Double-sided circuit board with single-sided copper-embedded asymmetric structure

Abstract

The utility model relates to the technical field of double-sided circuit boards, in particular to a single-sided copper-embedded double-sided circuit board with an asymmetric structure, which comprises a substrate, the outer side of the substrate is fixedly connected with a fixed frame, the fixed frame is provided with a heat absorption mechanism, the heat absorption mechanism comprises a copper ring and a mounting groove, the surface of the fixed frame is provided with the mounting groove, and the copper ring is fixedly connected with the mounting groove. A mounting groove is formed in the substrate, a copper ring is bonded in the mounting groove, a heat conduction mechanism is mounted on the copper ring, the heat conduction mechanism comprises a bonding plate I, a bonding plate II and a connecting plate, the bonding plate I is bonded on the copper ring, the bonding plate II is bonded on the substrate, and the connecting plate is fixedly connected between the bonding plate I and the bonding plate II. An air cooling mechanism is arranged at the bottom of the fixing frame, a heat absorption mechanism is arranged on the outer side of the circuit board to dissipate heat of the circuit board, the heat dissipation effect is improved, the circuit is protected, and normal work of electrical equipment is facilitated.

Description

Single-sided copper-embedded asymmetric double-sided circuit board Technical Field

[0001] This utility model relates to double-sided circuit boards, specifically a single-sided copper-embedded asymmetric double-sided circuit board, belonging to the field of double-sided circuit board technology. Background Technology

[0002] Single-sided copper embedding refers to a circuit board where copper foil or copper layer is embedded only on one side, while the other side may use different materials or copper layer distribution methods. This design breaks the conventional practice of symmetrical copper layering on both sides of a double-sided circuit board and can be achieved through local thickening, irregularly shaped copper foil, or specific patterned copper layers. The asymmetry is mainly reflected in the difference in the thickness, shape, or distribution density of the copper layer on both sides. For example, one side has a large area of ​​copper foil (for heat dissipation or power layer), while the other side has fine traces (for signal layer), or electromagnetic performance can be optimized through local copper embedding.

[0003] Current single-sided copper-embedded asymmetrical double-sided circuit boards directly mount many electronic components on their surface during use. Although one side of the circuit can be partially exposed on the other side of the circuit board for heat dissipation, no other heat dissipation mechanism is set up to cool the circuit board. The electrical components on the circuit board are installed in blocks according to their power, with high-power electrical components concentrated in one place and low-power electrical components installed in another. When electronic components work for a long time, the circuit board is prone to overheating. The heat dissipation is only achieved through the exposed printed circuit, which has a poor heat dissipation effect and can easily cause circuit damage, resulting in the electrical equipment not working. Summary of the Invention

[0004] The purpose of this utility model is to provide a single-sided copper-embedded asymmetric double-sided circuit board to solve the above problems. A heat-absorbing mechanism is set on the outside of the circuit board to dissipate heat from the circuit board, thereby improving the heat dissipation effect, protecting the circuit, and facilitating the normal operation of electrical equipment.

[0005] This utility model achieves the above-mentioned objectives through the following technical solution: a single-sided copper-embedded asymmetric double-sided circuit board, including a substrate, a fixing frame fixedly connected to the outer side of the substrate, a heat absorption mechanism provided on the fixing frame, the heat absorption mechanism including a copper ring and a mounting groove, the mounting groove being formed on the surface of the fixing frame, a copper ring being bonded inside the mounting groove, a heat conduction mechanism being installed on the copper ring, the heat conduction mechanism including a first adhesive plate, a second adhesive plate, and a connecting plate, the first adhesive plate being bonded to the copper ring, the second adhesive plate being bonded to the substrate, a connecting plate being fixedly connected between the first adhesive plate and the second adhesive plate, and a wind-cooling mechanism being provided at the bottom of the fixing frame.

[0006] Preferably, the copper ring has a cuboid cross-section, and the thickness of the copper ring is equal to the thickness of the substrate.

[0007] Preferably, the surface of the copper ring is flush with the surface of the fixing frame, the first adhesive plate is distributed in a rectangular array on the copper ring, the second adhesive plate is distributed in a rectangular array on the substrate, and a connecting plate is fixedly connected between the first adhesive plate and the second adhesive plate.

