Test device and its method for testing DSPIC under finished product state in digital video apparatus

A technology for video equipment and finished product status, applied in TV, application, measuring electricity, etc., can solve problems such as inability to test IC damage status, failure to check product damage or failure, etc.

Inactive Publication Date: 2003-09-17
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, this type of IC test equipment that can check only one IC when testing for IC damage status should be prepared separately
Therefore, in the assembled state of the PCB on which various ICs have been complicatedly mounted, it is not possible to test the damaged state of the ICs with the usual IC testing equipment.
This may result in damaged or malfunctioning parts that may be damaged or malfunctioned at the time of wiring ICs and manufacturing products on the PCB and storing and transporting the finished product without a method of checking for damage or malfunction of the product

Method used

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  • Test device and its method for testing DSPIC under finished product state in digital video apparatus
  • Test device and its method for testing DSPIC under finished product state in digital video apparatus
  • Test device and its method for testing DSPIC under finished product state in digital video apparatus

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Embodiment Construction

[0019] A preferred embodiment of the present invention will now be described in detail with reference to the accompanying drawings. Note that the same reference numerals or letters are used to denote similar or identical elements having the same function in the drawings viewed. In the following description, for example, specific numerical values ​​and expressions of elements constituting a specific circuit are given in order to more fully understand the present invention. However, it is apparent to one of ordinary skill in the art that the present invention may be practiced without these specific values. To describe the present invention in detail, detailed descriptions of well-known functions and constructions are omitted.

[0020] see figure 1 Therein are described a test apparatus and method capable of simply checking the operation state of each IC in the connection state of each DSP IC and the production and assembly state of a PCB when a finished product is manufactured...

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Abstract

A test equipment for testing a plurality of digital signal processor integrated circuits in a finished state of digital video equipment, comprising: a plurality of digital signal processor integrated circuits DSP ICs, used for testing the test signal generator generated from the digital signal The signal is processed, and the processed digital signal is output when the test is controlled, the test signal generator is provided at the front end within the plurality of DSP ICs and includes a black-to-white level for generating an indication of the covered pixels A scan signal generator for a flat full-level scan signal; and a monitor for monitoring the output of the DSP IC being tested; wherein the scan signal generator includes a horizontal scan signal for generating a horizontal line of scan signals a generator and a vertical scan signal generator for generating vertical lines of scan signals. The apparatus can simply check the operation state of each IC in the connection state of each DSP IC and the production and assembly state of the PCB when manufacturing the finished product of the digital video device.

Description

technical field [0001] This invention relates to digital video equipment for processing digital signals, and more particularly to inspection of digital signal processor integrated circuits (DSP ICs) and printed circuit boards (PCBs) in a printed circuit board (PCB) assembly within a product Whether it is in a damaged state or in a good state, a test device and a method thereof, in which various DSPs and ICS are assembled in combination in a digital video device for processing digital signals. Background technique [0002] Many ICs such as DSPs are assembled in combination on a PCB of a digital video device that processes digital signals. Before such ICs are mounted on a PCB, tests are performed to determine whether they are damaged using dedicated IC testing equipment. Testing for IC damage status with IC test equipment is usually done by inspecting only one IC. [0003] IC test equipment can be mainly divided into signal generators and signal analyzers. The signal genera...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): H04N17/00
CPCH04N17/004D06F39/125D06F37/20D06F39/001D06F37/26
Inventor金炳辰
OwnerSAMSUNG ELECTRONICS CO LTD