Electronic apparatus

Abstract

To sufficiently cool a heat sink.SOLUTION: An electronic apparatus according to an embodiment includes: a housing including an intake port and an exhaust port, and an opening where a connector is installed; a fan included in the exhaust port and exhausting air inside the housing to the outside; and a heat sink. A heating component is joined to the heat sink, and the heat sink is installed inside the housing so that air sucked through the intake port blows against the heat sink. The heat sink includes: an extension part that is a plate extending from a joint part with the heating component toward the opening; and a wall part rising parallel to a surface of the housing from the tip of the extension part, the opening being installed in the surface.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The disclosed embodiments relate to electronic devices. [Background technology]

[0002] Conventionally, electronic devices are known that suck in air from an intake port, direct it against a heat sink to cool heat-generating components such as semiconductor elements, and then expel the warm air from an exhaust port to the outside of the housing using a fan (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2019-030107 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, the conventional technology has a problem in that the heat sink may not be cooled sufficiently.

[0005] For example, in addition to the intake port, the housing of an electronic device is provided with openings for connectors, for example. When many connectors are provided, the amount of air drawn in through the openings for the connectors increases, and conversely, the amount of air drawn in through the intake port decreases. This can cause the air flow inside the housing to fluctuate as planned, reducing the cooling efficiency of the heat sink.

[0006] The present invention has been made in view of the above, and has an object to sufficiently cool a heat sink. [Means for solving the problem]

[0007] According to one aspect of the embodiment, an electronic device includes a housing having an opening where an air intake port, an exhaust port, and a connector are installed, a fan provided at the exhaust port to exhaust air inside the housing to the outside, and a heat sink. The heat sink is attached to a heat generating component and installed inside the housing so that the air sucked in from the air intake port hits the heat sink. The heat sink includes an extension portion that is a plate extending from the joint portion with the heat generating component toward the opening, and a wall portion that rises from the tip of the extension portion in parallel with the surface of the housing where the opening is installed. Effect of the Invention

[0008] According to one aspect of the embodiment, the heat sink can be sufficiently cooled. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a plan view of an electronic device according to an embodiment. [Diagram 2] FIG. 2 is a plan view of the electronic device according to the embodiment. [Diagram 3] FIG. 3 is a cross-sectional view taken along line AA of the electronic device according to the embodiment. [Figure 4] FIG. 4 is a plan view of a conventional electronic device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment of an electronic device will be described in detail with reference to the accompanying drawings. Note that the present invention is not limited to the embodiment described below.

[0011] In addition, in the following embodiments, expressions such as "rectangular parallelepiped", "vertical", and "parallel" may be used, but these conditions do not need to be strictly satisfied. In other words, each of the above expressions allows for deviations in manufacturing accuracy, installation accuracy, processing accuracy, detection accuracy, etc.

[0012] The electronic device may be any device having heat-generating components arranged on a substrate. The heat-generating components may be, for example, semiconductor elements such as processors. The heat-generating components may be, for example, electronic control units (ECUs), central processing units (CPUs), field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), microcomputers, etc.

[0013] The electronic device may be installed in a vehicle, and may be, for example, a part of a car navigation device, an audio device, a radio, or the like.

[0014] Fig. 1 is a plan view of an electronic device according to an embodiment. As shown in Fig. 1, the electronic device 1 has a rectangular parallelepiped housing, and a heat-generating component 10 and a heat sink 20 provided inside the housing. The heat sink 20 is joined to the heat-generating component 10.

[0015] The housing has an air intake 50. The air intake 50 is a hole provided in the housing. Air outside the housing enters the inside of the housing through the air intake 50.

[0016] The housing has an exhaust port 40L and an exhaust port 40R. The exhaust port 40L and the exhaust port 40R each have a fan. The fans provided at the exhaust port 40L and the exhaust port 40R are axial fans, and exhaust air inside the housing to the outside.

[0017] The housing has an opening 60. The opening 60 is a gap created by installing a connector for connecting a USB (Universal Serial Bus) cable, a LAN (Local area network) cable, or the like.

[0018] Inside the housing, flexible connectors 71, 72, and 73 to which the cables inserted through the air intake 50 are connected are provided.

[0019] Inside the housing, at a position on the positive side of the y axis (the front side of FIG. 1), a board holder is provided that supports another board parallel to the board on which the heat-generating component 10 is mounted and the extension portion of the heat sink 20. Board-to-board connectors 81 and 82 connect the board on which the heat-generating component 10 is mounted and the board holder. The extension portion of the heat sink 20 will be described in detail later.

[0020] Here, the heat sink 20 will be described in detail. The material of the heat sink 20 is a highly thermally conductive material such as aluminum. The heat sink 20 absorbs heat from the heat-generating component 10 (heat absorption) and releases the absorbed heat into the air (heat dissipation).

[0021] The heat sink 20 is placed inside the housing so that the air sucked in from the air intake 50 hits the heat sink 20. The heat sink 20 is in contact with a space on the opposite side (positive direction of the y-axis) from the heat-generating component 10. An airflow is generated in this space by the air that has entered from the air intake 50 being exhausted from the exhaust 40L and the exhaust 40R. The heat sink 20 is cooled by this airflow. This allows heat dissipation from the heat-generating component 10 and the entire housing to be achieved.

[0022] Moreover, the heat sink 20 extends from a position between the intake port 50 and the heat-generating component 10, passing through the position of the heat-generating component 10, toward the opening 60, that is, in the negative direction of the z-axis. This extending portion is the extending portion.

[0023] Here, a case where the efficiency of heat dissipation by a heat sink in a conventional electronic device is reduced will be described with reference to Fig. 4. Fig. 4 is a plan view of the conventional electronic device.

