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A kind of copper clad laminate lamination method

A copper-clad laminate and lamination technology, which is applied in the field of copper-clad laminate, can solve the problems of uneven distribution of fillers in copper-clad laminates, and achieve the effects of reducing voids and bad interfaces, increasing the amount of addition, and stacking tightly

Active Publication Date: 2018-11-09
SHAANXI SHENGYI TECH
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  • Summary
  • Abstract
  • Description
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AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for laminating copper clad laminates, which solves the problem of uneven distribution of fillers in copper clad laminates prepared by the existing lamination process

Method used

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  • A kind of copper clad laminate lamination method
  • A kind of copper clad laminate lamination method
  • A kind of copper clad laminate lamination method

Examples

Experimental program
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Effect test

Embodiment Construction

[0018] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0019] Take CEM-3 core bonding sheet as an example, the filler mass fraction is 85%, and the filler is alumina. The rheometer tests its T at a heating rate of 1.2°C / min 1 90°C, T 2 is 125°C. First, some high-frequency vibrators 2 are arranged on the upper and lower cover plates 1 used for lamination (see figure 1 ), and then assemble the laminated materials, mirror panels, upper and lower cover plates, and put them into a hot press for lamination.

[0020] A in Table 1 is the traditional lamination procedure A, as a comparative example; B1-B8 are lamination procedures with different vibration frequencies applied.

[0021] Table 1

[0022]

[0023] Performance test results:

[0024]

[0025] It can be seen that the appearance, water absorption and thermal conductivity of the plate subjected to vibration lamination are all improved,...

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Abstract

The invention discloses a laminating method for copper-clad plates. Vibration is performed in the laminating process. The method disclosed by the invention has the following advisable beneficial effects that fillings are uniformly distributed, plates have preferable presentation and have homogeneous and stable performance, empty and bad interfaces can be notably reduced, the water absorption is reduced, the heat resistance is improved, the fillings are uniformly and compactly accumulated, the heat conductivity is improved, the addition quantity of the fillings can be further increased, and the heat conductivity is improved.

Description

technical field [0001] The invention belongs to the field of copper clad laminates, and in particular relates to a method for laminating copper clad laminates. Background technique [0002] The packaging density of electronic products is getting higher and higher, and the power of LEDs and power modules is getting higher and higher, which puts higher and higher requirements on the heat dissipation capacity of the substrate. At present, the design idea of ​​heat-conducting copper-clad laminates is still based on adding fillers, and increasing the amount of fillers is a commonly used method to improve the thermal conductivity of the board. However, simply increasing the amount of filler added often leads to a significant decrease in process operability, and may cause defects such as increased voids inside the board and poor appearance. The existing technology mainly realizes the close packing of fillers and increases the amount of fillers added by using the combination of siz...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/06B32B37/10B32B37/12
CPCB32B37/06B32B37/1045B32B37/12
Inventor 秦云川
Owner SHAANXI SHENGYI TECH
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