Chip removal device for optical film processing

Abstract

The utility model discloses an optical film processing chip removal device which comprises a supporting bottom table, a chip removal assembly is arranged on the upper end face of the supporting bottom table, a sweeping assembly is arranged in the middle of the upper end face of the supporting bottom table, and an electric push rod can drive a falling guide hopper to ascend and descend through a connecting plate by controlling the electric push rod to stretch out and draw back. A worker can adjust the use height of the falling guide hopper to the needed position for matched use according to the heights of the chip removal ends of different external optical film cutting equipment, so that the application range of the device is widened, an installed shielding piece can shield a through cavity, and through cooperation of a limiting supporting rod, a bearing frame and a compression spring, the falling guide hopper can be conveniently adjusted to the needed position for matched use. The supporting bottom plate can elastically support the cleaning brush, so that the cleaning brush is in elastic contact with the lower end face of the chip removal conveying belt to sweep off most optical film chips adsorbed on the surface of the chip removal conveying belt, and the situation that the optical film chips adsorbed on the surface of the chip removal conveying belt cannot be cleaned in time, and the conveying smoothness is affected is avoided.

Description

Technical Field

[0001] This utility model relates to the field of chip removal technology in optical film processing, specifically to an optical film processing chip removal device. Background Technology

[0002] Optical film refers to one or more layers of dielectric film or metal film or a combination of both, deposited or coated on optical elements or independent substrates. After the optical film is produced, cutting equipment is needed to cut the large area of ​​optical film raw materials into the required size. During this process, the cut optical film waste and debris need to be collected and discharged by a chip removal device.

[0003] In the prior art, a chip removal device with the publication number "CN221291559U" uses scrapers to clean up granular and small roll-shaped optical film waste accumulated in the machine body. After the device has been used for a period of time, a large amount of waste will accumulate in the machine body and cannot be discharged with the spiral conveyor assembly. The operator can start the No. 1 motor, which will drive the gear to rotate, thereby driving the outer pulley to rotate. Two scrapers are set on one side of the pulley. The scrapers can rotate with the rotation of the pulley and scrape the waste accumulated in the machine body through the discharge port. The other end of the scraper is slidably engaged with the arc-shaped slide groove, which limits the scraper. The range of motion of the pulley is greater than that of the spiral conveyor assembly. A shovel is also set on one side of the scraper, which can better remove the waste accumulated in the machine body.

[0004] However, the above technical solutions and existing technologies have the following drawbacks:

[0005] Although the chip removal device can discharge optical film waste, the inlet height is fixed. This means that the device can only be used with optical film processing equipment of the same specification, and cannot be used with optical film processing equipment with different discharge heights. This limits the applicability of the chip removal device. Furthermore, the spiral conveyor component in the chip removal device requires workers to regularly clean the accumulated waste with scrapers and shovels during use. Therefore, the convenience of chip removal needs to be further improved. Utility Model Content

[0006] The purpose of this invention is to provide a chip removal device for optical film processing to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, this utility model provides the following technical solution:

[0008] An optical film processing chip removal device includes a support base and casters with foot brakes. Casters with foot brakes are symmetrically installed on the left and right sides of the lower end face of the support base. A chip removal component is provided on the upper end face of the support base, which is used to remove waste generated during the optical film cutting process. A cleaning component is provided in the middle of the upper end face of the support base, which is used to sweep off the debris adsorbed by the chip removal component during the chip removal process.

[0009] Preferably, the chip removal assembly includes a servo motor, a support frame, a fixed frame, a guide bucket, a discharge shell, a driven drum, a chip removal conveyor belt, a driving drum, and a limiting shell. Support frames are symmetrically fixedly connected to the left and right sides of the upper surface of the support base. A servo motor is mounted on the upper side of the front surface of the support frame. A driving drum is mounted on the drive end of the servo motor. A driven drum is mounted to the right of the driving drum. A chip removal conveyor belt connects the driving drum and the driven drum. Two sets of fixed frames are symmetrically fixedly connected to the front and rear sides of the upper surface of the support base. A limiting shell is fixedly connected between the two sets of fixed frames. A guide bucket is installed inside the limiting shell. A discharge shell is provided on the right end face of the limiting shell.

[0010] Preferably, an electric push rod is installed on the upper end face of the fixed frame, a connecting plate is provided on the upper side of the front end face of the guide bucket, and the lower end face of the connecting plate is connected to the top of the electric push rod by screws. Wear-resistant bottom strips are provided at the bottom of both the limiting shell and the discharge shell, and the wear-resistant bottom strips are made of wear-resistant rubber. The lower end face of the wear-resistant bottom strip is in contact with the upper end face of the chip conveyor belt.

