Relay circuit and electrical connection device

Abstract

To provide a relay circuit and an electrical connection device capable of reducing loss of a loopback circuit and noise.SOLUTION: An electrical connection device includes inspection terminals, a wiring board, and a relay circuit. The wiring board includes: first electrodes electrically connected to each of the inspection terminals; connection wires connected to each of the first electrodes; and second electrodes electrically connected to each of the first electrodes via the connection wires. The relay circuit is connected to a first wire and a second wire electrically connected to one of the first mutually different electrodes. The relay circuit includes: a common terminal; a first wiring terminal connected to the first wire; a second wiring terminal connected to the second wire; and a first inspection terminal and a second inspection terminal electrically connected to each of inspection devices. The relay circuit selectively connects the first wiring terminal to one of the common terminal and the first inspection terminal, and selectively connects the second wiring terminal to one of the common terminal and the second inspection terminal.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an electrical connection device used for testing electrical characteristics of relay circuits and test objects. [Background technology]

[0002] In order to measure the electrical characteristics of an object under test such as an integrated circuit, an electrical connection device having an inspection terminal that is brought into contact with the object under test is used. In a measurement using the electrical connection device, the object under test is electrically connected to an inspection device such as a tester via the inspection terminal.

[0003] In order to inspect the characteristics of an object under test, a signal output from an output terminal of the object under test is input to an input terminal of the object under test to inspect whether the output and input parts of the object under test are functioning. For this purpose, an electrical connection device is used that can configure a circuit (hereinafter also referred to as a "loopback circuit") that electrically connects the output and input terminals of the object under test. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Korean Patent Publication No. 10-2020-0063009 Summary of the Invention [Problem to be solved by the invention]

[0005] In order to measure the characteristics of an object to be tested with high accuracy, it is important to reduce loss and noise in the loopback circuit through which the signal propagates. The present invention aims to provide a relay circuit and an electrical connecting device that can reduce loss and noise in the loopback circuit. [Means for solving the problem]

[0006] The electrical connection device according to one aspect of the present invention includes a plurality of inspection terminals, a wiring board, and a relay circuit. The wiring board includes a plurality of first electrodes each electrically connected to one of the inspection terminals, a plurality of connection wires each connected to one of the first electrodes, and a plurality of second electrodes each electrically connected to one of the first electrodes via the connection wires. The relay circuit is connected to the first wire and the second wire each electrically connected to one of the first electrodes different from each other. The relay circuit includes a common terminal, a first wiring terminal connected to the first wire, a second wiring terminal connected to the second wire, and a first inspection terminal and a second inspection terminal each electrically connected to an inspection device. The relay circuit selectively connects the first wiring terminal to either the common terminal or the first inspection terminal, and selectively connects the second wiring terminal to either the common terminal or the second inspection terminal. Effect of the Invention

