5G Antenna Integrated Network Device
By adopting a multi-layer board structure in 5G antenna, combining calibration and phase-shifting network lines, and using metallized holes to achieve conduction, the problem of electrical indicator discontinuity in module integration is solved, and the port consistency and stability are improved. Optimization of electrical indicators for 5G large-scale arrays.
Patent Information
- Application Number
- CN201910949573.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2019-10-08
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2039-10-08
AI Technical Summary
The existing 5G antennas are difficult to achieve high integration and consistency of each module under the small size of dense arrays, resulting in insufficient electrical index discontinuity and structural stability.
The PCB board with double-sided copper-plated is formed by stacking connections to form a multi-layer board. The inner layer is equipped with a calibration network line and the outer layer is equipped with a phase shift network line. The metallized holes achieve layer conduction, combining striplines and microstrip lines. The structure is bonded and connected by a semi-cured sheet, and a solder resist zone and an oil-covered protective layer are provided on the outside to reduce components and optimize the line impedance at the conduction.
It achieves consistency of the port environment, improves accuracy and stability, avoids electrical problems caused by intermediate transfer, ensures good standing waves, and is suitable for the optimization of electrical indicators of 5G large-scale arrays.
Smart Images
Figure CN110691461B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of communication technologies, and in particular to a 5G antenna integrated network device. Background Art
[0002] With the rapid construction of 5G networks, the iteration of antenna industry products is also getting faster and faster. The demand for 5G (fifth-generation mobile communication technology) MIMO (Multiple-Input Multiple-Output) large-scale antenna arrays is changing with each passing day, and the market prospects for highly integrated and highly consistent 5G antennas are broad.
[0003] So, how to better design 5G antennas, better integrate various modules in a dense array with a small size, and achieve and improve the consistency of electrical indicators on the basis of easy assembly and good reliability plays a vital role in the series of 5G antenna products.
[0004] In summary, the existing methods have many problems in practical use, so it is necessary to improve them. Summary of the invention
[0005] In view of the above-mentioned defects, the object of the present invention is to provide a 5G antenna integrated network device, which can make the port environment tend to be consistent, with high accuracy, better stability and consistency.
[0006] In order to achieve the above-mentioned object, the present invention provides a 5G antenna integrated network device, comprising at least two PCB (circuit board) boards, the PCB boards are copper-plated on both sides and the PCB boards are stacked and connected in sequence to form a multi-layer board, the inner layer of the multi-layer board is provided with a calibration network circuit, the outer layer of the multi-layer board is provided with a phase shift network circuit, and the multi-layer board is provided with a plurality of metallized holes penetrating the multi-layer board, and the metallized holes conduct the layers between the multi-layer boards. .
[0007] According to the 5G antenna integrated network device, the calibration network circuit and the phase shifting network circuit are vertically staggered between the multilayer boards.
[0008] According to the 5G antenna integrated network device, upper and lower metal grounds are respectively provided on the upper outer layer board surface and the lower outer layer board surface of the multilayer board, and the calibration network circuit and the upper and lower metal grounds form a stripline structure.
[0009] According to the 5G antenna integrated network device, a middle metal ground is provided on the inner layer surface of the multilayer board, and the phase shift network circuit and the middle metal ground form a microstrip line structure.
[0010] According to the 5G antenna integrated network device, the PCB boards are bonded and connected by semi-cured sheets.
[0011] According to the 5G antenna integrated network device, a solder resist area is provided on the outer side of the multilayer board, and an oil-coated protective layer is provided on the solder resist area.
[0012] According to the 5G antenna integrated network device, several of the metallized holes on each layer of the multilayer board are closely arranged at equal distances along the routing of the calibration network line.
[0013] According to the 5G antenna integrated network device, the multilayer board is provided with at least one calibration port, at least one radio frequency port, a balancing resistor and a grounding resistor.
[0014] According to the 5G antenna integrated network device, the phase-shifting network composed of the phase-shifting network circuit and the middle metal ground is provided with a DC grounding lightning protection sub-circuit.
[0015] The present invention integrates the calibration network and the phase shift network on the same multilayer board, reducing the number of components and avoiding electrical problems and structural risk points caused by intermediate switching. The effective use of the multilayer board realizes the conversion from stripline to microstrip line, and the line impedance at the ground and conduction is optimized to solve the discontinuity problem, and the standing wave is good. 5G large-scale arrays have many ports, and the present invention can make the port environment tend to be consistent, with high accuracy, better stability and consistency. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 The first layer structure of the multilayer board of the 5G antenna integrated network device described in the preferred embodiment of the present invention;
[0017] Figure 2 The second layer structure of the multilayer board of the 5G antenna integrated network device described in the preferred embodiment of the present invention;
[0018] Figure 3 The third layer structure of the multilayer board of the 5G antenna integrated network device described in the preferred embodiment of the present invention;
[0019] Figure 4 This is the fourth layer structure of the multilayer board of the 5G antenna integrated network device described in the preferred embodiment of the present invention. DETAILED DESCRIPTION
[0020] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.