[0011] Preferably, a baffle plate is installed on the right side of the inner wall of the guide bucket, and the baffle plate is foldable. A support strip is fixedly connected to the right side of the inner wall of the limiting shell, and a through cavity is opened on the lower side of the right end face of the guide bucket.

[0012] Preferably, the cleaning assembly includes a collection box, a support frame, a cleaning brush, a limiting strut, and a supporting base plate. The collection box is placed on the upper surface of the supporting base plate, and the support frame is symmetrically installed on both the front and rear sides of the upper surface of the supporting base plate. The limiting strut is inserted inside the support frame, and the supporting base plate is provided at the upper end of the limiting strut. The cleaning brush is installed on the upper surface of the supporting base plate.

[0013] Preferably, a limiting stop ring is provided on the lower side of the annular side of the limiting support rod, a compression spring is installed on the upper side of the annular side of the limiting support rod, the cleaning brush is made of anti-static brush, and the cleaning brush is a separately detachable structure.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] 1. By controlling the extension and retraction of the electric push rod, the electric push rod can drive the guide bucket to rise and fall through the connecting plate. This allows the operator to adjust the height of the guide bucket to the required position according to the height of the chip discharge end of different external optical film cutting equipment, thereby improving the applicability of this device. The installed baffle not only blocks the cavity but also does not obstruct the rise and fall of the guide bucket. At the same time, the cavity also prevents the guide bucket from obstructing the transport of optical film waste and debris inside the limiting shell to the discharge shell after it has descended.

[0016] 2. With the cooperation of the limiting strut, the support frame and the compression spring, the support base plate will provide elastic support for the cleaning brush, so that the cleaning brush makes elastic contact with the lower end face of the chip conveyor belt to sweep off most of the optical film debris adsorbed on its surface. In addition, the cleaning brush, which is made of anti-static brush, can also eliminate most of the static electricity on the surface of the chip conveyor belt, thereby reducing the probability of the chip conveyor belt adsorbing optical film debris due to static electricity, thus avoiding the failure to clean the optical film debris adsorbed on the surface of the chip conveyor belt in time and affecting its smooth conveying.

[0017] 3. By starting the servo motor, the servo motor can drive the chip conveyor belt through the active rotating drum to transport the optical film waste and debris that fall into the limiting shell to the right and discharge them. The discharge shell will also limit and guide the optical film waste and debris during the conveying process, so that the optical film waste and debris can be transported to the external collection trolley. This structure is also better in terms of material discharge convenience and efficiency compared to the spiral conveyor discharge structure. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the main structure of this utility model;

[0019] Figure 2 This is a rear view of the cleaning component and the chip removal component in this utility model;

[0020] Figure 3 This is a front view of the cleaning component and the chip removal component in this utility model;

[0021] Figure 4 This is a cross-sectional view of the cleaning component and the chip removal component in this utility model;

[0022] Figure 5 for Figure 4 Enlarged view of A in the middle;

[0023] Figure 6 This is a structural diagram of the cleaning component in this utility model;

[0024] Figure 7 This is a cross-sectional view of the guide bucket in this utility model.

[0025] In the diagram: 1. Support base; 2. Casters with foot brakes; 3. Sweeping assembly; 31. Collection box; 32. Support frame; 33. Sweeping brush; 34. Limiting ring; 35. Limiting strut; 36. Compression spring; 37. Support base plate; 4. Chip removal assembly; 41. Servo motor; 42. Support frame; 43. Fixing frame; 44. Guide bucket; 45. Baffle plate; 46. Discharge shell; 47. Wear-resistant bottom strip; 48. Driven drum; 49. Chip conveyor belt; 411. Driven drum; 412. Limiting shell; 413. Electric push rod; 414. Connecting plate; 415. Through cavity; 416. Support bar. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] Please see Figures 1-7 This utility model provides a technical solution:

[0028] Example 1:

[0029] An optical film processing chip removal device includes a support base 1 and casters 2 with foot brakes. Casters 2 with foot brakes are symmetrically installed on the left and right sides of the lower end face of the support base 1. The casters 2 with foot brakes not only facilitate the movement of the device by the operator, but also have self-locking capability. A chip removal component 4 is provided on the upper end face of the support base 1. The chip removal component 4 is used to remove waste generated during the cutting process of optical film. A cleaning component 3 is provided in the middle of the upper end face of the support base 1. The cleaning component 3 is used to sweep off the debris adsorbed by the chip removal component 4 during the chip removal process, so as to avoid the waste adhering to the outer surface of the chip removal conveyor belt 49 due to static electricity not being cleaned and affecting its smooth conveying.

