Honeycomb type heat dissipation channel design structure of high-thermal-conductivity UVC ceramic support

Abstract

The utility model belongs to the technical field of LED lamp tube support structures, and particularly relates to a honeycomb type heat dissipation channel design structure of a high-heat-conduction UVC ceramic support, which comprises a ceramic substrate, UVC lamp beads, a lampshade and a heat dissipation structure, an annular groove is arranged on the front side of the ceramic substrate, the UVC lamp beads are fixedly arranged on the ceramic substrate, the lampshade is embedded into the annular groove through an annular convex rib at the bottom to be fixed, and the heat dissipation structure is arranged in the annular groove. The heat dissipation structure comprises a heat conduction column, a honeycomb channel and a heat dissipation disc, the two ends of the heat conduction column are connected with the bottom of the UVC lamp bead and the heat dissipation disc respectively, and the honeycomb channel is vertically arranged in the ceramic substrate. The working temperature of the UVC lamp bead is effectively reduced, and the problem of insufficient heat dissipation performance in the prior art is solved, so that the luminous efficiency is improved, and the service life is prolonged.

Description

Technical Field

[0001] This utility model belongs to the technical field of LED tube bracket structure, specifically relating to the honeycomb heat dissipation channel design structure of a high thermal conductivity UVC ceramic bracket. Background Technology

[0002] Ceramic substrates have excellent thermal conductivity, reliable electrical insulation, low dielectric constant, and low dielectric loss, therefore, ceramic substrates are widely used in LED products. In the prior art, utility model patent CN212805535 U discloses a UVC ceramic bracket, including a ceramic substrate, an annular groove on the surface of the ceramic substrate, a UVC lamp bead on the ceramic substrate, and a spherical lamp cover on the UVC lamp bead. The bottom end of the lamp cover is fixedly installed in the annular groove. The back of the ceramic substrate is divided into three areas: a positive electrode pad area, a thermally conductive pad area, and a negative electrode pad area. The positive electrode pad area and the negative electrode pad area are respectively located on both sides of the thermally conductive pad area. This utility model has an annular groove on its surface for installing the lamp cover. The annular groove has an internal thread, and the bottom end of the lamp cover has an external thread. The internal and external threads are screwed together, so that the LED lamp cover and the ceramic bracket are integrated into a single structure, reducing manufacturing costs and saving usage costs, and further reducing the size of the bracket. However, its UVC lamp bead generates a lot of heat when working, and the heat conduction efficiency of the thermally conductive pad area is insufficient, which can easily lead to excessively high lamp bead temperature, affecting luminous efficiency and service life. Utility Model Content

[0003] To address the aforementioned shortcomings in the existing technology, this utility model provides a honeycomb heat dissipation channel design structure for a high thermal conductivity UVC ceramic bracket, thereby solving the problems mentioned in the background technology.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: a honeycomb heat dissipation channel design structure for a high thermal conductivity UVC ceramic bracket, including a ceramic substrate, UVC lamp beads, a lamp cover, and a heat dissipation structure. The front side of the ceramic substrate is provided with an annular groove, the UVC lamp beads are fixedly mounted on the ceramic substrate, and the lamp cover is fixed by being embedded in the annular groove through an annular rib at the bottom. The heat dissipation structure includes heat-conducting pillars, honeycomb channels, and a heat dissipation plate. The two ends of the heat-conducting pillars are respectively connected to the bottom of the UVC lamp beads and the heat dissipation plate. The honeycomb channels are vertically arranged inside the ceramic substrate.

[0005] Preferably, the annular groove sidewall is provided with a plurality of snap-fit ​​holes, and the annular rib of the lampshade is provided with 3 to 6 elastic snap-fit ​​claws evenly distributed on the outer circumference of the sidewall, and the snap-fit ​​claws are embedded in the snap-fit ​​holes to achieve locking.

[0006] Preferably, the heat sink has a heat dissipation channel, which is connected to the honeycomb channel.

