CO2 radio frequency laser power supply for realizing power processing by adopting integrated PCB (Printed Circuit Board)

Abstract

The utility model relates to the technical field of CO2 radio frequency lasers, in particular to a CO2 radio frequency laser power supply adopting an integrated PCB (printed circuit board) to realize power processing, which comprises a control module, an information acquisition and processing module, a primary amplification module, a power distribution module, a main amplification module, a power synthesis module, an impedance matching module and a power supply module which are arranged on the integrated PCB, according to the utility model, a coaxial cable is replaced by the integrated PCB, the size of a power supply system is greatly reduced, the integration level is improved, the CO2 radio frequency laser can be more compact and convenient to install and use, signal transmission characteristics can be accurately controlled by arranging a plurality of strip-shaped impedance lines, the loss in a high-frequency signal transmission process is reduced, and the reliability of the system is improved. The power transmission efficiency is improved, the output power and stability of the laser are further improved, the manufacturing cost of the integrated PCB and microstrip line balun structure is relatively low, the use of coaxial cables and coaxial line balun is reduced, and the production cost of the whole power supply system is reduced.

Description

Technical Field

[0001] This utility model relates to the field of CO2 radio frequency laser technology, and specifically to a CO2 radio frequency laser power supply that uses an integrated PCB to realize power processing. Background Technology

[0002] In traditional CO2 RF laser power supply systems, power distribution, power combining, and impedance matching are typically accomplished using coaxial cables. Meanwhile, baluns (balanced-to-unbalanced converters) often employ conventional coaxial cable structures. While coaxial cables offer a degree of flexibility and transmission performance, they also present several limitations in practical applications. Coaxial baluns, due to their structural characteristics, also suffer from shortcomings in integration and performance optimization, specifically in the following aspects:

[0003] 1. Coaxial cables occupy a large amount of space, which is not conducive to the miniaturization and integration of power supply systems. This makes the entire CO2 RF laser device bulky, making it difficult to use in some space-constrained applications;

[0004] 2. Coaxial cables experience signal loss during high-frequency signal transmission, reducing power transmission efficiency and affecting the output power and stability of the laser;

[0005] 3. The manufacturing cost of coaxial cables and coaxial baluns is relatively high, which increases the production cost of the entire power system;

[0006] 4. The installation of coaxial cables is relatively complex, requiring professional tools and techniques. Moreover, troubleshooting and replacing parts during maintenance are also quite difficult. Utility Model Content

[0007] Therefore, the technical problem to be solved by this utility model is to overcome the defects in the prior art and thus provide a CO2 radio frequency laser power supply that uses an integrated PCB to realize power processing.

[0008] A CO2 radio frequency laser power supply that uses an integrated PCB for power processing includes: a control module, an information acquisition and processing module, a primary amplification module, a power distribution module, a main amplification module, a power combining module, an impedance matching module, and a power supply module, all mounted on the integrated PCB.

[0009] One end of the control module is connected to one end of the information acquisition and processing module, and the other end of the information acquisition and processing module is connected to one end of the primary amplification module. The primary amplification module is also connected to one end of the strip impedance line B in the power distribution module and the power supply module. The other end of the strip impedance line B in the power distribution module is connected to one end of two strip impedance lines A. The other ends of the two strip impedance lines A are respectively connected to one end of the first main amplification module and the second main amplification module. The other ends of the first main amplification module and the second main amplification module are respectively connected to one strip impedance line C in the power combining module. The power combining module is also connected to the strip impedance line D in the impedance matching module. The impedance matching module is also connected to the load.

[0010] Furthermore, both the first and second main amplification modules are integrated microstrip line balun structures, specifically two stacked microstrip lines, with the coils of the two microstrip lines set to 1 turn and 2 turns respectively.

[0011] Furthermore, the impedance ratio of the two microstrip lines is 1:4.

[0012] Furthermore, the primary amplification module is connected to one end of the strip impedance line B through the first input port of the power distribution module, and the other ends of the two strip impedance lines A are respectively connected to one end of the first main amplification module and the second main amplification module through the first output port and the second output port of the power distribution module.

