Substrate transfer device using upper magnetic levitation rail and lower magnetic levitation rail

Abstract

To provide a substrate transfer device which stably transfers a substrate using an upper levitation rail and a lower magnetic levitation rail.SOLUTION: A substrate transfer device includes: a moving plate including an upper magnetic levitation rail and a lower magnetic levitation rail; a processing chamber arranged adjacent to the moving plate for processing a substrate; and a shuttle arranged between the upper magnetic levitation rail and the lower magnetic levitation rail, configured to move on the moving plate and to accommodate the substrate.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a substrate transfer device, more particularly to a substrate transfer device including upper and lower magnetic levitation rails. This concerns the placement. [Background technology]

[0002] The throughput of equipment used in semiconductor or display processes is This refers to the amount of wafers or substrates processed per unit time in one process. Processing time of the processing chamber, processing speed of the vacuum robot, vacuum / Waiting conversion speed, wafer cooling / heating time, process environment before process starts However, the throughput of the equipment may be determined based on these factors alone. There is a limit to how much it can be maximized. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Korean Patent No. 10-0707390 Summary of the Invention [Problem to be solved by the invention]

[0004] One object of the present invention is to provide a substrate transfer method that uses upper and lower magnetic levitation rails to stably transfer substrates. The present invention aims to provide an apparatus for [Means for solving the problem]

[0005] In accordance with one embodiment, a substrate transfer apparatus includes a transfer rail including an upper magnetic levitation rail and a lower magnetic levitation rail. a moving plate; a processing device disposed adjacent to the moving plate for processing a substrate; a chamber, and a magnetic levitation rail disposed between the upper magnetic levitation rail and the lower magnetic levitation rail; a shuttle configured to move on the moving plate and receive the substrate; can be done.

[0006] wherein the shuttle has a first cavity configured to accommodate at least one substrate. and a second space, the first space and the second space being separated and partitioned from each other. This can be done.

[0007] Here, the first space may be disposed above the second space.

[0008] Here, the first space accommodates a substrate to be processed in the processing chamber, The second space is capable of receiving a substrate that has been processed in the processing chamber.

[0009] Here, the shuttle is a first permanent magnet arranged to face the upper magnetic levitation rail. and a second permanent magnet disposed to face the lower magnetic levitation rail. can.

[0010] Here, the shuttle includes a support for supporting a substrate, and a friction member is provided on one surface of the support. It can be arranged.

[0011] Here, the shuttle is disposed inside the first space, inside the second space, and the moving plate or a sensor for sensing the environment of the processing chamber. .

[0012] Here, the sensors include a temperature sensor, a humidity sensor, a vibration sensor, a weight sensor, Or it may be a gradient sensor.

[0013] Here, the moving plate includes a fixing pin for fixing the position of the shuttle. The fixed pin is disposed between the electromagnets of the upper magnetic levitation rail or the lower magnetic levitation rail. It is possible.

[0014] Here, the fixing pin contacts the shuttle or penetrates one surface of the shuttle. By doing so, the position of the shuttle can be fixed.

[0015] Here, a buffer member may be disposed on one side of the first space or the second space.

[0016] Here, the sensor may be configured in the same shape as the substrate. Effect of the Invention

[0017] According to one embodiment of the present invention, a substrate is stably transported using upper and lower magnetic levitation rails. A substrate transfer apparatus may be provided. [Brief description of the drawings]

[0018] [Figure 1] 1 is a diagram illustrating a substrate transfer process using a substrate transfer apparatus according to an embodiment; [Diagram 2] 1 is a diagram illustrating a substrate transfer apparatus according to an embodiment; [Diagram 3] 13 is a view illustrating a substrate transfer apparatus according to another embodiment; [Figure 4] 13 is a view illustrating a substrate transfer apparatus according to another embodiment; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] The embodiments described in this specification are merely illustrative of the principles of the present invention and are not intended to be limiting. The present invention is not limited to the embodiments described herein, but may be modified in any manner to suit the particular requirements of the present invention. The present invention is not limited to the above embodiment, and the scope of the present invention includes modifications and variations that do not depart from the spirit of the present invention. It must be analyzed to include examples.