[0030] The chip removal assembly 4 includes a servo motor 41, a support frame 42, a fixed frame 43, a guide bucket 44, a discharge shell 46, a driven drum 48, a chip removal conveyor belt 49, a driving drum 411, and a limiting shell 412. Support frames 42 are symmetrically fixed to the left and right sides of the upper surface of the support base 1. The support frames 42 are connected to the support base 1 by welding. The support frames 42 can support and limit the driving drum 411 and the driven drum 48 respectively. A servo motor 41 is installed on the upper side of the front end face of the support frame 42. The servo motor 41 is connected to an external servo controller via wires. The transmission end of the servo motor 41 is mounted on... The device is equipped with an active rotating drum 411, and a driven rotating drum 48 is installed to the right of the active rotating drum 411. A chip conveyor belt 49 is connected between the active rotating drum 411 and the driven rotating drum 48. When the servo motor 41 is working, it can drive the active rotating drum 411 to rotate, so that the active rotating drum 411 drives the chip conveyor belt 49 to work and convey the optical film waste and debris inside the limiting shell 412 to the right side for discharge. The driven rotating drum 48 also makes the conveying stability of the chip conveyor belt 49 better. Both the active rotating drum 411 and the driven rotating drum 48 are detachable structures, so that the chip conveyor belt 49 can be replaced by the staff later.

[0031] Two sets of fixing frames 43 are symmetrically fixedly connected to the front and rear sides of the upper end of the support base 1. The fixing frames 43 are connected to the support base 1 and the limiting shell 412 by welding. The two sets of fixing frames 43 can provide stable support for the limiting shell 412. The limiting shell 412 is fixedly connected between the two sets of fixing frames 43. The limiting shell 412 is connected to the discharge shell 46 by welding. The limiting shell 412 can limit the guide bucket 44. The guide bucket 44 is installed inside the limiting shell 412. The guide bucket 44 can guide the waste and debris discharged downward from the chip discharge end of the external optical film cutting and processing equipment into the limiting shell 412. The right end face of the limiting shell 412 is provided with the discharge shell 46. The discharge shell 46 can limit the optical film waste and debris during the process of being conveyed to the right by the chip discharge conveyor belt 49, so as to prevent the optical film waste and debris from sliding back and forth and scattering on the ground during the process of being conveyed and discharged to the right.

[0032] An electric push rod 413 is mounted on the upper surface of the fixed frame 43. The electric push rod 413 is electrically connected to the control panel mounted on the front surface of the support frame 42 via a wire. A connecting plate 414 is provided on the upper side of the front surface of the guide bucket 44. The connecting plate 414 is connected to the guide bucket 44 by welding. The lower surface of the connecting plate 414 is connected to the top of the electric push rod 413 by screws. When working, the electric push rod 413 can drive the guide bucket 44 to rise and fall through the connecting plate 414. Since the internal detailed structure and working principle of the electric push rod 413 are relatively mature technologies in the prior art, Therefore, we will not go into too much detail here. Both the bottom of the limiting shell 412 and the discharge shell 46 are provided with wear-resistant bottom strips 47. The wear-resistant bottom strips 47 are connected to the limiting shell 412 and the discharge shell 46 by adhesive bonding. The wear-resistant bottom strips 47 are made of wear-resistant rubber. The lower end face of the wear-resistant bottom strips 47 is in contact with the upper end face of the chip conveyor belt 49. The wear-resistant bottom strips 47, made of wear-resistant rubber, not only make the bottom of the limiting shell 412 and the discharge shell 46 more wear-resistant, but also prevent the optical film waste and debris inside the limiting shell 412 and the discharge shell 46 from being discharged to the front and back sides through the gaps.

[0033] A baffle plate 45 is installed on the right side of the inner wall of the guide bucket 44. The baffle plate 45 is foldable and made of silicone rubber. This foldable, silicone rubber baffle plate 45 not only blocks the passage cavity 415, preventing optical film waste and debris in the guide bucket 44 from being discharged to the outside through the passage cavity 415, but also does not obstruct the lifting and lowering of the guide bucket 44. The baffle plate 45 is detachable, facilitating subsequent maintenance by staff. Replacement is performed. A support strip 416 is fixedly connected to the right side of the inner wall of the limiting shell 412. The support strip 416 is connected to the limiting shell 412 by welding. The support strip 416 can support the lower end of the shielding plate 45. A through cavity 415 is opened on the lower side of the right end face of the guide bucket 44. The front and rear width of the inner wall of the through cavity 415 is the same as the front and rear width of the inner wall of the guide bucket 44. The through cavity 415 prevents the guide bucket 44 from obstructing the optical film waste and debris inside the limiting shell 412 from being transported to the discharge shell 46 after it descends.

