A residual glue prevention structure suitable for multi-layer board processing

Abstract

The utility model provides a kind of anti-residue structure suitable for multilayer board processing, including substrate;The substrate includes a plurality of interval distribution's circuit board unit, the circuit board unit includes isolation part, electroplating part and conductive part, the conductive part is located in the edge of the circuit board unit, the electroplating part is connected with the conductive part, the isolation part is arranged around the electroplating part, the electroplating part is surrounded by the conductive part and the isolation part, the thickness of the conductive part and the isolation part is same;The side of the conductive part away from the electroplating part is equipped with glue flow structure, the glue flow structure includes annular groove, the annular groove is closed shape, opposite sides of the annular groove are connected with straight groove, two the straight groove is connected to the edge of the conductive part and adjacent circuit board unit respectively.The utility model can effectively prevent gold finger from appearing residue phenomenon, improve processing quality and yield.

Description

Technical Field

[0001] This utility model relates to the field of circuit board manufacturing technology, and more specifically, to an anti-residue structure suitable for multilayer board processing. Background Technology

[0002] In circuit board manufacturing, to improve efficiency, multiple independent circuit board units are usually combined into a standard-sized substrate (also known as a "panel"), and then batch processed (such as etching, lamination, gold plating, etc.), thereby significantly improving processing efficiency. To facilitate processing and subsequent separation, gaps are usually left between adjacent circuit board units.

[0003] Multilayer circuit boards are composed of multiple stacked circuit board sub-boards. Currently, circuit board production typically adopts an N+M stacked design, which requires creating stepped gold fingers during the processing of the circuit board sub-boards before outer layer lamination. Before lamination, high-temperature tape is applied to the gold fingers to cover and protect them. After the multilayer circuit board is laminated and formed, the gold fingers are exposed by blind-tapping. However, the existing structure has the following problems during processing: 1. Because there are many pads and lines on the circuit board surface, there are undulations and height differences. When the edge of the high-temperature tape is attached to the pad or line, the adhesion is unstable and the bonding force is weak. The existence of height differences also makes it easy for gaps to be generated when the high-temperature tape is attached, resulting in poor sealing. PP glue may flow in during pressing, causing residual glue on the gold fingers to be unusable.

[0004] 2. During lamination, in order to guide the flow of PP glue and prevent glue residue in the gold finger area, a glue outlet is usually designed on the side of the circuit board unit with gold fingers. The traditional glue outlet is a straight or diagonal line directly cut on the copper surface between the boards. Since the straight channel path is smooth and lacks diversion or blocking structure, the glue flow rate and flow rate are difficult to control. It is easy to cause overflow due to excessive glue flow, resulting in glue residue in the gold finger area. Utility Model Content

[0005] In view of this, the purpose of this utility model is to provide an anti-residue structure suitable for multilayer board processing, so as to solve the problems existing in the prior art.

[0006] The objective of this utility model is achieved through the following technical solution.

[0007] A residue-resistant structure suitable for multilayer board processing includes a substrate; the substrate includes a plurality of spaced-apart circuit board units, each circuit board unit including an isolation portion, an electroplated portion, and a conductive portion, the conductive portion being disposed at the edge of the circuit board unit, the electroplated portion being in contact with the conductive portion, the isolation portion surrounding the electroplated portion, and the conductive portion and the isolation portion enclosing the electroplated portion, the conductive portion and the isolation portion having the same thickness; a glue-flowing structure is provided on the side of the conductive portion away from the electroplated portion, the glue-flowing structure including an annular groove, the annular groove being closed in shape, and straight grooves connecting opposite sides of the annular groove, the two straight grooves being respectively connected to the conductive portion and the edge of the adjacent circuit board unit.