[0007] According to the present invention, it is possible to provide a relay circuit and an electrical connecting device that can reduce loss and noise in a loopback circuit. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic diagram showing the configuration of the electrical connecting device according to the first embodiment. [Diagram 2] FIG. 2 is a schematic diagram showing the configuration of a relay circuit of the electrical connecting device according to the first embodiment. [Diagram 3] FIG. 3 is a schematic diagram showing a first connection state of the electrical connecting device according to the first embodiment. [Figure 4] FIG. 4 is a schematic diagram showing a second connection state of the electrical connecting device according to the first embodiment. [Diagram 5] FIG. 5 is a schematic diagram showing the configuration of a capacitor included in the relay circuit of the electrical connecting device according to the first embodiment. [Figure 6A] FIG. 6A is a schematic side view showing the configuration of a relay circuit of the electrical connecting device according to the first embodiment. [Figure 6B]FIG. 6B is a schematic cross-sectional view showing the configuration of the relay circuit of the electrical connecting device according to the first embodiment. [Figure 6C] FIG. 6C is a schematic front view showing the configuration of the relay circuit of the electrical connecting device according to the first embodiment. [Figure 7A] FIG. 7A is a schematic side view showing a first connection state of the relay circuit shown in FIG. 6A. [Figure 7B] FIG. 7B is a schematic cross-sectional view showing a first connection state of the relay circuit shown in FIG. 6B. [Figure 7C] FIG. 7C is a schematic front view showing a first connection state of the relay circuit shown in FIG. 6C. [Figure 8A] FIG. 8A is a schematic side view showing a second connection state of the relay circuit shown in FIG. 6A. [Figure 8B] FIG. 8B is a schematic cross-sectional view showing a second connection state of the relay circuit shown in FIG. 6B. [Figure 8C] FIG. 8C is a schematic front view showing a second connection state of the relay circuit shown in FIG. 6C. [Figure 9A] FIG. 9A is a schematic diagram showing a first connection state of a relay circuit of a comparative example. [Figure 9B] FIG. 9B is a schematic diagram showing a second connection state of the relay circuit of the comparative example. [Figure 10A] FIG. 10A is a schematic side view showing the configuration of a relay circuit of the electrical connecting device according to the second embodiment. [Figure 10B] FIG. 10B is a schematic cross-sectional view showing the configuration of the relay circuit of the electrical connecting device according to the second embodiment. [Figure 10C] FIG. 10C is a schematic front view showing the configuration of the relay circuit of the electrical connecting device according to the second embodiment. [Figure 11A] FIG. 11A is a schematic side view showing a first connection state of the relay circuit shown in FIG. 10A. [Figure 11B] FIG. 11B is a schematic cross-sectional view showing a first connection state of the relay circuit shown in FIG. 10B. [Figure 11C]FIG. 11C is a schematic front view showing the first connection state of the relay circuit shown in FIG. 10C. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Next, an embodiment of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic, and the thickness ratios of each part are different from the actual ones. Of course, the drawings also include parts with different dimensional relationships and ratios. The embodiments shown below are examples of devices and methods for embodying the technical ideas of this invention, and the embodiments of this invention do not specify the materials, shapes, structures, arrangements, etc. of the components as described below.

[0010] (First embodiment) 1 is used for inspecting an object to be inspected 2. The electrical connection device 1 includes a plurality of probes 10 that come into contact with the object to be inspected 2 when the object to be inspected 2 is inspected, a wiring board 20 connected to the probes 10, and a relay circuit 30 arranged on the wiring board 20. The electrical connection device 1 further includes a printed board 40 laminated on the wiring board 20, and a stiffener 50 laminated on the printed board 40.

[0011] One end of the probe 10 (hereinafter also referred to as the "base end") is connected to the wiring board 20. When the inspection object 2 is inspected, the other end of the probe 10 (hereinafter also referred to as the "tip end") comes into contact with a signal terminal (not shown) of the inspection object 2. The multiple probes 10 function as multiple inspection terminals that electrically connect the inspection object 2 to an inspection device. FIG. 1 shows a state in which the probe 10 and the inspection object 2 are separated from each other. The probe 10 may be supported by a probe head 60 through which the probe 10 penetrates. The probe head 60 may be a housing having a space provided inside. The probe head 60 is fixed to the wiring board 20, for example.

[0012] 1, the wiring board 20 includes a plurality of first electrodes 21 each electrically connected to one of the plurality of probes 10, and a plurality of second electrodes 22 each electrically connected to one of the first electrodes 21. The second electrodes 22 are electrically connected to the first electrodes 21 via a plurality of connection wirings 200 each connected to one of the first electrodes 21. The first electrodes 21 are connected to the base ends of the probes 10. The connection wirings 200 may be, for example, internal wirings arranged inside the wiring board 20. For example, a multi-layer wiring board such as MLO (Multi-Layer Organic) or MLC (Multi-Layer Ceramic) may be used for the wiring board 20.

[0013] The printed circuit board 40 includes a wiring pattern 400 that electrically connects the second electrode 22 of the wiring board 20 to an inspection device. For example, a first end 41 of the wiring pattern 400 arranged inside and on the surface of the printed circuit board 40 is connected to the second electrode 22 of the wiring board 20, and a second end 42 of the wiring pattern 400 is electrically connected to the inspection device.

[0014] Wiring board 20 is a space transformer that expands the spacing between the base ends of probes 10 to the spacing between wiring patterns 400 of printed circuit board 40, for example, in a plan view seen from the normal direction of the main surface of wiring board 20. By using a space transformer for wiring board 20, the base ends of probes 10, which correspond to the spacing between signal terminals arranged on inspection target 2, can be electrically connected to wiring patterns 400 of printed circuit board 40 that are arranged at a wider spacing than the spacing between the base ends.