[0034] Example 2:

[0035] Based on Embodiment 1, in this embodiment, with the cooperation of the limiting support rod 35, the support frame 32 and the compression spring 36, the supporting base plate 37 will provide elastic support for the cleaning brush 33, so that the cleaning brush 33 makes elastic contact with the lower end face of the chip conveyor belt 49 to sweep off most of the optical film debris adsorbed on its surface, thus avoiding the failure to clean the optical film debris adsorbed on the surface of the chip conveyor belt 49 in a timely manner, which would affect its smooth conveying.

[0036] The cleaning assembly 3 includes a collection box 31, a support frame 32, a cleaning brush 33, a limiting strut 35, and a supporting base plate 37. The collection box 31 is placed on the upper surface of the supporting base 1. The front-to-back length of the collection box 31 is greater than the front-to-back length of the cleaning brush 33. The collection box 31 can collect most of the optical film debris swept off by the cleaning brush 33. The support frame 32 is symmetrically installed on the front and back sides of the upper surface of the supporting base 1. The support frame 32 can limit and support the compression spring 36 and the limiting strut 35 respectively. The limiting strut 35 is inserted inside the support frame 32. The limiting strut 35 is connected to the limiting retaining ring 34 by welding. The top of the limiting strut 35 is connected to the bottom of the supporting base plate 37 by screws (not shown in the figure). The limiting strut 35 can support and limit the supporting base plate 37.

[0037] The upper end of the limiting strut 35 is provided with a supporting base plate 37, which supports the cleaning brush 33. The cleaning brush 33 is installed on the upper surface of the supporting base plate 37. The cleaning brush 33 is made of anti-static bristles. The cleaning brush 33, made of anti-static bristles, can not only sweep off the debris adhering to the surface of the chip conveyor belt 49, but also eliminate the static electricity on the surface of the chip conveyor belt 49, thereby reducing the probability of the chip conveyor belt 49 attracting optical film debris due to static electricity. The cleaning brush 33 is a separately detachable structure, which facilitates the replacement of the cleaning brush 33 by the staff in the future. A limiting retaining ring 34 is provided on the lower side of the annular side of the limiting strut 35. The distance between the upper end face of the limiting ring 34 and the upper side of the inner wall of the support frame 32 is five millimeters. The limiting ring 34, with a distance of five millimeters between it and the upper side of the inner wall of the support frame 32, can limit the upward movement of the limiting support rod 35, thereby preventing the support base plate 37 from causing the cleaning brush 33 to move upward significantly under the upward squeezing force of the compression spring 36, which would cause the cleaning brush 33 to fit too tightly with the chip conveyor belt 49 and increase the conveying resistance of the chip conveyor belt 49. The upper side of the annular side of the limiting support rod 35 is equipped with a compression spring 36, which can provide elastic support for the support base plate 37 so that the cleaning brush 33 can make elastic contact with the chip conveyor belt 49.

[0038] Working Principle: During the optical film processing, the operator first moves this device next to the external optical film cutting equipment and electrically connects the control panel and servo controller to the surrounding external fixed power supply. Then, by controlling the extension and retraction of the electric push rod 413, the electric push rod 413 can drive the guide bucket 44 to rise and fall through the connecting plate 414. This allows the operator to adjust the height of the guide bucket 44 to the required position according to the height of the chip discharge end of the external optical film cutting equipment. During this process, the foldable shielding plate 45 not only blocks the cavity 415, preventing optical film waste and debris in the guide bucket 44 from being discharged to the outside through the cavity 415, but also does not obstruct the flow of materials. The guide bucket 44 is raised and lowered, and the through cavity 415 also prevents the guide bucket 44 from obstructing the optical film waste and debris inside the limiting shell 412 from being transported to the discharge shell 46 after it is lowered. After the device is adjusted to the right position, the operator can push the external waste collection trolley to the right end of the device so that the external waste collection trolley can collect and transfer the optical film waste and debris transported by the chip conveyor belt 49. After the adjustment is completed, the guide bucket 44 needs to be moved to the right of the chip discharge end of the external optical film cutting equipment so that the guide bucket 44 can guide the optical film waste and debris discharged downward by the external optical film cutting equipment into the guide bucket 44.

