to the outer surface of the rotating rod 302. The inner ring of the reinforcing collar 305 is rotatably connected to the outer surface of the support column 1. The reinforcing collar 305 can further enhance the firmness of the gear 303 and ensure its stability when rotating around the gear ring 304.

[0025] As attached Figure 1 Appendix Figure 3 With appendix Figure 4As shown: Below the hanging plate 2, an adsorption assembly 4 is installed to move the copper block and embed it into the circuit board. The adsorption assembly 4 includes annularly arranged electric push rods 401 mounted on the bottom surface of the hanging plate 2. A circular plate 402 is mounted on the telescopic ends of a group of electric push rods 401. A vacuum pump 403 is positioned above the circular plate 402. The input end of the vacuum pump 403 is connected to a telescopic tube 404. The bottom end of the telescopic tube 404 is connected to a connecting tube 405. The bottom end of the connecting tube 405 passes through the circular plate 402 and is connected to two symmetrically arranged suction tubes 406. Each suction tube 406 has a suction cup 407 at its bottom end. The vacuum pump 40... 3. During operation, suction is applied inside the connecting tube 405, creating a vacuum inside the suction tube 406. The suction cup 407 then adsorbs the copper block. Controlling the extension of the electric push rod 401 causes the suction tube 406 to descend, allowing the copper block to be smoothly embedded into the groove. This also prevents excessive pressure on the resin, avoiding resin overflow from the groove and ensuring a good bond between the copper block, the resin, and the circuit board. A pressure relief valve 408 is installed on the outside of the connecting tube 405, equipped with a visual pressure display dial. By operating the pressure relief valve 408, the pressure changes within the pipe can be precisely controlled, quickly releasing the vacuum in the suction tube 406. This allows the suction cup 407 to separate smoothly from the adsorbed material, facilitating continued adsorption of the copper block. Furthermore, the visual pressure display dial features a high-contrast design with clear scales, allowing operators to intuitively and in real-time obtain the pressure value within the connecting tube 405, preventing excessive adsorption of the copper block.

[0026] As attached Figure 3 With appendix Figure 4 As shown: The outer surface of the vacuum pump 403 is fixedly connected with an L-shaped plate 411 arranged in a ring. The top of each L-shaped plate 411 is connected to the bottom surface of the hanging plate 2. The L-shaped plate 411 can be used to fix the vacuum pump 403, thereby ensuring that it is in a stable state during operation. The outer surface of each suction tube 406 is fixedly connected with a connecting ring 409. A cross rod 410 is fixedly connected between two sets of connecting rings 409. The cooperation between the connecting ring 409 and the cross rod 410 can reinforce the bottom of the suction tube 406, thereby ensuring the stability of the suction cup 407 and ensuring its stable adsorption of the copper block. The outer surface of the circular plate 402 is fixedly connected with a reinforcing rod 412 arranged in a ring. The bottom of each reinforcing rod 412 is connected to the outer surface of the suction tube 406. The reinforcing rod 412 can be used to connect the top of the suction tube 406 to the circular plate 402, further enhancing the stability of the suction tube 406 when pushing the copper block downward.

[0027] Working principle: When in use, the electric push rod 401 extends, and the circular plate 402 drives the suction tube 406 and suction cup 407 to descend until the suction cup 407 contacts the copper block. Then, the vacuum pump 403 is controlled to work, and the vacuum pump 403 will draw suction from the inside of the connecting tube 405, creating a vacuum inside the suction tube 406. The suction cup 407 will then adsorb the copper block. Next, the motor 301 is controlled to work, and the rotating rod 302 will drive the gear 303 to rotate around the gear ring 304. At the same time, the hanging plate 2 will deflect the adsorbed copper block until the copper block reaches above the slot of the circuit board. Then, the electric push rod 401 is controlled to extend, and the suction tube 406 will push the copper block down, allowing the copper block to be smoothly embedded into the slot. This also avoids excessive compression of the resin and prevents the resin from overflowing from the slot, ensuring the bonding effect between the copper block, the resin, and the circuit board.

Claims

1. A copper-embedding device for printed circuit boards, comprising a support column (1) and a hanging plate (2) rotatably connected to the top end of the support column (1), characterized in that: The lower part of the hanging plate (2) is provided with a rotating assembly (3), and the lower part of the hanging plate (2) is provided with a suction assembly (4) for driving the copper block to move to embed it into the circuit board, the suction assembly (4) comprises a plurality of electric push rods (401) arranged in a ring on the bottom surface of the hanging plate (2), the telescopic ends of a group of the electric push rods (401) are jointly provided with a circular plate (402), the upper part of the circular plate (402) is provided with a vacuum pump (403), the input end of the vacuum pump (403) is communicated with a telescopic pipe (404), the bottom end of the telescopic pipe (404) is communicated with a connecting pipe (405), the bottom end of the connecting pipe (405) penetrates through the circular plate (402) and is communicated with two groups of symmetrically arranged suction pipes (406), and the bottom end of each suction pipe (406) is provided with a suction disc (407).

2. The printed circuit board copper inlay apparatus of claim 1, wherein: The rotating assembly (3) comprises a motor (301) mounted on the bottom surface of the hanging plate (2), the output end of the motor (301) is provided with a rotating rod (302), the bottom end of the rotating rod (302) is fixedly connected with a gear (303), the outer part of the gear (303) is engaged with a gear ring (304), and the inner circle of the gear ring (304) is connected with the outer surface of the support column (1).

3. The printed circuit board copper inlay apparatus of claim 2, wherein: The outer surface of the rotating rod (302) is rotatably connected with a reinforcing sleeve ring (305), and the inner circle of the reinforcing sleeve ring (305) is rotatably connected with the outer surface of the support column (1).

4. The printed circuit board copper inlay apparatus of claim 1, wherein: The outer part of the connecting pipe (405) is provided with a pressure relief valve (408), and the pressure relief valve (408) is provided with a visual pressure display dial.

5. The printed circuit board copper inlay apparatus of claim 1, wherein: The outer surface of each suction pipe (406) is fixedly connected with a connecting ring (409), and the two groups of connecting rings (409) are jointly fixedly connected with a cross rod (410).

6. The printed circuit board copper inlay apparatus of claim 1, wherein: The outer surface of the vacuum pump (403) is fixedly connected with a ring-shaped L-shaped plate (411), and the top end of each L-shaped plate (411) is connected with the bottom surface of the hanging plate (2).

7. The printed circuit board copper inlay apparatus of claim 1, wherein: The outer surface of the circular plate (402) is fixedly connected with a ring-shaped reinforcing rod (412), and the bottom end of each reinforcing rod (412) is connected with the outer surface of the suction pipe (406).

8. The printed circuit board copper inlay apparatus of claim 1, wherein: The bottom end of the support column (1) is fixedly connected with a mounting seat (5), and the upper surface of the mounting seat (5) is provided with a ring-shaped mounting hole.

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