[0015] 1, a stiffener 50 may be laminated on the printed circuit board 40. The stiffener 50 has a higher rigidity than the printed circuit board 40, and ensures the mechanical strength of the electrical connection device 1 by preventing the printed circuit board 40 from bending. Furthermore, the stiffener 50 may be used as a support for fixing each of the components of the electrical connection device 1. The stiffener 50 may be fixed to the printed circuit board 40 by, for example, a screw.

[0016] The relay circuit 30 is connected to a first wiring 201A and a second wiring 202A, each of which is electrically connected to one of the different first electrodes 21. The relay circuit 30 shown in FIG. 1 is connected to a first wiring 201A and a second wiring 202A included in a connection wiring 200 arranged on a wiring board 20. The first wiring 201A is electrically connected to a first probe 101 of the multiple probes 10. The second wiring 202A is electrically connected to a second probe 102 of the multiple probes 10.

[0017] 2, the relay circuit 30 includes a common terminal 300, a first wiring terminal 301A connected to the first wiring 201A, a second wiring terminal 302A connected to the second wiring 202A, a first inspection terminal 301B, and a second inspection terminal 302B. The first inspection terminal 301B can be electrically connected to an inspection device via the first inspection wiring 201B included in the connection wiring 200 of the wiring board 20 and a part of the wiring pattern 400 of the printed circuit board 40. The second inspection terminal 302B can be electrically connected to an inspection device via the second inspection wiring 202B included in the connection wiring 200 of the wiring board 20 and a part of the wiring pattern 400 of the printed circuit board 40.

[0018] The relay circuit 30 selectively connects the first wiring terminal 301A to either the common terminal 300 or the first inspection terminal 301B. Furthermore, the relay circuit 30 selectively connects the second wiring terminal 302A to either the common terminal 300 or the second inspection terminal 302B. Hereinafter, the operation of the relay circuit 30 to switch the connection target of the first wiring terminal 301A and the second wiring terminal 302A is also referred to as a "switching operation." The switching operation of the relay circuit 30 may be controlled by, for example, a control signal CS that the relay circuit 30 receives from an inspection device.

[0019] The relay circuit 30 connects the second wiring terminal 302A to the common terminal 300 at the timing when the first wiring terminal 301A is connected to the common terminal 300. The state in which the first wiring terminal 301A and the second wiring terminal 302A are connected to the common terminal 300 is hereinafter referred to as a "first connection state." On the other hand, the relay circuit 30 connects the second wiring terminal 302A to the second inspection terminal 302B at the timing when the first wiring terminal 301A is connected to the first inspection terminal 301B. The state in which the first wiring terminal 301A is connected to the first inspection terminal 301B and the second wiring terminal 302A is connected to the second inspection terminal 302B is hereinafter referred to as a "second connection state."

[0020] Fig. 3 shows the wiring path in the first connection state. As shown in Fig. 3, the wiring path between the inspection object 2 and the inspection device 3 is composed of a first section P1 to a fourth section P4 (same below). The first section P1 is a wiring path via the probe 10 in a state where the tip portion is in contact with the signal terminal of the inspection object 2. The second section P2 is a wiring path composed of the connection wiring 200 of the wiring board 20. The third section P3 is a wiring path composed of the wiring pattern 400 of the printed circuit board 40. The fourth section P4 is a wiring path from the printed circuit board 40 to the inspection device 3.

[0021] 3, in the first connection state, the first probe 101 electrically connected to the first wiring 201A and the second probe 102 electrically connected to the second wiring 202A are electrically connected via a common terminal 300. In other words, in the electrical connection device 1, a loopback circuit can be configured by the first probe 101 and the second probe 102, each electrically connected to the common terminal 300.

[0022] The two signal terminals of the test object 2 are electrically connected by a loopback circuit configured in the first connection state. FIG. 3 exemplarily illustrates a case where the first signal terminal 2A of the test object 2, which the first probe 101 contacts, and the second signal terminal 2B of the test object 2, which the second probe 102 contacts, are electrically connected via a common terminal 300. For example, when the test object 2 is a receiving circuit, the first signal terminal 2A is an output terminal of the test object 2, and the second signal terminal 2B is an input terminal of the test object 2, a transmission test can be performed by returning the output from the test object 2 to the input. In other words, it is possible to test whether the output section or the input section of the test object 2 is functioning normally even without a device to transmit to. For example, as a test similar to a jitter tolerance test performed on a receiving circuit, an output signal output from the first signal terminal 2A (output terminal) may be input as an input signal to the second signal terminal 2B (input terminal) to test whether a specified error rate is ensured.