[0008] In the above scheme, the electroplating part is used for gold plating to form the required gold fingers. The conductive part is externally connected to a conductive brush to conduct the gold plating process by applying current to the electroplating part. The isolation part has no wiring or pads, a flat surface, and the same thickness as the conductive part. The isolation part and the conductive part surround the electroplating part used to form the gold fingers. When applying high-temperature tape before pressing, the edges of the high-temperature tape can adhere to the surfaces of the isolation part and the conductive part without any height difference, resulting in strong adhesion, good sealing effect, and effective isolation of the PP adhesive, protecting the gold fingers, and preventing damage to the gold fingers. Residual adhesive leads to scrap; the adhesive flow structure includes an annular groove and straight grooves on both sides of the annular groove. During pressing, the PP between the plates changes from solid to liquid and flows. The adhesive flow structure is used to guide the flow of PP adhesive. Compared with the traditional straight line design, the adhesive flow structure of this utility model adds a closed annular groove on the straight line, which can hinder the flow of adhesive, thereby effectively slowing down the flow of adhesive, preventing excessive adhesive flow, and avoiding residual adhesive in the gold finger area. At the same time, the adhesive flow structure can also play a role in venting during pressing, avoiding the generation of air bubbles and improving the pressing quality.

[0009] In one example of this invention, the surface of the isolation portion is a flat plane.

[0010] In the above solution, the isolation section has no wiring, no pads or circuits, and a smooth surface, which can effectively improve the adhesion with high-temperature tape, enhance the sealing performance, and prevent adhesive leakage.

[0011] In one example of this utility model, the electroplating part is provided with a plating pad, and the plating pad is connected to the conductive part.

[0012] In the above scheme, the plating pad is used to assist in the electroplating process, so as to make the current distribution uniform and ensure that the gold fingers formed are of uniform thickness and stable quality.

[0013] In one example of this invention, the annular groove is rectangular in shape.

[0014] In one example of this utility model, the outer periphery of the circuit board unit is provided with a partition groove, the adhesive flow structure is disposed between the partition grooves, and the straight groove is connected to the partition groove.

[0015] In the above scheme, the board separation slot is used to separate the circuit board units independently and define the boundaries of the circuit board units so that they can be separated into boards later.

[0016] In one example of this utility model, the circuit board unit further includes a wiring section, and the isolation section is located between the wiring section and the electroplating section.

[0017] In the above scheme, the wiring section is used for routing, and the isolation section separates the wiring section from the electroplating section.

[0018] In one example of this utility model, a gap is left between the circuit portion and the conductive portion.

[0019] In the above scheme, a gap is left between the circuit section and the conductive section to prevent current from being conducted to the circuit section during electroplating, thus preventing any impact on the electroplating effect.

[0020] Compared with the prior art, the beneficial effects of this utility model are as follows: This invention surrounds the electroplating part used to form the stepped gold fingers by setting an isolation part and a conductive part of the same thickness. While ensuring that the conductive part and the electroplating part are in contact and conducting electricity, it provides a flat bonding position for the high-temperature tape without height difference, making the adhesion between the high-temperature tape and the circuit board unit stronger and improving the sealing effect. This can effectively isolate the PP glue, prevent the gold fingers from being scrapped due to residual glue, and improve the yield. Compared to the traditional straight-line design, the adhesive flow structure of this invention features a closed-shaped annular groove, which effectively slows down the flow of adhesive and prevents excessive flow that could lead to uneven filling, thus avoiding adhesive residue in the gold finger area. At the same time, the adhesive flow structure also plays a role in venting during pressing, preventing the formation of air bubbles and improving the pressing quality. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the anti-residue structure according to an embodiment of the present invention.

[0023] Figure 2 for Figure 1 A schematic diagram showing the state after the high-temperature tape has been applied.

[0024] Explanation of the reference numerals in the figure: 1-Circuit board unit; 11-Gold finger; 12-Isolation part; 13-Conductive part; 14-Circuit part; 2-Glue flow structure; 21-Annular groove; 2-Straight groove; 3-Separation groove; 4-Copper surface; 5-High temperature tape. Detailed Implementation

[0025] To facilitate understanding of this invention, a more comprehensive description will be provided below with reference to the accompanying drawings. The drawings illustrate preferred embodiments of the invention. However, this invention can be implemented in many different forms and is not limited to the embodiments described herein.

