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Heat dissipation system and heat dissipation method

A heat dissipation system and technology for heat-generating devices, applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems of lack of flexibility and pertinence in heat dissipation of heat-generating devices, low heat-dissipating efficiency of heat-generating devices, etc.

Active Publication Date: 2020-12-18
LENOVO (BEIJING) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In the prior art, the heat dissipation efficiency is improved mainly by increasing the head of the oil pump and adding heat dissipation components. However, due to the high temperature and physical barriers of the heating element, the flow rate of the liquid around the heating element is lower than that of the fluid on both sides, resulting in the heat dissipation of the heating element. The heat dissipation efficiency is low, and the heat dissipation of different heat-generating devices lacks flexibility and pertinence

Method used

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  • Heat dissipation system and heat dissipation method
  • Heat dissipation system and heat dissipation method
  • Heat dissipation system and heat dissipation method

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Embodiment Construction

[0037] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. It should be understood, however, that these descriptions are exemplary only, and are not intended to limit the scope of the present disclosure. In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the embodiments of the present disclosure. It may be evident, however, that one or more embodiments may be practiced without these specific details. Also, in the following description, descriptions of well-known structures and techniques are omitted to avoid unnecessarily obscuring the concept of the present disclosure.

[0038] The terminology used herein is for the purpose of describing particular embodiments only, and is not intended to be limiting of the present disclosure. The terms "comprising", "comprising" and the like used herein indicate the presence of stated fea...

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Abstract

The invention provides a heat dissipation system and a heat dissipation method. The heat dissipation system comprises a convection accelerator arranged in a predetermined area at the periphery of a heating device and used for accelerating the flow of a heat dissipation fluid located at the periphery of the heating device and in contact with at least part of the heating device, wherein the convection accelerator is be controlled to adjust a path of the fluid moving from the convection accelerator to the heating device.

Description

technical field [0001] The present disclosure relates to a heat dissipation system and a heat dissipation method. Background technique [0002] Immersion liquid cooling is a cooling method with high cooling efficiency, mainly by directly immersing electronic equipment such as servers in a non-conductive, non-corrosive, and non-flammable liquid, and the heat is directly carried by convection or phase change of the liquid. Go, and then distribute a cooling method outdoors. [0003] With the rapid development of chip technology, the heat flux density of servers is getting higher and higher, and the immersion liquid cooling also has obvious heat dissipation limitations. In the prior art, the heat dissipation efficiency is improved mainly by increasing the head of the oil pump and adding heat dissipation components. However, due to the high temperature and physical barriers of the heating element, the flow rate of the liquid around the heating element is lower than that of the f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
Inventor 田婷陈良龙
Owner LENOVO (BEIJING) LTD