A quartz crystal resonator equipped with a capacitor module

Abstract

The present invention relates to a quartz crystal resonator equipped with a capacitor module, comprising a base, a quartz wafer, a capacitor module and a metal cover, wherein the base is sintered by a frame-shaped first-layer base, a second-layer base with a rectangular groove in the central part and a flat-plate-shaped third-layer base, and in terms of conduction, two circular conduction holes on a metal welding sealing ring are diagonally distributed and staggered with two circular conduction holes that are also diagonally distributed, and the circular conduction holes are electrically connected to a first left internal terminal and a second right internal terminal after penetrating the first layer of the base, the second layer of the base and the third layer of the base, so as to achieve the grounding effect of the metal cover. The present invention realizes the miniaturization design of electronic products by building the capacitor device that must be externally connected to the quartz resonator when in use into the cavity of the quartz resonator.

Description

Technical Field

[0001] The present invention relates to the technical field of quartz crystal resonators, and in particular to a quartz crystal resonator equipped with a capacitor module. Background Art

[0002] As a quartz crystal resonator with advantages such as high frequency stability, high precision, and high quality factor, its application scope has become more and more extensive with the development of science and technology. In the military industry such as radar detection, satellite navigation, and electronic communications, quartz crystal resonators are used as stable frequency sources to provide precise frequency signals for various devices; in various electronic products such as watches, mobile phones, computers, and cameras, quartz crystal resonators are used as standard frequency sources or pulse signal sources to provide frequency references, and their role is unmatched by other types of resonators.

[0003] In actual applications, quartz crystal resonators will produce spurious signals due to the influence of the comprehensive environment, and the frequency of the quartz crystal resonator will shift, which will eventually have a certain impact on electronic equipment.

[0004] To solve this problem, the industry generally adopts two or more capacitors in parallel with the quartz crystal resonator when designing the circuit to make the equivalent capacitance close to the load capacitance to reduce the influence of stray on the frequency. However, this method will occupy a certain space on the circuit board in the context of the miniaturization of electronic equipment, which brings certain difficulties to the circuit design. Another method is to put the capacitor into the IC to form an oscillation circuit, and the IC is soldered in the package base. This type of product is called an active crystal oscillator in the industry. Although this type of product can reduce the influence of stray, it has the problems of high cost and complex processing technology. Therefore, it is very necessary to design a simple quartz crystal resonator that can be equipped with a capacitor module. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a quartz crystal resonator equipped with a capacitor module, by embedding a capacitor device that must be externally connected to the quartz resonator when in use into the cavity of the quartz resonator, thereby realizing a miniaturized design of an electronic product.

[0006] The technical solution adopted by the present invention to solve the technical problem is: providing a quartz crystal resonator equipped with a capacitor module, comprising a base, a quartz wafer, a capacitor module and a metal upper cover;

[0007] The base is composed of a first-layer base, a second-layer base and a third-layer base from top to bottom. The first-layer base is a rectangular frame structure. A metal welding sealing ring is installed on the upper end of the first-layer base. The upper end of the metal welding sealing ring is sealed by a metal upper cover.

[0008] The quartz wafer is arranged in a first cavity formed by the inner wall of the first base and the upper end surface of the second base, a first left internal terminal and a first right internal terminal are respectively installed at the two front corners of the bottom of the first cavity, a second left internal terminal and a second right internal terminal are respectively installed at the two front corners of the bottom of the first cavity, and two excitation electrodes of the quartz wafer are respectively connected to the first left internal terminal and the second left internal terminal;

[0009] The capacitor module is arranged in a rectangular groove in the middle of the upper end of the second layer base, and the rectangular groove is a second cavity;

[0010] The first left terminal electrode and the first right terminal electrode are respectively installed at the two corners in front of the lower end of the third layer base, and the second left terminal electrode and the second right terminal electrode are respectively installed at the two corners behind the lower end of the third layer base. The upper end of the first right terminal electrode and the upper end of the second left terminal electrode are both connected to the metal cover, the first left terminal electrode is connected to the first left internal terminal, the second right terminal electrode is connected to the second right internal terminal, the capacitor module is connected to the first right internal terminal and the second left internal terminal, the second right internal terminal is connected to the second left internal terminal, and the capacitor module is connected in parallel with the quartz chip.