[0023] On the other hand, as shown in FIG. 4, in the second connection state, the first probe 101 electrically connected to the first wiring 201A is electrically connected to the inspection device 3 via the wiring board 20 and the printed circuit board 40. In other words, the first signal terminal 2A of the inspection object 2 is electrically connected to the first terminal 3A of the inspection device 3 via the electrical connection device 1. And the second probe 102 electrically connected to the second wiring 202A is electrically connected to the inspection device 3 via the wiring board 20 and the printed circuit board 40. In other words, the second signal terminal 2B of the inspection object 2 is electrically connected to the second terminal 3B of the inspection device 3 via the electrical connection device 1.

[0024] As described above, in the second connection state, the signal terminal of the object under test 2 is electrically connected to the terminal of the inspection device 3 via the relay circuit 30. In the second connection state, an electrical signal is transmitted between the object under test 2 and the inspection device 3, such as an IC tester, to measure the characteristics of the object under test 2.

[0025] The common terminal 300 of the relay circuit 30 may include a capacitor electrically connectable to the first wiring 201A and the second wiring 202A. FIG. 5 shows an example of a capacitor 33 included in the common terminal 300. The capacitor 33 may be a capacitor formed on a semiconductor substrate using a semiconductor manufacturing process (hereinafter, also referred to as a "process capacitor"). The capacitor 33 shown in FIG. 5 is formed in a semiconductor substrate 330 with a laminate in which a dielectric layer 33C is disposed between a first electrode layer 33A and a second electrode layer 33B. A first electrode terminal 331 connected to the first electrode layer 33A and a second electrode terminal 332 connected to the second electrode layer 33B are disposed on one main surface of the semiconductor substrate 330.

[0026] 6A to 6C show an example of the configuration of the relay circuit 30 including the capacitor 33. FIG. 6A shows the position of the first electrode terminal 331 facing the first wiring 201A. FIG. 6B shows the position of the second electrode terminal 332 facing the second wiring 202A. The direction from the top to the bottom of the paper in FIG. 6A and FIG. 6B is the Z direction, the direction from the right side to the left side of the paper perpendicular to the Z direction is the X direction, and the direction from the front side to the back side of the paper perpendicular to the Z direction is the Y direction. FIG. 6C shows the relative positional relationship between the first electrode terminal 331 and the second electrode terminal 332 as seen from the X direction. FIG. 6B is a cross-sectional view along the VIB-VIB direction of FIG. 6C. In the following, the drawing as seen from the X direction is a front view, and the drawing as seen from the Y direction is a side view.

[0027] The relay circuit 30 shown in Fig. 6A to Fig. 6C includes a support portion 311 having a main surface parallel to the XY plane, a first short-circuit wiring 3121 and a second short-circuit wiring 3122 disposed on the main surface of the support portion 311 facing the Z direction, and a column portion 313 having one end connected to the support portion 311 and extending in the Z direction. The support portion 311 is insulating, and the first short-circuit wiring 3121 and the second short-circuit wiring 3122 are conductive. The first short-circuit wiring 3121 and the second short-circuit wiring 3122 are disposed in parallel along the Y direction and each extends in the X direction. In the following description, the first short-circuit wiring 3121 and the second short-circuit wiring 3122 are also referred to as short-circuit wiring 312 when not limited to each other.

[0028] The capacitor 33 is connected to the other end of the column portion 313. On a main surface of the capacitor 33 facing the support portion 311, a first electrode terminal 331 and a second electrode terminal 332 are arranged along the Y direction.

[0029] 6A to 6C, the first wiring 201A and the second wiring 202A are located between the support portion 311 and the capacitor 33. The first wiring 201A, the second wiring 202A, the first short-circuit wiring 3121 and the second short-circuit wiring 3122 are disposed on the same XY plane level.

[0030] When viewed from the Z direction, the first electrode terminal 331 faces the first wiring 201A, and the second electrode terminal 332 faces the second wiring 202A. When viewed from the Z direction, the first short-circuit wiring 3121 faces the first wiring 201A and the first inspection wiring 201B. When viewed from the Z direction, the second short-circuit wiring 3122 faces the second wiring 202A and the second inspection wiring 202B.

