Electronic device and heat sink

Abstract

The embodiments of the present application relate to the technical field of electronic devices. Disclosed are an electronic device and a heat sink, which are used for solving the technical problem in the prior art of heat sinks having a single function. The electronic device comprises a circuit board and a heat sink. The circuit board comprises a feed portion and a grounding portion, and the heat sink and the circuit board are stacked. The heat sink comprises a first portion, a second portion and a connection site, wherein the second portion is located on the edge of the heat sink, and the vertical projection of the second portion on the circuit board has a long side L and a short side S, with L＞S; the connection site is arranged on at least one of the long side L and the short side S; the second portion is connected to the first portion by means of the connection site; and both the feed portion and the grounding portion are electrically connected to the second portion. In this way, the heat dissipation function and the antenna radiation function can be integrated on the heat sink, thereby enriching the functions of the heat sink, without influencing the heat dissipation function of the first portion of the heat sink for the electronic device.

Description

Electronic device and radiator

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on August 9, 2023, with application number 202322139221.4 and application name “An electronic device and radiator”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of electronic equipment, and in particular to an electronic device and a radiator. Background Art

[0003] As users' demands for electronic device performance continue to increase, the power consumption of the electronic components within these devices is also increasing accordingly. This in turn places higher demands on the heat dissipation capabilities of these electronic devices. Currently, to improve the heat dissipation performance of electronic devices, a common practice is to design radiators with larger heat dissipation dimensions so that they can cover all heat sources within the device. However, radiators within electronic devices only serve a single function: dissipating heat.

[0004] Summary of the Invention

[0005] The embodiments of the present application provide an electronic device and a radiator, which are used to solve the technical problem of single radiator function in the prior art.

[0006] To achieve the above objectives, this application adopts the following technical solutions:

[0007] According to a first aspect of an embodiment of the present application, an electronic device is provided, comprising a circuit board and a heat sink. The circuit board comprises a power feed portion and a ground portion, and the heat sink is stacked with the circuit board. The heat sink comprises a first portion, a second portion, and a connection point, wherein the second portion is located at the edge of the heat sink, and the vertical projection of the second portion on the circuit board has a long side L and a short side S, where L>S. The connection point is provided at at least one of the long side L and the short side S, the second portion is connected to the first portion via the connection point, and the power feed portion and the ground portion are electrically connected to the second portion, respectively.

[0008] As can be seen from the above, the heat sink and the circuit board are stacked so that the heat source on the circuit board can radiate heat outward through the heat sink to dissipate heat. The heat sink includes a first part and a second part, and the vertical projection of the second part on the circuit board has a long side L and a short side S, where L>S, so that the second part of the heat sink can serve as the radiating structure of the antenna. At the same time, the second part of the heat sink is connected to the first part through a connection point, which ensures that the second part can be set independently relative to the first part and that the second part can be connected to the first part. At this time, when the feeding part and the grounding part on the circuit board are respectively electrically connected to the second part, the feeding part can provide a feeding current to the second part of the heat sink, and the grounding part can serve as a reference ground for the second part, so that a current return path can be formed between the second part of the heat sink and the circuit board. As a result, the second part can serve as an antenna for the electronic device to transmit or receive electromagnetic wave signals. In this way, the heat dissipation function and the antenna radiation function are integrated into the heat sink, which not only enriches the function of the heat sink and improves the utilization rate of the heat sink, but also the second part is arranged at the edge of the heat sink, which does not affect the heat dissipation function of the first part of the heat sink for the electronic device.

[0009] In some embodiments, the first portion includes a notched edge, which is arranged opposite to the long side L of the second portion. The connection point is set at the short side S of the second portion, and the second portion is connected to the first portion through the connection point of the short side S, forming a through gap between the long side L of the second portion and the notched edge of the first portion. As a result, the long side L of the second portion of the radiator can be isolated from the notched edge of the first portion to form a through gap. At the same time, the short side S of the second portion of the radiator is connected to the first portion. Since L>S, the feeding current can be prevented from flowing away from the longer long side L, and the excitation current cannot be formed. Therefore, the short side S will not have a significant impact on the feeding current of the second portion, and the second portion of the radiator can function as an antenna.

[0010] In some embodiments, the radiator includes a base plate and heat dissipation teeth connected to each other, the base plate and the circuit board are stacked, and a plurality of heat dissipation teeth are arranged side by side and perpendicular to the base plate. A through-slit is opened on the base plate and is located between two adjacent heat dissipation teeth at the edge of the base plate; among the two adjacent heat dissipation teeth at the edge of the base plate, the heat dissipation tooth closer to the edge of the base plate forms a second part at the through-slit position. As a result, the existing radiator in the electronic device can be directly utilized. By opening a through-slit in the base plate between the adjacent heat dissipation teeth at the edge of the radiator, the heat dissipation tooth located on the outermost side of the edge of the base plate can form a second part at the through-slit position, so that the radiator can be used as an antenna. At the same time, this method only requires cutting out the existing radiator in the electronic device to realize the function of the antenna, and there is no need to set up an additional antenna separately, thereby saving the cost of the electronic device.

[0011] In some embodiments, the heat sink includes a heat dissipation plate, which is stacked with a circuit board. The first portion and the second portion are disposed on the heat dissipation plate, and the second portion and the through-slit are disposed at the edge of the heat dissipation plate. Similarly, an existing heat dissipation plate in an electronic device can be directly utilized. By providing a through-slit at the edge of the heat dissipation plate, the edge of the heat dissipation plate forms the second portion, which can be used as an antenna. This also achieves antenna functionality while reducing the cost of the electronic device.

[0012] In some embodiments, the first part includes a notched edge, which is arranged opposite to the long side L of the second part. The connection point is set on the long side L of the second part, and the second part is connected to the first part through the connection point of the long side L, forming a gap between the long side L of the second part and the notched edge of the first part. The contact area between the connection point and the second part is smaller than the cross-sectional area of ​​the second part, and the cross-sectional area is perpendicular to the direction of the long side L. In this way, the long side L of the second part can also be isolated from the notched edge of the first part, and because the contact area between the connection point and the second part is smaller than the cross-sectional area of ​​the second part, the connection point will not have a significant impact on the feeding current of the second part, and the second part of the radiator can function as an antenna.