[0011] As a supplement to the technical solution described in the present invention, the quartz wafer is electrically connected to the first left internal terminal, the first right internal terminal, the second left internal terminal and the second right internal terminal through a conductive adhesive.

[0012] As a supplement to the technical solution described in the present invention, the capacitor module is composed of multiple capacitor devices and resistors connected in parallel or in series.

[0013] As a supplement to the technical solution described in the present invention, the capacitor module includes two groups of parallel capacitor device groups connected in series, the parallel capacitor device group has 4 capacitor devices and a resistor in parallel, the capacitor sizes used in the parallel capacitor device group are 1pF, 2pF, 4pF and 8pF respectively, and these four specifications can be arbitrarily combined into any capacitance value between 1pF and 15pF. The two parallel capacitor device groups are connected in series to further adjust the capacitance value according to actual needs.

[0014] As a supplement to the technical solution described in the present invention, if the existing capacitor devices in the capacitor module are not needed, the circuit of the unused capacitor devices can be disconnected in any process before the quartz wafer is loaded in the quartz crystal resonator processing to match the ideal capacitance value required by the circuit; if one of the two groups of parallel capacitor device groups does not need to use the capacitor, the parallel capacitor device circuits therein can be completely disconnected, leaving only zero ohm resistance.

[0015] As a supplement to the technical solution described in the present invention, the circuit is disconnected by laser beam or ion bombardment.

[0016] As a supplement to the technical solution described in the present invention, the capacitor device is a chip-type ceramic capacitor.

[0017] As a supplement to the technical solution described in the present invention, the upper ends of the first right terminal electrode and the second left terminal electrode are connected to the second circular via hole that passes through the third layer base, the second layer base, the first layer base and the metal welding ring, the upper end of the first left terminal electrode is connected to the first circular via hole that passes through the third layer base and the second layer base and is connected to the first left internal terminal, the upper end of the second right terminal electrode is connected to the first circular via hole that passes through the third layer base and the second layer base and is connected to the second right internal terminal, and the first circular via hole and the second circular via hole are both filled with conductive material.

[0018] As a supplement to the technical solution described in the present invention, two relatively arranged rectangular pads are installed on both sides of the second cavity, and the two rectangular pads are correspondingly connected to the two ends of the capacitor module through a joining component, and each rectangular pad is connected to the corresponding second circular via hole through a first wiring pattern.

[0019] As a supplement to the technical solution described in the present invention, the second right internal terminal and the second left internal terminal are connected via a second wiring pattern.

[0020] Beneficial effects: The present invention relates to a quartz crystal resonator equipped with a capacitor module. By building the capacitor device that must be externally connected to the quartz resonator when in use into the cavity of the quartz resonator, on the one hand, it is possible to reduce the area occupied by the quartz resonator when designing the PCB circuit layout, which is convenient for realizing the miniaturization design of electronic products and reducing the complexity of PCB design. At the same time, the saved space can be used for other functional designs to achieve the diversification of electronic equipment functions. On the other hand, the capacitor device and the quartz chip are in the same environment, and the changes in the influence of the ambient temperature will be synchronized. In addition, compared with the active crystal oscillator, the solution of the present invention not only has the function of reducing stray effects, but also has a simple structure and is easy to process, which can achieve the purpose of low cost and high frequency accuracy to a great extent. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the structure of the present invention;

[0022] Figure 2 1 is a schematic top view of the present invention (omitting the metal upper cover, quartz wafer and metal welding sealing ring);

[0023] Figure 3 is a schematic top view of the present invention (with the metal cover omitted);

[0024] Figure 4 It is a bottom view schematic diagram of the present invention.

[0025] Illustration: 1. quartz crystal resonator, 2. base, 3. quartz wafer, 4. capacitor module, 5. metal cover, 6. metal welding ring, 21. first layer base, 22. second layer base, 23. third layer base, 211. first left internal terminal, 212. first right internal terminal, 213. second right internal terminal, 214. second left internal terminal, 221. bonding component, 222. rectangular pad, 231. first left terminal electrode, 232. first right terminal electrode, 233. second right terminal electrode, 234. second left terminal electrode, 33. conductive adhesive, P1. first wiring pattern, P2. second wiring pattern, B1. first circular via, B2. second circular via, E1. first cavity, E2. second cavity. DETAILED DESCRIPTION

[0026] The present invention will be further described below in conjunction with specific embodiments. It should be understood that these embodiments are only used to illustrate the present invention and are not intended to limit the scope of the present invention. In addition, it should be understood that after reading the content taught by the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms fall within the scope limited by the appended claims of the application equally.

