Heat insulation device and chip fixing system

Abstract

The utility model relates to a heat insulation device and a chip fixing system. The heat insulation device comprises a drainage piece, the drainage piece is provided with a drainage cavity, an air inlet communicated with the drainage cavity is formed in the middle of the drainage piece in the length direction of the drainage piece, and the drainage piece is further provided with an air outlet communicated with the drainage cavity. The heat insulation device can be arranged between the wafer bearing device and a welding device such as a lead frame, cooling airflow is introduced from the air inlet, the cooling airflow flows through the drainage cavity, heat is taken out from the air outlet, and direct transfer of external heat to the wafer bearing device is reduced. The drainage piece is arranged between the wafer bearing device and the welding device and can serve as a physical heat insulation barrier to block heat transfer from the welding device to the wafer bearing device, so that heat radiation is weakened in the transmission process, and the heat radiation quantity reaching the wafer bearing device is reduced. Furthermore, the air inlet is formed in the middle of the drainage piece, and the position of the air inlet can correspond to a high-temperature die bonding area of the welding device, so that the high-temperature heat dissipation effect of the heat insulation device can be improved.

Description

Technical Field

[0001] This application relates to the field of chip fixing technology, and in particular to a heat insulation device and a chip fixing system. Background Technology

[0002] The Small Outline Transistor (SOT) bonding process involves using a robotic arm to transfer semiconductor chips from a wafer to a bonding device, such as a leadframe, and then bonding and securing the semiconductor chips to the leadframe. This process directly affects the electrical connection reliability, heat dissipation performance, and mechanical strength of the device. To improve the transfer efficiency of the robotic arm, the wafer carrier is usually positioned close to the leadframe to reduce the transfer distance. Because the bonding process requires high temperatures, the leadframe also reaches a high temperature, and heat can easily be transferred to the wafer carrier, causing the wafer to expand and wrinkle due to heat. This can lead to misalignment of the semiconductor chips on the wafer, making it difficult for the robotic arm to accurately identify the chip's location.

[0003] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this utility model and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content

[0004] Therefore, it is necessary to provide a heat insulation device and a chip fixing system to address the problem that the chips on the wafer may shift due to heat on the wafer carrier and become difficult for the robotic arm to recognize.

[0005] In a first aspect, a heat insulation device includes:

[0006] The heat insulation device includes a drainage component, which has a drainage cavity. Along the length of the drainage component, the middle part of the drainage component has an air inlet communicating with the drainage cavity, and the drainage component also has an air outlet communicating with the drainage cavity.

[0007] In one embodiment, the air inlet includes a first air inlet and a second air inlet both disposed in the middle of the guide member, and the air outlet includes a first air outlet and a second air outlet. The first air outlet and the second air outlet are respectively disposed at both ends of the guide member along its length direction. The guide cavity includes a first airflow channel and a second airflow channel disposed at intervals. The first air inlet and the first air outlet are connected to the first airflow channel, and the second air inlet and the second air outlet are connected to the second airflow channel.

[0008] In one embodiment, the drainage member includes a housing and a drainage protrusion. The housing has a receiving cavity, and the drainage protrusion is connected to the housing and located within the receiving cavity to divide the receiving cavity into the drainage cavity. The housing has an air inlet at the middle of its length direction, and the housing also has an air outlet.

[0009] In one embodiment, the drainage protrusion includes a first drainage protrusion and a second drainage protrusion that are staggered along the length direction of the housing. The housing has a first sidewall and a second sidewall along a first direction. The first direction, the length direction of the housing, and the thickness direction of the housing intersect each other, and the three are not coplanar. One end of the first drainage protrusion along its own length direction is connected to the first sidewall, and the other end extends along the first direction toward the second sidewall and is spaced apart from the second sidewall along the first direction. One end of the second drainage protrusion along its own length direction is connected to the second sidewall, and the other end extends along the first direction toward the first sidewall and is spaced apart from the first sidewall along the first direction.

[0010] In one embodiment, the housing includes a detachably connected upper shell and a lower shell, the upper shell and the lower shell together forming the receiving cavity, the drainage protrusion protruding from the upper shell and abutting against the lower shell, the drainage protrusion, the upper shell and the lower shell together defining the drainage cavity, and the upper shell having a through-hole and an air inlet communicating with the drainage cavity.

[0011] In one embodiment, the air inlet includes a side opening and a bottom opening. The side opening is formed on the side of the upper shell along its own length direction. The side opening extends along a first direction and communicates with the bottom opening. The bottom opening is formed on the bottom surface of the upper shell along its own thickness direction. The bottom opening communicates with the drainage cavity. The first direction intersects the length direction and the thickness direction of the upper shell in pairs, and the three directions are not coplanar.