[0013] In some embodiments, the first portion includes a notched edge that intersects with the long side L of the second portion. A connection point is provided on the short side S of the second portion, and the second portion is connected to the first portion via the connection point on the short side S, forming a gap between the long side L of the second portion and the notched edge of the first portion. This also isolates the long side L of the second portion from the notched edge of the first portion. At the same time, the short side S of the second portion of the radiator is connected to the first portion. Since L>S, this does not significantly affect the feed current of the second portion, enabling the second portion of the radiator to function as an antenna.

[0014] In some embodiments, the ratio L / S of the long side L of the second portion to the short side S of the second portion is greater than 4. Therefore, when the ratio L / S of the long side L of the second portion to the short side S of the second portion is greater than 4, the second portion of the heat sink can be formed into a long strip structure, which is more conducive to adjusting the resonant frequency, standing wave characteristics, and other antenna performance parameters when the second portion of the heat sink is used as a radiating structure, thereby improving the performance of the antenna when transmitting or receiving electromagnetic waves.

[0015] In some embodiments, the electronic device further includes a grounding member. The grounding member is connected between the grounding portion and the first part, and the grounding member is close to the connection point, and the first part and the second part are also electrically connected through the connection point. Since the second part is located at the edge of the radiator, it is not conducive to the installation of the grounding member. Therefore, the grounding member can be connected between the grounding portion of the circuit board and the first part of the radiator. Since the second part of the radiator is connected to the first part through the grounding point, and the grounding member is close to the connection point, the feed current flowing through the second part of the radiator can flow into the grounding portion on the circuit board through the connection point and the grounding member, thereby realizing the function of electrically connecting the grounding portion and the second part.

[0016] In some embodiments, the grounding member includes a connecting screw that connects between the circuit board and the heat sink. This allows the existing connecting screws of the electronic device to be used as the grounding member for the second portion of the heat sink. Simply position the connecting screw near the connection point between the first and second portions. This allows the connecting screw to not only connect the heat sink and the circuit board, but also electrically connect the grounding portion to the second portion.

[0017] In some embodiments, the electronic device further includes a feeder connected between the feed portion and the second portion. Thus, the feeder can be directly connected between the feed portion of the circuit board and the second portion of the heat sink, so that the feeder can directly provide a feed current to the second portion of the heat sink.

[0018] In some embodiments, along the long side L of the second portion, the second portion has a first end and a second end that are oppositely disposed. The first end is connected to the first portion, and the feeder is disposed between the grounding member and the second end. Thus, along the long side L of the second portion of the radiator, when the feeder is disposed at different positions between the grounding member and the second end, that is, when there are different spacings between the feeder and the grounding member, the performance parameters of the antenna, such as the resonant frequency and standing wave characteristics, of the second portion of the radiator as a radiating structure can be adjusted, thereby also improving the performance of the antenna when transmitting or receiving electromagnetic waves.

[0019] In some embodiments, the feed element includes a feed screw or a feed spring, which is connected between the circuit board and the heat sink. Thus, when the vertical projection area of ​​the second portion of the heat sink on the circuit board is large, the feed screw can be connected between the feed portion of the circuit board and the second portion of the heat sink. When the vertical projection area of ​​the second portion of the heat sink on the circuit board is small, the feed spring can be connected between the feed portion of the circuit board and the second portion of the heat sink.

[0020] In some embodiments, the long side L of the second portion is 1 / 4λ0, where λ0 is the wavelength corresponding to any frequency point in the operating frequency band of the second portion. Therefore, when the long side L of the second portion of the heat sink is 1 / 4λ0, when the second portion of the heat sink functions as an antenna, the conversion efficiency of transmitting and receiving electromagnetic wave signals at the corresponding frequency point in the operating frequency band is high.

[0021] In some embodiments, the radiator includes multiple second portions, and the long sides L of the multiple second portions intersect. Thus, the long sides L of the multiple second portions on the radiator intersect, allowing the long sides L of the second portions to be arranged in different directions. This allows the second portion of the radiator, when used as an antenna, to transmit or receive electromagnetic wave signals in different directions, thereby expanding the coverage range of the antenna's transmission or reception of electromagnetic wave signals and avoiding signal blind spots.

[0022] A second aspect of the embodiments of the present application provides a heat sink comprising a first portion, a second portion, and a connection point. The second portion is located at an edge of the heat sink, and a vertical projection of the second portion on a circuit board has a long side L and a short side S, where L>S. The connection point is provided at at least one of the long side L and the short side S, and the second portion is connected to the first portion via the connection point. This heat sink has the same technical effects as the heat sink in the electronic device of any embodiment of the first aspect described above, and will not be further described here. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] FIG1 is a schematic diagram of the three-dimensional structure of an electronic device provided in an embodiment of the present application;

[0024] FIG2 is a schematic diagram of the exploded structure of the electronic device in FIG1 ;

[0025] FIG3 is a schematic diagram of the three-dimensional structure of the circuit board in the electronic device in FIG2 ;

[0026] FIG4 is a schematic diagram of the three-dimensional structure of the radiator in the electronic device in FIG2 ;

[0027] FIG5 is a schematic diagram of the front view of the connection between the circuit board in FIG3 and the heat sink in FIG4;

[0028] FIG6 is a schematic diagram of the three-dimensional structure of a heat sink and a circuit board provided in an embodiment of the present application;

[0029] FIG7 is a schematic top view of the heat sink and circuit board in FIG6 ;

[0030] FIG8 is an enlarged structural diagram of the heat sink and circuit board at point A in FIG7 ;

[0031] FIG9 is a partial enlarged structural schematic diagram of the second part of the radiator in FIG6 ;

[0032] FIG10 is a structural diagram of an embodiment of the second part of the radiator in FIG7 ;

[0033] FIG11 is a second structural diagram of an embodiment of the second part of the radiator in FIG7 ;

[0034] FIG12 is a third structural diagram of an embodiment of the second part of the radiator in FIG7 ;

[0035] FIG13 is a first structural diagram of an embodiment of the second part when the heat sink in FIG7 is a heat dissipation flat plate;

[0036] FIG14 is a second structural diagram of an embodiment of the second part when the heat sink in FIG7 is a heat dissipation flat plate;

