Ultrasonic horn
By using PCB modules and heat insulation frame structures in ultrasonic speakers, the problems of plastic shell melting and poor soldering caused by heat transfer during the welding process are solved, resulting in higher product quality and heat insulation performance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-30
- Publication Date
- 2026-04-07
AI Technical Summary
During the welding process of ultrasonic speakers, the high thermal conductivity of metal materials causes the surface of the plastic shell to melt or deform, and the high thermal conductivity of iron rivets causes the solidified tin to melt again during the secondary soldering process, resulting in poor soldering and tin beads falling off, which affects product quality.
PCB modules are used to replace iron rivets, and a heat insulation frame and adhesive layer are set on the plastic shell. The low thermal conductivity of the PCB and the adhesive layer isolate heat, reduce thermal conductivity, prevent heat from being transferred to the plastic shell, and reduce cold solder joints and solder ball falling off.
It effectively reduces the scrap rate of plastic shells, avoids poor soldering and solder ball falling off, improves the quality stability of products, and the PCB module can be replaced without discarding plastic shells, thus enhancing the heat insulation effect.
Smart Images
Figure CN224097841U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to ultrasonic loudspeaker production technical field especially relates to ultrasonic loudspeaker. BACKGROUND
[0002] Ultrasonic loudspeaker is a kind of equipment using ultrasonic technology to realize the directional propagation of sound, it can accurately transmit sound to specific location by adjusting the emission direction of ultrasonic, realizes the directional propagation of sound in specific area without noise interference to other areas.Ultrasonic loudspeaker needs welding work in production process, metal material (such as titanium alloy, steel) is quickly heat-conductive when welding, heat is transferred to the plastic shell of ultrasonic loudspeaker through rivet needle, can cause the surface of plastic shell to melt or deform (especially in secondary welding process), and the high thermal conductivity of iron rivet needle can cause the solidified tin to melt again when secondary tin soldering, so that the originally welded product produces false welding, false welding and tin beads falling into the inner cavity of plastic shell affect quality. SUMMARY
[0003] In order to solve the deficiencies existing in the prior art, the utility model provides ultrasonic loudspeaker.
[0004] The technical implementation scheme of the utility model is: ultrasonic loudspeaker, including plastic shell, the installation port is arranged on the plastic shell, the heat insulation frame is arranged in the installation port, the installation channel is formed in the heat insulation frame, the PCB module is fixedly arranged in the installation channel by gluing, and the PCB module is composed of insulating substrate and conductive circuit.
[0005] Preferably, the insulating substrate is ceramic filled epoxy resin material.
[0006] Preferably, the thickness of the adhesive layer is 0.1-0.5mm, and the thermal conductivity coefficient is less than or equal to 0.5W / m·K.
[0007] Preferably, the installation port and the heat insulation frame leave a heat insulation interval.
[0008] The utility model has the following advantages: 1, the utility model replaces iron rivet needle by PCB module, utilizes the low thermal conductivity of PCB and the isolation of adhesive layer, reduces the heat of heat insulation frame to plastic shell, reduces the scrap rate of plastic shell, and can avoid the solidified tin to melt again when secondary tin soldering, so that the originally welded product produces false welding, false welding and tin beads falling into the inner cavity of plastic shell affect quality;
[0009] 2, the utility model leaves a heat insulation interval between the installation port and the heat insulation frame to reduce the thermal conductivity and improve the heat insulation effect. BRIEF DESCRIPTION OF DRAWINGS
[0010] Fig. 1 It is the three-dimensional structure schematic diagram of the utility model.
[0011] Fig. 2 This is a three-dimensional structural cross-sectional view of the mounting port and heat insulation frame of this utility model.
[0012] In the attached diagram: 1-Plastic shell, 2-Mounting port, 3-Insulation frame, 31-Mounting channel, 32-Insulation zone, 4-PCB module. Detailed Implementation
[0013] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0014] Example 1: Ultrasonic loudspeaker, see reference Figs. 1-2 The ultrasonic speaker includes a plastic shell 1. The top of the plastic shell 1 is provided with two mounting ports 2. Each mounting port 2 is provided with a heat insulation frame 3. Each heat insulation frame 3 is provided with a mounting channel 31. A PCB module 4 is fixedly mounted in the mounting channel 31 by adhesive. The PCB module 4 is composed of an insulating substrate and conductive lines.
[0015] Preferably, the insulating substrate is FR-4, polyimide, or ceramic-filled epoxy resin material.
[0016] Preferably, the adhesive layer has a thickness of 0.1-0.5 mm and a thermal conductivity of ≤0.5 W / m·K.
[0017] Preferably, each mounting port 2 has a heat insulation zone 32 between it and the heat insulation frame 3.
[0018] Working principle: By utilizing the low thermal conductivity of the PCB and the insulation layer, the heat transferred from the heat insulation frame 3 to the plastic shell 1 is reduced, thus reducing the scrap rate of the plastic shell 1. At the same time, it can prevent the solidified solder from melting again during secondary soldering, which would cause the originally soldered product to have poor soldering, false soldering, and solder balls falling into the inner cavity of the plastic shell, affecting the quality. In addition, the PCB module 4 can be replaced, eliminating the need to discard the plastic shell 1. Furthermore, the heat insulation zone 32 left between the mounting port 2 and the heat insulation frame 3 reduces the thermal conductivity and improves the heat insulation effect.
[0019] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made using the content of this utility model specification, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.
Claims
1. An ultrasonic loudspeaker, characterized by: It includes a plastic shell (1), an installation port (2) is provided on the plastic shell (1), a heat insulation frame (3) is provided inside the installation port (2), an installation channel (31) is provided inside the heat insulation frame (3), and a PCB module (4) is fixedly installed in the installation channel (31) by adhesive. The PCB module (4) is composed of an insulating substrate and conductive lines.
2. The ultrasonic loudspeaker according to claim 1, characterized in that: The insulating substrate is made of ceramic-filled epoxy resin material.
3. The ultrasonic loudspeaker according to claim 1, characterized in that: The adhesive layer has a thickness of 0.1-0.5 mm and a thermal conductivity of ≤0.5 W / m·K.
4. The ultrasonic loudspeaker according to claim 1, characterized in that: A heat insulation zone (32) is left between the installation port (2) and the heat insulation frame (3).