[0027] The embodiment of the present invention relates to a quartz crystal resonator equipped with a capacitor module, such as Figure 1-4 As shown, it includes a base 2, a quartz wafer 3, a capacitor module 4 and a metal cover 5;

[0028] The base 2 comprises a first base 21, a second base 22 and a third base 23 from top to bottom. The first base 21 is a rectangular frame structure. A metal welding ring 6 is installed on the upper end of the first base 21. The upper end of the metal welding ring 6 is sealed by a metal upper cover 5.

[0029] The quartz wafer 3 is arranged in a first cavity E1 formed by the inner wall of the first layer base 21 and the upper end surface of the second layer base 22. A first left internal terminal 211 and a first right internal terminal 212 are respectively installed at the two front corners of the bottom of the first cavity E1. A second left internal terminal 214 and a second right internal terminal 213 are respectively installed at the two rear corners of the bottom of the first cavity E1. The two excitation electrodes of the quartz wafer 3 are respectively connected to the first left internal terminal 211 and the second left internal terminal 214.

[0030] The capacitor module 4 is disposed in a rectangular groove in the middle of the upper end of the second layer base 22, and the rectangular groove is a second cavity E2;

[0031] The first left terminal electrode 231 and the first right terminal electrode 232 are respectively installed at the two corners in front of the lower end of the third layer base 23, and the second left terminal electrode 234 and the second right terminal electrode 233 are respectively installed at the two corners behind the lower end of the third layer base 23. The upper end of the first right terminal electrode 232 and the upper end of the second left terminal electrode 234 are both connected to the metal cover 5, the first left terminal electrode 231 is connected to the first left internal terminal 211, the second right terminal electrode 233 is connected to the second right internal terminal 213, the capacitor module 4 is connected to the first right internal terminal 212 and the second left internal terminal 214, the second right internal terminal 213 is connected to the second left internal terminal 214, and the capacitor module 4 is connected in parallel with the quartz chip 3.

[0032] The quartz wafer 3 is electrically connected to the first left internal terminal 211 , the first right internal terminal 212 , the second left internal terminal 214 and the second right internal terminal 213 via a conductive adhesive 33 .

[0033] The capacitor module 4 is composed of a plurality of capacitor components and resistors connected in parallel or in series.

[0034] The capacitor device is a chip-type ceramic capacitor.

[0035] The upper ends of the first right terminal electrode 232 and the second left terminal electrode 234 are connected to the second circular conductive hole B2 that passes through the third-layer base 23, the second-layer base 22, the first-layer base 21 and the metal welding ring 6; the upper end of the first left terminal electrode 231 is connected to the first circular conductive hole B1 that passes through the third-layer base 23 and the second-layer base 22 and is connected to the first left internal terminal 211; the upper end of the second right terminal electrode 233 is connected to the first circular conductive hole B1 that passes through the third-layer base 23 and the second-layer base 22 and is connected to the second right internal terminal 213; the first circular conductive hole B1 and the second circular conductive hole B2 are both filled with conductive materials.

[0036] Two oppositely arranged rectangular pads 222 are installed on both sides of the second cavity E2. The two rectangular pads 222 are correspondingly connected to the two ends of the capacitor module 4 through the bonding component 221. Each rectangular pad 222 is connected to the corresponding second circular via B2 through the first wiring pattern P1.

[0037] The second right internal terminal 213 and the second left internal terminal 214 are connected via a second wiring pattern P2.

[0038] The base 2 is sintered by a frame-shaped first-layer base 21, a second-layer base 22 with a rectangular groove in the central part, and a flat-plate-shaped third-layer base 23. In terms of conduction, the two circular conduction holes B2 on the metal welding sealing ring 6 are diagonally distributed and staggered with the two circular conduction holes B1 that are also diagonally distributed. After passing through the first-layer base 21, the second-layer base 22 and the third-layer base 23, the circular conduction hole B2 is electrically connected to the first left internal terminal 211 and the second right internal terminal 213, thereby realizing the grounding effect of the metal cover 5.

