OPTICAL BOX COMPRISING A COVER AND SUPPORT SUBSTRATE CONNECTED TOGETHER

Abstract

Optical housing (BT) comprising a support substrate (SUB) having first electrical contacts (PAD), a cover (CPT) fixed to the support substrate (SUB) by adhesive (GL1, GL2) and comprising second electrical contacts (LF) connected to the first electrical contacts (PAD) by a solder material (SLD), wherein assembly means (TRC1, TRC2, CRX, ORF1, ORF2, ORF3, STD_BP) are configured to interpose a separation between the solder material (SLD) and the adhesive (GL2). Figure for abbreviation: Fig 1

Description

Title of the invention: OPTICAL PACKAGE COMPRISING A CONNECTED COVER AND SUPPORT SUBSTRATE TOGETHER

[0001] Embodiments and implementations relate to the field of electronics, in particular the field of packaging of integrated circuits and more particularly the connection between a cover and a support substrate of an optical package.

[0002] An optical package typically provides an electrical connection between the cover and the support substrate so as to detect a failure of the optical elements of the cover and to control, for example, a cut-off of the power supply within the optical package. In particular, the power supply of the electronic chips of the package can be cut off so as to prevent the emission of optical radiation through these failed optical elements.

[0003] This electrical connection is established by means of a weld between electrical contacts of the cover and the substrate, carried out during the assembly of the cover on the support substrate. The cover is conventionally secured to the substrate by means of an adhesive. The solder material and the adhesive can, however, come into contact and mix during the assembly of the cover, generating electrical malfunctions such as short circuits for example.

[0004] In this regard, the solder material can be deposited so as to be sufficiently far from the adhesive to avoid mixing. This type of conventional deposition is restrictive because it may require a larger substrate surface area.

[0005] There is therefore a need to propose a solution making it possible to electrically connect the cover to the substrate without generating an electrical malfunction while limiting the surface area dedicated to this electrical connection.

[0006] According to one aspect, there is provided an optical package comprising a support substrate having first electrical contacts, a cover fixed on the support substrate by glue and comprising second electrical contacts connected to the first electrical contacts by a solder material, in which assembly means are configured to interpose a separation between the solder material and the glue.

[0007] More particularly, the assembly means make it possible to interpose a separation which may be a separation by a distance which thus serves to prevent the welding material and the glue from mixing together, or a separation obtained due to the nature of the glue preventing such mixing even if the welding material comes into contact with the glue.

[0008] The first contacts and the second contacts can thus be welded by the solder material with a limited surface footprint on the surface of the support substrate, and without risk of mixing between the solder material and the glue.

[0009] According to one embodiment, the assembly means comprise an arrangement in the second electrical contacts adapted to house a portion of the solder material.

[0010] The arrangement is in this embodiment a structural modification of the cover allowing excess solder material to be evacuated to avoid contact between the solder material and the adhesive. A cover comprising such an arrangement is particularly suitable for being electrically connected to a conventional support substrate.

[0011] According to one embodiment, the arrangement in the second contacts comprises a first through orifice having a closed contour inside the second contacts, or a contour open to the outside of the second contacts, forming a passage allowing a portion of the solder material to overflow outside the cover or allowing an injection of the solder material passing through the first orifice.

[0012] The first orifice located in the second contacts of the cover allows the introduction of the solder material after fixing the cover to the substrate with the glue, and also to evacuate the excess material.

[0013] According to one embodiment, the assembly means comprise an arrangement in the substrate adapted to contain a portion of the solder material.

[0014] The arrangement is in this embodiment a structural modification of the support substrate making it possible to direct and contain the excess solder material away from the glue. A support substrate comprising such an arrangement is particularly suitable for allowing an electrical connection of a conventional cover to this substrate.

[0015] According to one embodiment, the arrangement in the support substrate comprises a first trench and a second trench around the first contacts, the first trench containing the glue and the second trench containing at least a portion of the solder material.

[0016] The first trench contains excess glue and the second trench contains excess solder material. In this way, the glue and solder material are kept apart so that they do not mix.