[0020] The terms used in this specification are those currently in common use and may be used in light of their function in the present invention. General terms have been selected, but these terms will be understood by those of ordinary skill in the art to which the present invention pertains. This may change due to changes in the figures, legal precedents, or the emergence of new technology. In the case where a specific term is defined and used in any way, the meaning of that term shall be determined separately. Therefore, the terms used in this specification are not simply names of terms, but are used in accordance with their usage. The terms must be defined based on their substantial meaning and the overall content of this specification. stomach.

[0021] The drawings attached to this specification are for the purpose of easily explaining the present invention. The shapes shown are exaggerated as necessary to facilitate understanding of the invention. Therefore, the present invention is not limited to the drawings.

[0022] In the present specification, the detailed description of the known configurations or functions related to the present invention is not included in the scope of the present invention. If it is determined that the purpose of the present application may be obscured, detailed explanations regarding the same will be omitted as necessary. do.

[0023] FIG. 1 is a diagram illustrating a substrate transfer process using a substrate transfer apparatus according to an embodiment. be.

[0024] Referring to FIG. 1, a substrate transfer apparatus 100 according to an embodiment includes a plurality of processing chambers. bars 112-138, a moving plate 140, magnetic levitation rails 142-148, The arm 152, 154 and at least one of a plurality of shuttles 162, 164 It is possible.

[0025] The first shuttle 162 and / or the second shuttle 164 are each attached to the magnetic levitation rails 142 to 144. 48 to transport the substrate (hereinafter, the first shuttle 162 is referred to as the Specifically, the first shuttle 162 is connected to the plurality of processing chambers 112 to A substrate is obtained from any one of the chambers 138, and the obtained substrate is placed on a magnetic levitation rack. The substrate can then be transferred along the rails 142 to 146 by the multiple arms 15. 2, 154 to the load lock chamber 170 by at least one arm. It can be done.

[0026] The magnetic levitation rails 142-148 may include multiple regions. The upper rails 142 to 148 are disposed along one side edge of the moving plate 140 in the vertical direction. The first rail area 142 and / or the moving plate 140 are disposed vertically on the other side edge of the one surface of the moving plate 140. The second rail region 146 may be disposed along the first direction.

[0027] The magnetic levitation rails 142-148 connect the first rail section 142 and the second rail section 146. The third rail region 144 and / or the fourth rail region 148 may be configured to couple the In this case, the third rail region 144 and / or the fourth rail region 148 may be the same as that shown in FIG. As shown, they can be arranged along the lateral direction of the moving plate 140.

[0028] Meanwhile, the magnetic levitation rails 142-148 are moving while the multiple shuttles 162, 164 are moving. In order to prevent the shuttles 162 and 164 from colliding with each other, The shuttle may include a parking area. Thus, the parking area may be a magnetic It may be included in a specific area among the air floating rails 142 to 148. Thus, the areas for stopping are determined based on the direction of travel and / or the positions of the multiple shuttles 162, 164. Based on this, a portion of the magnetic levitation rails 142 to 148 may be selected.

[0029] Additionally or alternatively, the magnetic levitation rails 142-148 may include a plurality of shuttles 162, 64, any one of the shuttles is moved to one side edge of the moving plate 140 (i.e., the first rail region 142) to the other side edge of the moving plate 140 (i.e., the second rail area 146). The rail section 140 may also include a third rail region 144 and / or a fourth rail region 148 for supporting the first and second rails.

[0030] The plurality of shuttles 162, 164 includes a first shuttle 162 and / or a second shuttle 164. FIG. 1 shows that the plurality of shuttles 162, 164 may include two shuttles. For example, the plurality of shuttles 162, 164 may include three or more The upper shuttle may be included.

