Semiconductor process cavity multi-sensor integrated detection device
By integrating the miniaturized design of the testing device and its convenient maintenance functions, the problems of large size and cumbersome maintenance of semiconductor testing devices have been solved, and an efficient testing and maintenance process has been achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- YOSEMI SEMICONDUCTOR TECHNOLOGY (WUXI) CO LTD
- Filing Date
- 2025-06-24
- Publication Date
- 2026-05-05
AI Technical Summary
Existing semiconductor testing devices lack sufficient integration, resulting in large device size, space occupation, and cumbersome periodic quality inspections, which affects testing efficiency.
A multi-sensor integrated detection device for semiconductor process cavities was designed. It adopts a transparent mounting box, a power storage component, sensors, warning lights, and clamping components. Through highly integrated sensors, the warning lights alert users to abnormal data, and the clamping components facilitate the fixing and removal of sensors, thereby achieving miniaturization and convenient maintenance of the device.
This achieves efficient integration of sensors, reduces device size, improves the convenience of detection and maintenance efficiency, and ensures timely detection and processing of abnormal data.
Smart Images

Figure CN224202501U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor detection technology, specifically to a multi-sensor integrated detection device for semiconductor process cavities. Background Technology
[0002] Semiconductor process equipment typically involves four steps when performing copper interconnect physical vapor deposition (PEV) processes: degassing, pre-cleaning, tantalum nitride deposition, and copper deposition. During the degassing process, the wafer is placed in a degassing chamber and heated to approximately 350°C (this may vary depending on the process) to remove water vapor and other volatile impurities from the wafer. The degassing process requires a high degree of uniformity in wafer heating; if this uniformity is not guaranteed, some areas will not be completely free of volatile impurities, and severe localized temperature unevenness may cause fragmentation.
[0003] Therefore, it is necessary to monitor data such as temperature, gas, and humidity during the semiconductor process to ensure its smooth operation. Existing semiconductor testing devices suffer from insufficient integration, resulting in excessively large size, space-consuming operation, and inconvenient installation. Furthermore, periodic quality inspections of these devices are cumbersome, time-consuming, and labor-intensive. To address these issues, we propose a multi-sensor integrated testing device for semiconductor process cavities. Utility Model Content
[0004] The purpose of this invention is to provide a multi-sensor integrated detection device for semiconductor process cavities to solve the problems mentioned in the background art.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a multi-sensor integrated detection device for semiconductor process cavities, comprising a mounting box, a connecting frame bolted to the upper surface of the mounting box, filter plates connected to both sides of the mounting box, a through groove opened at the bottom of the mounting box, a mounting frame slidably connected to the inner wall of the through groove, a power storage component connected to the inner wall of the mounting frame, a warning light connected to the inner wall of the mounting frame, a mounting plate bolted to the mounting frame, a sensor mounted on the mounting plate, a clamping component mounted on the mounting plate, and a triggering component mounted at the inner bottom of the mounting frame.
[0006] Preferably, the inner sidewall of the mounting box has two symmetrical sliding grooves, and the inner sidewalls of the two sliding grooves are slidably connected to sliders, and the two sliders are respectively fixedly connected to the two sides of the mounting frame.
[0007] Preferably, the clamping assembly includes a worm gear and a rotating rod. The mounting plate has a mounting groove, and the worm gear is rotatably connected to the bottom of the mounting groove. Two worm wheels are symmetrically meshed on both sides of the worm gear. One end of each worm wheel is rotatably connected to the inner wall of the mounting groove, and one end of each worm wheel is fixedly connected to a rotating rod. The upper surface of the mounting plate has a groove, and one end of each rotating rod passes through the groove and is rotatably connected to its inner sidewall. An arc-shaped plate is fixedly sleeved on each of the two rotating rods, and a clamping plate is fixedly connected to each of the two arc-shaped plates.
[0008] Preferably, one end of the worm gear extends through the mounting plate and is fixedly connected to a rotating head.
[0009] Preferably, the triggering component includes an iron sheet and a spring. An electromagnet is fixedly connected to the inner bottom of the mounting bracket. A mounting block is fixedly connected to one side of the inner bottom of the mounting bracket. The iron sheet is slidably connected to the inner side wall of the mounting block. A limit groove is formed on the mounting block. One end of the spring is connected to one side of the limit groove. The other end of the spring is connected to a limit rod. The limit rod is connected to the iron sheet.
[0010] Preferably, the inner sidewall of the mounting box is symmetrically connected with two fixing blocks, and a rubber block is fixedly connected to the upper end face of each of the two fixing blocks. One of the fixing blocks has a slot, and one end of the iron sheet is engaged with the slot.
[0011] Compared with the prior art, the beneficial effects of this utility model are:
[0012] 1. This semiconductor process cavity multi-sensor integrated detection device, by setting up a power storage component, sensors, warning lights and a transparent mounting box, can directly alert the staff by turning on the warning lights when the sensors receive abnormal data such as temperature, gas and humidity. The high integration of multiple sensors reduces the size of the detection device, occupies less space and is more convenient to use.