[0026] Please refer to Figure 1 and Figure 2 In a preferred embodiment, a gold finger anti-residue structure suitable for multilayer circuit board processing is provided, including a substrate; the substrate includes a plurality of spaced circuit board units 1, each circuit board unit 1 including an isolation portion 12, an electroplating portion and a conductive portion 13, the conductive portion 13 being disposed at the edge of the circuit board unit 1, the electroplating portion being in contact with the conductive portion 13, the isolation portion 12 being disposed around the electroplating portion, and the electroplating portion being surrounded by the conductive portion 13 and the isolation portion 12, the conductive portion 13 and the isolation portion 12 having the same thickness; a glue flow structure 2 is provided on the side of the conductive portion 13 away from the electroplating portion, the glue flow structure 2 including an annular groove 21, the annular groove 21 being closed in shape, and straight grooves 2 being connected to opposite sides of the annular groove 21, the two straight grooves 2 being respectively connected to the conductive portion 13 and the edge of the adjacent circuit board unit 1.

[0027] It should be noted that the circuit board units 1 are distributed on the substrate in an array, and the specific arrangement can be flexibly adjusted according to actual needs. Figure 1 Only the gold finger 11 area of ​​one circuit board unit 1 on the substrate is shown for explanation. The specific settings of the rest can be referred to the existing technology, and will not be elaborated on here.

[0028] Specifically, the electroplating section is used to perform gold plating to form the required gold fingers 11. Figure 1The image shows the state after electroplating is completed. Gold fingers 11 have been formed in the electroplated area. A conductive brush is connected to the conductive part 13 to conduct gold plating on the electroplated part by applying current. The isolation part 12 has no circuits or pads, has a flat surface, and is the same thickness as the conductive part 13. The isolation part 12 and the conductive part 13 surround the electroplated part used to form the gold fingers 11. When the high-temperature tape 5 is applied before pressing, the edge of the high-temperature tape 5 can adhere to the surfaces of the isolation part 12 and the conductive part 13 without any height difference. It has strong adhesion, good sealing effect, and can effectively isolate the PP glue, protect the gold fingers 11, and prevent gold from being deposited. Finger 11 is scrapped due to residual glue; the glue flow structure 2 includes an annular groove 21 and straight grooves 2 on both sides of the annular groove 21. During pressing, the PP between the plates changes from solid to liquid and flows. The glue flow structure 2 is used to guide the flow of PP glue. Compared with the traditional straight line design, the glue flow structure 2 of this utility model adds a closed annular groove 21 on the straight line, which can hinder the glue flow, thereby effectively slowing down the flow of glue, preventing excessive glue flow, and avoiding residual glue in the area of ​​the gold finger 11. At the same time, the glue flow structure 2 can also play a role in venting during pressing, avoiding the generation of air bubbles and improving the pressing quality.

[0029] For example, Figure 2 This is a schematic diagram of the high-temperature tape 5 after it has been applied. The high-temperature tape 5 is square in shape. The insulating part 12 and the conductive part 13 provide the application position for the high-temperature tape 5 to cover and protect the gold finger 11.

[0030] Preferably, the adhesive flow structure 2 includes a plurality of annular grooves 21, which are spaced apart. The annular grooves 21 are rectangular in shape. Alternatively, the annular grooves 21 can be set as closed shapes such as polygons, circles, or ellipses.

[0031] Preferably, the surface of the conductive part 13 is coated with copper to ensure good conductivity.

[0032] It should be noted that, as Figure 1 As shown, the spacer area of ​​the circuit board unit 1 is covered with a copper surface 4, and the annular groove 21 and the straight groove 2 can be formed on the copper surface 4 by etching.