[0013] Furthermore, the other ends of the first main amplification module and the second main amplification module are respectively connected to one end of the two strip impedance lines C through the second input port and the third input port of the power combining module, and the other end of the strip impedance lines C is connected to the impedance matching module through the third output port of the power combining module.

[0014] Furthermore, the other ends of the two strip impedance lines C are connected to the fourth input port of the impedance matching module through the third output port of the power combining module, and then connected to the strip impedance line D. The other end of the strip impedance line D is connected to the load through the fourth output port of the impedance matching module.

[0015] Furthermore, the resistance of the strip impedance line A is 50Ω, and the resistance of the strip impedance line B is 35Ω.

[0016] Furthermore, the resistance of the strip impedance line C is 50Ω.

[0017] Furthermore, the resistance of the strip impedance line D is 25Ω.

[0018] The technical solution of this utility model has the following advantages:

[0019] 1. This utility model replaces the coaxial cable with an integrated PCB, which greatly reduces the size of the power supply system, improves the integration, and makes the CO2 RF laser more compact, easy to install and use.

[0020] 2. This utility model can precisely control signal transmission characteristics by setting multiple strip impedance lines, reducing losses in the high-frequency signal transmission process, improving power transmission efficiency, and thus enhancing the output power and stability of the laser.

[0021] 3. In this utility model, the manufacturing cost of the integrated PCB and microstrip balun structure is relatively low, reducing the use of coaxial cables and coaxial baluns, and lowering the production cost of the entire power supply system.

[0022] 4. In this invention, the integrated PCB has a simple structure, is easy to install, and requires no complex tools or techniques. During maintenance, troubleshooting and component replacement are also easier, reducing maintenance costs and time. Attached Figure Description

[0023] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of this utility model;

[0025] Figure 2 This is a schematic diagram of the power distribution module.

[0026] Figure 3 This is a schematic diagram of the power combining module.

[0027] Figure 4 This is a schematic diagram of the impedance matching module. Detailed Implementation

[0028] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0029] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0030] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0031] Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0032] Please see Figures 1 to 4 A CO2 radio frequency laser power supply that uses an integrated PCB for power processing includes: a control module, an information acquisition and processing module, a primary amplification module, a power distribution module, a main amplification module, a power combining module, an impedance matching module, and a power supply module, all mounted on the integrated PCB.

[0033] One end of the control module is connected to one end of the information acquisition and processing module, and the other end of the information acquisition and processing module is connected to one end of the primary amplification module. The primary amplification module is also connected to one end of the strip impedance line B in the power distribution module and the power supply module. The other end of the strip impedance line B in the power distribution module is connected to one end of two strip impedance lines A. The other ends of the two strip impedance lines A are respectively connected to one end of the first main amplification module and the second main amplification module. The other ends of the first main amplification module and the second main amplification module are respectively connected to one strip impedance line C in the power combining module. The power combining module is also connected to the strip impedance line D in the impedance matching module, and the impedance matching module is also connected to the load.

[0034] The primary amplification module is connected to one end of the strip impedance line B through the first input port of the power distribution module, and the other ends of the two strip impedance lines A are respectively connected to one end of the first main amplification module and the second main amplification module through the first output port and the second output port of the power distribution module.

[0035] The other ends of the first and second main amplification modules are respectively connected to one end of the two strip impedance lines C through the second and third input ports of the power combining module. The other ends of the strip impedance lines C are connected to the impedance matching module through the third output port of the power combining module.

[0036] The other ends of the two strip impedance lines C are connected to the fourth input port of the impedance matching module through the third output port of the power combining module, and then connected to the strip impedance line D. The other end of the strip impedance line D is connected to the load through the fourth output port of the impedance matching module.

[0037] In this embodiment, the resistance of the strip impedance line A is 50Ω, the resistance of the strip impedance line B is 35Ω, the resistance of the strip impedance line C is 50Ω, and the resistance of the strip impedance line D is 25Ω.

[0038] Both the first and second main amplification modules are integrated microstrip balun structures, specifically two stacked microstrip lines. The coils of the two microstrip lines are set to 1 turn and 2 turns respectively, and the impedance ratio of the two microstrip lines is 1:4.