[0031] 6A to 6C is configured to be movable in the M direction along the Z direction relative to the first wiring 201A, the second wiring 202A, the first inspection wiring 201B, and the second inspection wiring 202B. The support portion 311 on which the short-circuit wiring 312 is arranged, the pillar portion 313, and the capacitor 33 move together. For example, the relay circuit 30 moves in the Z direction between a first connection state and a second connection state in response to a control signal CS.

[0032] 7A to 7C show an example of a first connection state of the relay circuit 30 shown in Figs. 6A to 6C. Fig. 7B is a cross-sectional view along the VIIB-VIIB direction in Fig. 7C. In the first connection state, the relay circuit 30 moves in the -Z direction from the state in Figs. 6A to 6C. As a result, in the first connection state, the first electrode terminal 331 of the capacitor 33 is electrically connected to the first wiring 201A, and the second electrode terminal 332 is electrically connected to the second wiring 202A. In the first connection state, the first electrode terminal 331 corresponds to the first wiring terminal 301A, and the second electrode terminal 332 corresponds to the second wiring terminal 302A. The capacitor 33 corresponds to the common terminal 300.

[0033] In the first connection state, the first signal terminal 2A and the second signal terminal 2B of the test object 2 are electrically connected via the capacitor 33. In other words, in the first connection state, a loopback circuit including the capacitor 33 is configured between the first signal terminal 2A and the second signal terminal 2B.

[0034] An example of the second connection state of the relay circuit 30 shown in FIGS. 6A to 6C is shown in FIGS. 8A to 8C. FIG. 8B is a cross-sectional view taken along the VIIIB-VIIIB direction in FIG. 8C. In the second connection state, the relay circuit 30 moves in the Z direction from the state shown in FIGS. 6A to 6C. As a result, in the second connection state, the first wiring 201A and the first inspection wiring 201B are connected to the first short-circuit wiring 3121. Furthermore, the second wiring 202A and the second inspection wiring 202B are connected to the second short-circuit wiring 3122. That is, the first wiring 201A and the first inspection wiring 201B are electrically connected via the first short-circuit wiring 3121, and the second wiring 202A and the second inspection wiring 202B are electrically connected via the second short-circuit wiring 3122.

[0035] In the second connection state, the portion of first short-circuit wiring 3121 connected to first wiring 201A corresponds to first wiring terminal 301A, and the portion of first short-circuit wiring 3121 connected to first inspection wiring 201B corresponds to first inspection terminal 301B. Then, the portion of second short-circuit wiring 3122 connected to second wiring 202A corresponds to second wiring terminal 302A, and the portion of second short-circuit wiring 3122 connected to second inspection wiring 202B corresponds to second inspection terminal 302B.

[0036] In the second connection state, the first signal terminal 2A and the second signal terminal 2B of the object under test 2 are electrically connected to the first terminal 3A and the second terminal 3B, respectively, of the inspection device 3. As a result, in the second connection state, an electrical signal is transmitted between the inspection device 3 and the object under test 2, and the characteristics of the object under test 2 are measured.

[0037] As described above, the common terminal 300, the first wiring terminal 301A, the second wiring terminal 302A, the first inspection terminal 301B, and the second inspection terminal 302B are integrally formed as the relay circuit 30. Therefore, the relay circuit 30 has a simple circuit configuration and a short internal signal path. Furthermore, the relay circuit 30 having an integrated circuit configuration can have a small external size. For example, the relay circuit 30 can be miniaturized by integrally forming the relay circuit 30 using a MEMS (Micro Electro Mechanical Systems) process.

[0038] On the other hand, even if a comparative relay circuit (hereinafter, also referred to as "comparison relay circuit 30M") including two relays and an external capacitance 33M as shown in FIG. 9A and FIG. 9B is used, a configuration similar to the first connection state and the second connection state can be realized. The comparison relay circuit 30M controlled by the control signal CS electrically connects the first signal terminal 2A of the inspection object 2 to either the first terminal 3A of the inspection device 3 or the external capacitance 33M by the first relay 310. Then, the comparison relay circuit 30M connects the second signal terminal 2B of the inspection object 2 to either the second terminal 3B of the inspection device 3 or the external capacitance 33M by the second relay 320. That is, the comparison relay circuit 30M electrically connects the first signal terminal 2A of the inspection object 2 to one terminal of the external capacitance 33M and electrically connects the second signal terminal 2B of the inspection object 2 to the other terminal of the external capacitance 33M as shown in FIG. 9A. Alternatively, the comparison relay circuit 30M electrically connects the first signal terminal 2A of the object to be inspected 2 to the first terminal 3A of the inspection device 3, and electrically connects the second signal terminal 2B of the object to be inspected 2 to the second terminal 3B of the inspection device 3, as shown in FIG. 9B.