[0017] According to one embodiment, the arrangement in the support substrate comprises a second through orifice, capable of allowing injection of the solder material passing through the second orifice.

[0018] The second hole allows the soldering to be carried out independently of the fixing of the cover on the substrate during the manufacture of the optical housing, thus making it possible to po- polymerize the glue before injecting the solder material to avoid mixing it with the polymerized glue even if the solder material is in contact with the glue.

[0019] According to one embodiment, the second contacts comprise a projecting part engaged in the second orifice, opposite the first contacts arranged on the sides of the second orifice.

[0020] The protruding part makes it possible to improve the electrical connection of the second contacts of the cover with the first contacts of the support substrate, in a male-female type structure.

[0021] According to one embodiment, the assembly means comprise an arrangement in the cover and in the substrate capable of separating the first contacts and the second contacts by a distance, and capable of containing the solder material comprising a solder wire or a solder bump.

[0022] The arrangement is in this embodiment a structural modification of both the cover and the support substrate providing the possibility of making an electrical connection of the cover to the substrate using controlled connection means such as solder wire or solder bump. Furthermore, these connection means do not have the disadvantage of the risk of overflow and mixing with the glue.

[0023] According to another aspect, there is provided a method of assembling a support substrate comprising first electrical contacts, with a cover comprising second contacts, comprising fixing the cover to the support substrate by glue, connecting the second contacts to the first electrical contacts by a solder material, assembly means interposing a separation between the solder material and the glue during said fixing of the cover to the support substrate.

[0024] According to one embodiment, the assembly means comprise an arrangement formed in the second electrical contacts, a portion of the solder material being housed in the arrangement during said assembly of the cover with the substrate.

[0025] According to one embodiment, the arrangement in the second contacts comprises a first opening orifice having a closed contour on the inside or a contour open to the outside formed in the second contacts, a portion of the solder material being housed in the first orifice during said assembly.

[0026] According to one embodiment, said part of the welding material is housed in the first orifice, by an overflow of the welding material outside the cover passing through the first orifice.

[0027] According to one embodiment, said part of the solder material is housed in the first orifice, by an injection of the solder material passing through the first orifice during said connection of the electrical contacts.

[0028] According to one embodiment, the assembly means comprise an arrangement formed in the substrate, a portion of the solder material being housed in the arrangement during said assembly of the cover with the substrate.

[0029] According to one embodiment, the arrangement in the support substrate comprises a first trench and a second trench formed in the support substrate around the first contacts, the glue being contained in the first trench and at least a portion of the solder material being contained in the second trench, during said fixing of the cover.

[0030] According to one embodiment, the arrangement in the support substrate comprises a second through orifice formed in the support substrate, the method comprising an injection of the solder material passing through the second orifice.

[0031] According to one embodiment, said fixing of the cover comprises an engagement of a projecting part of the second contacts in the second orifice opposite the first contacts arranged on the sides of the second orifice.

[0032] According to one embodiment, said step of connecting the second contacts to the first electrical contacts by a solder material is carried out after a polymerization treatment of the glue fixing the cover to the support substrate.

[0033] According to one embodiment, the assembly means comprise an arrangement in the cover and in the substrate separating the first contacts and the second contacts by a distance, the method comprising a formation of the solder material in the separation of said arrangement, by a solder wire or by a solder bump.

[0034] Other advantages and characteristics of the invention will appear on examining the detailed description of the embodiment and implementation, which is in no way limiting, and the appended drawings in which:

[0035] [Fig.l] ;

[0036] [Fig.2] ;

[0037] [Fig.3] ;

[0038] [Fig.4] ;

[0039] [Fig.5] ;

[0040] [Fig.6] ;

[0041] [Fig.7] ;

[0042] [Fig.8] ;

[0043] [Fig.9] ;

[0044] [Fig. 10] ;

[0045] [Fig. 11];

[0046] [Fig. 12] ;

[0047] [Fig.l3];and

[0048] [Fig. 14] schematically illustrate embodiments and implementations of the invention.