[0031] Each of the multiple shuttles 162, 164 can accommodate one or more substrates. For example, any of the shuttles 162, 164 may serve multiple processing chambers. -112 to 138 must be processed in one of the processing chambers The substrate to be processed that is not included in the processing chamber is placed in the processing chamber and transferred to one of the processing chambers. For example, any shuttle can be processed in any one of the processing chambers. The assembled substrate can then be loaded and transferred to the load lock chamber 170.

[0032] The second shuttle 164 has a path that includes one area among the magnetic levitation rails 142 to 148. As provided to shuttle 162, predetermined positions are provided within magnetic levitation rails 142-148. In this case, the shuttles 162, 164 can stop in other areas. A shuttle that stops in a region is determined to be a shuttle that is relatively close to other regions. This can be done.

[0033] Specifically, the first shuttle 162 is moving upward along the first rail region 142, The second shuttle 164 is moving downward along the first rail region 142. The second shuttle 164 is located relatively close to the fourth rail area 148 set in the area. It can move into the fourth rail area 148 and stop there.

[0034] Therefore, the first shuttle 162 continues to move along the first rail region 142. However, the area where the second shuttle 164 stops is limited to the fourth rail area 148. For example, the first shuttle 162 must be provided with a route that includes another area. In this case, the second shuttle 164 may stop in another area.

[0035] On the other hand, FIG. 1 shows an example in which multiple shuttles 162, 164 move along the same rail area. For example, the first shuttle 162 is located in the third rail region 14 4, the second shaft is moving from the first rail area 142 to the second rail area 146. Torx 164 travels from the second rail region 146 to the first rail region 146 via the third rail region 144. It may be moving to 142.

[0036] In this case, the first shuttle 162 located relatively close to the fourth rail region 148 is the fourth It can move to the second rail area 146 via the rail area 148. The second shuttle 164 moves to the first rail area 142 via the third rail area 144. In other words, the multiple shuttles 162, 164 may be moved in different directions so as not to collide with each other. / or the stopping position can be controlled.

[0037] In this case, the shuttles 162 and 164 are moved in such a way that the total moving direction of the shuttles 162 and 164 is minimized. The direction of travel and / or stopping position of each of the vehicles 162, 164 can be determined. With such a configuration, the substrate transfer apparatus 100 can efficiently transfer the substrate to the multiple shuttles 162, 164. Providing traffic flow improves throughput and saves energy. The consumption can be reduced.

[0038] In the following, reference will be made to FIGS. 2 to 4 for the magnetic levitation rail and shuttle of the substrate transfer device. This will be explained in detail.

[0039] FIG. 2 is a view illustrating a substrate transfer device according to an embodiment.

[0040] Referring to FIG. 2, the substrate transfer device according to the embodiment includes an upper magnetic levitation rail 210, a lower The moving plate may include an upper magnetic levitation rail 220, and a shuttle 300. It may include an air levitation rail 210 and a lower magnetic levitation rail 220 .

[0041] An upper magnetic levitation rail 210 may be disposed on one side 201 of the moving plate. Also, a lower magnetic levitation rail 220 may be disposed on the other side 202 of the moving plate. At this time, the upper magnetic levitation rail 210 and the lower magnetic levitation rail 220 face each other. The devices can be arranged to respond to the above-mentioned demands.

[0042] In the prior art, the shuttle 300 has a lower magnetic levitation rail 2 disposed at the bottom for substrate transfer. However, the shuttle was moved on the lower magnetic levitation rail 220. When the shuttle departs or stops, or when the robot arm removes a substrate from the shuttle, there are minute vibrations. The substrate transfer device of the present invention is different from the conventional one in that it has an upper magnetic levitation rail. By including 210, it is possible to prevent the occurrence of minute vibrations. The present invention uses not only the lower magnetic levitation rail 220 but also the upper magnetic levitation rail 210. Solving the problems of the past by magnetically levitating the shuttle 300 from the top and bottom of the shuttle 300 can be done.