[0039] However, it is difficult to miniaturize the comparison relay circuit 30M. That is, since the comparison relay circuit 30M has two relays and an external capacitor, it has a complex structure and a large external size compared to the relay circuit 30. Therefore, the signal path of the comparison relay circuit 30M is longer than that of the relay circuit 30, and the signal loss and noise are large.

[0040] Furthermore, by miniaturizing the relay circuit 30, the degree of freedom in the arrangement position of the relay circuit 30 is increased. For example, the relay circuit 30 can be arranged on the wiring board 20, which is closer to the probe 10 than the printed circuit board 40. By shortening the distance between the probe 10 and the relay circuit 30, the length of the wiring connecting the probe 10 and the relay circuit 30 can be shortened. As a result, for example, when measuring the high-frequency characteristics of the test object 2 using a loopback circuit, the loss of signals propagating through the wiring and the generation of noise can be suppressed.

[0041] As described above, according to the electrical connection device 1 according to the first embodiment including the relay circuit 30, the loss and noise of the loopback circuit can be reduced.

[0042] The switching operation of the relay circuit 30 may be performed in response to a control signal CS from an inspection device, for example. Since the relay circuit 30 is configured to be able to receive the control signal CS from the inspection device, a loopback circuit can be configured at any timing during a series of inspections of the inspection target 2. For example, wiring for transmitting the control signal CS between the relay circuit 30 and the inspection device may be formed on the wiring board 20 and the printed circuit board 40. Alternatively, the switching operation of the relay circuit 30 may be performed manually.

[0043] Second Embodiment As shown in FIGS. 10A to 10C, in the electrical connection device 1 according to the second embodiment, a support substrate 35 having a connecting wire 34 arranged on its main surface is connected to one end of a column portion 313, the other end of which is connected to a support portion 311, instead of a capacitor 33. The connecting wire 34 is made of a conductive material and is arranged on the main surface of the support substrate 35 facing the support portion 311. The connecting wire 34 faces the first wiring 201A and the second wiring 202A. The electrical connection device 1 according to the second embodiment is different from the first embodiment in that the relay circuit 30 includes the connecting wire 34 instead of the capacitor 33. As for the other configurations, the electrical connection device 1 according to the second embodiment is similar to the first embodiment shown in FIG. 1.

[0044] 11A to 11C, in the first connection state, the relay circuit 30 moves in the -Z direction from the position shown in FIGS. 10A to 10C. This causes the first wiring 201A and the second wiring 202A to be connected to the connecting wiring 34. As a result, the first wiring 201A and the second wiring 202A are electrically connected via the connecting wiring 34.

[0045] Therefore, in the first connection state, the first signal terminal 2A and the second signal terminal 2B of the test object 2 are electrically connected via the connecting wire 34. In other words, in the first connection state, a loopback circuit is formed in which the first signal terminal 2A and the second signal terminal 2B are connected in series.

[0046] In the electrical connecting device 1 according to the second embodiment, the second connection state is similar to the configuration described with reference to Figures 8A to 8C. That is, the first signal terminal 2A and the second signal terminal 2B of the inspection object 2 are electrically connected to the first terminal 3A and the second terminal 3B of the inspection device 3, respectively, via the short-circuit wire 312. For this reason, a description of the second connection state will be omitted.

[0047] For example, when a protective element with capacitance is connected to the input / output terminal of the inspection object 2, the measured waveform is distorted. For this reason, the inspection device may measure the inspection object 2 without the protective element being connected. In this case, the capacitor 33 included in the relay circuit 30 of the electrical connecting device 1 according to the first embodiment functions in place of the protective element.