[0037] FIG15 is a third structural diagram of an embodiment of the second part when the heat sink in FIG7 is a heat dissipation flat plate;

[0038] FIG16 is a fourth structural diagram of an embodiment of the second part when the heat sink in FIG7 is a heat dissipation flat plate;

[0039] FIG17 is a fifth structural diagram of an embodiment of the second part when the radiator in FIG7 is a heat dissipation flat plate;

[0040] FIG18 is a schematic diagram of the radiation direction of the second portion of the radiator in FIG7 as an antenna in the XY plane;

[0041] FIG19 is a schematic diagram of the radiation direction of the second portion of the radiator in FIG7 as an antenna in the XZ plane;

[0042] FIG20 is a schematic diagram of radiation beams when the second portion of the radiator in FIG7 is used as an antenna at different frequencies;

[0043] FIG21 is a sixth structural diagram of an embodiment of the second part when the heat sink in FIG7 is a heat dissipation flat plate;

[0044] FIG22 is a current distribution diagram when the second portion of the radiator provided in an embodiment of the present application is used as an antenna;

[0045] FIG. 23 is a reflection coefficient curve S11 of the resonance point formed by the induced current in FIG. 22 .

[0046] Reference numerals:

[0047] 01-electronic device; 10-housing; 10a-top cover; 10b-base; 11-indicator light; 12-button; 20-antenna pole; 100-radiator; 101-heat dissipation plate; 110-bottom plate; 111-through seam; 112-broken seam; 113-notch; 120-heat dissipation tooth; 120a-first heat dissipation tooth; 120b-second heat dissipation tooth; 120c-opening; 121-first part; 1210-notch edge; 122-second part; 122a-first end; 122b-second end; 123-connection point; 200-circuit board; 210-substrate; 220-grounding part; 230-feeding part; 240-main collecting antenna; 250-chip; 300-feeding element; 310-feeding shrapnel; 400-grounding element; 410-connecting screw. DETAILED DESCRIPTION

[0048] In order to make the purpose, technical solutions and advantages of this application clearer, this application will be further described in detail below with reference to the accompanying drawings.

[0049] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified with "first," "second," etc., may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0050] In addition, in this application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they can change accordingly according to changes in the orientation of the components in the drawings.

[0051] The embodiment of the present application provides an electronic device 01. The electronic device 01 may be a gateway, a router, an optical modem, a server, a tablet computer, a mobile phone, an e-reader, a remote control, a personal computer (PC), a laptop computer, a personal digital assistant (PDA), an in-vehicle device, an Internet-connected television, a wearable device, a television, or the like. The embodiment of the present application does not impose any particular restrictions on the specific product type of the electronic device 01. Of course, different types of electronic devices 01 have different structures, functions, and usage scenarios. Depending on the different structures, functions, and usage scenarios of the electronic device 01, the electronic device 01 may have different appearances.

[0052] In order to better illustrate the contents of the embodiments of the present application, the following will take the above-mentioned electronic device 01 as an example of a gateway for detailed introduction. As shown in Figure 1, the electronic device 01 may include a housing 10 and an antenna pole 20 connected to each other, and the housing 10 may include an indicator light 11 and a button 12. Among them, the housing 10 may have a length direction, a width direction, and a height direction. For the convenience of explanation, the following embodiments will use the X direction as the length direction of the electronic device 01, the Y direction as the width direction of the electronic device 01, and the Z direction as the height direction of the electronic device 01. Taking the illustrated gateway as an example, the arrangement direction of the indicator light 11 can be used as the length direction of the gateway, the direction from the button 12 to the antenna pole 20 can be used as the width direction of the gateway, and the vertical direction of the antenna pole 20 can be used as the thickness direction of the gateway.

[0053] Based on this, as shown in FIG2 , the electronic device 01 may further include a heat sink 100 and a circuit board 200. The housing 10 may further include a top cover 10a and a base 10b. The base 10b may be a box-shaped structure with an opening at the top. The indicator light 11 may be provided on the top cover 10a, and the button 12 may be provided on the base 10b. The top cover 10a and the base 10b may be connected to form the housing 10 by screwing, riveting, or bonding. The housing 10 may have a cavity for accommodating the heat sink 100 and the circuit board 200, so that the heat sink 100 and the circuit board 200 may be installed in the housing 10. The antenna rod 20 may be electrically connected to the circuit board 200. The number of antenna rods 20 may be two or more. The embodiment of the present application does not impose any special restrictions on the number of antenna rods 20.

[0054] In some embodiments, as shown in FIG3 , the circuit board 200 may include a substrate 210, as well as electronic components such as a grounding portion 220, a feeding portion 230, a main antenna 240, and a chip 250 electrically connected to the substrate 210. For example, the substrate 210 may be a printed circuit board (PCB). The grounding portion 220 may be a metal sheet or metal plating disposed on the substrate 210, serving as a reference ground for the various electronic components. The feeding portion 230 may be a pad or feeding contact disposed on the substrate 210, serving to feed the main antenna 240 or the antenna rod 20 (shown in FIG2 ). The main antenna 240 may be an onboard antenna or a patch ceramic antenna disposed on the substrate 210, serving to transmit or receive electromagnetic wave signals. The chip 250 may be a central processing unit (CPU) or a graphics processing unit (GPU), etc. disposed on the substrate 210, serving to process data. The embodiment of the present application does not impose any particular limitation on the specific structures of the ground portion 220 , the feeding portion 230 , the main antenna 240 , and the chip 250 .

[0055] Of course, according to the different functional requirements of the circuit board 200, more types of electronic devices can be electrically connected to the substrate 210. The embodiment of the present application does not impose any special restrictions on the specific types of electronic devices on the substrate 210. In addition, according to the different shapes of the shell 10 and the size of the cavity in the shell 10, the circuit board 200 can also be set to different shapes such as rectangular, circular, U-shaped, T-shaped or other special shapes. The embodiment of the present application does not impose any special restrictions on the specific shape of the circuit board 200. In addition, according to the different structures and shapes of the electronic device 01, the electronic device 01 can be installed on a desktop, on a wall, or on the ground. The embodiment of the present application does not impose any special restrictions on the installation position of the electronic device 01.

