The present application belongs to the field of precision
microfabrication, and discloses a
microstructure substrate film forming method combining
ultrasonic oscillation and doctor blade
coating, comprising the following steps: positioning and fixing the
microstructure substrate; improving the wettability of the
microstructure substrate; removing the excess solution on the microstructure substrate and leveling the liquid film. The microstructure substrate is immersed into the solution in the ultrasonic instrument, the solution is oscillated by the amplitude and frequency of the ultrasonic wave, the
contact angle of the solution at the bottom of the microstructure is reduced by the
hysteresis effect of the
contact angle, and the
air layer at the bottom of the microstructure is removed by the
cavitation effect of the ultrasonic wave, so as to enhance the wettability of the solution to the bottom of the microstructure. The wettability of the solution to the microstructure substrate is effectively improved, the problems of poor wettability of the solution to the bottom of the microstructure, multiple repetitive operations and long process in the existing single wet
coating method are overcome, and the thin film with
high coverage, ideal film thickness and uniformity is prepared on the microstructure substrate.