[0043] The upper magnetic levitation rail 210 and the lower magnetic levitation rail 220 may include a plurality of electromagnets. At this time, as shown in FIG. 2, the electromagnets included in the upper magnetic levitation rail 210 and the lower magnetic levitation rail 220 are The electromagnets included in the upper rail 220 may be arranged to correspond one-to-one to each other. However, the present invention is not limited to this and may be arranged alternately with each other.

[0044] The shuttle 300 can be configured to accommodate a substrate therein. The magnetic pole is disposed between the upper rail 210 and the lower magnetic levitation rail 220 and moves on the moving plate. The shuttle 300 moves on the moving plate to Transferring a substrate to the processing chamber or transferring a processed substrate to the processing chamber It can be done.

[0045] The shuttle 300 includes a first space 3 configured to accommodate at least one substrate. In this case, the first space 310 and the second space 320 may be included. The first space 310 and the second space 320 may be separated from each other. The boundaries can be set differently. For example, the first space 310 is set to a vacuum state. The second space 320 can be set to a non-vacuum state. The environments such as temperature and / or humidity of the first space 310 and the second space 320 can be set differently. Cut.

[0046] The first space 310 and the second space 320 may be arranged along one axis. For example, As shown in FIG. 2, the first space 310 and the second space 320 are disposed on one surface 201 or the other surface 202 of the moving plate. 02. In this case, the first space 310 may be arranged along an axis perpendicular to the second space 310. In this case, the shuttle 300 can be moved by the moving plate. Since it occupies a small lateral area, it can be efficient on the moving side.

[0047] Alternatively, the first space 310 and the second space 320 are connected to one surface 201 and the other surface 202 of the moving plate. The first space 31 may be arranged along an axis that is parallel to the first space 31 in FIG. The first space 300 and the second space 320 may be arranged side by side. The distance between the first surface 201 and the second surface 202 is shortened, so that the vertical area occupied by the moving plate is small. It can become.

[0048] The first space 310 and the second space 320 may accommodate different types of substrates. Generally, the first space 310 accommodates a substrate to be processed in the processing chamber, and the second space 3 20 can accommodate the substrate processed in the processing chamber. The space 310 may be located below the second space 320. Since smoke is generated on the surface of the plate, the treated surface of the surrounding untreated substrates (substrates to be treated) is not damaged. In order to prevent this, the space for accommodating the processed substrate is located above the space for accommodating the substrate to be processed. However, the shuttle 300 can be placed in a processing chamber. Since the boards before and after processing are stored separately by member, confusion about the boards before and after processing is eliminated. It can be prevented.

[0049] In addition, the first space 310 and the second space 320 of the shuttle 300 are separated from each other. Thus, it is possible to provide an optimized environment for each pre-processing / post-processing substrate. The first space 310 contains the substrate before processing under vacuum conditions, and the second space 320 contains the substrate after processing under non-vacuum conditions. By storing substrates in a single container, the shuttle 300 provides an optimized environment for each substrate. can be done.

[0050] The shuttle 300 is a first permanent magnet arranged to face the upper magnetic levitation rail 210. 330 and a second permanent magnet 340 arranged to face the lower magnetic levitation rail 220. For example, the first permanent magnet 330 may be disposed on the top of the shuttle 300 as shown in FIG. The second permanent magnet 340 may be disposed at the bottom of the shuttle 300. In addition, in FIG. 2, two permanent magnets are arranged on the top and bottom of the shuttle 300. However, the number of permanent magnets is not limited to this, and may be one, three, or four. etc., and the number of permanent magnets disposed at the top and bottom can also be different.

[0051] The first permanent magnet 330 and the second permanent magnet 340 are respectively attached to the upper magnetic levitation rail 210 and the lower magnetic levitation rail 220. The shuttle 300 is magnetically levitated by the attractive or repulsive force between the magnetic levitation rail 220 and the electromagnet. The shuttle 300 uses a first permanent magnet 330 and a second permanent magnet 340. can move between the upper magnetic levitation rail 210 and the lower magnetic levitation rail 220. .