[0056] On this basis, as shown in Figure 4, the radiator 100 may include a base plate 110 and heat dissipation teeth 120 connected to each other. For example, the base plate 110 may be a flat structure, the heat dissipation teeth 120 may be a sheet structure, and the plane where the heat dissipation teeth 120 are located may be perpendicular to the base plate 110. According to different heat dissipation requirements, the base plate 110 may be set to different shapes and sizes in the XY plane, and the heat dissipation teeth 120 may be set to different shapes and sizes in the XZ plane. In addition, the number of heat dissipation teeth 120 may be set to multiple, and the multiple heat dissipation teeth 120 may be parallel to each other and arranged side by side on the base plate 110. Among them, the heat dissipation teeth 120 may be arranged side by side along the Y direction, or may be arranged side by side along the X direction. The embodiment of the present application does not impose any special restrictions on the arrangement direction of the heat dissipation teeth 120.

[0057] In this way, as shown in Figure 5, the bottom plate 110 of the radiator 100 can be stacked with the substrate 210 of the circuit board 200. The heat dissipation teeth 120 can be located on the side of the bottom plate 110 facing away from the circuit board 200, and the side of the bottom plate 110 facing the circuit board 200 can be in contact with electronic devices such as the chip 250. When the chip 250 generates heat during operation, the heat can flow to the bottom plate 110 and the heat dissipation teeth 120, and finally dissipated through the bottom plate 110 and the heat dissipation teeth 120 to prevent the electronic devices from burning out. Of course, the radiator 100 can also be set as a heat dissipation plate, a heat dissipation pipe or a heat dissipation block and other structures. The embodiment of the present application does not impose any special restrictions on the specific structure of the radiator 100.

[0058] The above embodiment describes the specific structure of electronic device 01 using a gateway as an example. Other electronic devices 01 may also have a similar structure. Specifically, a heat sink 100 and a circuit board 200 may be provided within electronic device 01, and the heat sink 100 may be stacked with the circuit board 200 to dissipate heat from the electronic components on the circuit board 200. To improve the wireless local area network (WiFi) coverage of the gateway and enhance the user experience, this embodiment of the application further provides a heat sink 100. The specific structure of the heat sink 100 will be described in detail below.

[0059] In some embodiments, as shown in FIG6 , the base plate 110 of the heat sink 100 can be configured to have different sizes and shapes based on the different locations of the electronic components on the circuit board 200 to cover the areas on the circuit board 200 where the electronic components need to dissipate heat. For example, when the multiple electronic components on the circuit board 200 are arranged in a rectangular shape, the base plate 110 can be configured to have a rectangular plate structure. The heat dissipation teeth 120 of the heat sink 100 can be arranged along the X direction, and multiple heat dissipation teeth 120 can be arranged along the Y direction. In addition, the heat dissipation teeth 120 can also be set to different heights along the Z direction based on the different amounts of heat dissipation required by different electronic components on the circuit board 200.

[0060] As shown in FIG6 , along the Y direction, the heat dissipation teeth 120 may include a first heat dissipation tooth 120a and a second heat dissipation tooth 120b located at the edge of the radiator 100, the first heat dissipation tooth 120a being located at the outermost side of the edge of the radiator 100, and the second heat dissipation tooth 120b being located on the inner side of the first heat dissipation tooth 120a. Along the X direction, depending on the heat dissipation requirements, the lengths of the first heat dissipation tooth 120a and the second heat dissipation tooth 120b may be the same or different. In the figure, the length of the second heat dissipation tooth 120b is greater than the length of the first heat dissipation tooth 120a. Along the Z direction, for locations with lower heat dissipation requirements, an opening 120c may be provided on the heat dissipation tooth 120 to reduce the weight of the radiator 100. Of course, the same heat dissipation tooth 120 may also be set to different heights along the Z direction.

[0061] For ease of description, in the drawings of the following embodiments, hollow components such as openings, hollow areas, slots, holes, and apertures are marked with arrowed lines, while other components are marked with arrow-less lines. For example, the opening 120c on the heat dissipation tooth 120 is marked with a line, which will not be further described below.

[0062] Based on the above embodiment, as shown in FIG7 , the heat sink 100 may include a first portion 121, a second portion 122, and a connection point 123, and a through-slit 111 may be provided between the first portion 121 and the second portion 122. That is, the heat sink 100 may be divided into the first portion 121 and the second portion 122 by providing the through-slit 111. Specifically, as shown in FIG8 , the first portion 121 may include a notched edge 1210, which may be disposed opposite the long side L of the second portion 122, thereby forming the through-slit 111 between the notched edge 1210 of the first portion 121 and the long side L of the second portion 122. The through-slit 111 may be provided on the bottom plate 110 between the first heat dissipation tooth 120a and the second heat dissipation tooth 120b, and the through-slit 111 may be provided along the X-direction at the edge of the bottom plate 110. Thus, the portion of the first heat dissipation tooth 120a located at the through-slit 111 can serve as the second portion 122 of the heat sink 100, the rest of the heat sink 100 can serve as the first portion 121, and the second portion 122 is located at the edge of the heat sink 100. The location where the first portion 121 and the second portion 122 connect is a connection point 123 (the portion indicated by the dotted box in the figure).

[0063] In this way, as shown in FIG8 , the second portion 122 of the heat sink 100 (shown in FIG7 ) can have a long side L along the X direction and a short side S along the Y direction in the vertical projection direction of the circuit board 200 (i.e., in the XY plane). The length of the long side L of the second portion 122 is greater than the length of the short side S, i.e., L>S. As a result, the second portion 122 of the heat sink 100 can serve as the radiating structure of the antenna. The connection point 123 is provided on the short side S on one side of the second portion 122, so that the second portion 122 can be connected to the first portion 121 (shown in FIG7 ) through the connection point 123. This ensures that the long side L of the second portion 122 can be isolated from the first portion 121 by the through-slit 111, while also ensuring that the second portion 122 can be connected to the first portion 121. Moreover, the short side S of the second part 122 of the radiator 100 is connected to the first part 121. Since L>S, the short side S will not have a significant impact on the antenna performance of the second part 122, thereby realizing the function of the second part 122 of the radiator 100 as an antenna.