[0021] The present embodiment provides a 5G antenna integrated network device, preferably including two PCB boards, the PCB boards are copper-plated on both sides and the PCB boards are stacked and connected in sequence to form a multi-layer board, and the PCB boards are specifically connected by bonding with a prepreg. Of course, more than two PCB boards can also be combined to form a multi-layer board; each layer of the multi-layer board in the present embodiment is respectively as follows Figure 1 to Figure 4 As shown, it specifically includes a first board surface 100, a second board surface 200, a third board surface 300 and a fourth board surface 400, the first board surface 100 and the second board surface 200 correspond to the front and back of the first PCB board respectively, the third board surface 300 and the fourth board surface 400 correspond to the front and back of the second PCB board respectively, a calibration network circuit 203 is arranged on the inner board surface of the multilayer board, and a phase shift network circuit 107 is arranged on the outer board surface of the multilayer board, the first board surface 100 is located at the upper end surface of the multilayer board, and the phase shift network circuit 107 is arranged on the first board surface 100, and the calibration network circuit 203 is arranged on the second board surface 200 on the back of the first board surface 100; the multilayer board is provided with a plurality of metallized holes penetrating the multilayer board; the metallized holes connect the layers between the multilayer boards, and a part of the lines in the multilayer board go through the inner layer and a part of the lines go through the surface layer, thus realizing the conversion from stripline to microstrip line. This embodiment integrates the calibration network and the phase shifting network on the same multi-layer board, thereby reducing components and avoiding electrical problems and structural risk points caused by intermediate switching.
[0022] As shown in the figure, the calibration network line 203 and the phase-shifting network line 107 are vertically staggered between the multilayer boards. Upper and lower metal grounds are respectively provided on the upper outer layer and the lower outer layer of the multilayer board, and the calibration network line 203 and the upper and lower metal grounds form a stripline structure; that is, the upper and lower metal grounds are respectively provided on the first layer 100 and the fourth layer 400, and the grounds are connected to other grounds through metallized holes; a middle metal ground is provided on the inner layer of the multilayer board, and the phase-shifting network line 107 and the middle metal ground form a microstrip line structure. The connection between the stripline and the microstrip line forms a discontinuity. First, the ground, i.e., the copper-clad area of each layer, is reasonably optimized. Secondly, the line impedance at the conduction point is adjusted according to the simulation to improve the discontinuity, to ensure that the electrical indicators such as standing waves are good after the module is integrated.
[0023] A solder resist area 404 is disposed on the outer side of the multilayer board, and an oil-coated protective layer is disposed on the solder resist area 404. Figure 2 A plurality of metallized holes in each layer of the multilayer board are closely arranged at equal distances along the routing of the calibration network line 203 to ensure equipotential distribution.
[0024] The multilayer board (i.e., the integrated network consisting of the calibration network and the phase shift network) is provided with at least one calibration port, at least one RF port, a balancing resistor, and a grounding resistor. The phase shift network composed of the phase shift network circuit 107 and the metal ground is provided with a DC grounding lightning protection subcircuit 110. The copper cladding layer is the ground corresponding to the circuit, and the copper foil filling area is determined according to the circuit characteristics of different modules; see Figure 1 , the large copper-clad area is the ground 101 (specifically the upper metal ground) on one side of the calibration network stripline; the calibration network 203 includes a calibration network calibration port 103, a calibration network RF port 104, and a calibration network balancing resistor 105; a calibration network grounding resistor 106, a first metallized hole 102 on the first layer of the panel; a microstrip line phase shift network main port of the microstrip line phase shift network 107 and a stripline calibration network antenna port conductive point 108; a phase shift network branch port 109 is connected to the antenna feeding network; the first layer of the board 100 is integrated with a pad 111, a solder resist protective layer 112 and a phase shift slider 113 corresponding to the phase shift network. Since the calibration network circuit 203 of the stripline structure and the phase-shifting network circuit 107 of the microstrip line structure have discontinuity at the conduction point 108, the copper-clad area near them needs to be locally adjusted; the main port line of the phase-shifting network circuit 107 also needs to be adjusted, especially the microstrip line width at the conduction point 108 should be widened and the next-level line should be narrowed to improve the deviation of the Smith chart after connection.
