Semiconductor Processing Equipment
A technology for processing equipment and semiconductors, applied in metal material coating process, coating, gaseous chemical plating, etc., can solve the problems of high manufacturing cost and difficult manufacturing of atomic layer deposition equipment, and achieve reduced sensitivity and transmission accuracy. The effect of reducing the requirements and reducing the crosstalk
Active Publication Date: 2018-11-06
理想晶延半导体设备(浙江)有限公司 +1
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Problems solved by technology
In this way, the transmission device of the atomic layer deposition equipment in the prior art requires a very high transmission accuracy, and the manufacturing accuracy of each component of the atomic layer deposition equipment is also required, which makes the manufacture of the atomic layer deposition equipment difficult and expensive
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[0018] The inventors of the present invention have found that prior art semiconductor processing equipment has a problem of high sensitivity to the gap between the gas inlet device and the substrate to be processed. In order to solve the technical problems in the semiconductor processing equipment in the prior art, the present invention proposes a semiconductor processing equipment for processing a substrate to be processed, the semiconductor processing equipment includes: an air intake device, the air intake device is connected with the substrate to be processed The bottoms are opposite to each other, the air inlet device includes: a gas outlet surface, the gas outlet surface faces the substrate to be processed, and the gas outlet surface includes: a first gas outlet, which is used to transport the first gas outlet to the substrate to be processed. Reactive gas, a second gas outlet, which is spaced apart from the first gas outlet on the gas outlet surface, and the second gas o...
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Semiconductor processing equipment comprises a gas inlet device. The gas inlet device comprises a first gas outlet, which is used to deliver first reaction gas to a substrate to be processed; a second gas outlet, which is separated from the first gas outlet in a same gas outlet plane and is used to deliver second reaction gas to the substrate; and a driving device, which is used to drive the substrate to go through the first gas outlet and the second gas outlet in sequence; wherein the gas outlet plane also comprises a third gas outlet, which is arranged between the first gas outlet and the second gas outlet and is used to deliver third gas that will not carry out reactions with the first reaction gas or the second reaction gas to the substrate. The provided semiconductor processing equipment can reduce the sensitivity of a gap between the gas inlet device and a substrate to be processed.
Description
technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to a semiconductor processing device for processing substrates to be processed. Background technique [0002] Atomic Layer Deposition (ALD) technology is widely used in the field of semiconductor processing due to its advantages of good deposition uniformity and precise controllable deposition thickness. [0003] In the prior art, space atomic layer deposition equipment appears to improve the efficiency of atomic layer deposition equipment. The space atomic layer deposition equipment mainly sets the gas outlets of different atomic layer deposition reaction gases at intervals on the shower head, and makes the substrate to be processed pass through the gas outlets facing the different reaction gas outlets sequentially under the drive of the driving device. area, so that the substrate to be processed can complete multiple atomic layer deposition cycles in the process ...
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IPC IPC(8): C23C16/52C23C16/455
Inventor奚明吴红星胡兵黄占超马悦
Owner理想晶延半导体设备(浙江)有限公司