[0064] Of course, the ratio of the long side L to the short side S of the second portion 122 of the radiator 100 can also be set to L / S>4, which can form the second portion 122 of the radiator 100 into a long strip-shaped structure. This is more conducive to adjusting antenna performance parameters such as the resonant frequency and standing wave characteristics when the second portion 122 of the radiator 100 functions as a radiating structure, thereby improving the antenna's performance when transmitting or receiving electromagnetic waves. In addition, the long side L of the second portion 122 can also be set to 1 / 4λ0, where λ0 is the wavelength corresponding to any frequency point in the operating frequency band of the second portion 122. When the second portion 122 of the radiator 100 functions as an antenna, the antenna can achieve higher conversion efficiency for transmitting and receiving electromagnetic wave signals at the corresponding frequency point in the operating frequency band. Depending on different antenna performance, different ratios of the long side L to the short side S of the second portion 122 can be set, and different lengths of the long side L of the second portion 122 can also be set. The embodiments of the present application do not impose any specific restrictions on the length of the long side L of the second portion 122 or the ratio of the long side L to the short side S. Taking into account the existence of parasitic capacitance and parasitic inductance, the long side L of the second portion 122 may also be set to a length slightly less than 1 / 4λ0, so that the antenna can resonate better.

[0065] In order to realize the antenna function of the second part 122 of the radiator 100, as shown in Figure 8, for example, the electronic device 01 may further include a feeder 300 and a grounding member 400. The feeder 300 can be connected between the feeder portion 230 (shown in Figure 3) of the circuit board 200 and the second part 122 of the radiator 100 to provide a feeding current for the second part 122 of the radiator 100. The grounding member 400 can be connected between the grounding portion 220 (shown in Figure 3) of the circuit board 200 and the first part 121 (shown in Figure 7) of the radiator 100, and the grounding member 400 is arranged at a position close to the connection point 123. Considering that the second part 122 is located at the edge of the radiator 100, there may be a problem that the second part 122 is small in size, resulting in insufficient installation space for the grounding member 400. Therefore, the grounding member 400 can be connected between the grounding portion 220 of the circuit board 200 and the first part 121 of the radiator 100. In this way, the feeding current flowing through the second portion 122 can flow into the ground portion 220 through the connection point 123 and the grounding member 400 , thereby achieving the function of electrically connecting the ground portion 220 and the second portion 122 .

[0066] Among them, as shown in Figure 9, the feeding element 300 (shown in Figure 8) may include a feeding spring 310, and the feeding spring 310 may be connected between the circuit board 200 and the radiator 100 by welding, screwing or riveting. The embodiment of the present application does not impose any special restrictions on the connection method of the feeding spring 310. Since the vertical projection area of ​​the second part 122 of the radiator 100 on the circuit board 200 is small, the feeding spring 310 with a smaller end face can ensure the connection effect. When the vertical projection area of ​​the second part 122 of the radiator 100 on the circuit board 200 is large, a feeding screw can also be selected to connect between the circuit board 200 and the radiator 100. The embodiment of the present application does not impose any special restrictions on the specific structure of the feeding element 300.

[0067] Similarly, as shown in Figure 9, the grounding member 400 (shown in Figure 8) can include the original connecting screw 410 of the electronic device 01, and the connecting screw 410 can be connected between the circuit board 200 and the radiator 100. In this way, it is only necessary to set the connecting screw 410 at a position close to the above-mentioned connection point 123 (shown in Figure 8), and at the same time, make the connecting screw 410 pass through the above-mentioned grounding part 220, without making too many changes to the electronic device 01, thereby saving the cost of the electronic device 01. As a result, the connecting screw 410 can not only play the role of connecting the radiator 100 and the circuit board 200, but also play the role of electrically connecting the grounding part 220 and the second part 122. Of course, the grounding member 400 can also use other conductive media such as conductive wire and conductive silicone. The embodiment of the present application does not impose any special restrictions on the specific structure of the grounding member 400.

[0068] When the heat sink 100 and the circuit board 200 in the above embodiment are stacked, the heat source on the circuit board 200 can radiate heat outward through the first portion 121 of the heat sink 100 to dissipate heat. At the same time, the second portion 122 of the heat sink 100 can serve as the radiating structure of the antenna. When the feeding portion 230 and the grounding portion 220 on the circuit board 200 are respectively electrically connected to the second portion 122, the feeding portion 230 can provide a feeding current to the second portion 122, and the grounding portion 220 can serve as a reference ground for the second portion 122, so that a current return path can be formed between the second portion 122 of the heat sink 100 and the circuit board 200. In this way, when the feeding portion 230 feeds an alternating current to the second portion 122, the second portion 122 can be used as the antenna of the electronic device 01 to transmit electromagnetic wave signals. At the same time, the second portion 122 of the heat sink 100 can also serve as the antenna of the electronic device 01 to receive electromagnetic wave signals from the outside.

[0069] As can be seen from the above, the radiator 100 provided in the embodiment of the present application combines the heat dissipation function and the antenna radiation function, which not only improves the utilization rate of the radiator 100, but also the second part 122 is set at the edge of the radiator 100, which will not affect the heat dissipation function of the first part 121 of the radiator 100 for the electronic device 01. In addition, the embodiment of the present application is an improvement made by utilizing the original radiator 100 of the electronic device 01. The improvement method mainly involves notching the edge of the radiator 100, which will not affect the overall structure of the radiator 100. After the improvement, the radiator 100 has the function of an antenna, which helps to reduce the number of antenna components separately set on the circuit board 200, thereby saving the cost of the electronic device 01.

[0070] The above embodiment provides a detailed introduction to the specific structure of the radiator 100. In further embodiments, the radiator 100 may be provided with different notches, which can also enable the second portion 122 to function as an antenna for the electronic device 01. The following embodiments will provide a detailed introduction to the different notches of the radiator 100.

[0071] In some embodiments, as shown in FIG10 , the heat sink 100 can also be formed by notching a slit 112 between the first portion 121 (shown in FIG7 ) and the second portion 122. Specifically, the notched edge 1210 of the first portion 121 can be positioned opposite the long side L of the second portion 122, and the connection point 123 can be positioned on one side of the long side L of the second portion 122, allowing the second portion 122 to connect to the first portion 121 via the connection point 123 on the long side L. Thus, the connection point 123 can separate the through-slit 111 (shown in FIG8 ) to form a notched slit 112, with the notched edge 1210 of the first portion 121 located between the long side L of the second portion 122 and the notched edge 1210 of the first portion 121. In other words, the notched slit 112 can be formed in the bottom plate 110 of the heat sink 100 along the X-direction, with the remaining portion of the bottom plate 110 after the notched edge 112 is formed forming the connection point 123.