[0039] If the capacitor components in the capacitor module 4 are not needed, they can be disconnected by laser beam, ion bombardment, etc. in any process before the quartz crystal resonator is loaded with the quartz wafer in the quartz crystal resonator processing, so as to match the ideal capacitance value required by the circuit. Among them, the capacitor components used are generally surface-mount ceramic capacitors, and MLCC capacitors of types such as C0G, X7R, and Z5U are commonly used. The size selected will depend on the size of the package base for actual application. The capacitor components and resistors can use conductive adhesives 33, or metal wires punched out by wire bonding, or they can be connected to the ceramic substrate by flip chip technology.

[0040] The quartz crystal resonator 1 is a package body in a shape similar to a rectangular parallelepiped. The main components of the quartz crystal resonator 1 include a base 2, a quartz wafer 3, a capacitor module 4, a metal upper cover 5 and a metal welding sealing ring 6.

[0041] The base 2 is made of ceramic insulating materials such as alumina sintered bodies formed by molding, stacking and sintering ceramic powder. The base 2 has a three-layer structure, specifically, from top to bottom, a frame-shaped first-layer base 21, a second-layer base 22 with a rectangular groove in the center, and a flat-plate-shaped third-layer base 23. The first cavity E1 is formed by the space surrounded by the inner wall of the first-layer base 21 and the upper end surface of the second-layer base 22. The first cavity E1 is approximately rectangular when viewed from above, and has the same shape as the inner wall of the first-layer base 21. At the four vertex positions of the first cavity E1, there are internal terminals 211 to 214 for electrically connecting the quartz wafer 3 through a conductive adhesive 33. The quartz wafer 3 is a rectangular flat plate cut into AT cut, ST cut, SC cut, etc. using quartz material at a specified angle.

[0042] It should be noted that the first left internal terminal 211, the first right internal terminal 212, the second right internal terminal 213 and the second left internal terminal 214 can be a single-layer terminal structure or a two-layer terminal stacked structure, and the upper terminal area is smaller than the lower terminal; the terminal shape can be rectangular, circular, etc., and the number can be 2, 3, 4, etc.

[0043] The depth of the second cavity E2 is less than the thickness of the second base 22. Two rectangular pads 222 are distributed on the opposite sides of the second cavity E2 for electrically connecting the capacitor module 4 through the bonding component 221. The capacitor module 4 is composed of multiple capacitors and resistors welded in parallel on a ceramic substrate, and connected to the first right internal terminal 212 and the second left internal terminal 214 through the first wiring pattern P1. The bonding component 221 can be an adhesive that is conductive and the same as the electrical adhesive 33, or a metal wire punched by flip chip technology or wire bonding. The bonding component 221 can be the above types, but is not limited to these types.

[0044] The metal upper cover 5 will be used in conjunction with the metal welding ring 6 during packaging. Its shape is the same as that of the base 2, and its size is smaller than the outer wall of the first layer base 21, and larger than the inner wall of the first layer base 21. The metal upper cover 5 and the metal welding ring 6 are generally made of iron-nickel-cobalt alloy. During packaging, the bottom layer of the metal upper cover 5 and the upper surface layer of the metal welding ring 6 are melted together under electric current heating. If a ceramic upper cover is used for packaging, the metal welding ring 6 can be omitted. The bottom edge of the ceramic upper cover is provided with a glass glue ring. During packaging, the glass glue ring is welded to the upper end surface of the first layer base 21 at high temperature.

[0045] The conduction mode between the above components is briefly described with reference to the diagram. The bottom of the third base 23 is provided with four rectangular terminal electrodes, namely a first left terminal electrode 231, a first right terminal electrode 232, a second right terminal electrode 233 and a second left terminal electrode 234. Figure 4As shown. The first left terminal electrode 231 and the second right terminal electrode 233 are connected to the external oscillation circuit in actual use. The two terminal electrodes contain a first circular conduction hole B1. The first circular conduction hole B1 is respectively connected to the third layer base 23 and the second layer base 22. After passing through, it is connected to the first left internal terminal 211 and the second right internal terminal 213 distributed in the diagonal position in the first cavity E1. The second right internal terminal 213 is connected to the second left internal terminal 214 via the second wiring pattern P2. In actual use, the second left internal terminal 214 will energize the excitation electrode surface on the back of the quartz wafer 3 through the conductive adhesive 33, thereby forming a complete electric field with the excitation electrode surface on the front of the quartz wafer 3. The capacitor module 4 is connected to the first right internal terminal 212 and the second left internal terminal 214 through the wiring pattern P1, so as to realize the parallel connection of the capacitor module 4 and the quartz wafer 3. The two second circular conductive holes B2 on the metal welding sealing ring 6 are diagonally distributed and staggered with the two first circular conductive holes B1 which are also diagonally distributed. After the metal upper cover 5 and the metal welding sealing ring 6 are welded together, the second circular conductive holes B2 penetrate the metal welding sealing ring 6, the first layer base 21, the second layer base 22, and the third layer base 23 from top to bottom, and are connected with the first right terminal electrode 232 and the second left terminal electrode 234 on the bottom surface of the third layer base 23, so as to realize the grounding of the metal upper cover 5 and thereby obtain a shielding effect.