[0039] Overall Design Concept: This application uses an integrated PCB as the core component for power processing in a CO2 RF laser. The power distribution module, power combining module, and impedance matching module on the integrated PCB are designed as strip impedance line structures, which can precisely control the characteristic impedance of signal transmission, ensuring efficient and stable signal transmission on the integrated PCB. The principle is that the characteristic impedance of a strip impedance line depends on parameters such as line width, line spacing, dielectric thickness, and dielectric constant. By precisely designing these parameters, the signal can maintain a constant characteristic impedance during transmission, reducing reflection and loss.

[0040] For the power distribution module, using the strip impedance lines on the integrated PCB, the input RF power is proportionally distributed to each output port according to different power distribution requirements through reasonable line layout and impedance parameter settings. This power distribution is implemented based on the Wilkinson power divider principle. It is a classic power distribution circuit based on transmission line theory. The input signal enters from one port and is transmitted to the power divider point through a strip impedance line with characteristic impedance Z0 and length 1 / 4λ. The power divider point splits the signal into two or more paths, each path passing through a strip impedance line with characteristic impedance Z0. The strip impedance lines are connected to the corresponding output ports. When the input signal reaches the power distribution point, due to the proper design of the characteristic impedance and length of each branch of the strip impedance line, the signal will be distributed to each output port according to a preset ratio. By adjusting the width, length, and spacing of the strip impedance lines, the power distribution ratio of each output port can be precisely controlled.

[0041] For power combining modules, when multiple RF signals need to be combined, specific circuit structures and impedance matching designs on the integrated PCB are used to adjust the phase and superimpose the amplitude of each input signal, achieving efficient power combining. The principle of power combining is based on the superposition characteristics of signals. On the integrated PCB, multiple input signals are transmitted to the combining point through strip impedance lines. To achieve effective power combining, it is necessary to ensure that each input signal has the same phase at the combining point. By adjusting the length of the strip impedance lines, the transmission phase of the signals can be changed, making the signals in phase at the combining point. At the combining point, the electric and magnetic fields of each signal are superimposed. If the amplitude and phase of each signal are properly matched, their power will be added, achieving power combining. Simultaneously, to reduce interference and reflection between signals, impedance matching design is required for the power combining module. By rationally designing the characteristic impedance of the strip impedance lines and the circuit structure, the input impedance of the power combining module is matched with the output impedance of each input signal source and the load impedance, thereby improving the efficiency of power combining.

[0042] Impedance matching modules primarily aim to achieve good impedance matching between the power supply module and the load. Based on the load's impedance characteristics and the power supply's output impedance, parameters such as width, length, and copper thickness of the impedance strip are adjusted to match the power supply module's output impedance to the load impedance, thereby reducing reflected power and improving power transmission efficiency. The basic principle of impedance matching is based on the maximum power transfer theorem in transmission line theory. When the power supply module's output impedance equals the load impedance, the power transmitted from the power supply module to the load is maximized, and the reflected power is minimized. On an integrated PCB, impedance matching modules typically consist of one or more impedance strip segments. By changing the width and length of the impedance strip, its characteristic impedance can be altered. Based on the difference between the load impedance and the power supply's output impedance, a suitable structure and parameters of the impedance strip are designed so that the signal's impedance gradually transitions from the power supply module's output impedance to the load impedance as it passes through the impedance matching network.

[0043] This application abandons the traditional coaxial balun and integrates the balun onto an integrated PCB board. Specifically, the first and second main amplification modules are integrated microstrip line balun structures, both consisting of two stacked microstrip lines. By designing microstrip lines of specific shapes and sizes on the integrated PCB, the conversion between balanced and unbalanced signals is achieved. This integrated microstrip line balun structure has advantages such as small size, light weight, and low cost, and can be better integrated with other modules on the integrated PCB, reducing losses and interference from external connections. The working principle of the integrated microstrip line balun structure is based on electromagnetic coupling and transmission line theory. On the integrated PCB, by designing microstrip lines of specific shapes, such as spirals or tapered lines, electromagnetic coupling is generated between the microstrip lines. When an unbalanced signal is input to the microstrip line balun, it is converted into a balanced signal output through electromagnetic coupling and the transmission characteristics of the microstrip lines; conversely, when a balanced signal is input, it can also be converted into an unbalanced signal output. By precisely designing the size, spacing, and shape of the microstrip lines, the performance of the balun, such as bandwidth, insertion loss, and balance, can be optimized.