[0072] As shown in FIG10 , the contact area between the connection point 123 and the second portion 122 is smaller than the cross-sectional area of ​​the short side S, and the cross-sectional area is perpendicular to the long side L. In this way, the first portion 121 (shown in FIG7 ) and the second portion 122 of the heat sink 100 will not be affected by the excessively large connection area of ​​the connection point 123, which would affect the function of the second portion 122 as an antenna. Of course, the number of connection points 123 can be one or more, and the present embodiment of the application does not impose any specific restrictions on the specific number of connection points 123. The short side S of the second portion 122 can be connected to or disconnected from the first portion 121, and the present embodiment of the application does not impose any specific restrictions on whether the short side S of the second portion 122 is connected to the first portion 121. At the same time, the grounding member 400 can also be moved to a position close to the connection point 123, or a grounding member 400 can be added to a position close to the connection point 123.

[0073] In other embodiments, as shown in FIG11 , the heat sink 100 can also be formed by a notch 113 between the first portion 121 and the second portion 122. Specifically, the notch edge 1210 of the first portion 121 can intersect with the long side L of the second portion 122. For example, the notch edge 1210 can be perpendicular to the long side L. In this manner, the connection point 123 can be located on the short side S of the second portion 122, and the second portion 122 is connected to the first portion 121 via the connection point 123 on the short side S. In this case, one side of the notch 113 is the notch edge 1210 of the first portion 121, and the other side is the long side L of the second portion 122. That is, the notch 113 is located between the long side L of the second portion 122 and the first portion 121. In other words, along the X-direction, the heat dissipation teeth 120 (shown in FIG6 ) can protrude beyond the edge of the heat sink 100, thereby forming the second portion 122 that can function as an antenna. Thus, the long side L of the second portion 122 can be isolated from the first portion 121 by the notch 113. Meanwhile, the short side S of the second portion 122 is connected to the first portion 121. Since L>S, the short side S will not significantly affect the antenna performance of the second portion 122.

[0074] Of course, depending on the different shapes and structures of the radiator 100, the notched edge 1210 of the first part 121 can intersect with the long side L of the second part 122 to form an acute angle or an obtuse angle, so that the notch 113 can form a rectangle, an arc, a polygon or other shapes. The embodiment of the present application does not impose any special restrictions on the specific shape of the notch 113. In addition, as shown in Figure 11, along the Y direction of the radiator 100, the heat dissipation teeth 120 (shown in Figure 6) serving as the second part 122 can be arranged in the middle position of the radiator 100, so that notches 113 are provided on both sides of the second part 122. Alternatively, as shown in Figure 12, the heat dissipation teeth 120 serving as the second part 122 can be arranged at the edge position of the radiator 100 along the Y direction of the radiator 100, so that a notch 113 is provided on one side of the second part 122. The embodiment of the present application does not impose any special restrictions on the specific setting position of the second part 122.

[0075] The above embodiment is described by taking the heat sink 100 having the heat dissipation teeth 120 as an example. In more embodiments, the heat sink 100 may also be a heat dissipation plate 101. As shown in FIG13 , the heat dissipation plate 101 may be stacked with the above-mentioned circuit board 200 (shown in FIG3 ) by screwing, riveting or snapping, and the heat dissipation plate 101 may also be divided into a first part 121 and a second part 122 by a notch formed by setting a through slit 111. The second part 122 and the through slit 111 may be provided at the edge of the heat dissipation plate 101, and the second part 122 may also have the same long side L and short side S as the above embodiment, and be connected to the first part 121 through the short side S of the second part 122, which will not be described in detail here.

[0076] In further embodiments, as shown in FIG14 , the heat dissipation plate 101 can also be divided into a first portion 121 and a second portion 122 by providing a notch 112. The long side L of the second portion 122 can also be connected to the first portion 121 via the connection point 123 described in the aforementioned embodiment, which will not be further described here.

[0077] In further embodiments, as shown in FIG15 , the heat dissipation plate 101 can also be divided into a first portion 121 and a second portion 122 by providing a notch 113. The second portion 122 can also be positioned in the middle of the heat dissipation plate 101 along the Y direction, with notches 113 provided on both sides of the second portion 122. The second portion 122 can also be connected to the first portion via a short side S, which will not be further described here.

[0078] In further embodiments, as shown in FIG16 , the heat dissipation plate 101 can also be divided into a first portion 121 and a second portion 122 by providing a notch 113. The second portion 122 can also be positioned at an edge of the heat dissipation plate 101 along the Y direction, with the notch 113 provided on one side of the second portion 122. The second portion 122 can also be connected to the first portion via a short side S, which will not be further described here.

[0079] In addition, as shown in Figure 17, in the above embodiment, the notch shape of the radiator 100 in the XY plane can not only be set to a long rectangular structure. For example, the notch shape can also be set on the radiator 100 to be approximately elliptical. In this case, the side of the second part 122 close to the first part 121 is arc-shaped, and the notch side 1210 of the first part 121 is also arc-shaped. Of course, the notch shape can also be set to a broken line shape, a wave shape, or an arc shape. The embodiment of the present application does not impose any special restrictions on the notch shape of the radiator 100. According to different notch shapes, the second part 122 can have different long sides and short sides, and therefore can also serve as the radiation structure of the antenna. Among them, the relatively longer side in the second part 122 is the long side, and the relatively shorter side is the short side.

[0080] The above embodiment provides a detailed introduction to the specific structure of the radiator 100 and the circuit board 200 in the electronic device 01. In order to better demonstrate the content of the embodiment of the present application, as shown in Figure 8, the circuit board 200 can provide the second part 122 of the radiator 100 (shown in Figure 7) with the excitation signal required for antenna radiation. The excitation signal can excite the second part 122 through the feeder 300 to form the radiation current of the antenna. The following embodiment will take the radiator 100 structure shown in Figure 8 as an example to provide a detailed description of the performance of the second part 122 under the radiator 100 structure when used as an antenna.

