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Electronic component mounting device, electronic component mounting system, and electronic component mounting method

A technology for electronic component installation and electronic components, applied in the direction of electrical components, electrical components, etc., can solve problems such as expensive and limited

Active Publication Date: 2018-05-29
JUKI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the types of electronic components that can be mounted corresponding to the types of mounting heads mounted on the mounting device are limited, and since there are various types of mounting heads, it becomes a very expensive device.

Method used

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  • Electronic component mounting device, electronic component mounting system, and electronic component mounting method
  • Electronic component mounting device, electronic component mounting system, and electronic component mounting method
  • Electronic component mounting device, electronic component mounting system, and electronic component mounting method

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Embodiment Construction

[0196] Hereinafter, the present invention will be described in detail with reference to the drawings. In addition, the present invention is not limited by the following modes for implementing the invention (hereinafter referred to as embodiments). In addition, the constituent elements in the following embodiments include elements that can be easily conceived by those skilled in the art, elements that are substantially the same, and so-called equivalent elements. In addition, the constituent elements disclosed in the following embodiments can be combined as appropriate.

[0197] Hereinafter, embodiments of the electronic component mounting apparatus, electronic component mounting system, and electronic component mounting method according to the present invention will be described in detail based on the drawings. In addition, the present invention is not limited by this embodiment. figure 1 It is a schematic diagram showing the schematic structure of an electronic component mounti...

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PUM

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Abstract

The present invention discoses an electronic component installation apparatus, an electronic component instalation system and an electronic component instalation method, and a lead type electronic component can be installed in high efficiency and precision. The electronic component instalation system comprises an electronic component supply apparatus that supplies a lead type electronic component with an electronic component main body and a lead connected to the main body to a hold position, a load head main body that ha a suctionn nozzle that holds the main body of the electronic component supplied by the electronic component supply apparatus, a nozzle drie part and a load head support body; the suction drive part drives up and down and rotarily and provides air paressure, a control part that control the acitons; and a status test part that tests the lead type electronic component hold by the nozzle. The control part inserts the electronic component on a baseplate if the lesd state satisfies based on the state tested by the test part.

Description

Technical field [0001] The present invention relates to an electronic component mounting device, an electronic component mounting system, and an electronic component mounting method, which use a suction nozzle to hold an electronic component, move the electronic component, and mount it on a substrate. Background technique [0002] An electronic component mounting device for mounting electronic components on a substrate includes a mounting head having a suction nozzle, and the electronic components are held by the suction nozzle and mounted on the substrate. The electronic component mounting device moves the suction nozzle of the mounting head in a direction orthogonal to the surface of the substrate, thereby sucking the components in the electronic component supply device, and then causes the mounting head to face in a direction parallel to the surface of the substrate After moving, after reaching the mounting position of the sucked component, the suction nozzle of the mounting h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/02H05K13/04
CPCH05K13/02H05K13/0408
Inventor 伊藤直也齐藤乐伊藤公宏藤本和弥儿玉裕介木村光伊势谷和宏
Owner JUKI CORP
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