[0025] The large copper-clad area 201 of the second layer 200 is the middle layer ground; the second metallized hole 202 on the second layer; the metal ground 201 and the second metallized hole 202 are arranged at almost the same distance along the calibration network line 203 to ensure equipotential distribution. The distance between the ground at the point where the main port 204 of the phase-shift network and the antenna port of the stripline calibration network are connected and the line needs to be locally adjusted to improve discontinuity. The last level of the stripline line 205 at the conductive point is widened to adjust the impedance characteristics after the connection. The third metallized hole 301 on the third layer 300 runs through the metallized holes of other layers. The large copper-clad area of the fourth layer 400 is the ground 401 on the other side of the calibration network stripline (specifically the lower metal ground); as well as the fourth metallized hole 402, the pad 403 and the solder mask 404. The multilayer board is not limited to a four-layer board; the number of RF ports is not limited to 4 groups, and this embodiment only uses 4 groups as an illustration; the ground of the microstrip line phase shift network is not limited to being located in the middle layer shown in the figure, but can also be located in the outer layer, and the line impedance can be changed by changing the thickness of the corresponding dielectric substrate; the coupling calibration network and the phase shift network are not limited to the wiring method shown in the figure; the phase shift network is not limited to the full microstrip line form, and can further adopt the stripline to microstrip line form to perform matching optimization at the transition point to be equivalent, etc.
[0026] In summary, the calibration network of the 5G antenna integrated network device described in the present invention adopts a stripline solution, the calibration network line is located in the inner layer of the multilayer board, the upper and lower grounds are located in the outer layer, and the large copper-clad area outside the line at a certain distance is connected through a metallized hole; the phase shifter adopts a microstrip line solution, the phase shift network line is located in the outer layer of the multilayer board, and the ground is located in the inner layer or another outer layer. The position of the ground determines the thickness of the dielectric substrate, that is, determines the impedance of the phase shift network line, and the ground is connected to the calibration network through a large area of metallized holes; wherein the calibration network and the phase shift network cause discontinuity in the process of conducting and connecting from the inner layer to the outer layer through the metallized holes, and the ground at the conduction connection is adjusted and filled, and the line impedance of the two modules at the connection is optimized, which can improve the electrical indicators after the module is integrated, especially the standing wave. And it can make the antenna port environment tend to be consistent, with high accuracy, better stability and consistency.
[0027] Of course, the present invention may have many other embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art may make various corresponding changes and modifications based on the present invention, but these corresponding changes and modifications should all fall within the scope of protection of the claims attached to the present invention.
Claims
1. A 5G antenna integrated network device, characterized in that: The invention comprises at least two PCB boards, the double-sided copper-plated PCB boards are stacked and connected in sequence to form a multi-layer board, the inner layer of the multi-layer board is provided with a calibration network circuit, the outer layer of the multi-layer board is provided with a phase-shifting network circuit, the multi-layer board is provided with a plurality of metallized holes penetrating the multi-layer board, the metallized holes conduct the layers between the multi-layer boards; wherein the plurality of metallized holes on each layer of the multi-layer board are closely arranged at equal distances along the routing of the calibration network circuit; the calibration network circuit and the phase-shifting network circuit are vertically staggered between the multi-layer boards.
2. The 5G antenna integrated network device according to claim 1, characterized in that: Upper and lower metal grounds are respectively arranged on the upper outer layer board surface and the lower outer layer board surface of the multilayer board, and the calibration network circuit and the upper and lower metal grounds form a stripline structure.
3. The 5G antenna integrated network device according to claim 1, characterized in that: A middle metal ground is provided on the inner layer surface of the multilayer board, and the phase shift network circuit and the middle metal ground form a microstrip line structure.
4. The 5G antenna integrated network device according to claim 1, characterized in that: The PCB boards are bonded and connected by prepreg.
5. The 5G antenna integrated network device according to claim 1, characterized in that: A solder resist area is arranged on the outer side of the multilayer board, and an oil-covered protective layer is arranged on the solder resist area.
6. The 5G antenna integrated network device according to claim 1, characterized in that: The multilayer board is provided with at least one calibration port, at least one radio frequency port, a balancing resistor and a grounding resistor.
7. The 5G antenna integrated network device according to claim 3, characterized in that: The phase-shifting network composed of the phase-shifting network line and the middle metal ground is provided with a DC grounding lightning protection sub-circuit.