[0081] For example, the radiation direction of the second part 122 of the radiator 100 when used as an antenna can be characterized by an antenna pattern. The antenna pattern can represent the amount of energy radiated by the antenna by the change of the relative field strength with the direction. The denser the lines in the figure, the greater the energy radiated by the antenna at that position. As shown in Figure 18, the left figure shows the arrangement direction of the radiator 100 in the XY plane, and the right figure shows the radiation direction of the second part 122 of the radiator 100 when used as an antenna. It can be seen from the figure that the second part 122 after being excited presents a radiation energy area a and a radiation energy area b in the XY plane, and the radiation energy area a and the radiation energy area b are distributed at both ends of the electronic device 01 along the X direction. Among them, the right figure is only used to indicate the direction of antenna radiation and does not represent the actual signal coverage range.

[0082] Similarly, as shown in Figure 19, the left figure shows the arrangement orientation of the heat sink 100 in the XZ plane, and the right figure shows the radiation direction of the second portion 122 of the heat sink 100 when used as an antenna. As can be seen from the figure, after being excited, the second portion 122 also presents radiation energy area a and radiation energy area b in the XZ plane, and the radiation energy area a and radiation energy area b are also distributed along the X direction at both ends of the electronic device 01.

[0083] In addition, the antenna pattern typically has multiple radiation beams, of which the radiation beam with the highest radiation intensity is called the main lobe, and the remaining radiation beams are called side lobes or side lobes. As shown in Figure 20, the left figure shows the layout direction of the radiator 100 in the XY plane, and the right figure shows the radiation beams of the second part 122 at different frequencies in the XY plane. As can be seen from the figure, when the frequency of the second part 122 is 5.15 GHz (the solid line curve in the figure), the main lobe of the radiation beam is mainly distributed in the 30°-150° area and the 210°-330° area, and the side lobes are mainly distributed in the 30°-330° area and the 150°-210° area. When the frequency of the second part 122 is 5.50 GHz (the dashed line curve in the figure), the main lobe and side lobes of the radiation beam are also distributed in similar areas. When the frequency of the second part 122 is 5.85 GHz (the dashed line curve in the figure), the main lobe and side lobes of the radiation beam are also distributed in similar areas. Therefore, when the second portion 122 of the heat sink 100 provided in the embodiment of the present application is used as an antenna, the overall radiation direction is distributed along the X direction at both ends of the electronic device 01.

[0084] In some embodiments, as shown in FIG21 , the heat sink 100 may further include two second portions 122 , wherein the long side L of one second portion 122 may be arranged along the X direction, and the long side L of the other second portion 122 may be arranged along the Y direction, such that the long sides L of the two second portions 122 are perpendicular to each other. In this way, the long sides L of the two second portions 122 on the heat sink 100 may be arranged in different directions. When a feed current is supplied to the two second portions 122 , the two second portions 122 on the heat sink 100 can function as antennas and transmit or receive electromagnetic wave signals in different directions, thereby expanding the coverage range of the antenna transmitting or receiving electromagnetic wave signals and avoiding signal blind spots.

[0085] Of course, in more embodiments, the radiator 100 may also include a larger number of second parts 122, and the second part 122 of each radiator 100 may be arranged in different directions, so that the signal coverage range is larger. The embodiment of the present application does not impose any special restrictions on the specific number of second parts 122 set on the radiator 100. At the same time, according to different structures of the radiator 100, the radiator 100 may also be notched using different notching methods in the above embodiments. For example, for the same radiator 100, a part may adopt a notching method of a through seam 111, and another part may adopt a notching method of a gap 113. The embodiment of the present application does not impose any special restrictions on the notching method of multiple second parts 122 on the radiator 100.

[0086] In addition, when the second part 122 of the radiator 100 in the above embodiment is used as an antenna, the overall radiation direction is distributed along the X direction at both ends of the electronic device 01. At this time, as shown in Figure 18, a structure such as an onboard antenna or a patch ceramic antenna can also be set on the circuit board 200, and the radiation direction of the antenna on the circuit board 200 is set along the Z direction (as shown in Figure 19), forming the radiation energy area c shown in the figure. In this way, the antenna structure on the circuit board 200 can form a complementary effect with the second part 122 of the radiator 100 in the radiation direction of the antenna, thereby realizing the function of full coverage of three-dimensional space signals. When the electronic device 01 provided in the embodiment of the present application is used in a gateway, the gateway can provide full coverage of WiFi signals to each room, thereby improving the user experience of fiber to the room (FTTR). At the same time, the manufacturing cost of the product is reduced.

[0087] The above embodiment provides a detailed introduction to the radiation direction of the second portion 122 of the radiator 100 when used as an antenna. The following embodiment will provide a detailed introduction to the radiation performance of the second portion 122 when used as an antenna. As shown in Figure 22, the second portion 122 can have a first end 122a and a second end 122b arranged opposite to each other, and the first end 122a can be connected to the first portion 121 (shown in Figure 7). When the circuit board 200 provides a feeding current to the second portion 122 of the radiator 100 through the feeder 300, a portion of the induced current (indicated by the small arrow in the figure) flows through the feeder 300 to the circuit board 200 along the height H direction of the second end 122b of the second portion 122, thereby forming a current path 1 (the path indicated by the white arrow in the figure). Another portion of the induced current flows through the grounding member 400 to the circuit board 200 along the height H direction of the first end 122a of the second portion 122, thereby forming a current path 2 (the path indicated by the black arrow in the figure). As can be seen from the figure, because current path 1 is longer than current path 2 by the length of the bottom edge of the second portion 122 (along the X direction), current path 1 is longer than current path 2 (the induced current at the top edge of the second portion 122 is small and can be ignored). Therefore, the second portion 122 of the heat sink 100 can be excited to form a low-frequency resonance at the position of the feeding element 300, and can also be excited to form a high-frequency resonance at the position of the grounding element 400.