[0044] During the integrated PCB design phase, the size, number of layers, and materials of the integrated PCB are determined based on parameters such as the power requirements, operating frequency, and load characteristics of the CO2 RF laser.

[0045] The power distribution module, power combining module, impedance matching module, and microstrip balun structure were designed using the professional PCB design software Altium Designer. SI9000 was used to accurately calculate the parameters of the strip impedance lines at each location to ensure that design requirements were met.

[0046] Meanwhile, during the design process, strip impedance lines were used to fully consider signal isolation and shielding, avoiding interference from radiation.

[0047] During the integrated PCB manufacturing stage, selecting appropriate manufacturing processes and suppliers ensures the quality of the integrated PCB. During manufacturing, strict control is maintained over the accuracy of the circuitry and the consistency of impedance. The manufactured integrated PCB undergoes rigorous quality testing, including checks on circuit continuity, insulation resistance, and impedance characteristics.

[0048] During the power supply assembly phase, various active and passive components are soldered onto the integrated PCB, paying attention to the component placement and orientation. The power input and output ports are then connected, and the power supply is subjected to overall commissioning. Using professional testing equipment, such as network analyzers and power meters, the actual performance of the power distribution module, power combining module, and impedance matching module is tested and adjusted to ensure the power supply reaches its optimal operating state.

[0049] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.

Claims

1. A CO2 radio frequency laser power supply that uses an integrated PCB for power processing, characterized in that, include: The control module, information acquisition and processing module, primary amplification module, power distribution module, main amplification module, power combining module, impedance matching module and power supply module are set on the integrated PCB; One end of the control module is connected to one end of the information acquisition and processing module, and the other end of the information acquisition and processing module is connected to one end of the primary amplification module. The primary amplification module is also connected to one end of the strip impedance line B in the power distribution module and the power supply module. The other end of the strip impedance line B in the power distribution module is connected to one end of two strip impedance lines A. The other ends of the two strip impedance lines A are respectively connected to one end of the first main amplification module and the second main amplification module. The other ends of the first main amplification module and the second main amplification module are respectively connected to one strip impedance line C in the power combining module. The power combining module is also connected to the strip impedance line D in the impedance matching module. The impedance matching module is also connected to the load.

2. The CO2 RF laser power supply with integrated PCB for power processing according to claim 1, characterized in that, Both the first and second main amplification modules are integrated microstrip line balun structures, specifically two stacked microstrip lines, with the coils of the two microstrip lines set to 1 turn and 2 turns respectively.

3. The CO2 RF laser power supply with integrated PCB for power processing according to claim 2, characterized in that, The impedance ratio of the two microstrip lines is 1:

4.

4. The CO2 RF laser power supply with integrated PCB for power processing according to claim 1, characterized in that, The primary amplification module is connected to one end of the strip impedance line B through the first input port of the power distribution module, and the other ends of the two strip impedance lines A are respectively connected to one end of the first main amplification module and the second main amplification module through the first output port and the second output port of the power distribution module.

5. The CO2 RF laser power supply with integrated PCB for power processing according to claim 4, characterized in that, The other ends of the first and second main amplification modules are respectively connected to one end of the two strip impedance lines C through the second and third input ports of the power combining module. The other ends of the strip impedance lines C are connected to the impedance matching module through the third output port of the power combining module.

6. The CO2 RF laser power supply with integrated PCB for power processing according to claim 5, characterized in that, The other ends of the two strip impedance lines C are connected to the fourth input port of the impedance matching module through the third output port of the power combining module, and then connected to the strip impedance line D. The other end of the strip impedance line D is connected to the load through the fourth output port of the impedance matching module.

7. The CO2 RF laser power supply with integrated PCB for power processing according to claim 1, characterized in that, The resistance of the strip impedance line A is 50Ω, and the resistance of the strip impedance line B is 35Ω.

8. The CO2 RF laser power supply with integrated PCB for power processing according to claim 1, characterized in that, The resistance of the strip impedance line C is 50Ω.

9. The CO2 RF laser power supply with integrated PCB for power processing according to claim 1, characterized in that, The resistance of the strip impedance line D is 25Ω.

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