Electronic component mounting device and electronic component mounting method

An electronic component installation and electronic component technology, applied in the direction of electrical components, electrical components, etc., can solve problems such as expensive and limited, and achieve the effect of efficient and high-precision installation

Active Publication Date: 2017-07-07
JUKI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the types of electronic components that can be mounted corresponding to the types of mounting heads mounted on the mounting device are limited, and since there are various types of mounting heads, it becomes a very expensive device.

Method used

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  • Electronic component mounting device and electronic component mounting method
  • Electronic component mounting device and electronic component mounting method
  • Electronic component mounting device and electronic component mounting method

Examples

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Embodiment Construction

[0159] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In addition, this invention is not limited by the form (henceforth embodiment) for carrying out the invention mentioned below. In addition, the constituent elements in the following embodiments include elements within the so-called equivalent range, such as elements that can be easily conceived by those skilled in the art, substantially the same elements, and the like. In addition, components disclosed in the following embodiments may be appropriately combined.

[0160]Hereinafter, embodiments of the electronic component mounting apparatus and electronic component mounting method according to the present invention will be described in detail based on the drawings. In addition, this invention is not limited by this embodiment. figure 1 It is a schematic diagram which shows the schematic structure of an electronic component mounting apparatus.

[0161] figure 1 ...

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PUM

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Abstract

The present invention provides an electronic component mounting device and an electronic component mounting method capable of mounting lead-type electronic components efficiently and with high precision. This electronic component mounting apparatus uses a mounting head that moves on a horizontal plane to transfer and mount electronic components to a mounting position on a substrate, and includes: an electronic component supply unit that supplies electronic components; a suction nozzle for holding the main body of the electronic component supplied by the component supply unit, a suction nozzle drive unit for vertically moving and rotating the suction nozzle, a mounting head support for supporting the suction nozzle and the suction nozzle drive unit; and a control unit, It controls the operation of the mounting head main body and the electronic component supply unit. When the electronic component is a lead type electronic component in which a lead is inserted into an insertion hole of the substrate, based on the lead length of the lead type electronic component, Conditions for mounting the electronic component on the substrate by the head main body are determined.

Description

technical field [0001] The invention relates to a method of using a suction nozzle to hold an electronic component and move it to a substrate [0002] An electronic component mounting device for mounting on top, and an electronic component mounting method. Background technique [0003] An electronic component mounting apparatus for mounting an electronic component on a substrate includes a mounting head having a suction nozzle, and the electronic component is held by the suction nozzle and mounted on the substrate. The electronic component mounting device moves the suction nozzle of the mounting head in a direction perpendicular to the surface of the substrate to absorb the components in the electronic component supply device, and then makes the mounting head face to face in a direction parallel to the surface of the substrate. After reaching the mounting position of the suctioned component, the suction nozzle of the mounting head moves in a direction perpendicular to the s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/02H05K13/04
Inventor 儿玉裕介
Owner JUKI CORP
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