[0049] [Fig.l] schematically illustrates a sectional view of a BT optical package according to a first embodiment. The BT package comprises a support substrate SUB comprising a mounting face FM, as well as a cover CPT comprising side walls PRL1 and PRL2 fixed to the mounting face FM of the support substrate SUB by glue GL1 and GL2. The glue GL1, GL2 may for example be an epoxy glue. In particular, the side walls PRL1 and PRL2 delimit cavities which can house for example electronic chips CHP1 and CHP2.

[0050] The electronic chips CHP1 and CHP2 are mounted and connected on the FM mounting face of the support substrate SUB according to a “wire bonding” type assembly (or “wire connection” in French) known to those skilled in the art. In this type of package, the electronic chips CHP1 and CHP2 can be configured to emit or receive optical radiation passing through, for example, orifices FNT1 and FNT2 of the cover CPT located opposite the electronic chips CHP1 and CHP2 on the optical path of the optical radiation.

[0051] Furthermore, the optical housing BT comprises a metal structure (usually known by the English term “lead frame”), which can be embedded in the CPT cover for example, and which makes it possible to electrically connect elements of the CPT cover, such as filters (not shown), to the support substrate SUB. The electrical connection between the CPT cover and the substrate SUB makes it possible to detect a failure at the CPT cover, such as filter delaminations. The risk of malfunction of the optical housing BT caused by such a failure can thus be avoided for example by cutting off the power supply to the electronic chips CHP1 and / or CHP2 in the event of detection of the failure.

[0052] In order to establish this electrical connection between the CPT cover and the SUB substrate, the support substrate SUB comprises first electrical contacts PAD and the CPT cover comprises second electrical contacts LF connected to the first electrical contacts PAD by a solder material SLD. The solder material SLD may be metal in the form of solder paste having been deposited on the first contacts PAD and on which the second contacts LF of the CPT cover rest.

[0053] However, the SLD solder material may have an incompatibility with the GL2 glue, and it is desirable to avoid mixing the SLD solder material and the GL2 glue.

[0054] In this regard, assembly means are provided to allow the CPT cover to be electrically connected to the SUB substrate without risk of malfunction and without requiring a larger surface area dedicated to the electrical connection and bonding of the CPT cover.

[0055] The assembly means are presented by structures of the support substrate SUB and / or of the cover CPT, hereinafter designated by the term “arrangement”, which can be produced according to the different embodiments and implementations described in relation to FIGS. 1 to 14.

[0056] Indeed, the assembly means are configured to interpose a separation between the SLD solder material and the GL2 glue. The separation is for example a distance in the case where the SLD solder material is kept away from the GL2 glue. The separation can also be structural so as to prevent the SLD solder material and the GL2 glue from mixing during the manufacturing process of the BT box, including if they come into contact.

[0057] To achieve these separations, the assembly means comprise an arrangement in the support substrate SUB, as shown in Figures 1, 2, 7 and 8 or an arrangement in the support substrate SUB and the cover CPT, as shown in Figures 4-6, 9 and 10.

[0058] [Fig.2] schematically illustrates a top view of the support substrate SUB of a BT optical package according to the first embodiment described previously in relation to [Fig.l], and more particularly an arrangement of the substrate SUB making it possible to maintain a distance D1 between the solder material SLD and the glue GL2. The view of [Fig.2] is located in the plane II-II of [Fig.l].

[0059] The arrangement in the support substrate SUB comprises a first trench TRC1 and a second trench TRC2 around the first PAD contacts. The first trench TRC1 contains the glue GL2, for example an excess of glue GL2 overflowing from the mounting face FM. The second trench TRC2 contains at least a portion of the solder material SLD, for example an excess of solder material SLD overflowing from the first electrical contacts PAD.

[0060] In this way, the BT housing has a CPT cover, for example a conventional cover of the prior art having electrical contacts, connected to the support substrate SUB by the solder material SLD kept away from the glue GL2 by the distance DI by means of this arrangement.

[0061] The distance Dl, which can be set according to the quantity of surplus that can be deposited, and according to the dimensions of the product and the surface available on the substrate, is for example greater than or equal to 200 μm.