[0008] Preferably, both the first adhesive plate and the second adhesive plate are disc-shaped, and the first adhesive plate and the second adhesive plate have the same diameter.

[0009] Preferably, the air-cooling mechanism includes heat dissipation holes, and the fixed frame is provided with heat dissipation holes.

[0010] Preferably, the heat dissipation holes are located at half the width of the mounting groove, and the heat dissipation holes are rectangularly distributed on the fixing frame.

[0011] Preferably, the air-cooling mechanism further includes a slide rail one, which is rectangularly fixedly connected to the bottom edge of the fixed frame. Four slide rails two, which are opposite to the slide rail one, are fixedly connected to the bottom of the fixed frame. The four slide rails two are rectangularly distributed at the bottom of the fixed frame, and the length of the four slide rails two is less than the length and width of the fixed frame. Two sliders are slidably connected inside each of the slide rail one and slide rail two. A fan is fixedly connected between the two sliders, and the fan is located at the bottom of the heat dissipation hole.

[0012] Preferably, the air-cooling mechanism further includes bolts, and four bolts are threaded in a rectangular shape on the fan, with the ends of the bolts abutting against the fixing frame.

[0013] The beneficial effects of this utility model are as follows: the copper ring is placed inside the mounting groove and bonded with thermally conductive adhesive. The thermally conductive adhesive can both bond and conduct heat. Multiple adhesive plates two are bonded to the substrate in a rectangular shape at equal intervals using thermally conductive adhesive. On the copper ring, adhesive plates one opposite to the adhesive plates two are bonded to the copper ring at equal intervals using thermally conductive adhesive. A connecting plate is welded between the two. Then, the adhesive plates two can absorb the heat on the substrate and transfer the heat to the copper ring through the connecting plate and the adhesive plates two, thus achieving heat absorption and heat dissipation. The air-cooling mechanism is installed at the bottom of the fixed frame to air-cool the copper ring and improve the heat dissipation effect. Attached Figure Description

[0014] Figure 1 is a schematic diagram of the overall structure of this utility model;

[0015] Figure 2 is a schematic diagram of the connection structure of the substrate, fixing frame and copper ring of this utility model;

[0016] Figure 3 is a schematic diagram of the connection structure of the fixing frame and mounting groove of this utility model;

[0017] Figure 4 is a schematic diagram of the connection structure of the fixing frame, heat dissipation holes and slide rail 1 of this utility model.

[0018] Figure 5 is a schematic diagram of the connection structure of the fixed frame, slide rail one, slide rail two and fan of this utility model;

[0019] Figure 6 is a schematic diagram of the connection structure of slide rail one, slide rail two and fan of this utility model;

[0020] Figure 7 is a schematic diagram of the connection structure of the fan, slider and bolt of this utility model.

[0021] In the diagram: 1. Substrate; 2. Fixing frame; 3. Heat absorption mechanism; 301. Copper ring; 302. Mounting groove; 4. Heat conduction mechanism; 401. Adhesive plate one; 402. Adhesive plate two; 403. Connecting plate; 5. Air cooling mechanism; 501. Heat dissipation hole; 502. Slide rail one; 503. Slide rail two; 504. Fan; 505. Bolt; 506. Slider. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please refer to Figures 1-7. The single-sided copper-embedded asymmetric double-sided circuit board includes a substrate 1. A fixing frame 2 is fixedly connected to the outer side of the substrate 1. A heat absorption mechanism 3 is provided on the fixing frame 2. The heat absorption mechanism 3 includes a copper ring 301 and a mounting groove 302. The mounting groove 302 is opened on the surface of the fixing frame 2. The copper ring 301 is bonded to the inside of the mounting groove 302. A heat conduction mechanism 4 is installed on the copper ring 301. The heat conduction mechanism 4 includes a first adhesive plate 401, a second adhesive plate 402, and a connecting plate 403. The first adhesive plate 401 is bonded to the copper ring 301. The second adhesive plate 402 is bonded to the substrate 1. A connecting plate 403 is fixedly connected between the first adhesive plate 401 and the second adhesive plate 402. A wind-cooling mechanism 5 is provided at the bottom of the fixing frame 2.