[0024] 4, in conventional electronic device 1a, air enters the inside of the housing not only through intake port 50a but also through opening 60a. As the amount of air entering through opening 60a increases, the amount of air entering through intake port 50a decreases.

[0025] In addition, the airflow created by the air entering through intake port 50a (dotted arrow pointing from the right to the left on the page in the figure) is obstructed by the airflow created by the air entering through opening 60a (dotted arrow pointing up and down from the left side on the page in the figure), and does not flow smoothly toward exhaust port 40La and exhaust port 40Ra.

[0026] As a result, the air heated by the heat released from the heat sink 20a cannot be exhausted efficiently.

[0027] Returning to the description of the embodiment, Fig. 2 is a plan view of the electronic device according to the embodiment. As shown in Fig. 2, air enters through the opening 60 in this embodiment as well.

[0028] In contrast, the heat sink 20 is provided with a wall portion 21, a wall portion 22, and a wall portion 23. The wall portion 21, the wall portion 22, and the wall portion 23 are portions that rise from the tip of the extension portion in parallel to the surface on which the opening portion 60 of the housing is provided. For example, the wall portion 21, the wall portion 22, and the wall portion 23 are realized by bending the extension portion or by bonding a member that will become the wall.

[0029] As indicated by the dotted arrows in FIG. 2, the air entering through the opening 60 hits the walls 21, 22, and 23.

[0030] This allows the airflow created by the air entering through intake port 50 to flow smoothly toward exhaust port 40L and exhaust port 40R (dotted arrows in Figure 1) without being obstructed by the airflow created by the air entering through opening 60.

[0031] Furthermore, since wall portion 21, wall portion 22, and wall portion 23 are part of heat sink 20, the air entering through opening 60 hits wall portion 21, wall portion 22, and wall portion 23, thereby promoting heat dissipation from heat sink 20.

[0032] Here, the surface of the housing on which the intake port 50 is provided is referred to as the front surface. The surface on which the opening 60 is provided is referred to as the rear surface. The surface of the housing on which the exhaust port 40L is provided is referred to as the left side surface. The surface of the housing on which the exhaust port 40R is provided is referred to as the right side surface.

[0033] In this case, the positional relationship of each part provided in the housing can be expressed as follows. That is, the intake port 50 is provided on the front side of the housing. The exhaust port 40L and the fan are provided on the left side perpendicular to the front side of the housing. The opening 60 is provided on the rear side parallel to the front side of the housing. The heat sink 20 is disposed perpendicular to both the front side and the second side. The extension part of the heat sink 20 extends toward the rear side of the housing. The wall portion 21, the wall portion 22, and the wall portion 23 rise parallel to the rear side of the housing. In addition, the exhaust port 40R and the fan are further provided on the right side parallel to the left side of the housing.

[0034] The exhaust ports 40L and 40R are disposed on the left and right sides closer to the rear than to the front. By disposing the intake port 50 and the exhaust ports 40L and 40R at positions separated from each other in this manner, the area of ​​the heat sink 20 that comes into contact with the airflow can be increased.

[0035] Fig. 3 is an AA cross-sectional view of an electronic device according to an embodiment. Fig. 3 shows a board holder 90 connected by board-to-board connectors 81 and 82. The board holder 90 is an example of a plate-like member, and is placed parallel to the heat sink 20. A space is provided between the board holder 90 and the heat sink 20 for air to flow.

[0036] Furthermore, wall portion 91 rises from substrate holder 90 toward heat sink 20. Wall portion 91 rises in the negative direction of the y-axis. In contrast, wall portion 21, wall portion 22, and wall portion 23 rise in the positive direction of the y-axis. This makes it more difficult for air to flow between the space on the intake port 50 side and the space on the opening portion 60 side, improving the efficiency of heat exhaust.

[0037] As shown in FIG. 3, the air entering through intake port 50 (thick dotted arrow) and the air entering through opening 60 (thin dotted arrow) hit wall portion 22 (and part of it hits wall portion 91), and therefore are unlikely to interfere with each other's flow. [Explanation of symbols]

[0038] 1 Electronic equipment 10 Heat generating parts 20 Heat sink 21, 22, 23 Wall section 40L, 40R exhaust port 60 Opening 71, 72, 73 Flexible connector 81, 82 Board-to-board connector 90 PCB Holder 91 Wall section

Claims

1. a housing having an opening in which an intake port, an exhaust port, and a connector are provided; a fan provided at the exhaust port for discharging air from inside the housing to the outside; a heat sink to which a heat generating component is joined and which is installed inside the housing so that the air drawn in through the air intake port hits the heat sink; Equipped with The heat sink is an extension portion that is a plate extending from a joint portion with the heat generating component toward the opening; a wall portion rising from a tip of the extension portion in parallel with a surface of the housing on which the opening is provided; An electronic device comprising:

2. The housing has a rectangular parallelepiped shape, The air intake is provided on a first surface of the housing, the exhaust port and the fan are provided on a second surface of the housing perpendicular to the first surface, the opening is provided in a third surface of the housing parallel to the first surface, the extension is disposed perpendicular to both the first surface and the second surface and extends toward the third surface; The wall portion rises parallel to the third surface of the housing.

2. The electronic device according to claim 1.

3. The housing further includes an exhaust port and a fan for exhausting air from inside the housing to the outside, the exhaust port being provided on a fourth surface of the housing that is parallel to the second surface.

3. The electronic device according to claim 2.

4. The exhaust port and the fan are disposed on the second surface closer to the third surface than to the first surface.

3. The electronic device according to claim 2.

5. A plate-shaped member for supporting a substrate disposed parallel to the extension portion within the housing. The electronic device according to claim 1 , further comprising:

6. A wall portion rising from the plate-like member toward the extending portion. The electronic device according to claim 5 , further comprising:

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