Horizontal consolidated computer mainboard radiator

A radiator and computer technology, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve the problems of complex processing and manufacturing of radiators, poor heat dissipation effect, and insufficient heat dissipation area, and achieve heat dissipation effect. Good, high production efficiency, the effect of improving production efficiency

Inactive Publication Date: 2013-04-17
SHENZHEN TAXINJIE TECH
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Good heat dissipation is the prerequisite for ensuring the stable operation of the computer motherboard. The processing and production of the existing computer motherboard radiators are relatively complicated, the heat dissipation area is not large enough, and there is a lack of effective heat dissipation components, so the heat dissipation effect is not very good. It is put forward that it is necessary to design a computer motherboard radiator with simple processing and production, good heat conduction effect, large effective heat dissipation area and good heat dissipation effect

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Horizontal consolidated computer mainboard radiator
  • Horizontal consolidated computer mainboard radiator
  • Horizontal consolidated computer mainboard radiator

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0039] Below in conjunction with accompanying drawing, the structure and the function of the horizontal compression solidified computer motherboard heat sink described in the present invention are described in detail, the purpose is for the public to better understand the technical scheme described in the present invention, rather than to the technical scheme described in the present invention. Restrictions, in fact, additions, subtractions, replacements and improvements made within the spirit of the present invention to the structure of the heat sink are all within the scope of protection of the present invention.

[0040] Specifically, the horizontal compacted computer motherboard radiator of the present invention includes a radiator main body, a fan, a buckle, a spring wire buckle and a bracket, the fan is located above the radiator main body, and the radiator main body is located above the bracket, wherein, The main body of the radiator 1 is formed by pressing and solidifyi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a horizontal consolidated computer mainboard radiator which comprises a radiator main body, a fan, a fastener, a spring wire and a bracket, wherein the fan is located above the radiator main body; the radiator main body is located above the bracket; the fastener fastens the radiator main body on the bracket; the spring wire is used for fixedly connecting the fan to the radiator main body; the radiator also comprises a heat conduction pipe and a base; the heat conduction pipe is a bent U-shaped pipe; a heat conduction pipe groove containing the heat conduction pipe is arranged on the bottom surface of the base; the radiating end of the heat conduction pipe is overlapped in series with radiating fins; and the heat conduction end of the heat conduction pipe and the bottom surface of the base are consolidated into one plane. The horizontal consolidated computer mainboard radiator provided by the invention has the advantages of practical structure, easiness for processing, excellent radiating effect and wide application prospect.

Description

technical field [0001] The invention relates to a radiator for a computer motherboard, in particular to a radiator for a computer motherboard with good heat dissipation effect, and belongs to the technical field of computer radiators. Background technique [0002] Good heat dissipation is the prerequisite for ensuring the stable operation of the computer motherboard. The processing and production of the existing computer motherboard radiators are relatively complicated, the heat dissipation area is not large enough, and there is a lack of effective heat dissipation components, so the heat dissipation effect is not very good. It is proposed that it is necessary to design a heat sink for a computer motherboard with simple processing and fabrication, good heat conduction effect, large effective heat dissipation area and good heat dissipation effect. Contents of the invention [0003] The present invention aims at the above-mentioned deficiencies existing in the field of radia...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20
Inventor 伍战中
Owner SHENZHEN TAXINJIE TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products