Waterproof ring forming method, waterproof ring and electronic product accessory

Abstract

The invention provides a waterproof ring forming method and further provides a waterproof ring made through the waterproof ring forming method, and an electronic product accessory provided with the waterproof ring in an integrally formed mode. The waterproof ring forming method comprises the steps that after glue is painted on the position, needing to be formed, of the electronic product accessory, the electronic product accessory is put into an electronic product accessory mold cavity of a waterproof ring mold; solid silica gel is cut to be in the predetermined quantity and placed in a feeding hole of the waterproof ring mold; the solid silica gel in the feeding hole is extruded to flow into a waterproof ring mold cavity in the waterproof ring mold, and the solid silica gel and the electronic product accessory are glued through glue; and the solid silica gel in the waterproof ring mold cavity is subjected to a sulfidation reaction due to the high temperature in the waterproof ring mold, so that the silica gel waterproof ring is integrally formed on the electronic product accessory, thus residue glue in the waterproof ring mold cavity is less, and the waterproof ring mold cavity iscleaned conveniently.

Description

technical field [0001] The invention relates to the technical field of accessories of electronic products, in particular to a forming method of a waterproof ring, a waterproof ring and electronic accessories. Background technique [0002] Existing electronic devices, such as mobile phones and tablet computers, are equipped with electronic product accessories such as card holders and thimbles. At present, the preparation methods of the waterproof structure on the card holders and thimbles are generally as follows: Injecting the liquid silicone onto the tray or the thimble, injecting the liquid silicone onto the tray or the thimble, and directly pointing the silica gel on the tray or the thimble by means of glue dispensing. However, the above-mentioned solid-formed silicone ring may affect the waterproof effect of the silicone ring sleeved on the card holder or thimble due to tolerance problems in the manufacturing process; the liquid silicone injection molding method is used ...

AI Technical Summary

Problems solved by technology

However, the above-mentioned solid-formed silicone ring may affect the waterproof effect of the silicone ring sleeved on the card tray or thimble due to tolerance problems in the manufacturing process; the liquid silicone injection molding method is used due to the high fluidity of liquid silicone , it is prone to problems such as overflow glue and the residual glue in the cavity of the waterproof ring mold is not easy to clean, which affects the waterproof performance and production efficiency of the silicone ring; and the production efficiency and precision of the glue point bonding method are low, so that the silicone rubber The waterproof performance of the ring is low

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