[0046] In the above, the first circular via B1 and the second circular via B2 are filled with metal or conductive material in the through holes; the internal terminals 211~214, two rectangular pads 222, four rectangular terminal electrodes 231~234 and wiring patterns P1, P2 are all composed of a metal covering film, and the metal covering film is formed by electroplating a nickel layer and a gold layer in the order of a tungsten layer formed by printing on a base by an electroplating method.

[0047] It should be noted that the conduction modes of the components in the figure are only for convenience of explanation, so different conduction modes between the components in practice are also applicable to the present invention.

[0048] The present invention focuses on the application of the capacitor module 4, which is described in detail below.

[0049] Figure 2A simple example of a simple way to connect capacitor devices in capacitor module 4 is shown in the figure. In the figure, there are 4 capacitor devices and a resistor in parallel on the left and right sides respectively, and the two groups of parallel capacitor device groups on the left and right sides are connected in series; the capacitor sizes used in the parallel capacitor device groups on the left and right sides are 1pF, 2pF, 4pF and 8pF respectively. The beneficial effect of using these four specifications is that these four specifications of capacitance values ​​can be arbitrarily combined into any capacitance value of 1pF to 15pF. The two groups of parallel capacitor device groups on the left and right sides can be connected in series to further adjust the capacitance value according to actual needs, and the resistance value used by the resistor can be adjusted according to the actual working environment. If the capacitor devices in capacitor module 4 are not needed, they can be disconnected in any process before the quartz crystal resonator is loaded with a quartz wafer in the processing of the quartz crystal resonator by means of laser beam, ion bombardment, etc., so as to match the ideal capacitance value required by the circuit; if one of the two groups of capacitor device groups on the left and right does not need to use the capacitor, the parallel capacitor device circuits can be disconnected, leaving only the zero ohm resistor. Among them, the capacitor components used are generally chip ceramic capacitors, and MLCC capacitors of the types C0G, X7R, Z5U, etc. are commonly used. The selected size will depend on the size of the package base in actual application. It should be noted that the above example of the capacitance value of the capacitor components used in the capacitor module 4 is only a combination for convenience of explanation. The actual needs shall prevail when applying. Therefore, the combination of capacitor components and resistors of different specifications and quantities, and the changes between different connection modes of series or parallel connection all belong to the protection scope of the present invention.

[0050] Through the scheme of the above invention, the capacitor that must be connected to the quartz resonator when in use is built into the cavity of the quartz resonator. On the one hand, it can be realized that when designing the PCB circuit layout, the extra capacitor components can be omitted, and the area occupied by the quartz resonator on the PCB can be reduced, which is convenient for realizing the miniaturization design of electronic products; and the complexity of the PCB design can be reduced, and the space saved on the PCB can be used for other functional designs to realize the diversification of electronic equipment functions. On the other hand, due to the influence of the ambient temperature, the frequency of the quartz resonator will have certain strays when in use, and the capacitor is built into the cavity of the quartz resonator. The capacitor and the quartz wafer 3 are in the same environment, and the temperature changes will be synchronized, avoiding the two being in different ambient temperatures. The function of reducing the stray effect of the capacitor is avoided. In addition, compared with the active crystal oscillator, the scheme of the present invention not only has the function of reducing the stray effect, but also has relatively low processing complexity and cost, which can achieve the purpose of low cost and high frequency accuracy to a great extent.