[0062] [Fig. 3] schematically illustrates a bottom view of a CPT cover which can be fixed and connected to the support substrate SUB as described previously in relation to figures 1 and 2. The side walls PRL1 and PRL2 of the CPT cover can in particular be fixed by the glue GL located on the contour of the substrate SUB and surround the electrical contacts LF of the CPT cover.

[0063] The CPT cover is dedicated to being assembled with the SUB substrate, and the PRL1 walls, PRL2 are arranged in this respect to come into contact with the portion of the substrate intended to receive the line of glue. In particular, the PRL2 walls are intended to be placed opposite the TRC1 trenches, and outside the outline of the TRC2 trenches.

[0064] [Fig.4] schematically illustrates a bottom view of another CPT hood, according to a second embodiment. The elements common to the CPT hood of [Fig.3] bear the same references and will not all be detailed again.

[0065] In this second embodiment, an arrangement in the second electrical contacts LF is adapted to accommodate a portion of the SLD solder material. Such an arrangement makes it possible to allow a portion of the SLD solder material to overflow outside the CPT cover, and also to introduce the SLD solder material.

[0066] The arrangement in the second LF contacts comprises a first through orifice which has an open contour on the exterior CRX of the second LF contacts.

[0067] [Fig.5] schematically illustrates a bottom view of CPT covers according to a third embodiment. The elements common to the CPT cover of [Fig.3] bear the same references and will not all be detailed again.

[0068] In the second and third embodiments, the first through orifice, the contour of which is closed or open, forms a passage allowing a portion of the SLD solder material to overflow outside the CPT cover or allowing the solder material to be injected through the first orifice.

[0069] Furthermore, the first orifice ORF1 located in the second contacts LF of the cover CPT represents a relatively simple means for introducing the solder material SLD after fixing the cover CPT to the substrate SUB, in particular after polymerization of the glue during a chemical treatment, and / or for removing the surplus solder material SLD.

[0070] [Fig.6] schematically illustrates an oblique view of the CPT cover as described previously in relation to [Fig.5], making it possible to distinguish the assembled structure BT from the CPT cover and the substrate SUB.

[0071] In particular, the second LF contacts are surrounded by the side wall PRL2 which extends over a height of the cover while leaving a space, in the extension of the first orifice, allowing the installation of an instrument used to deposit the SLD solder material.

[0072] [Fig.7] schematically illustrates a sectional view of the BT optical housing according to a fourth embodiment. The elements common to the BT housing of [Fig.1] bear the same references and will not all be detailed again.

[0073] This fourth embodiment comprises an arrangement in the substrate SUB comprising a second opening orifice ORF2, and capable of allowing injection of the SLD solder material through the second 0RF2 port.

[0074] The second orifice ORF2 can also allow electrical connections to be made with electronic components via electrical contacts arranged on the sides of the orifice. Indeed, the first electrical contacts PAD of the substrate SUB are arranged on the sides of the second orifice ORF2. Thus, the solder material SLD can be introduced into the second orifice ORF2 during the manufacturing process of the BT package, in order to bring it into contact with the first electrical contacts PAD and the second electrical contacts LF of the cover CPT, after the polymerization of the adhesive.

[0075] Furthermore, the second orifice ORF2 can contain only the SLD solder material or GL3 glue in addition to the SLD solder material.

[0076] Thus, the SLD solder material introduced after fixing the CPT cover can be in contact with the already polymerized GL glue, for example when the excess SLD solder material overflows onto the FM mounting face of the SUB substrate, without being mixed with the glue. This therefore makes it possible to electrically connect the CPT cover to the SUB substrate without the risk of generating electrical malfunctions within the BT housing.

[0077] [Fig.8] schematically illustrates a sectional view of the BT optical housing according to a fifth embodiment. The elements common to the BT housing of [Fig.1] bear the same references and will not all be detailed again.

[0078] [Fig. 8] illustrates a variant of the fourth embodiment described in relation to [Fig. 7]. In this variant, the second LF contacts comprise a projecting part engaged in the second orifice ORF2, opposite the first PAD contacts arranged on the sides of the second orifice ORF2.

