Chuck for high and low temperature probe station

Abstract

The utility model discloses a chuck for a high and low temperature probe station, which comprises a shell, and an accommodating cavity is arranged in the shell; the heat insulation assembly is arranged in the accommodating cavity; the heating part is arranged on the upper surface of the heat insulation assembly; the refrigeration assembly is tightly attached to the upper surface of the heating part and comprises a liquid nitrogen disc, a nitrogen inlet pipe and a nitrogen outlet pipe are arranged at the two ends of the liquid nitrogen disc, and a plurality of flow blocking columns are arranged in the liquid nitrogen disc; the heat conduction assembly is arranged on the upper surface of the liquid nitrogen disc. The chuck is arranged on the upper surface of the heat conduction assembly. According to the liquid nitrogen disc, the effect of refrigerating through liquid nitrogen is better, the liquid nitrogen disc is internally provided with a plurality of flow blocking columns, the liquid nitrogen can be evenly dispersed to all positions in the liquid nitrogen disc, the phenomena that single-channel circulation is achieved, the temperature of the formed channel position is low, and the surrounding temperature is high are avoided, and the refrigerating and heat conduction effects of the liquid nitrogen disc are further improved; when heat heated by the heating part is transferred upwards, the heat is transferred to the chuck after being sequentially transferred through the liquid nitrogen disc and the heat conduction assembly, the temperature uniformity is good, and the heating effect is good.

Description

A chuck for a high and low temperature probe station Technical Field

[0001] This utility model relates to a chuck, and more particularly to a chuck for a high and low temperature probe station. Background Technology

[0002] Probe stations are mainly used in the semiconductor, optoelectronic, integrated circuit, and packaging testing industries. They are widely used in the research and development of precision electrical measurements for complex, high-speed devices, aiming to ensure quality and reliability while reducing research and development time and device manufacturing costs.

[0003] In semiconductor reliability testing (such as JEDEC MSL testing), superconducting material property research, and thermal cycling experiments on aerospace components, chucks are required to hold samples. These chucks also need to be able to switch between high and low temperatures to meet the testing requirements of different environments. Most existing structures use heating and water cooling devices to switch the chuck between high and low temperatures. However, in practical use, it has been found that water cooling has poor cooling efficiency, with a maximum low temperature of only -60°C and high energy consumption. Meanwhile, the heating devices produce poor temperature uniformity, resulting in poor temperature uniformity in high-temperature environments on the chuck, which fails to meet the requirements of related experiments. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art by providing a chuck for high and low temperature probe stations, which has good cooling effect and good temperature uniformity on the chuck after heating, thus meeting the testing requirements of relevant experimental environments.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is: a chuck for a high and low temperature probe station, comprising:

[0006] A housing having a receiving cavity inside;

[0007] A heat insulation component is disposed within the receiving cavity;

[0008] A heating element is disposed on the upper surface of the heat insulation component;

[0009] A refrigeration assembly is attached to the upper surface of the heating part. The refrigeration assembly includes a liquid nitrogen disk with a nitrogen inlet pipe and a nitrogen outlet pipe at both ends. The cavity of the liquid nitrogen disk is provided with a plurality of uniformly distributed flow-blocking columns.

[0010] A heat-conducting component is disposed on the upper surface of the liquid nitrogen disk;

[0011] A chuck is disposed on the upper surface of the heat-conducting component.

[0012] Furthermore, the heating part includes a heating plate, and the two ends of the heating plate are provided with connecting wires for an external power supply.

[0013] Furthermore, the heat insulation component includes heat insulation cotton and heat insulation board that are tightly attached to each other, and the area of ​​the heat insulation cotton is smaller than the area of ​​the heat insulation board.

[0014] Furthermore, the heat-conducting component includes a heat transfer plate and a copper plate arranged vertically, and the area of ​​the heat transfer plate is smaller than the area of ​​the copper plate and the chuck.

[0015] Furthermore, the shell is made of aluminum.

[0016] Furthermore, the housing is also provided with an isolation layer surrounding the heat insulation component, heating element, cooling component, heat conduction component, and chuck for signal isolation.

[0017] Furthermore, the chuck incorporates a shape memory alloy.

[0018] Furthermore, the housing includes a grounded outer shell and a floor disposed at the bottom of the grounded outer shell.

[0019] Due to the application of the above technical solution, this utility model has the following advantages compared with the prior art:

[0020] The high and low temperature probe station chuck of this utility model uses liquid nitrogen for cooling through a liquid nitrogen pan. Since the temperature of liquid nitrogen can reach a lower temperature than that of cold water, its cooling effect is better. In addition, multiple flow-blocking columns are set inside the liquid nitrogen pan, which can evenly distribute the liquid nitrogen to all positions in the cavity of the liquid nitrogen pan, avoiding the phenomenon of low temperature at the channel position and high temperature at the surrounding area due to single-channel flow, and further improving the cooling and heat conduction effect of the liquid nitrogen pan.

