Heat dissipation device and heat dissipation system applying same

Abstract

The invention provides a heat dissipation system, which comprises a heat dissipation device and a plurality of electronic devices, wherein the heat dissipation device is used for heat dissipation of the plurality of electronic devices, and comprises a heat dissipation groove and a filling module, the heat dissipation groove is used for accommodating a cooling liquid and the plurality of electronicdevices, the plurality of electronic devices are immersed in the cooling liquid, the cooling liquid is used for heat dissipation of the plurality of electronic devices, and when the electronic deviceis taken out from the heat dissipation groove, the filling module is used for filling the same volume of the electronic device taken out from the heat dissipation groove, so that the heat dissipationeffect is good.

Description

technical field [0001] The invention relates to a heat dissipation device and a heat dissipation system using the heat dissipation device. Background technique [0002] With the rapid development of cloud computing technology, electronic devices such as servers are usually placed in heat sinks containing cooling liquid for centralized heat dissipation, so as to meet the heat dissipation requirements of electronic devices. [0003] However, when workers take out or add electronic equipment to the heat sink, the liquid level of the coolant will change. In this way, the heat dissipation effect will be poor. Contents of the invention [0004] In view of this, it is necessary to provide a heat dissipation device with a better heat dissipation effect and a heat dissipation system using the heat dissipation device. [0005] A heat dissipation device is used to dissipate heat for several electronic devices, the heat dissipation device includes a heat dissipation groove and a fil...

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Problems solved by technology

[0003] However, when the staff takes out or adds electronic equipment to the heat sink, t

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