[0079] The protruding part makes it possible to improve the electrical connection of the second LF contacts of the CPT cover with the first PAD contacts of the support substrate SUB, in a male-female type structure.

[0080] [Fig.9] schematically illustrates a sectional view of a BT optical housing according to a fifth embodiment. The elements common to the BT housing of [Fig.l] bear the same references and will not all be detailed again.

[0081] The assembly means provided in this fifth embodiment comprise an arrangement in the CPT cover and in the support substrate SUB capable of separating the first PAD contacts and the second LF contacts by a distance. Furthermore, this arrangement is capable of containing a SLD_BP solder bump (usually designated by the English term “stud bump”).

[0082] [Fig. 10] schematically illustrates a sectional view of a BT optical housing according to a sixth embodiment. The elements common to the BT housing of [Fig.l] bear the same references and will not all be detailed again.

[0083] The arrangement is similar to that in the CPT cover and the SUB substrate of the BT housing described previously in relation to [Fig. 9] and differs from it in that the second electrical contacts LF are arranged laterally on the side wall PRL2 of the CPT cover and that the arrangement contains a solder wire WB. The solder wire WB is for example embedded in a resin RES (designated by the usual Anglo-Saxon terms “glob top”) allowing it to be protected from the outside world.

[0084] Such an arrangement therefore makes it possible to make an electrical connection by a technique called “wire bonding” (or “wire connection” in French) commonly used to connect electronic chips. In particular, this electrical connection can be made after fixing the CPT cover, by passing the solder wire through a third orifice ORF3 provided in the CPT cover opposite the first PAD contacts of the SUB substrate.

[0085] Therefore, the arrangement may comprise a simple structure interposing a distance between the solder material such as the solder bump SLD_BP or the solder wire WB and the glue. Furthermore, this may make it possible to establish an electrical connection between the first contacts PAD and the second contacts LF in a controlled manner, i.e. without the risk of overflow of the solder material which may mix with the glue GL2 during its formation.

[0086] [Fig. 11] schematically illustrates the steps of an example of a manufacturing method for the BT optical housing described previously in relation to Figures 1 and 2.

[0087] The method comprises a step 110 of forming a support substrate SUB comprising first electrical contacts PAD.

[0088] The method comprises a step 111 of forming a first trench TRC1 and a second trench TRC2 around the first electrical contacts PAD.

[0089] The method comprises a step 112 of depositing a solder material SLD and a glue GL on the substrate SUB. In particular, the solder material SLD is deposited on the first electrical contacts PAD.

[0090] The method comprises a step 113 of fixing a CPT cover. In particular, a connection of the second LF contacts of the CPT cover to the first PAD contacts of the substrate SUB is carried out simultaneously with the fixing of the CPT cover. During this fixing, glue GL can overflow into the first trench TRC1 and at least a portion of the solder material SLD can overflow into the second trench TRC2. In this way, the glue GL2 and the solder material SLD remaining on the mounting face FM are separated by a distance DI after the fixing of the CPT cover.

[0091] [Fig. 12] schematically illustrates the steps of an example of a manufacturing process for the BT optical boxes described previously in relation to Figures 7 and 8.

[0092] The method begins at step 120 corresponding to step 110 of forming the SUB substrate of the process described previously in relation to [Fig.l 1].

[0093] The method comprises a step 121 of forming a second orifice ORF2. The first electrical contacts PAD are formed on the sides of the second orifice ORF2, for example by metallization on the sides of an orifice according to conventional techniques.

[0094] The method then comprises a step 122 corresponding to step 113 of fixing the CPT cover of the method described previously in relation to [Fig. 11]. After fixing the CPT cover, the GL glue can be polymerized during a heat treatment of the BT optical housing.

[0095] After the heat treatment, the method comprises a step 123 of injecting SLD solder material through the second orifice ORF2 so that the SLD solder material passes through the second orifice ORF2 and electrically connects the second LF contacts and the first PAD contacts. GL3 glue or resin may also be injected in order to plug the second orifice ORF2.