[0024] As a technical optimization of this utility model, the copper ring 301 has a rectangular cross-section, and its thickness is equal to that of the substrate 1. The surface of the copper ring 301 is flush with the surface of the fixing frame 2. The first adhesive plate 401 is arranged in a rectangular array on the copper ring 301, and the second adhesive plate 402 is arranged in a rectangular array on the substrate 1. A connecting plate 403 is fixedly connected between each of the first adhesive plate 401 and the second adhesive plate 402. Both the first adhesive plate 401 and the second adhesive plate 402 have a disc-shaped structure. Furthermore, the diameters of the first adhesive plate 401 and the second adhesive plate 402 are the same. During installation, the copper ring 301 is bonded to the inside of the mounting groove 302 with thermally conductive adhesive. Then, multiple first adhesive plates 401 are bonded to the copper ring 301 at equal intervals, and multiple second adhesive plates 402 are bonded to the substrate 1 at equal intervals. The connecting plate 403 connects the two, so that the heat absorbed by the substrate 1 by the second adhesive plate 402 is transferred to the connecting plate 403. The connecting plate 403 transfers the heat to the first adhesive plate 401, and further dissipates heat through the copper ring 301.

[0025] As a technical optimization of this utility model, the air-cooling mechanism 5 includes heat dissipation holes 501. The fixed frame 2 is provided with heat dissipation holes 501. The heat dissipation holes 501 are located at half the width of the mounting groove 302, and the heat dissipation holes 501 are rectangularly distributed on the fixed frame 2. The heat dissipation holes 501 can directly exchange heat at the copper ring 301 with the air to achieve natural heat dissipation.

[0026] As a technical optimization of this utility model, the air-cooling mechanism 5 further includes a slide rail 502. The bottom edge of the fixed frame 2 is rectangularly connected to the slide rail 502. Four slide rails 503, opposite to the slide rail 502, are fixedly connected to the bottom of the fixed frame 2. The four slide rails 503 are rectangularly distributed at the bottom of the fixed frame 2, and their lengths are less than the length and width of the fixed frame 2. Two sliders 506 are slidably connected inside each slide rail 502 and slide rail 503. A fan 504 is fixedly connected between the two sliders 506. The fan 504 is located at the bottom of the heat dissipation hole 501. It can be moved to a location with more electronic components by using the slider 506 in conjunction with the first slide rail 502 and the second slide rail 503 to dissipate heat from areas with higher temperatures. The air cooling mechanism 5 also includes bolts 505. Four bolts 505 are threadedly connected to the fan 504 in a rectangular shape. The ends of the bolts 505 abut against the fixing frame 2. After the fan 504 is slid to a designated position, the bolts 505 can be rotated to make the bolts 505 abut against the bottom of the fixing frame 2, thus fixing the fan 504 and preventing shaking and abnormal noise during operation.

[0027] In this invention, the fixing frame 2 and the substrate 1 can be directly welded together during production, and the two can be made of the same material. Electronic components are welded onto the circuit board according to their power rating. Higher-power electronic components can be installed in one area during circuit printing, while lower-power components can be installed in another. Then, when installing the copper ring 301, the dust inside the mounting groove 302 on the fixing frame 2 is cleaned. A layer of thermally conductive adhesive is applied in a rectangular shape to the mounting groove 302, taking care not to apply the thermally conductive adhesive to the heat dissipation holes 501 to avoid clogging them. The copper ring 301 is placed inside the mounting groove 302 and bonded to the thermally conductive adhesive. The thermally conductive adhesive serves both bonding and heat dissipation. Further, multiple adhesive plates 402 are equidistantly bonded to the substrate 1 in a rectangular shape using thermally conductive adhesive. An adhesive plate 401, opposite to the adhesive plates 402, is equidistantly bonded to the copper ring 301 using thermally conductive adhesive. A connecting wire is welded between the two. If the connecting plate 403 and the second adhesive plate 402 can absorb the heat on the substrate 1, and can transfer the heat to the copper ring 301 through the connecting plate 403 and the second adhesive plate 402, thus achieving heat absorption and dissipation, protecting the circuit on the substrate 1 from damage due to excessive temperature; finally, slide the fan 504 between the first slide rail 502 and the second slide rail 503, power it, and the fan 504 can blow air towards the heat dissipation hole 501 at the bottom of the fixing frame 2, increasing airflow, carrying away the heat at the copper ring 301, further dissipating heat from the copper ring 301, improving the heat dissipation effect on the substrate 1, protecting the circuit, and facilitating the normal operation of electrical equipment. To quickly dissipate heat from the substrate 1 where the electrical components have high power, the fan 504 needs to be installed at the bottom of the first slide rail 502 where there are more electrical components. Simply slide the fan 504 to the first slide rail 502 where there are more electrical components, and then tighten the bolt 505 to accurately blow heat.