[0033] In this embodiment, the isolation part 12 has no wiring, no pads or circuits, and its surface is a flat plane. After the high-temperature tape 5 is applied, the adhesion is strong and the sealing is good, which can effectively prevent glue leakage and avoid the gold finger 11 from being scrapped due to residual glue.

[0034] In this embodiment, the electroplating section is provided with a plating pad (not specifically shown in the figure), which is connected to the conductive section 13. The plating pad is used to assist in the electroplating process, so as to make the current distribution uniform and ensure that the formed gold fingers 11 have uniform thickness and stable quality.

[0035] In this embodiment, a partition groove 3 is provided around the outer periphery of the circuit board unit 1, and a flow structure 2 is provided between the partition grooves 3. Two straight grooves 2 are respectively connected to the partition grooves 3 of two adjacent circuit board units 1. The partition grooves 3 are used to independently separate the circuit board units 1 and define the boundaries of the circuit board units 1 so as to facilitate subsequent partitioning.

[0036] In this embodiment, the circuit board unit 1 further includes a circuit section 14, which is used for normal wiring. An isolation section 12 is located between the circuit section 14 and the electroplating section. The isolation section 12 separates the circuit section 14 from the electroplating section to provide a bonding position for the high-temperature tape 5 and prevents the lines and pads on the circuit section 14 from affecting the bonding effect of the high-temperature tape 5.

[0037] Furthermore, a gap is left between the circuit section 14 and the conductive section 13 to prevent current from being conducted to the circuit section 14 during electroplating, thus preventing any impact on the electroplating effect.

[0038] Please refer to Figure 1 and Figure 2 The main steps and principles of this utility model during processing are as follows: First, an external conductive brush energizes the conductive part 13, forming gold fingers 11 on the electroplating part through electroplating. Then, high-temperature tape 5 is applied to the gold fingers 11, so that the adhesive part of the edge of the high-temperature tape 5 falls on the isolation part 12 and the conductive part 13. After the application is completed, stacking and pressing are performed. During pressing, solid PP becomes liquid and flows between the upper and lower circuit board units 1, filling the space between the upper and lower circuit board units 1 and thus bonding them together. After pressing and shaping, the gold fingers 11 are exposed by blind-fishing opening.

[0039] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0040] Furthermore, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0041] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The various embodiments can be combined as needed, and the same or similar parts can be referred to each other.

[0042] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A residue-resistant structure suitable for multilayer board processing, characterized in that, Including the substrate; The substrate includes a plurality of spaced-apart circuit board units. Each circuit board unit includes an isolation portion, an electroplating portion, and a conductive portion. The conductive portion is disposed at the edge of the circuit board unit. The electroplating portion is in contact with the conductive portion. The isolation portion is disposed around the electroplating portion, and the electroplating portion is surrounded by the conductive portion and the isolation portion. The conductive portion and the isolation portion have the same thickness. The conductive part is provided with a glue-flowing structure on the side away from the electroplating part. The glue-flowing structure includes an annular groove, which is closed in shape. Straight grooves are connected to the opposite sides of the annular groove. The two straight grooves are respectively connected to the edge of the conductive part and the edge of the adjacent circuit board unit.

2. The anti-residue structure for multilayer board processing according to claim 1, characterized in that, The surface of the isolation section is a flat plane.

3. The anti-residue structure for multilayer board processing according to claim 1, characterized in that, The electroplating section is provided with a plating pad, which is connected to the conductive section.

4. The anti-residue structure for multilayer board processing according to claim 1, characterized in that, The annular groove is rectangular in shape.

5. The anti-residue structure for multilayer board processing according to claim 1, characterized in that, The outer periphery of the circuit board unit is surrounded by a partition groove, the adhesive flow structure is disposed between the partition grooves, and the straight groove is connected to the partition groove.

6. The anti-residue structure for multilayer board processing according to claim 1, characterized in that, The circuit board unit also includes a wiring section, and the isolation section is located between the wiring section and the electroplating section.

7. The anti-residue structure for multilayer board processing according to claim 6, characterized in that, A gap is left between the circuit section and the conductive section.

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