[0096] Alternatively, the CPT cover may comprise second LF contacts having a projecting portion, in which case the step 122 of fixing the CPT cover is done so as to engage the projecting portion of the second LF contacts in the second orifice ORF2 opposite the first PAD contacts, as illustrated in [Fig.8], before the injection 123 of the SLD solder material.

[0097] The second orifice ORF2 therefore makes it possible to establish an electrical connection between the first contacts and the second contacts independently of the fixing of the CPT cover on the SUB substrate, thus making it possible to polymerize the glue before the injection of the solder material in order to avoid mixing it with the polymerized glue even if the solder material is in contact with the glue.

[0098] [Fig. 13] schematically illustrates the steps of an example of a manufacturing process for the BT optical boxes described previously in relation to Figures 4 and 5.

[0099] The method comprises a step 130 of forming a cover CPT comprising second electrical contacts LF as well as a step 131 of forming a first orifice opening into the second electrical contacts LF. More particularly, the first orifice has an open contour on the outside CRX or an open contour ORF1 formed in the second contacts LF.

[0100] The method comprises a step 132 of depositing a GL glue on a SUB substrate such as a conventional substrate and a step 133 of fixing the CPT cover in a manner analogous to steps 113 and 122 described previously in relation to FIGS. 11 and 12. After fixing the CPT cover, the GL glue can be polymerized during a heat treatment of the BT optical package.

[0101] After the heat treatment, the method comprises a step 134 of injecting SLD solder material through the first port such that the SLD solder material passes through the first port and electrically connects the second LF contacts and the first PAD contacts.

[0102] [Fig. 14] schematically illustrates the steps of an example of a manufacturing process for the BT optical boxes described previously in relation to Figures 9 and 10.

[0103] The method comprises a step 140 of forming the support substrate SUB and the CPT cover. The formation of the CPT cover may comprise the formation 141 of a third orifice ORF3 and a formation 142 of the second electrical contacts LF on a side wall PRL2 of the CPT cover so that the second contacts are oriented vertically.

[0104] The method comprises, as an alternative to steps 141 and 142, a step 143 of forming a solder bump. Such a solder bump can be obtained by first depositing the SLD solder material in the form of a ball on the first PAD contacts and, once the material is fixed to the first contacts, it is stretched and torn to form a tip on which the second LF contacts can rest when fixing the CPT cover.

[0105] The method then comprises a step 144 of fixing the CPT cover similar to steps 113, 122 and 133 described previously in relation to figures 11, 12, 13. In the case of the BT box illustrated in [Fig.9], the electrical connection between the first PAD contacts and the second LF contacts is made during the fixing step.

[0106] In the case of the BT housing illustrated in [Fig. 10], the first PAD contacts are connected to the second LF contacts using a wire bonding technique. Indeed, the method further comprises a step 144 of forming a solder wire WB through the third orifice ORF3 between the first PAD contacts and the second LF contacts as well as forming a resin RES introduced through the third orifice ORF3 so as to embed the solder wire WB.

Claims

Claims

1. Optical package (BT) comprising a support substrate (SUB) having first electrical contacts (PAD), a cover (CPT) fixed on the support substrate (SUB) by glue (GL1, GL2) and comprising second electrical contacts (LF) connected to the first electrical contacts (PAD) by a solder material (SLD), in which assembly means (TRC1, TRC2, CRX, 0RF1, ORF2, ORF3, STD_BP) are configured to interpose a separation between the solder material (SLD) and the glue (GL2).

2. Housing according to claim 1, in which the assembly means comprise an arrangement in the second electrical contacts (LF) adapted to accommodate a portion of the solder material (SLD).

3. Housing according to claim 2, in which the arrangement in the second contacts (LF) comprises a first through orifice having a closed contour inside (0RF1) of the second contacts (LF), or an open contour on the outside (CRX) of the second contacts, forming a passage allowing a part of the solder material (SLD) to overflow outside the cover (CPT) or allowing an injection of the solder material (SLD) passing through the first orifice.