[0007] Preferably, the ceramic substrate has a positive electrode pad and a negative electrode pad on its back side, and the heat sink is located in the central area between the positive electrode pad and the negative electrode pad.

[0008] Preferably, the inner wall of the honeycomb channel is covered with a thermally conductive metal layer.

[0009] Preferably, a silicone sealing ring is provided at the bottom of the annular groove.

[0010] Compared with the prior art, this utility model has the following advantages:

[0011] By using a honeycomb heat dissipation channel design (including heat-conducting pillars, honeycomb channels, and heat sinks) combined with a heat-conducting metal layer, an efficient heat conduction path is formed, which effectively reduces the operating temperature of UVC lamp beads and solves the problem of insufficient heat dissipation performance in existing technologies, thereby improving luminous efficiency and extending service life. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of this utility model;

[0013] Figure 2 This is a schematic diagram of the heat dissipation structure of this utility model;

[0014] Figure 3 This is a schematic diagram of the cellular channel of this utility model;

[0015] Figure 4 for Figure 1 Enlarged view of point A in the middle.

[0016] The reference numerals in the accompanying drawings include:

[0017] 1-Ceramic substrate, 11-Positive electrode pad, 12-Negative electrode pad, 13-Annular groove, 131-Snap-in hole, 2-UVC lamp bead, 3-Lamp cover, 31-Annular rib, 311-Snap-in claw, 4-Heat dissipation structure, 41-Heat conduction pillar, 42-Honeycomb channel, 421-Heat conduction metal layer, 43-Heat dissipation plate. Detailed Implementation

[0018] To enable those skilled in the art to better understand this utility model, the technical solution of this utility model will be further described below in conjunction with the accompanying drawings and embodiments.

[0019] The accompanying drawings are for illustrative purposes only and are schematic diagrams, not actual images. They should not be construed as limiting the scope of this patent. To better illustrate the embodiments of this utility model, some components in the drawings may be omitted, enlarged, or reduced, and do not represent the actual dimensions of the product. It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings.

[0020] In the accompanying drawings of this utility model, the same or similar reference numerals correspond to the same or similar components. In the description of this utility model, it should be understood that if terms such as "upper," "lower," "left," "right," "inner," and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0021] In the description of this utility model, unless otherwise explicitly specified and limited, the term "connection" or similar designation indicating the connection relationship between components should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0022] like Figure 1-4 As shown, the honeycomb heat dissipation channel design structure of the high thermal conductivity UVC ceramic bracket of this utility model includes a ceramic substrate 1, UVC lamp beads 2, lamp cover 3 and heat dissipation structure 4. The front side of the ceramic substrate 1 is provided with an annular groove 13. The UVC lamp beads 2 are fixedly set on the ceramic substrate 1. The lamp cover 3 is fixed by being embedded in the annular groove 13 by the annular rib 31 at the bottom. The heat dissipation structure 4 includes a heat-conducting column 41, a honeycomb channel 42 and a heat dissipation plate 43. The two ends of the heat-conducting column 41 are respectively connected to the bottom of the UVC lamp beads 2 and the heat dissipation plate 43. The honeycomb channel 42 is vertically set inside the ceramic substrate 1.

[0023] Furthermore, the annular groove 13 has several snap-fit ​​holes 131 on its side wall, and 3 to 6 elastic snap-fit ​​claws 311 are evenly distributed on the outer circumference of the annular rib 31 of the lampshade 3. The snap-fit ​​claws 311 are embedded in the snap-fit ​​holes 131 to achieve locking.

[0024] Furthermore, the heat sink 43 has a heat dissipation channel inside, which is connected to the honeycomb channel 42. The heat sink 43 can increase the heat dissipation contact area and can be connected to an external heat sink to accelerate heat dissipation.

[0025] Furthermore, a positive electrode pad 11 and a negative electrode pad 12 are provided on the back of the ceramic substrate 1, and a heat sink 43 is located in the central area between the positive electrode pad 11 and the negative electrode pad 12.