[0021] Secondly, due to the presence of the heat insulation component below, the heat generated by the heating element can only be transferred upwards. As the heat is transferred upwards, it passes through the liquid nitrogen plate and the heat conduction component in sequence. Because it passes through two layers, the temperature uniformity is better when the heat is finally transferred to the chuck. Attached Figure Description

[0022] The technical solution of this utility model will be further described below with reference to the accompanying drawings:

[0023] Figure 1 is a three-dimensional structural schematic diagram of an embodiment of the present invention;

[0024] Figure 2 is a three-dimensional structural diagram of an embodiment of the present invention with the chuck omitted;

[0025] Figure 3 is a three-dimensional structural diagram of Figure 2 after omitting the grounding shell;

[0026] Figure 4 is a structural schematic diagram of the assembly of the heating part and the heat insulation component in one embodiment of this utility model;

[0027] Figure 5 is a schematic diagram of the internal structure of the liquid nitrogen disk in one embodiment of the present invention;

[0028] The components are as follows: 1. Shell; 2. Insulation component; 3. Heating unit; 4. Cooling component; 5. Heat conduction component; 6. Chuck; 7. Insulation layer; 10. Grounded shell; 11. Floor; 20. Insulation cotton; 21. Insulation board; 30. Heating plate; 31. Connecting wire; 40. Liquid nitrogen plate; 41. Nitrogen inlet pipe; 42. Nitrogen outlet pipe; 43. Flow-blocking column; 50. Heat transfer plate; 51. Copper plate. Detailed Implementation

[0029] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0030] This invention provides a chuck for a high and low temperature probe station to solve the problems of poor temperature uniformity and poor cooling effect when switching between high and low temperatures in existing chucks.

[0031] For ease of understanding, the specific process of the embodiments of this application is described below. Please refer to Figures 1 to 3. A chuck for a high and low temperature probe station in this embodiment of the application includes a housing 1, a heat insulation component 2, a heating part 3, a cooling component 4, a heat conducting component 5, and a chuck 6. The housing 1 has a receiving cavity for placing the heat insulation component 2, the heating part 3, the cooling component 4, the heat conducting component 5, and the chuck 6. The heat insulation component 2 is disposed in the receiving cavity. The heating part 3 is disposed on the upper surface of the heat insulation component. The heating part 3 transfers heat to the upper part, while the lower part is isolated by the heat insulation component 2, so that the heat transferred to the upper part is more concentrated and effective.

[0032] The cooling component 4 is attached to the upper surface of the heating part 3. The cooling component includes a liquid nitrogen disk 40, with a nitrogen inlet pipe 41 and a nitrogen outlet pipe 42 at both ends. The liquid nitrogen disk 40 has multiple flow-blocking columns 43 inside. The heat-conducting component 5 is disposed on the upper surface of the liquid nitrogen disk 40; the chuck 6 is disposed on the upper surface of the heat-conducting component 5.

[0033] The high and low temperature probe station chuck of this utility model allows cold liquid nitrogen to flow into the liquid nitrogen pan 40 from the nitrogen inlet pipe 41 and then out from the nitrogen outlet pipe 42. Since the temperature of liquid nitrogen can reach a lower temperature than that of cold water, its cooling effect is better, and liquid nitrogen cooling can achieve rapid cooling. In addition, multiple flow-blocking columns 43 are set inside the liquid nitrogen pan 40. When the liquid nitrogen flows inside the liquid nitrogen pan 40, the presence of the flow-blocking columns 43 can evenly distribute the liquid nitrogen to all positions in the cavity of the liquid nitrogen pan 40, avoiding the phenomenon of low temperature at the channel position and high temperature at the surrounding area due to single-channel flow, further improving the cooling and heat conduction effect of the liquid nitrogen pan 40. Secondly, the heat generated by the heating part 3 can only be transferred upward due to the presence of the heat insulation component 2 below. When the heat is transferred upward, it passes through the liquid nitrogen pan and the heat conduction component in sequence. Due to the transfer through two layers, the temperature uniformity is better when the heat is finally transferred to the chuck.

[0034] Furthermore, based on Figure 1, the housing 1 is also provided with an isolation layer 7 surrounding the heat insulation component 2, the heating part 3, the cooling component 4, the heat conduction component 5 and the chuck 6, for signal isolation and to improve test accuracy.

[0035] Furthermore, based on FIG1, the housing 1 includes a grounded outer shell 10 and a floor 11 located at the bottom of the grounded outer shell 10, the grounded outer shell 10 and the floor 11 forming a receiving cavity.

[0036] In addition, the grounding housing 10 and the floor 11 are made of aluminum, which provides good grounding, but the material is not limited to aluminum.

