Patents
Literature
Patsnap Eureka AI that helps you search prior art, draft patents, and assess FTO risks, powered by patent and scientific literature data.

2results about How to "Realize Broadband" patented technology

A broadband matching network and antenna

The embodiment of the present application discloses an antenna and a broadband matching network, the broadband matching network comprises: a passive impedance matching circuit and a non-Foster impedance matching circuit. The passive impedance matching circuit has a first port and a second port; the second port is connected with a coaxial port. The non-Foster impedance matching circuit has an input end and an output end; the input end is connected with the first port, and the output end is connected with a feed end of the antenna. The passive impedance matching circuit comprises at least one capacitor and at least one inductor which are connected with each other; and the non-Foster impedance matching circuit comprises at least one transistor and at least one capacitor, inductor or resistor which are connected with each other. The antenna of the embodiment of the present application realizes impedance matching between a coaxial cable and the feed end of the antenna by using the broadband matching network, realizes the broadband design of the antenna, and provides convenience for the miniaturization of the antenna.
Owner:KUANG CHI CUTTING EDGE TECH LTD

Antenna element

The invention provides an antenna element capable of realizing broadband of available electromagnetic waves. An antenna element according to an embodiment of the present invention is provided with an inorganic material substrate, a first conductor layer, a support substrate, a cavity, and a ground conductor layer. The first conductor layer is disposed on one side of the inorganic material substrate in the thickness direction and includes a patch antenna. The support substrate is disposed on the opposite side of the inorganic material substrate from the first conductor layer. The cavity portion is disposed on the opposite side of the inorganic material substrate from the first conductor layer and on the inorganic material substrate side of the support substrate. The ground conductor layer is disposed in the hollow portion. The thickness t of the inorganic material substrate satisfies the following formula (1). When the patch antenna is projected in the thickness direction of the inorganic material substrate, at least a part of the projection surface of the patch antenna overlaps the cavity.
Owner:NGK INSULATORS LTD