4. Housing according to one of claims 1 to 3, in which the assembly means comprise an arrangement in the substrate (SUB) adapted to contain a portion of the solder material (SLD).

5. A package according to claim 4, wherein the arrangement in the support substrate (SUB) comprises a first trench (TRC1) and a second trench (TRC2) around the first contacts (PAD), the first trench (TRC1) containing the glue (GL2) and the second trench (TRC2) containing at least a portion of the solder material (SLD).

6. Housing according to claim 4, wherein the arrangement in the support substrate (SUB) comprises a second through orifice (ORF2), capable of allowing injection of the solder material (SLD) passing through the second orifice (0RF2).

7. Housing according to claim 6, in which the second contacts (LF) comprise a projecting part engaged in the second orifice (0RF2), opposite the first contacts (PAD) arranged on the sides of the second orifice (0RF2).

8. Housing according to claim 1, in which the assembly means comprise an arrangement in the cover and in the substrate capable of separating by a distance the first contacts (PAD) and the second contacts (LF), and capable of containing the solder material (SLD) comprising a solder wire (WB) or a solder bump (SLD_BP).

9. Method for assembling a support substrate (SUB) comprising first electrical contacts (PAD), with a cover (CPT) comprising second contacts (LF), comprising fixing the cover (CPT) on the support substrate (SUB) by the glue (GL1, GL2), a connection of the second contacts (LF) to the first electrical contacts (PAD) by a solder material (SLD), assembly means interposing a separation between the solder material (SLD) and the glue (GL2) during said fixing of the cover (CPT) on the support substrate (SUB).

10. A method according to claim 9, wherein the assembly means comprise an arrangement formed in the second electrical contacts (LF), a portion of the solder material (SLD) being housed in the arrangement during said assembly of the cover (CPT) with the substrate (SUB).

11. Method according to claim 10, in which the arrangement in the second contacts (LF) comprises a first through hole having a closed contour on the inside (ORF1) or an open contour on the outside (CRX) formed in the second contacts (LF), a part of the solder material (SLD) being housed in the first hole during said assembly.

12. Method according to claim 11, in which said part of the solder material (SLD) is housed in the first orifice, by an overflow of the solder material (SLD) outside the cover (CPT) passing through the first orifice.

13. A method according to claim 11, wherein said portion of the solder material (SLD) is housed in the first orifice, by an injection of the solder material (SLD) passing through the first orifice during said connection of the electrical contacts.

14. Method according to one of claims 9 to 13, in which the assembly means comprise an arrangement formed in the substrate (SUB), a part of the solder material (SLD) being housed in the arrangement during said assembly of the cover (CPT) with the substrate (SUB).

15. The method of claim 14, wherein the arrangement in the support substrate (SUB) comprises a first trench (TRC1) and a second trench (TRC2) formed in the support substrate (SUB) around the first contacts (PAD), the glue (GL2) being contained in the first trench (TRC1) and at least a portion of the solder material (SLD) being contained in the second trench (TRC2), during said fixing of the cover (CPT).

16. The method of claim 14, wherein the arrangement in the support substrate (SUB) comprises a second through-hole (0RF2) formed in the support substrate (SUB), the method comprising injecting the solder material (SLD) through the second through-hole (0RF2).

17. Method according to claim 16, in which said fixing of the cover (CPT) comprises an engagement of a projecting part of the second contacts (LF) in the second orifice (0RF2) opposite the first contacts (PAD) arranged on the sides of the second orifice (0RF2).

18. Method according to one of claims 9 to 17, wherein said step of connecting the second contacts (LF) to the first electrical contacts (PAD) by a solder material (SLD) is carried out after a polymerization treatment of the glue fixing the cover (CPT) on the support substrate (SUB).

19. Method according to claim 9, in which the assembly means comprise an arrangement in the cover and in the substrate separating by a distance the first contacts (PAD) and the second contacts (LF), the method comprising a formation of the solder material (SLD) in the separation of said arrangement, by a solder wire (WB) or by a solder bump (SLD_BP).

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