[0012] In one embodiment, the air outlet is an air outlet groove recessed along the thickness direction of the upper shell. The air outlet groove is connected to the drainage cavity. The opening of the air outlet groove is opened on the side of the upper shell along its length direction. The air outlet groove extends along a first direction. The first direction intersects the length direction and the thickness direction of the upper shell in pairs, and the three directions are not coplanar.

[0013] In one embodiment, the heat insulation device further includes a heat insulation element disposed at the top and / or bottom of the drain element along its own thickness direction.

[0014] In one embodiment, the heat insulation device further includes a mounting bracket connected to the draining member, the mounting bracket being used to fix the draining member.

[0015] In a second aspect, a chip fixing system includes a welding device, a heat insulation device, and a carrier device, wherein the carrier device is used to carry a wafer on which transistors are disposed, and the heat insulation device is disposed between the welding device and the carrier device, and the heat insulation device is the heat insulation device as described in the first aspect.

[0016] The aforementioned heat insulation device can be installed between the wafer carrier and the bonding equipment, such as the lead frame. Cooling airflow can be introduced through the air inlet of the lead-in component. The cooling airflow flows through the lead-in cavity and carries heat away from the air outlet, reducing the direct transfer of external heat to the wafer carrier. The lead-in component, positioned between the wafer carrier and the bonding equipment, itself acts as a physical heat barrier, blocking heat transfer from the bonding equipment to the wafer carrier, thus weakening heat radiation during propagation and reducing the amount of heat radiation reaching the wafer carrier. Furthermore, since the air inlet is located in the middle of the lead-in component, its position corresponds to the high-temperature die-bonding area of ​​the bonding equipment, improving the heat dissipation effect of the heat insulation device. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the disclosed drawings without creative effort.

[0018] Figure 1 This is a three-dimensional schematic diagram of a heat insulation device provided in an embodiment of this application.

[0019] Figure 2 (a) is a bottom view of the upper shell provided in an embodiment of this application. Figure 2 (b) is a front view of an upper shell provided in an embodiment of this application.

[0020] Figure 3 An exploded schematic diagram of a heat insulation device provided in an embodiment of this application.

[0021] Explanation of reference numerals in the attached drawings: 100, heat insulation device; 1, air intake component; 11, air intake cavity; 111, first airflow channel; 112, second airflow channel; 12, air inlet; 121, first air inlet; 122, second air inlet; 123, side opening; 124, bottom opening; 13, air outlet; 131, first air outlet; 132, second air outlet; 133, air outlet groove; 14, housing; 141, first side wall; 142, second side wall; 143, upper shell; 144, lower shell; 15, air intake protrusion; 151, first air intake protrusion; 152, second air intake protrusion; 2, heat insulation component; 3, mounting bracket. Detailed Implementation

[0022] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0023] The Small Outline Transistor (SOT) bonding process involves using a robotic arm to transfer semiconductor chips from a wafer to a bonding device, such as a leadframe, and then bonding the semiconductor chips to the leadframe. This process directly affects the electrical connection reliability, heat dissipation performance, and mechanical strength of the device. To improve the transfer efficiency of the robotic arm, the wafer carrier is usually placed close to the leadframe to reduce the transfer distance. Because the bonding process requires high temperatures, the leadframe also reaches a high temperature, and heat is easily transferred to the wafer carrier. This causes the wafer on the carrier to expand and wrinkle due to heat, and the semiconductor chips on the wafer are prone to shifting, making it difficult for the robotic arm to accurately identify and grasp the chip.

[0024] In this embodiment of the application, the length direction is Figures 1 to 3 The Y direction shown is the first direction. Figures 1 to 3 The X-direction shown is the thickness direction. Figures 1 to 3 The Z direction is shown.

[0025] Based on the above issues, please refer to Figure 1 This application provides a heat insulation device 100, which includes a draining member 1. Please refer to [link to relevant documentation]. Figure 2 The drainage component 1 is provided with a drainage cavity 11. Along the length of the drainage component 1, please refer to... Figure 1The guide element 1 has an air inlet 12 communicating with the guide cavity 11 in its middle part, and an air outlet 13 communicating with the guide cavity 11. The heat insulation device 100 of this application can be disposed between the wafer carrier and the welding device, such as the lead frame. Cooling airflow can be introduced from the air inlet 12 of the guide element 1. The cooling airflow flows through the guide cavity 11 and carries away heat from the air outlet 13, reducing the direct transfer of external heat to the wafer carrier. The guide element 1, disposed between the wafer carrier and the welding device, can itself act as a physical heat insulation barrier, blocking the heat transfer from the welding device to the wafer carrier, thus weakening the heat radiation during propagation and reducing the amount of heat radiation reaching the wafer carrier. Furthermore, since the air inlet 12 is located in the middle of the guide element 1, the position of the air inlet 12 corresponds to the high-temperature die-bonding area of ​​the welding device, which can improve the heat dissipation effect of the heat insulation device 100 on high temperatures.