[0028] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0029] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A single-sided copper-embedded asymmetric double-sided circuit board, comprising a substrate (1), characterized in that: A fixing frame (2) is fixedly connected to the outer side of the substrate (1). A heat absorption mechanism (3) is provided on the fixing frame (2). The heat absorption mechanism (3) includes a copper ring (301) and a mounting groove (302). The mounting groove (302) is opened on the surface of the fixing frame (2). A copper ring (301) is bonded inside the mounting groove (302). A heat conduction mechanism (4) is installed on the copper ring (301). The heat conduction mechanism (4) includes a first adhesive plate (401), a second adhesive plate (402), and a connecting plate (403). The first adhesive plate (401) is bonded to the copper ring (301). The second adhesive plate (402) is bonded to the substrate (1). A connecting plate (403) is fixedly connected between the first adhesive plate (401) and the second adhesive plate (402). A wind-cooling mechanism (5) is provided at the bottom of the fixing frame (2).

2. The single-sided copper-embedded asymmetric double-sided circuit board according to claim 1, characterized in that: The copper ring (301) has a rectangular parallelepiped cross-section, and the thickness of the copper ring (301) is equal to the thickness of the substrate (1).

3. The single-sided copper-embedded asymmetric double-sided circuit board according to claim 1, characterized in that: The surface of the copper ring (301) is flush with the surface of the fixing frame (2). The first adhesive plate (401) is arranged in a rectangular array on the copper ring (301), and the second adhesive plate (402) is arranged in a rectangular array on the substrate (1). A connecting plate (403) is fixedly connected between the first adhesive plate (401) and the second adhesive plate (402).

4. The single-sided copper-embedded asymmetric double-sided circuit board according to claim 1, characterized in that: Both the first adhesive plate (401) and the second adhesive plate (402) are disc-shaped, and the first adhesive plate (401) and the second adhesive plate (402) have the same diameter.

5. The single-sided copper-embedded asymmetric double-sided circuit board according to claim 1, characterized in that: The air-cooling mechanism (5) includes heat dissipation holes (501), and the fixed frame (2) is provided with heat dissipation holes (501).

6. The single-sided copper-embedded asymmetric double-sided circuit board according to claim 5, characterized in that: The heat dissipation holes (501) are located at half the width of the mounting groove (302), and the heat dissipation holes (501) are rectangularly distributed on the fixing frame (2).

7. The single-sided copper-embedded asymmetric double-sided circuit board according to claim 5, characterized in that: The air-cooling mechanism (5) also includes a slide rail 1 (502). The bottom edge of the fixed frame (2) is fixedly connected to the slide rail 1 (502) in a rectangular shape. The bottom of the fixed frame (2) is fixedly connected to four slide rails 2 (503) that are opposite to the slide rail 1 (502). The four slide rails 2 (503) are rectangularly distributed at the bottom of the fixed frame (2). The length of the four slide rails 2 (503) is less than the length and width of the fixed frame (2). The slide rail 1 (502) and the slide rail 2 (503) are each slidably connected to two sliders (506). A fan (504) is fixedly connected between the two sliders (506). The fan (504) is located at the bottom of the heat dissipation hole (501).

8. The single-sided copper-embedded asymmetric double-sided circuit board according to claim 7, characterized in that: The air-cooling mechanism (5) also includes bolts (505). The fan (504) has four bolts (505) connected in a rectangular thread. The ends of the bolts (505) abut against the fixing frame (2).

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