[0048] On the other hand, when a protective element is not connected to the inspection target 2, or when the capacitance of the protective element is not an issue for measurement, the relay circuit 30 does not need to include the capacitor 33, as in the electrical connection device 1 according to the second embodiment. By not including the capacitor 33 in the relay circuit 30, the circuit configuration of the relay circuit 30 can be further simplified and the internal signal path can be shortened. Otherwise, the electrical connection device 1 according to the second embodiment is substantially similar to the first embodiment, and duplicated descriptions will be omitted.

[0049] (Other embodiments) Although the present invention has been described above by way of the embodiment, the description and drawings forming part of this disclosure should not be understood as limiting the present invention. Various alternative embodiments, examples and operating techniques will become apparent to those skilled in the art from this disclosure.

[0050] For example, in the above, the case where the relay circuit 30 is disposed on the wiring board 20 has been described as an example. However, the relay circuit 30 may be disposed at any position on the electrical connection device 1. In the electrical connection device 1, the relay circuit 30 is miniaturized, so there is a high degree of freedom in arranging the relay circuit 30. Therefore, for example, the relay circuit 30 may be disposed on the printed circuit board 40. However, the shorter the wiring connecting the probe 10 and the relay circuit 30, the more preferable it is in terms of reducing loss and noise of the signal propagating to the relay circuit 30.

[0051] Further, although the case where there is one relay circuit 30 has been described as an example, the electrical connection device 1 may include multiple relay circuits 30. According to the electrical connection device 1 including multiple relay circuits 30, it is possible to configure a loopback circuit for any two signal terminals of the inspection target 2, or to simultaneously configure multiple loopback circuits.

[0052] In the above, the case where the relay circuit 30 includes the capacitor 33 has been described as an example, but elements such as an inductor or a resistive element other than the capacitor 33 may be disposed in the relay circuit 30. For example, a passive element included in the relay circuit 30 may be selected in order to achieve impedance matching of the loopback circuit. In this way, in the electrical connection device 1, the elements to be inserted in the loopback circuit can be arbitrarily selected depending on the inspection content of the inspection target 2, etc.

[0053] In FIG. 1, the electrical connection device 1 in which the relay circuit 30 is arranged includes a probe 10 that contacts the test object 2. According to the electrical connection device 1 shown in FIG. 1, for example, it is possible to measure the electrical characteristics of the test object 2 in a state where it is not separated from a wafer or in a state where it is made into a chip. On the other hand, the relay circuit 30 may be arranged in the electrical connection device including a test socket in response to the measurement of the electrical characteristics performed in a state where the test object 2 is mounted on a package or the like. For example, instead of the probe 10 of the electrical connection device 1 shown in FIG. 1, a test socket in which a test terminal for connecting with an external terminal of a package in which the test object 2 is mounted may be arranged on the wiring board 20. For the signal terminal of the test object 2 mounted on the package, the test socket and the package are connected to form a loopback circuit via the external terminal of the package and the test terminal of the test socket. In the electrical connection device including the test socket, the first connection state and the second connection state can be switched, as in the electrical connection device 1 including the probe 10 described above.

[0054] The switching operation of the relay circuit 30 may be performed by controlling the test object 2. For example, the semiconductor device, which is the test object 2, may have a self-diagnosis function that outputs a control signal CS for controlling the switching operation to the relay circuit 30 and performs a measurement using a loopback circuit. In other words, the electrical connection device 1 and the test object 2 may be configured so that the relay circuit 30 can receive the control signal CS from the test object 2, and the test object 2 may control the operation of the relay circuit 30. By the control signal CS, the relay circuit 30 selectively connects the first wiring terminal 301A to either the common terminal 300 or the first test terminal 301B, and selectively connects the second wiring terminal 302A to either the common terminal 300 or the second test terminal 302B. For example, the test circuit built in the test object 2 may transmit the control signal CS to the relay circuit 30 via the test terminal of the electrical connection device 1 to form a loopback circuit, and the test object 2 may perform self-diagnosis. As described above, even in a configuration in which the test object 2 has a built-in test device, the loss and noise of the loopback circuit can be reduced.