Claims

1. A quartz crystal resonator equipped with a capacitor module, characterized in that: It comprises a base (2), a quartz wafer (3), a capacitor module (4) and a metal upper cover (5); The base (2) comprises, from top to bottom, a first-layer base (21), a second-layer base (22) and a third-layer base (23); the first-layer base (21) is a rectangular frame structure; a metal welding sealing ring (6) is installed at the upper end of the first-layer base (21); and the upper end of the metal welding sealing ring (6) is sealed by a metal upper cover (5); The quartz wafer (3) is arranged in a first cavity (E1) formed by the inner wall of the first layer base (21) and the upper end surface of the second layer base (22); a first left internal terminal (211) and a first right internal terminal (212) are respectively installed at two front corners of the bottom of the first cavity (E1); a second left internal terminal (214) and a second right internal terminal (213) are respectively installed at two front corners of the bottom of the first cavity (E1); and the quartz wafer (3) is respectively connected to the first left internal terminal (211) and the second left internal terminal (214); The capacitor module (4) is arranged in a rectangular groove in the middle of the upper end of the second layer base (22), and the rectangular groove is a second cavity (E2); A first left terminal electrode (231) and a first right terminal electrode (232) are respectively installed at two corners in front of the lower end of the third layer base (23); a second left terminal electrode (234) and a second right terminal electrode (233) are respectively installed at two corners in the rear of the lower end of the third layer base (23); the upper end of the first right terminal electrode (232) and the upper end of the second left terminal electrode (234) are both connected to the metal upper cover (5); the first left terminal electrode (231) is connected to the first left internal terminal (211); the second right terminal electrode (233) is connected to the second right internal terminal (213); the capacitor module (4) is connected to the first right internal terminal (212) and the second left internal terminal (214); the second right internal terminal (213) is connected to the second left internal terminal (214); and the capacitor module (4) is connected in parallel with the quartz wafer (3); The quartz wafer (3) is electrically connected to the first left internal terminal (211), the first right internal terminal (212), the second left internal terminal (214) and the second right internal terminal (213) via a conductive adhesive (33); A first circular conductive hole (B1) is provided between the first left terminal electrode (231) and the first left internal terminal (211), and between the second right terminal electrode (233) and the second right internal terminal (213); the upper ends of the first right terminal electrode (232) and the second left terminal electrode (234) are connected to a second circular conductive hole (B2) penetrating the third layer base (23), the second layer base (22), the first layer base (21) and the metal welding ring (6); and the first circular conductive hole (B1) and the second circular conductive hole (B2) are filled with conductive material; Two oppositely arranged rectangular pads (222) are installed on both sides of the second cavity (E2); the two rectangular pads (222) are correspondingly connected to two ends of the capacitor module (4) via a bonding component (221); and each rectangular pad (222) is connected to a corresponding second circular via (B2) via a first wiring pattern (P1); The second right internal terminal (213) and the second left internal terminal (214) are connected via a second wiring pattern (P2).

2. The quartz crystal resonator equipped with a capacitor module according to claim 1, characterized in that: The capacitor module (4) is composed of a plurality of capacitor components and resistors connected in parallel or in series.

3. The quartz crystal resonator equipped with a capacitor module according to claim 2, characterized in that: The capacitor module (4) comprises two groups of parallel capacitor device groups connected in series, wherein the parallel capacitor device groups are connected in parallel with four capacitor devices and a resistor, and the capacitance sizes used in the parallel capacitor device groups are 1pF, 2pF, 4pF and 8pF respectively. These four specifications can be arbitrarily combined into any capacitance value between 1pF and 15pF. The two parallel capacitor device groups can be connected in series to further adjust the capacitance value according to actual needs.

4. The quartz crystal resonator equipped with a capacitor module according to claim 3, characterized in that: If the capacitor components in the capacitor module (4) are no longer needed, the circuit of the unused capacitor components can be disconnected in any process before the quartz wafer is mounted in the processing of the quartz crystal resonator to match the ideal capacitance value required by the circuit; if one of the two parallel capacitor component groups does not need to use the capacitor, the parallel capacitor component circuits can be completely disconnected, leaving only zero ohm resistance.

5. The quartz crystal resonator equipped with a capacitor module according to claim 4, characterized in that: The circuit is disconnected by laser beam or ion bombardment.

6. The quartz crystal resonator equipped with a capacitor module according to claim 2, characterized in that: The capacitor device is a chip-type ceramic capacitor.

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