[0088] In addition, the heat sink 100 provided in the embodiment of the present application has induced current distributed on the second portion 122, the feeder 300, the grounding member 400, and the circuit board 200, so that the induced current has a 3D direction, thereby making the polarization mode of the second portion 122 of the heat sink 100 when used as an antenna also 3D polarization. In this way, the 3D polarized antenna can better match the polarization of terminal antennas such as mobile phones, tablets, and computers, thereby improving the flow performance (i.e., the flow performance that can be tested) of the second portion 122 of the heat sink 100 when used as an antenna and docking with the terminal antenna.

[0089] Of course, the position of the feeder 300 between the grounding member 400 and the second end 122b can be adjusted along the long side L (i.e., the X direction) of the second portion 122. When the feeder 300 is closer to the grounding member 400, the current path 1 becomes longer, thereby causing the induced current to be more biased toward low-frequency resonance. Similarly, when the grounding member 400 is closer to the connection point 123 (as shown in FIG8 ), the current path 2 becomes shorter, thereby causing the induced current to be more biased toward high-frequency resonance.

[0090] On this basis, as shown in FIG23 , a reflection coefficient curve S11 is shown when the second part 122 of the radiator 100 is used as an antenna, which is used to represent the return loss of the antenna. Usually, the resonance shown in the S11 graph is less than -10dB, which can be understood as the working frequency band of the antenna. The S11 parameter is usually a negative number, and the smaller the S11 parameter is, the smaller the return loss of the antenna is, and the less energy is reflected back by the antenna itself, which means that more energy actually enters the antenna and the higher the working efficiency of the antenna is. Conversely, the larger the S11 parameter is, the greater the return loss of the antenna is, and the lower the working efficiency of the antenna is. Among them, the return loss refers to the ratio between the signal power reflected back to the antenna through the antenna circuit and the power transmitted by the antenna.

[0091] As shown in Figure 23, point d is the low-frequency resonance point formed by current path 1, and point e is the high-frequency resonance point formed by current path 2. Due to the presence of low-frequency resonance point d and high-frequency resonance point e, the antenna can achieve a return loss of less than -10 dB within the 5.0 GHz to 6.0 GHz frequency range. In other words, when the second portion 122 of the heat sink 100 functions as an antenna, it can operate within a wide operating frequency band of 5.0 GHz to 6.0 GHz.

[0092] The above is only a specific embodiment of the present application, but the scope of protection of this application is not limited to this. Any changes or substitutions within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. An electronic device, characterized in that: include: A circuit board, comprising a feeding portion and a grounding portion; as well as, A heat sink is stacked with the circuit board; the heat sink comprises a first part, a second part and a connection point, the second part is located at the edge of the heat sink, and a vertical projection of the second part on the circuit board has a long side L and a short side S, L>S; The connection point is arranged at at least one of the long side L and the short side S, the second part is connected to the first part via the connection point, and the feeding part and the grounding part are electrically connected to the second part respectively.

2. The electronic device according to claim 1, characterized in that: The first portion includes a notched edge, and the notched edge is arranged opposite to the long side L of the second portion; The connection point is arranged at the short side S of the second part, and the second part is connected to the first part via the connection point of the short side S, forming a through seam between the long side L of the second part and the notched side of the first part.

3. The electronic device according to claim 2, characterized in that: The heat sink comprises a bottom plate and heat dissipation teeth connected to each other, the bottom plate and the circuit board are stacked, and a plurality of heat dissipation teeth are arranged side by side and perpendicular to the bottom plate; The through seam is opened on the bottom plate and is located between two adjacent heat dissipation teeth at the edge of the bottom plate; the heat dissipation tooth closer to the edge of the bottom plate among the two adjacent heat dissipation teeth at the edge of the bottom plate forms the second part at the through seam position.

4. The electronic device according to claim 2, characterized in that: The heat sink comprises a heat dissipation plate, and the heat dissipation plate is stacked with the circuit board; The first part and the second part are arranged on the heat dissipation plate, and the second part and the through seam are arranged at the edge of the heat dissipation plate.

5. The electronic device according to claim 1, characterized in that: The first portion includes a notched edge, and the notched edge is arranged opposite to the long side L of the second portion; The connection point is set at the long side L of the second part, and the second part is connected to the first part through the connection point of the long side L, forming a gap between the long side L of the second part and the notched side of the first part; The contact area between the connection point and the second portion is smaller than the cross-sectional area of ​​the second portion, and the cross-sectional area is perpendicular to the long side L.

6. The electronic device according to claim 1, characterized in that: The first portion includes a notched edge, and the notched edge intersects with a long side L of the second portion; The connection point is set at the short side S of the second part, and the second part is connected to the first part through the connection point of the short side S, forming a gap between the long side L of the second part and the notched side of the first part.

7. The electronic device according to any one of claims 1 to 6, characterized in that: A ratio of a long side L of the second portion to a short side S of the second portion (L / S)>4.

8. The electronic device according to any one of claims 1 to 7, characterized in that: The electronic device further comprises a grounding member; The grounding member is connected between the grounding portion and the first part, and the grounding member is close to the connection point. The first part and the second part are also electrically connected through the connection point.

9. The electronic device according to claim 8, characterized in that: The grounding member includes a connecting screw; The connecting screw is connected between the circuit board and the heat sink.

10. The electronic device according to claim 8, characterized in that: The electronic device further comprises a feeding element; The feeding element is connected between the feeding portion and the second portion.

11. The electronic device according to claim 10, characterized in that: Along the long side L of the second portion, the second portion has a first end and a second end that are oppositely disposed; The first end is connected to the first portion, and the feeding element is arranged between the grounding element and the second end.

12. The electronic device according to claim 10, characterized in that: The feeding element includes a feeding screw or a feeding spring; The feeding screw or the feeding spring is connected between the circuit board and the heat sink.

13. The electronic device according to any one of claims 1 to 12, characterized in that: The long side L of the second portion is 1 / 4λ0; Wherein, λ0 is the wavelength corresponding to any frequency point in the working frequency band of the second part.

14. The electronic device according to any one of claims 1 to 13, characterized in that: The heat sink comprises a plurality of the second portions; The long sides L of the plurality of second portions intersect with each other.

15. A radiator, characterized in that: include: Part I; A second portion is located at an edge of the heat sink, and a vertical projection of the second portion on the circuit board has a long side L and a short side S, L>S; as well as, A connection point is provided at at least one of the long side L and the short side S, and the second part is connected to the first part via the connection point.

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