[0055] Thus, the present invention naturally includes various embodiments not described above. Therefore, the technical scope of the present invention is defined only by the invention-specifying matters related to the scope of the claims appropriate from the above description. [Explanation of symbols]

[0056] 1 Electrical connection device 10 Probes 20 Wiring board 21 1st electrode 22 2nd electrode 30 Relay Circuit 33 Capacitor 40 Printed Circuit Board 50 Stiffna 60 Probe Head 200 Connection Wiring 201A 1st Wiring 201B First inspection wiring 202A 2nd Wiring 202B Second inspection wiring 300 Common terminal 301A 1st wiring terminal 301B First inspection terminal 302A 2nd wiring terminal 302B 2nd inspection terminal 400 Wiring Pattern

Claims

1. An electrical connection device used for inspection of an object to be inspected by an inspection device, comprising: a plurality of inspection terminals that come into contact with the object to be inspected; a wiring board including a plurality of first electrodes each electrically connected to any of the inspection terminals, a plurality of connection wires each connected to any of the first electrodes, and a plurality of second electrodes each electrically connected to any of the first electrodes via the connection wires; a relay circuit connected to a first wiring and a second wiring electrically connected to the first electrodes different from each other; Equipped with The relay circuit comprises: A common terminal; a first wiring terminal connected to the first wiring; a second wiring terminal connected to the second wiring; a first inspection terminal and a second inspection terminal each electrically connectable to the inspection device; Including, selectively connecting the first wiring terminal to either the common terminal or the first inspection terminal; selectively connecting the second wiring terminal to either the common terminal or the second inspection terminal; Electrical connection device.

2. 2. The electrical connecting device according to claim 1, comprising: a first terminal for inspection electrically connected to the common terminal; and a second terminal for inspection electrically connected to the common terminal, and capable of configuring a loopback circuit that electrically connects two signal terminals of the object to be tested.

3. 2. The electrical connecting device according to claim 1, wherein the common terminal, the first wiring terminal, the second wiring terminal, the first inspection terminal, and the second inspection terminal are integrally formed.

4. the common terminal includes a capacitor; a first electrode terminal of the capacitor is electrically connectable to the first wiring; a second electrode terminal of the capacitor is electrically connectable to the second wiring; 4. The electrical connecting device according to claim 1.

5. the relay circuit is disposed on the wiring board; the first wiring and the second wiring are included in the connection wiring; 2. The electrical connection device according to claim 1.

6. The electrical connecting device according to claim 5 , wherein the first test terminal and the second test terminal are electrically connected to the second electrode.

7. 6. The electrical connecting device according to claim 5, further comprising a printed circuit board laminated on said wiring board and including a wiring pattern electrically connecting said second electrodes and said inspection device.

8. 8. The electrical connecting device according to claim 7, wherein the wiring board is a space transformer that expands a spacing between the terminals for inspection to a spacing between the wiring patterns in a plan view seen from a normal direction to a main surface of the wiring board.

9. 2. The electrical connection device according to claim 1, wherein the relay circuit is capable of receiving a control signal from the inspection device that selectively connects the first wiring terminal to either the common terminal or the first inspection terminal, and selectively connects the second wiring terminal to either the common terminal or the second inspection terminal.

10. 2. The electrical connection device according to claim 1, wherein the relay circuit is capable of receiving a control signal from the object to be tested that selectively connects the first wiring terminal to either the common terminal or the first test terminal, and selectively connects the second wiring terminal to either the common terminal or the second test terminal.

11. 2. The electrical connecting device according to claim 1, wherein the terminal for inspection is a probe having one end connected to the wiring board and the other end contacting a signal terminal of the device under test.

12. 2. The electrical connecting device according to claim 1, wherein the terminals for inspection are arranged in a test socket that connects to external terminals of a package in which the device under test is mounted.

13. A common terminal; A first wiring terminal and a second wiring terminal; a first inspection terminal and a second inspection terminal; Equipped with selectively connecting the first wiring terminal to either the common terminal or the first inspection terminal; selectively connecting the second wiring terminal to either the common terminal or the second inspection terminal; the common terminal, the first wiring terminal, the second wiring terminal, the first inspection terminal, and the second inspection terminal are integrally formed. Relay circuit.

14. The relay circuit according to claim 13 , wherein the common terminal, the first wiring terminal, the second wiring terminal, the first test terminal, and the second test terminal are integrally formed using a MEMS process.

15. the common terminal includes a capacitor; a first electrode terminal of the capacitor is electrically connectable to the first wiring terminal; a second electrode terminal of the capacitor is electrically connectable to the second wiring terminal; 15. A relay circuit according to claim 13 or 14.

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