Electronic component installation apparatus, electronic component instalation system and electronic component instalation method

A technology for electronic component installation and electronic components, applied in the direction of electrical components, electrical components, etc., can solve problems such as expensive and limited

Active Publication Date: 2013-08-14
JUKI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the types of electronic components that can be mounted corresponding to the types of mounting heads mounted on the mounting device are limited, and since there are various types of mounting heads, it becomes a very expensive device.

Method used

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  • Electronic component installation apparatus, electronic component instalation system and electronic component instalation method
  • Electronic component installation apparatus, electronic component instalation system and electronic component instalation method
  • Electronic component installation apparatus, electronic component instalation system and electronic component instalation method

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Embodiment Construction

[0196] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In addition, this invention is not limited by the form (henceforth embodiment) for carrying out the invention mentioned below. In addition, the constituent elements in the following embodiments include elements within the so-called equivalent range, such as elements that can be easily conceived by those skilled in the art, substantially the same elements, and the like. In addition, components disclosed in the following embodiments may be appropriately combined.

[0197] Hereinafter, embodiments of the electronic component mounting apparatus, electronic component mounting system, and electronic component mounting method according to the present invention will be described in detail based on the drawings. In addition, this invention is not limited by this embodiment. figure 1 It is a schematic diagram which shows the schematic structure of an electronic component ...

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PUM

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Abstract

The present invention discoses an electronic component installation apparatus, an electronic component instalation system and an electronic component instalation method, and a lead type electronic component can be installed in high efficiency and precision. The electronic component instalation system comprises an electronic component supply apparatus that supplies a lead type electronic component with an electronic component main body and a lead connected to the main body to a hold position, a load head main body that ha a suctionn nozzle that holds the main body of the electronic component supplied by the electronic component supply apparatus, a nozzle drie part and a load head support body; the suction drive part drives up and down and rotarily and provides air paressure, a control part that control the acitons; and a status test part that tests the lead type electronic component hold by the nozzle. The control part inserts the electronic component on a baseplate if the lesd state satisfies based on the state tested by the test part.

Description

technical field [0001] The present invention relates to an electronic component mounting device, an electronic component mounting system, and an electronic component mounting method that hold an electronic component using a suction nozzle, move the electronic component, and mount the electronic component on a substrate. Background technique [0002] An electronic component mounting apparatus for mounting an electronic component on a substrate includes a mounting head having a suction nozzle, and the electronic component is held by the suction nozzle and mounted on the substrate. The electronic component mounting device moves the suction nozzle of the mounting head in a direction perpendicular to the surface of the substrate to absorb the components in the electronic component supply device, and then makes the mounting head face to face in a direction parallel to the surface of the substrate. After reaching the mounting position of the suctioned component, the suction nozzle ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/02H05K13/04
CPCH05K13/02H05K13/0408
Inventor 伊藤直也齐藤乐伊藤公宏藤本和弥儿玉裕介木村光伊势谷和宏
Owner JUKI CORP
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