Electronic component mounting method, electronic component mounting device, and electronic component mounting system

An electronic component installation and electronic component technology, applied in the direction of electrical components, electrical components, etc., can solve problems such as expensive and limited, and achieve the effect of efficient and high-precision installation

Active Publication Date: 2017-07-07
JUKI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the types of electronic components that can be mounted corresponding to the types of mounting heads mounted on the mounting device are limited, and since there are various types of mounting heads, it becomes a very expensive device.

Method used

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  • Electronic component mounting method, electronic component mounting device, and electronic component mounting system
  • Electronic component mounting method, electronic component mounting device, and electronic component mounting system
  • Electronic component mounting method, electronic component mounting device, and electronic component mounting system

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Embodiment Construction

[0155] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In addition, this invention is not limited by the form (henceforth embodiment) for carrying out the invention mentioned below. In addition, the constituent elements in the following embodiments include elements within the so-called equivalent range, such as elements that can be easily conceived by those skilled in the art, substantially the same elements, and the like. In addition, components disclosed in the following embodiments may be appropriately combined.

[0156] Hereinafter, embodiments of the electronic component mounting apparatus and electronic component mounting method according to the present invention will be described in detail based on the drawings. In addition, this invention is not limited by this embodiment.figure 1 It is a schematic diagram which shows the schematic structure of an electronic component mounting apparatus.

[0157] figure 1 T...

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PUM

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Abstract

The invention discloses an electronic part installation method, an electronic part installation apparatus and an electronic part installation system, and the electronic components can be precisely installed in high efficiency. The load type electronic part supplies a first hold position, and transmits an electronic component hold belt; the electronic component hold belt has a plurality of radial lead type electronic components that has a main body and lead that is connected to the main body along radical direction, and has a hold belt main body that holds the plurality of radial lead type electronic components, and cut off the lead that holds the radial lead type electronic components, and supplies a second hold position, then transmit the load type electronic component of the first hold position through a nozzle, then load on the load position of a baseplate; the main body of the radial lead type electronic component are supplied and transmitted to the second hold position through a nozzle at the same time, the lead is inserted into a jack hole of the baseplate and installed thereon.

Description

technical field [0001] The present invention relates to an electronic component mounting method, an electronic component mounting device, and an electronic component mounting system for holding and moving an electronic component with a suction nozzle and mounting the electronic component on a substrate. Background technique [0002] An electronic component mounting apparatus for mounting an electronic component on a substrate includes a mounting head having a suction nozzle, and the electronic component is held by the suction nozzle and mounted on the substrate. The electronic component mounting device moves the suction nozzle of the mounting head in a direction perpendicular to the surface of the substrate to absorb the components in the electronic component supply device, and then makes the mounting head face to face in a direction parallel to the surface of the substrate. After reaching the mounting position of the suctioned component, the suction nozzle of the mounting h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/02H05K13/04
CPCH05K13/02H05K13/0408H05K13/0421H05K13/046
Inventor 伊藤直也
Owner JUKI CORP
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