[0037] Furthermore, based on Figures 1 to 4, the heating part 3 includes a heating plate 30. The heating plate 30 has two connecting wires 31 for external power supply at both ends. When the heating plate is energized through the connecting wires 31, it is heated. The connecting wires 31 at both ends are led out from the isolation layer 7 and the grounded outer shell 10 in sequence.

[0038] Furthermore, based on Figures 3 and 4, the heat insulation component 2 includes heat insulation cotton 20 and heat insulation board 21. The heat insulation cotton 20 can block a large amount of heat from being transferred downward to the heat insulation board, so that very little heat will end up on the heat insulation board 21, and even less heat will be transferred downward from the heat insulation board 21 to the floor 11.

[0039] In addition, the area of ​​the heat insulation cotton 20 is smaller than that of the heat insulation board 21, which is more conducive to the heat being dispersed onto the large area of ​​the heat insulation board 21, resulting in better heat insulation performance of the heat insulation board 21.

[0040] Furthermore, based on Figure 2, the heat-conducting component 5 includes a heat transfer plate 50 and a copper plate 51 arranged vertically, and the area of ​​the heat transfer plate is smaller than the area of ​​the copper plate and the chuck. In this embodiment, the heat from the heating part 3 is transferred from the liquid nitrogen disk to the copper plate 51, then from the copper plate 51 to the heat transfer plate 50, and finally to the chuck, thereby rapidly heating the chuck. The area of ​​the heat transfer plate 50 is smaller than the area of ​​the copper plate 51, so when the heat generated by the heating part 3 is conducted upwards, the heat is forced to concentrate as it enters the small area of ​​the heat transfer plate from the large area of ​​the copper plate 51, thus accelerating the heating effect of the chuck.

[0041] Furthermore, a shape memory alloy is built into the chuck 6, which allows the chuck 6 to quickly return to its original shape under pressure deformation, ensuring the normal conduct of the test.

[0042] In actual use, the product to be tested is first placed on the chuck 6. When the product needs to be in a high-temperature environment, the heating plate 30 is powered on and begins to heat up. The heat is then uniformly transferred to the chuck through the liquid nitrogen plate, copper plate 51, and heat transfer plate 50. The chuck quickly heats up to the set temperature, and then the test can be performed on the chuck. When the product needs to be in a low-temperature state, liquid nitrogen is introduced into the liquid nitrogen plate to rapidly cool it down. The low temperature is then uniformly transferred to the chuck through the copper plate and heat transfer plate 50. The chuck quickly cools down to the set temperature, and then the test can be performed.

[0043] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A chuck for a high and low temperature probe station, characterized in that, include: The housing (1) has a receiving cavity; a heat insulation component (2) is disposed in the receiving cavity; a heating part (3) is disposed on the upper surface of the heat insulation component (2); a cooling component (4) is attached to the upper surface of the heating part (3), the cooling component (4) includes a liquid nitrogen disk (40), the two ends of the liquid nitrogen disk (40) are provided with a nitrogen inlet pipe (41) and a nitrogen outlet pipe (42), and a plurality of uniformly distributed flow-blocking columns (43) are provided in the cavity of the liquid nitrogen disk (40); a heat conduction component (5) is disposed on the upper surface of the liquid nitrogen disk (40); and a chuck (6) is disposed on the upper surface of the heat conduction component (5).

2. The chuck for a high and low temperature probe station as described in claim 1, characterized in that: The heating part (3) includes a heating plate (30), and the two ends of the heating plate (30) are provided with connecting wires (31) for external power supply.

3. The chuck for a high and low temperature probe station as described in claim 1, characterized in that: The heat insulation component (2) includes heat insulation cotton (20) and heat insulation board (21) that are closely attached to each other, and the area of ​​the heat insulation cotton (20) is smaller than the area of ​​the heat insulation board (21).

4. The chuck for a high and low temperature probe station as described in claim 1, characterized in that: The heat-conducting component (5) includes a heat transfer plate (50) and a copper plate (51) arranged vertically, and the area of ​​the heat transfer plate (50) is smaller than the area of ​​the copper plate (51) and the chuck (6).

5. The chuck for a high and low temperature probe station as described in claim 1, characterized in that: The shell (1) is made of aluminum.

6. The chuck for a high and low temperature probe station as described in claim 1, characterized in that: The housing (1) is further provided with an isolation layer (7) surrounding the heat insulation component (2), heating part (3), cooling component (4), heat conduction component (5) and chuck (6) for signal isolation.

7. The chuck for a high and low temperature probe station as described in claim 1, characterized in that: The chuck (6) has a built-in memory alloy.

8. The chuck for a high and low temperature probe station as described in claim 1, characterized in that: The housing (1) includes a grounded outer shell (10) and a floor (11) disposed at the bottom of the grounded outer shell (10).

Images