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Electronic equipment

A technology for electronic equipment and circuit boards, which is applied in the direction of electrical equipment shells/cabinets/drawers, electrical components, sealed shells, etc. It can solve the problems of reduced sealing width and poor waterproof performance of electronic equipment, so as to increase thickness and improve airtightness , Improve the effect of waterproof performance

Active Publication Date: 2021-06-18
OPPO CHONGQING INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present application provides an electronic device, which can solve the problem that the waterproof performance of the electronic device is deteriorated due to the reduction of the sealing width of the foam

Method used

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  • Electronic equipment
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Embodiment Construction

[0025] In order to better understand the above-mentioned purpose, features and advantages of the present application, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

[0026] In the following description, many specific details are set forth in order to fully understand the application, but the application can also be implemented in other ways different from those described here, therefore, the protection scope of the application is not limited by the specific details disclosed below. EXAMPLE LIMITATIONS.

[0027] The following discussion provides several embodiments of the application. Although each embodiment represents a single combination of the present application, different embodiments of the present application can be r...

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Abstract

An embodiment of the present application provides an electronic device, which includes: a first housing; a second housing, including a first side wall and a second side wall connected to the first side wall, the first The inner surface of the side wall is recessed inwardly relative to the inner surface of the second side wall to form a first groove; the circuit board is arranged in the second housing; the first sealing part is arranged in the first Between the housing and the first side wall; the second sealing part is disposed adjacent to the first sealing part and the inner surface of the first side wall between the first housing and the circuit board . The electronic device provided by the present application can effectively increase the sealing thickness and improve the sealing performance of the electronic device without changing the overall structure of the electronic device by providing the first sealing part and the second sealing part, thereby improving the waterproof performance of the electronic device .

Description

technical field [0001] The present application relates to the technical field of terminals, and in particular, to an electronic device. Background technique [0002] The description of the background technology in this application belongs to the relevant technology related to this application, which is only used for illustration and to facilitate the understanding of the application content of this application, and should not be understood as that the applicant clearly believes or presumes that the applicant believes that this application was filed for the first time prior art on the filing date. [0003] With the development of science and technology, electronic equipment is increasingly diversified and complex, and the integration of electronic equipment makes users more and more favor electronic equipment with better sealing effect. In order to improve the sealing effect between the casing of the electronic device and the circuit board, foam will be added between the cas...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K5/06
CPCH05K5/061
Inventor 曾鸿敏
Owner OPPO CHONGQING INTELLIGENT TECH CO LTD
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