[0013] 2. This semiconductor process cavity multi-sensor integrated detection device, through the setting of clamping components and triggering components, allows for the fixing and disassembly of multiple sensors via the clamping components, making operation convenient and improving the efficiency of the device during maintenance. Abnormal data from any sensor can energize the electromagnet through the energy storage component, causing the iron plate to disengage from the slot, resulting in the entire mounting bracket sliding between the mounting bracket and the mounting box. The components on the mounting bracket will then slide completely out of the mounting box. At this time, the warning light remains constantly lit, making it easier to detect problems immediately. The detection device can then be reset after maintenance, saving time and effort and improving maintenance efficiency. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0015] Figure 2 This is a cross-sectional view of the internal structure of this utility model;
[0016] Figure 3 This is a sectional view of the connection structure of the mounting groove of this utility model;
[0017] Figure 4 This is a schematic diagram of the connection structure of the mounting block of this utility model.
[0018] Figure 5 This is a schematic diagram of the overall structure of the mounting bracket of this utility model;
[0019] Figure 6 This is a schematic diagram of the overall structure of the mounting box of this utility model.
[0020] In the diagram: 1. Mounting box; 2. Through slot; 3. Mounting bracket; 4. Energy storage component; 5. Mounting plate; 6. Sensor; 7. Mounting slot; 8. Worm gear; 9. Worm wheel; 10. Rotating head; 11. Rotating rod; 12. Groove; 13. Arc plate; 14. Clamping plate; 15. Warning light; 16. Electromagnet; 17. Mounting block; 18. Iron sheet; 19. Limiting slot; 20. Spring; 21. Limiting rod; 22. Fixing block; 23. Slot; 24. Rubber block; 25. Filter plate; 26. Connecting bracket; 27. Slider; 28. Slide. Detailed Implementation
[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0022] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0023] like Figures 1 to 6As shown, the semiconductor process cavity multi-sensor integrated detection device of this embodiment includes a mounting box 1. A connecting frame 26 is bolted to the upper surface of the mounting box 1. Filter plates 25 are connected to both sides of the mounting box 1. A through groove 2 is opened at the bottom of the mounting box 1. A mounting frame 3 is slidably connected to the inner side wall of the through groove 2. A power storage component 4 is connected to the inner side wall of the mounting frame 3. A warning light 15 is connected to the inner side wall of the mounting frame 3. A mounting plate 5 is bolted to the mounting frame 3. A sensor 6 is provided on the mounting plate 5. A clamping component is provided on the mounting plate 5. A triggering component is provided at the inner bottom of the mounting frame 3.
[0024] Specifically, by setting up a power storage component 4, a sensor 6, a warning light 15, and a mounting box 1, the mounting box 1 is made of a transparent material, so that when the sensor 6 receives abnormal data such as temperature, gas, and humidity, the warning light 15 will be turned on to directly remind the staff. By highly integrating multiple sensors 6, the size of the detection device is reduced, it occupies less space, and is more convenient to use.
[0025] Furthermore, two symmetrical grooves 28 are formed on the inner sidewall of the mounting box 1. Sliding blocks 27 are slidably connected to the inner sidewalls of both grooves 28. The two sliding blocks 27 are fixedly connected to both sides of the mounting frame 3. The clamping assembly includes a worm gear 8 and a rotating rod 11. A mounting groove 7 is formed in the mounting plate 5. The worm gear 8 is rotatably connected to the bottom of the mounting groove 7. Two worm wheels 9 are symmetrically meshed on both sides of the worm gear 8. One end of each worm wheel 9 is rotatably connected to the inner wall of the mounting groove 7. A rotating rod 11 is fixedly connected to one end of each worm wheel 9. A groove 12 is formed on the upper surface of the mounting plate 5. One end of each rotating rod 11 passes through the groove 12 and is connected to it. The inner wall is rotatably connected, and two rotating rods 11 are each fixedly fitted with an arc-shaped plate 13. Each arc-shaped plate 13 is fixedly connected with a clamping plate 14. One end of the worm gear 8 extends through the outside of the mounting plate 5 and is fixedly connected with a rotating head 10. The triggering component includes an iron plate 18 and a spring 20. An electromagnet 16 is fixedly connected to the inner bottom of the mounting frame 3. A mounting block 17 is fixedly connected to one side of the inner bottom of the mounting frame 3. The iron plate 18 is slidably connected to the inner wall of the mounting block 17. A limit groove 19 is opened on the mounting block 17. One end of the spring 20 is connected to one side of the limit groove 19, and the other end of the spring 20 is connected to a limit rod 21. The limit rod 21 is connected to the iron plate 18.