[0026] Furthermore, the inner wall of the honeycomb channel 42 is covered with a thermally conductive metal layer 421. The vertical air duct of the honeycomb channel 42 can accelerate heat convection, and the thermally conductive metal layer 421 improves thermal conductivity.

[0027] Furthermore, a silicone sealing ring is provided at the bottom of the annular groove 13.

[0028] The working principle of this utility model is as follows: When the UVC lamp bead 2 is working, it generates heat. The generated heat is conducted to the heat sink 43 through the heat-conducting column 41 connected to the bottom of the lamp bead. The heat-conducting column 41 directly conducts the heat of the lamp bead to the back of the ceramic substrate 1, reducing the lateral thermal resistance. At the same time, the heat-conducting metal layer 421 on the inner wall of the honeycomb channel 42 accelerates the diffusion of heat inside the ceramic substrate 1. The heat dissipation channel in the heat sink 43 is connected to the honeycomb channel 42 to form an air convection channel, which carries away the heat through air flow, achieving efficient heat dissipation.

[0029] The above are merely embodiments of this utility model. The circuits, electronic components, and modules involved are all prior art, fully achievable by those skilled in the art, and require no further explanation. The content protected by this application does not involve improvements to the software or methods. Commonly known structures and characteristics in the solution are not described in detail here. Those skilled in the art are aware of all common technical knowledge in the field to which this utility model pertains prior to the application date or priority date, are able to access all existing technologies in that field, and possess the ability to apply conventional experimental methods prior to that date. Those skilled in the art can, under the guidance of this application, improve and implement this solution in conjunction with their own capabilities. Some typical known structures or methods should not be obstacles for those skilled in the art to implement this application. It should be noted that those skilled in the art can make several modifications and improvements without departing from the structure of this utility model. These should also be considered within the scope of protection of this utility model, and will not affect the effectiveness of the implementation of this utility model or the practicality of the patent.

Claims

1. A honeycomb heat dissipation channel design structure for a high thermal conductivity UVC ceramic bracket, comprising a ceramic substrate (1), UVC lamp beads (2), a lamp cover (3), and a heat dissipation structure (4), characterized in that: The ceramic substrate (1) has an annular groove (13) on its front side. The UVC lamp bead (2) is fixedly mounted on the ceramic substrate (1). The lamp cover (3) is fixed by being embedded in the annular groove (13) through the annular rib (31) at the bottom. The heat dissipation structure (4) includes a heat-conducting column (41), a honeycomb channel (42) and a heat sink (43). The two ends of the heat-conducting column (41) are respectively connected to the bottom of the UVC lamp bead (2) and the heat sink (43). The honeycomb channel (42) is vertically arranged inside the ceramic substrate (1).

2. The honeycomb heat dissipation channel design structure of the high thermal conductivity UVC ceramic bracket according to claim 1, characterized in that: The annular groove (13) has several snap-fit ​​holes (131) on its side wall. The annular rib (31) of the lampshade (3) has 3 to 6 elastic snap-fit ​​claws (311) evenly distributed around its outer circumference. The snap-fit ​​claws (311) are embedded in the snap-fit ​​holes (131) to achieve locking.

3. The honeycomb heat dissipation channel design structure of the high thermal conductivity UVC ceramic bracket according to claim 1, characterized in that: The heat sink (43) has a heat dissipation channel, which is connected to the honeycomb channel (42).

4. The honeycomb heat dissipation channel design structure of the high thermal conductivity UVC ceramic bracket according to claim 1, characterized in that: The ceramic substrate (1) has a positive electrode pad (11) and a negative electrode pad (12) on its back side, and the heat sink (43) is located in the central area between the positive electrode pad (11) and the negative electrode pad (12).

5. The honeycomb heat dissipation channel design structure of the high thermal conductivity UVC ceramic bracket according to claim 1, characterized in that: The inner wall of the honeycomb channel (42) is covered with a thermally conductive metal layer (421).

6. The honeycomb heat dissipation channel design structure of the high thermal conductivity UVC ceramic bracket according to claim 1, characterized in that: A silicone sealing ring is provided at the bottom of the annular groove (13).

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