[0052] The shuttle 300 includes a support 350 capable of supporting a substrate housed therein. Specifically, the first space 310 and / or the second space 320 of the shuttle 300 may be a base space. The substrate may include a support 350 configured to support the plate. The support 350 is disposed on the substrate 300 and can be moved via the shuttle 300. It can support a substrate, a processed substrate, a dummy substrate, or a sensor in the shape of a substrate. In this case, the dummy board refers to a test board used to evaluate the stability, performance, etc. of the entire device. It could be that.

[0053] According to an embodiment, a friction member may be disposed on one surface of the support 350. In particular, a friction member is disposed on one of the surfaces of the support 350 that contacts the rear surface of the substrate. At this time, the friction member is supported by the minute vibration of the shuttle 300. The friction material can contain a material with a high coefficient of friction to prevent the device from shaking. For example, the friction material can be neoprene. Examples of suitable materials include, but are not limited to, polyester or rubber.

[0054] Shuttle 300 may include at least one or more sensors (not shown) therein. Specifically, the first space 310 and / or the second space 320 of the shuttle 300 may have an internal environment. The sensor may be a temperature sensor, a humidity sensor, or the like. sensors, but are not limited to, sensors, vibration sensors, weight sensors, or gradient sensors. .

[0055] For example, the first space 310 or the second space 320 can measure the weight of the substrate or the slope of the substrate. In addition, for example, the first space 310 or the second space 32 may include a sensor that can 0 allows you to check whether the temperature / humidity or vacuum state of each space is set appropriately. In this case, the sensor may have the same shape as the substrate, but This is not limited to the above.

[0056] The sensor detects not only the internal environment of the shuttle 300 but also the overall environmental information of the substrate transfer device. Specifically, the shuttle 300 can sense the temperature of the processing chamber. Once inside the processing chamber, the sensor can sense the environmental information inside the processing chamber. Also, when the shuttle 300 enters the load lock chamber, the sensor In this way, the substrate transfer device can sense the environmental information in the chamber. The sensors of the shuttle 300 can be used to sense environmental information within the device.

[0057] FIG. 3 is a view illustrating a substrate transfer apparatus according to another embodiment.

[0058] Referring to FIG. 3, a shuttle 300 of a substrate transfer apparatus according to another embodiment of the present invention may be additionally provided. The shuttle 300 may include a bumper 360. Specifically, the shuttle 300 is configured to bump the substrate 302 when the substrate 302 slides. The board is provided with a shock absorbing member 360 that can absorb shocks to protect the board from vibrations. It can include.

[0059] The buffer member 360 may be disposed on one side of the first space 310 or the second space 320. For example, as shown in FIG. 3, the buffer member 360 is supported on the side surface of the first space 310 or the second space 320. The support 350 may be disposed adjacent to the support 350, but is not limited thereto.

[0060] The cushioning member 360 may include a material capable of absorbing shock. The member 360 is made of a material such as polyurethane, polycarbonate, polypropylene, polyethylene, etc. It is made of a suitable polymer resin, or is made of rubber, urethane-based material, or acrylic-based material. The material may include, but is not limited to, elastic materials such as foamed sponge.

[0061] FIG. 4 is a view illustrating a substrate transfer apparatus according to another embodiment.

[0062] Referring to FIG. 4, a substrate transfer device according to another embodiment further includes a fixing pin 230. Specifically, the moving plate includes a fixing member for fixing the position of the shuttle 300. For example, the fixed pin 230 may be attached to the upper magnetic levitation lever as shown in FIG. The magnets may be disposed between the electromagnets included in the lower magnetic levitation rail 210 or the lower magnetic levitation rail 220. However, the present invention is not limited to this.

[0063] The fixing pin 230 may be protruded or not protruded by the control unit of the substrate transfer device. Specifically, the fixed pin 230 is not protruded when the shuttle 300 moves, but is When the torque 300 stops, the fixing pin 230 can be controlled to be protruded. The shuttle 300 is penetrated by contacting the shuttle 300 or penetrating one side of the shuttle 300. The present invention uses the fixing pin 230 to fix the position of the shaft 300. By fixing the position of the torque 300, the robot arm can pick up the substrate from the shuttle. This prevents minute vibrations from occurring when the board is taken out or put into the shuttle. Cut.