[0026] Furthermore, by setting up clamping and triggering components, the clamping components can fix and remove multiple sensors 6, causing the rotating head 10 to rotate, the worm gear 8 to rotate, and the worm gear 8 to drive the two worm wheels 9 to rotate, causing the two clamping plates 14 to move to clamp and fix the sensors 6. The operation is convenient and improves the efficiency of the device during maintenance. By detecting abnormal data from any sensor 6, the power storage component 4 can energize the electromagnet 16, causing the iron plate 18 to disengage from the slot 23, causing the entire mounting frame 3 to slide between the mounting box 1 and the mounting frame 3. The components on the mounting frame 3 will slide completely out of the mounting box 1. At this time, the warning light 15 will remain constantly lit, making it easier to detect problems immediately. The detection device can then be reset after maintenance, saving time and effort and improving maintenance efficiency.
[0027] The inner sidewall of the mounting box 1 is symmetrically connected with two fixing blocks 22. The upper surface of each fixing block 22 is fixedly connected with a rubber block 24. One of the fixing blocks 22 has a slot 23, and one end of the iron piece 18 is engaged with the slot 23.
[0028] Furthermore, when the iron plate 18 disengages from the slot 23 and slides between the mounting bracket 3 and the mounting box 1, the mounting bracket 3 comes into contact with the rubber block 24, which provides a cushioning effect for the mounting bracket 3.
[0029] The usage method of this embodiment is as follows: When the sensor 6 receives abnormal data such as temperature, gas, and humidity, the warning light 15 is turned on to directly remind the staff, causing the rotating head 10 to rotate, the worm gear 8 to rotate, and the worm gear 8 to drive the two worm wheels 9 to rotate, causing the two clamping plates 14 to move to clamp and fix the sensor 6. Based on the abnormal data of any sensor 6, the power storage component 4 can energize the electromagnet 16, the iron plate 18 disengages from the slot 23, and the entire mounting bracket 3 slides between the mounting box 1 and the mounting bracket 3. The components on the mounting bracket 3 slide completely out of the mounting box 1. At this time, the warning light 15 remains constantly lit.
[0030] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A semiconductor process cavity multi-sensor integrated detection device, comprising a mounting box (1), characterized in that: The upper surface of the mounting box (1) is bolted to a connecting frame (26). Filter plates (25) are connected to both sides of the mounting box (1). A through groove (2) is provided at the bottom of the mounting box (1). A mounting frame (3) is slidably connected to the inner wall of the through groove (2). An energy storage component (4) is connected to the inner wall of the mounting frame (3). A warning light (15) is connected to the inner wall of the mounting frame (3). A mounting plate (5) is bolted to the mounting frame (3). A sensor (6) is provided on the mounting plate (5). A clamping component is provided on the mounting plate (5). A triggering component is provided at the bottom of the mounting frame (3).
2. The semiconductor process cavity multi-sensor integrated detection device according to claim 1, characterized in that: The inner sidewall of the mounting box (1) has two symmetrical sliding grooves (28), and the inner sidewalls of the two sliding grooves (28) are slidably connected to sliders (27), and the two sliders (27) are fixedly connected to the two sides of the mounting frame (3).
3. The semiconductor process cavity multi-sensor integrated detection device according to claim 1, characterized in that: The clamping assembly includes a worm (8) and a rotating rod (11). The mounting plate (5) has a mounting groove (7) inside. The worm (8) is rotatably connected to the bottom of the mounting groove (7). Two worm wheels (9) are symmetrically meshed on both sides of the worm (8). One end of each of the two worm wheels (9) is rotatably connected to the inner wall of the mounting groove (7). One end of each of the two worm wheels (9) is fixedly connected to the rotating rod (11). The upper surface of the mounting plate (5) has a groove (12). One end of each of the two rotating rods (11) passes through the groove (12) and is rotatably connected to its inner sidewall. An arc plate (13) is fixedly sleeved on each of the two rotating rods (11). A clamping plate (14) is fixedly connected to each of the two arc plates (13).
4. The semiconductor process cavity multi-sensor integrated detection device according to claim 3, characterized in that: One end of the worm (8) extends through the mounting plate (5) and is fixedly connected to a rotating head (10).
5. The semiconductor process cavity multi-sensor integrated detection device according to claim 1, characterized in that: The triggering component includes an iron plate (18) and a spring (20). An electromagnet (16) is fixedly connected to the inner bottom of the mounting bracket (3). A mounting block (17) is fixedly connected to one side of the inner bottom of the mounting bracket (3). The iron plate (18) is slidably connected to the inner side wall of the mounting block (17). A limiting groove (19) is opened on the mounting block (17). One end of the spring (20) is connected to one side of the limiting groove (19). The other end of the spring (20) is connected to a limiting rod (21). The limiting rod (21) is connected to the iron plate (18).
6. The semiconductor process cavity multi-sensor integrated detection device according to claim 5, characterized in that: The inner sidewall of the mounting box (1) is symmetrically connected with two fixing blocks (22). The upper surfaces of the two fixing blocks (22) are fixedly connected with rubber blocks (24). One of the fixing blocks (22) has a slot (23) and one end of the iron sheet (18) is engaged with the slot (23).