[0039] When it is necessary to discharge optical film waste and debris inside the limiting shell 412 to the right, the operator only needs to start the servo motor 41. The servo motor 41 will drive the chip conveyor belt 49 through the active rotating drum 411, so that the chip conveyor belt 49 can transport and discharge the optical film waste and debris that has fallen into the limiting shell 412 to the right. During this process, the discharge shell 46 will limit and guide the optical film waste and debris during the conveying process to prevent the optical film waste and debris from slipping back and forth during the rightward conveying and discharge. At the same time, with the cooperation of the limiting support rod 35, the support frame 32 and the compression spring 36, the support base plate 37 will guide the cleaning brush 33. The cleaning brush 33 is elastically supported so that it contacts the lower end face of the chip conveyor belt 49, sweeping off most of the optical film debris adsorbed on its surface. The cleaning brush 33, made of anti-static bristles, can also eliminate most of the static electricity on the surface of the chip conveyor belt 49, thereby reducing the probability of the chip conveyor belt 49 adsorbing optical film debris due to static electricity. This prevents the optical film debris adsorbed on the surface of the chip conveyor belt 49 from not being cleaned in time, which would affect the smoothness of its conveying. At the same time, the limiting ring 34 can limit the upward movement of the limiting support rod 35, preventing the cleaning brush 33 from being too tightly attached to the chip conveyor belt 49, which would increase the conveying resistance of the chip conveyor belt 49.

[0040] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A chip removal device for optical film processing, comprising a support base (1) and casters (2) with foot brakes, characterized in that: The support base (1) is symmetrically equipped with casters (2) with foot brakes on the left and right sides of the lower end face. The support base (1) is provided with a chip removal component (4) on the upper end face. The chip removal component (4) is used to remove waste generated during the optical film cutting process. The support base (1) is provided with a cleaning component (3) in the middle position of the upper end face. The cleaning component (3) is used to sweep away the debris adsorbed by the chip removal component (4) during the chip removal process. The chip removal assembly (4) includes a servo motor (41), a support frame (42), a fixed frame (43), a guide bucket (44), a discharge shell (46), a driven drum (48), a chip removal conveyor belt (49), a driving drum (411), and a limiting shell (412). The support frame (42) is symmetrically fixedly connected to the left and right sides of the upper end face of the support base (1). The servo motor (41) is installed on the upper side of the front end face of the support frame (42). The driving drum (412) is installed on the transmission end of the servo motor (41). 1) A driven drum (48) is installed on the right side of the active drum (411). A chip conveyor belt (49) is connected between the active drum (411) and the driven drum (48). Two sets of fixed frames (43) are symmetrically fixed on the front and rear sides of the upper end of the support base (1). A limiting shell (412) is fixedly connected between the two sets of fixed frames (43). A guide bucket (44) is installed inside the limiting shell (412). A discharge shell (46) is provided on the right end face of the limiting shell (412). An electric push rod (413) is installed on the upper end face of the fixed frame (43). A connecting plate (414) is provided on the upper side of the front end face of the guide bucket (44). The lower end face of the connecting plate (414) is connected to the top of the electric push rod (413) by screws. Wear-resistant bottom strips (47) are provided at the bottom of the limiting shell (412) and the discharge shell (46). The wear-resistant bottom strips (47) are made of wear-resistant rubber. The lower end face of the wear-resistant bottom strips (47) is in contact with the upper end face of the chip conveyor belt (49). A shielding plate (45) is installed on the right side of the inner wall of the guide bucket (44), and the shielding plate (45) is a foldable structure. A support strip (416) is fixedly connected to the right side of the inner wall of the limiting shell (412), and a through cavity (415) is opened on the lower side of the right end face of the guide bucket (44). The cleaning assembly (3) includes a collection box (31), a support frame (32), a cleaning brush (33), a limiting strut (35), and a supporting base plate (37). The collection box (31) is placed on the upper surface of the supporting base (1). The support frame (32) is symmetrically installed on both the front and rear sides of the upper surface of the supporting base (1). The limiting strut (35) is inserted inside the support frame (32). The supporting base plate (37) is provided on the upper end of the limiting strut (35). The cleaning brush (33) is installed on the upper surface of the supporting base plate (37).

2. The chip removal device for optical film processing according to claim 1, characterized in that: The limiting support rod (35) has a limiting stop ring (34) on the lower side of its annular side, and a compression spring (36) is installed on the upper side of its annular side. The cleaning brush (33) is made of antistatic brush and is a separately detachable structure.

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