Electronic device case and manufacturing method, case assembly and electronic device

Abstract

The present disclosure provides an electronic device case and a manufacturing method, a case assembly and an electronic device. The case includes a plate body, the interior of the plate body is provided with a cavity extending along the plane in which the plate body is located, and the cavity is provided with a gas passage and a liquid suction core containing a liquid medium. After the case is mounted to the electronic device, when the local temperature of the electronic device is high, the position of the electronic device is in the high temperature region, the liquid medium in the cavity located closer to the high temperature region absorbs heat which is gasified to gas, and the gas travels through the gas passageway in the cavity to a cooler position, and then releases heat, which is re-liquefied into a liquid medium; the liquid medium enters the liquid suction core and moves back to a position in the cavity closer to the high-temperature region under the action of a capillary force; in this manner, the heat dissipation of the high-temperature region of the electronic device is accelerated, so that no additional heat dissipation components are required in the electronic device,thereby facilitating the reduction of the size of the electronic device.

Description

technical field The present disclosure relates to the technical field of heat dissipation, and in particular to a housing of an electronic device, a manufacturing method, a housing assembly and the electronic device. Background technique Heating is a phenomenon that occurs when all electronic devices (such as mobile phones, laptops, etc.) are working. Heat generation will cause the temperature of electronic equipment to rise and affect the performance of electronic equipment. When the heat generation is too large and the temperature is too high, it may even cause the electronic equipment to fail to work normally. A heat dissipation structure is usually provided in an electronic device to dissipate heat generated by the electronic device and reduce the temperature of the electronic device. Heat dissipation structures currently used in electronic equipment include heat pipes and vapor chambers. During installation, a part of the heat pipe and the vapor chamber will be close...

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