[0026] Please see Figure 1 and Figure 2 In an optional embodiment, the air inlet 12 and the air outlet 13 may include one, two, or more. The airflow channel formed between the air inlet 12 and the air outlet 13 may be one or more.

[0027] Please see Figure 2 In some embodiments, the air inlet 12 includes a first air inlet 121 and a second air inlet 122 both located in the middle of the guide member 1, and the air outlet 13 includes a first air outlet 131 and a second air outlet 132. The first air outlet 131 and the second air outlet 132 are respectively located at both ends of the guide member 1 along its length. The guide cavity 11 includes a first airflow channel 111 and a second airflow channel 112 spaced apart. The first air inlet 121 and the first air outlet 131 are connected to the first airflow channel 111, and the second air inlet 122 and the second air outlet 132 are connected to the second airflow channel 112. The first airflow channel 111 and the second airflow channel 112 flow from the middle of the guide member 1 to both ends, forming a bidirectional airflow, which can improve the heat dissipation area and heat dissipation efficiency of the guide member 1. The first air inlet 121 and the second air inlet 122 are located in the middle of the guide member 1, and the low-temperature airflow preferentially flows through the high-temperature area in the middle before diffusing to both ends, balancing the overall temperature field and avoiding local overheating.

[0028] In the optional implementation, please refer to Figure 2The first air inlet 121 and the second air inlet 122 are respectively and symmetrically arranged on both sides of the axis along the length of the guide member 1. The first air outlet 131 is located at one end of the guide member 1 and the first air inlet 121 on the same side, and the second air outlet 132 is located at the other end of the guide member 1 and the second air inlet 122 on the same side. The first air outlet 131 and the second air outlet 132 are symmetrically arranged along the axis of the guide member 1. The first airflow channel 111 and the second airflow channel 112 are symmetrically arranged with respect to the axis of the guide member 1. The first air inlet 121 and the second air inlet 122 are symmetrically distributed on both sides of the axis. The introduced low-temperature airflow flows synchronously from both sides to both ends, forming a symmetrical airflow field. This can ensure that the heat exchange rate on the left and right sides of the guide member 1 is consistent, avoiding lateral temperature unevenness caused by strong airflow on one side and weak airflow on the other side. This is especially suitable for scenarios where the wafer carrier device is wide, preventing the wafer from twisting or wrinkling due to uneven heating on both sides.

[0029] Please see Figure 2 In embodiment (a), the drainage member 1 includes a housing 14 and a drainage protrusion 15. The housing 14 has a receiving cavity, and the drainage protrusion 15 is connected to the housing 14 and located within the receiving cavity to divide the receiving cavity into a drainage cavity 11. Please refer to [reference needed]. Figure 2 In (b), the housing 14 has an air inlet 12 at its center along its length and an air outlet 13. By providing a drainage protrusion 15 to form a drainage cavity 11, the flow path of gas within the drainage component 1 can be increased, thereby increasing the heat exchange area and achieving full absorption of heat. The drainage protrusion 15 serves as an internal support structure for the housing 14, improving the structural stability of the housing 14 and preventing deformation of the housing 14 under airflow pressure and external vibration, thus ensuring the stability of airflow exchange.

[0030] In optional embodiments, the shape of the drainage cavity 11 is not limited. For example, the drainage protrusion 15 can construct the drainage cavity 11 into a rectangular cavity, a circular cavity, an S-shaped cavity, or a U-shaped cavity, etc.

[0031] Please see Figure 2In some embodiments (a), the drainage protrusion 15 includes a first drainage protrusion 151 and a second drainage protrusion 152 that are staggered along the length direction of the housing 14. The housing 14 has a first sidewall 141 and a second sidewall 142 along a first direction. The first direction, the length direction of the housing 14, and the thickness direction of the housing 14 intersect each other and are not coplanar. One end of the first drainage protrusion 151 along its own length direction is connected to the first sidewall 141, and the other end extends toward the second sidewall 142 along the first direction and is spaced apart from the second sidewall 142 along the first direction. One end of the second drainage protrusion 152 along its own length direction is connected to the second sidewall 142, and the other end extends toward the first sidewall 141 along the first direction and is spaced apart from the first sidewall 141 along the first direction. Thus, the arrangement of the first drainage protrusion 151 and the second drainage protrusion 152 divides the drainage cavity 11 into an S-shaped flow channel, which can further increase the gas flow path. The bent drainage cavity 11 can improve the heat exchange efficiency and balance the overall temperature of the drainage component 1.