[0064] The method according to the embodiment may be implemented by a program that can be implemented by various computer means. The program may be implemented in the form of a program instruction and recorded on a computer-readable medium. The computer-readable recording medium may contain program instructions, data files, data structures, etc. The computer-readable recording medium may include the above-mentioned components alone or in combination. The program instructions are either specially designed or constructed for the implementation, or or may be known and available to those skilled in the art of computer software. Examples of computer-readable recording media include hard disks, floppy disks, etc. magnetic media such as magnetic tapes, optical recording media such as CD-ROMs and DVDs, Magnetic-optical media such as floppy disks o-optical media), and ROM, RAM, Flash memory, etc. It includes a hardware device specially configured to store and execute program instructions. An example of a program instruction is machine code, such as that produced by a compiler. In addition, high-level programs that can be executed by a computer using an interpreter, etc. The hardware device may include one or more processors for performing the operations of the embodiment. can be configured to operate as a software module of the be.

[0065] Although the embodiment has been described above with reference to a limited embodiment and drawings, Those skilled in the art will appreciate that numerous modifications and variations are possible from the above description. For example, the techniques described may be performed in a different order than described and / or It is understood that the components of the described systems, structures, devices, circuits, etc. may be combined in ways other than as described. Even if combined or substituted with other elements or equivalents. Suitable results can be achieved.

[0066] Accordingly, other implementations, embodiments, and equivalents within the scope of the following claims are also contemplated. The present invention falls within the scope of the claims. [Explanation of symbols]

[0067] 210 Upper magnetic levitation rail 220 Lower magnetic levitation rail 300 Shuttle

Claims

1. a moving plate including magnetic levitation rails; a plurality of processing chambers disposed adjacent to the moving plate for processing substrates; a plurality of shuttles that move on the moving plate using the magnetic levitation rails and transport substrates from one of the plurality of processing chambers to another of the plurality of processing chambers. Substrate transfer device.

2. the plurality of processing chambers includes a first processing chamber group adjacent to one end of the moving plate and a second processing chamber group adjacent to the other end of the moving plate; The magnetic levitation rail includes a first rail region adjacent the first group of processing chambers and a second rail region adjacent the second group of processing chambers. The substrate transfer apparatus of claim 1 .

3. The magnetic levitation rail further includes a third rail region connecting the first rail region and the second rail region. The substrate transfer apparatus of claim 2 .

4. the plurality of shuttles includes a first shuttle and a second shuttle; The first shuttle stops in another area of ​​the magnetic levitation rail so as not to interfere with a first path (the first path includes one area of ​​the magnetic levitation rail) which is a moving path of the first shuttle. The substrate transfer apparatus of claim 1 .

5. the plurality of shuttles includes a first shuttle and a second shuttle; When the path of the first shuttle and the path of the second shuttle overlap in a first area, the second shuttle stops in a second area of ​​a third rail adjacent to the first area. The substrate transfer apparatus of claim 3 .

6. The second shuttle, which has stopped in the second area, moves to the first area from the second area after the first shuttle has passed through the first area. The substrate transfer apparatus of claim 5 .

7. a load lock chamber disposed adjacent to the moving plate; the plurality of shuttles includes a first shuttle; The first shuttle is parked in a predetermined area within the magnetic levitation rail while the substrate is transferred between the first shuttle and the load lock chamber. The substrate transfer apparatus of claim 1 .

8. The moving plate includes an arm configured to transport the substrate between the processing chambers or the shuttles. The substrate transfer apparatus of claim 2 .

9. The arm is disposed between the first rail area and the second rail area. The substrate transfer apparatus of claim 8 .

10. the magnetic levitation rail includes a third rail section connecting the first rail section and the second rail section, The arm is surrounded by the first rail area, the second rail area, and the third rail area. The substrate transfer apparatus of claim 8 .

Images