[0032] In the optional implementation, please refer to Figure 2 In (a), the first drainage protrusion 151 and the second drainage protrusion 152 are simultaneously disposed within the first airflow channel 111 and the second airflow channel 112, so that both the first airflow channel 111 and the second airflow channel 112 are divided into an S-shape. While the first airflow channel 111 and the second airflow channel 112 dissipate heat synchronously, they can further improve the heat exchange path and further improve the heat exchange efficiency.

[0033] The specific structure of housing 14 will be described below: In some embodiments, please refer to Figure 3 The housing 14 includes a detachably connected upper shell 143 and a lower shell 144, which together form a receiving cavity. A drainage protrusion 15 protrudes from the upper shell 143 and abuts against the lower shell 144. The drainage protrusion 15, the upper shell 143, and the lower shell 144 together define a drainage cavity 11. The upper shell 143 is provided with an air inlet 12 and an air outlet 13 communicating with the drainage cavity 11. The housing 14 includes a detachable upper shell 143 and a lower shell 144, which facilitates assembly.

[0034] In optional embodiments, the upper shell 143 and the lower shell 144 can be fixed by fasteners such as screws and nuts, or by clips, or by protrusions and grooves. This application does not limit the specific fixing method of the upper shell 143 and the lower shell 144.

[0035] This application does not limit the location of the air inlet 12 and the air outlet 13. In optional embodiments, the air inlet 12 may be located on the top or side surface of the upper shell 143 along its own thickness direction. The air outlet 13 may also be located on the top or side surface of the upper shell 143 along its own thickness direction. This application does not limit the location of the air inlet 12 and the air outlet 13.

[0036] In some embodiments, please refer to Figure 2 The air inlet 12 includes a side opening 123 and a bottom opening 124. The side opening 123 is formed on the side of the upper shell 143 along its length direction. The side opening 123 extends along a first direction and communicates with the bottom opening 124. The bottom opening 124 is formed on the bottom surface of the upper shell 143 along its thickness direction and communicates with the drainage cavity 11. The first direction intersects the length direction and the thickness direction of the upper shell 143 in pairs, and the three directions are not coplanar. In other words, the air inlet 12 simultaneously penetrates the side surface and the bottom surface of the upper shell 143. The side opening 123 of the air inlet 12 facilitates communication with the air intake device, thereby facilitating the introduction of airflow.

[0037] Please see Figure 2 In an optional embodiment, the first air inlet 121 includes a side opening 123 and a bottom opening 124, and the second air inlet 122 also includes a side opening 123 and a bottom opening 124.

[0038] Please see Figure 2 In some embodiments, the air outlet 13 is an air outlet groove 133 recessed along the thickness direction of the upper shell 143. The air outlet groove 133 communicates with the drainage cavity 11. The opening of the air outlet groove 133 is formed on the side of the upper shell 143 along its length direction. The air outlet groove 133 extends along a first direction, which intersects the length direction and the thickness direction of the upper shell 143 in pairs, and the three directions are not coplanar. Setting the shape of the air outlet 13 as an air outlet groove 133 can facilitate the smooth flow of air and reduce the resistance to airflow.

[0039] Please see Figure 1 In some embodiments, the heat insulation device 100 further includes a heat insulation element 2, which is disposed at the top and / or bottom of the draining element 1 along its own thickness direction. In optional embodiments, the heat insulation element 2 may be disposed at the top of the draining element 1, or at the bottom of the draining element 1, or both at the top and bottom of the draining element 1.

[0040] In optional embodiments, the heat insulation component 2 may be heat insulation cotton, heat insulation ceramic, heat insulation aerogel layer, etc.

[0041] In an optional embodiment, the heat insulation component 2 can be fixed to the drainage component 1 by adhesive, screws, or other means.

[0042] Please see Figure 1 In some embodiments, the heat insulation device 100 further includes a mounting bracket 3, which is connected to the draining member 1 and is used to fix the draining member 1. The mounting bracket 3 facilitates fixing the draining member 1.

[0043] In an optional implementation, the mounting bracket 3 can be fixed to an external device using fasteners such as screws and bolts.

[0044] Secondly, embodiments of this application also provide a chip mounting system, which includes a welding apparatus, a heat insulation device 100, and a carrier device. The carrier device is used to support a wafer on which transistors are disposed, and the heat insulation device 100 is disposed between the welding apparatus and the carrier device. The heat insulation device 100 is the heat insulation device 100 of the first aspect. Disposing the heat insulation device 100 between the welding apparatus and the carrier device can reduce the transfer of heat from the welding apparatus to the carrier device.

[0045] In an optional embodiment, along the height direction of the welding apparatus, the heat insulation device 100 is disposed at the bottom of the welding apparatus, and the supporting device is disposed at the bottom of the heat insulation device 100.

[0046] Furthermore, the heat insulation element 2 of the heat insulation device 100 is located on the top of the upper shell 143 of the diverting element 1. The bottom of the welding device contacts the heat insulation element 2, and the lower shell 144 of the diverting element 1 contacts the bearing device.

[0047] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0048] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0049] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0050] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0051] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0052] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0053] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A heat insulation device, characterized in that, The heat insulation device includes a drainage component, which has a drainage cavity. Along the length of the drainage component, the middle part of the drainage component has an air inlet communicating with the drainage cavity, and the drainage component also has an air outlet communicating with the drainage cavity.

2. The heat insulation device according to claim 1, characterized in that, The air inlet includes a first air inlet and a second air inlet, both located in the middle of the guide member. The air outlet includes a first air outlet and a second air outlet. The first air outlet and the second air outlet are respectively located at both ends of the guide member along its length. The guide cavity includes a first airflow channel and a second airflow channel arranged at intervals. The first air inlet and the first air outlet are connected to the first airflow channel, and the second air inlet and the second air outlet are connected to the second airflow channel.

3. The heat insulation device according to claim 1, characterized in that, The drainage component includes a housing and a drainage protrusion. The housing has a receiving cavity, and the drainage protrusion is connected to the housing and located within the receiving cavity to divide the receiving cavity into the drainage cavity. The housing has an air inlet at the middle of its length direction, and the housing also has an air outlet.

4. The heat insulation device according to claim 3, characterized in that, The drainage protrusions include a first drainage protrusion and a second drainage protrusion that are staggered along the length direction of the shell. The shell has a first sidewall and a second sidewall along a first direction. The first direction, the length direction of the shell, and the thickness direction of the shell intersect each other, and the three are not coplanar. One end of the first drainage protrusion along its own length direction is connected to the first sidewall, and the other end extends along the first direction toward the second sidewall, and is spaced apart from the second sidewall along the first direction. One end of the second drainage protrusion along its own length direction is connected to the second sidewall, and the other end extends along the first direction toward the first sidewall, and is spaced apart from the first sidewall along the first direction.

5. The heat insulation device according to claim 3, characterized in that, The housing includes a detachably connected upper shell and a lower shell, which together form the receiving cavity. The drainage protrusion protrudes from the upper shell and abuts against the lower shell. The drainage protrusion, the upper shell, and the lower shell together define the drainage cavity. The upper shell is provided with an air inlet and an air outlet that communicate with the drainage cavity.

6. The heat insulation device according to claim 5, characterized in that, The air inlet includes a side opening and a bottom opening. The side opening is formed on the side of the upper shell along its own length direction. The side opening extends along a first direction and communicates with the bottom opening. The bottom opening is formed on the bottom surface of the upper shell along its own thickness direction. The bottom opening communicates with the drainage cavity. The first direction intersects the length direction and the thickness direction of the upper shell in pairs, and the three directions are not coplanar.

7. The heat insulation device according to claim 5, characterized in that, The air outlet is an air outlet groove recessed along the thickness direction of the upper shell. The air outlet groove is connected to the drainage cavity. The opening of the air outlet groove is opened on the side of the upper shell along its own length direction. The air outlet groove extends along a first direction. The first direction intersects the length direction and the thickness direction of the upper shell in pairs, and the three directions are not coplanar.

8. The heat insulation device according to any one of claims 1 to 7, characterized in that, The heat insulation device further includes a heat insulation element disposed at the top and / or bottom of the draining element along its own thickness direction.

9. The heat insulation device according to any one of claims 1 to 7, characterized in that, The heat insulation device further includes a mounting bracket, which is connected to the draining component and is used to fix the draining component.

10. A chip fixing system, characterized in that, The chip fixing system includes a welding device, a heat insulation device, and a carrier device. The carrier device is used to carry a wafer with transistors. The heat insulation device is disposed between the welding device and the carrier device. The heat insulation device is the heat insulation device as described in any one of claims 1 to 9.

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