Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Soc integrated mainboard switching method and device

A technology for switching devices and motherboards, applied in the direction of electronic circuit testing, etc., can solve problems such as poor display effect, high cost of graphics cards, inability to achieve compatibility and stability of mobile phones, etc., to achieve easy replacement, good stability and compatibility performance, easy installation

Pending Publication Date: 2021-11-05
河南仁之康医疗科技有限公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Most of the current electronic devices such as computers or mobile phones mostly use separate system graphics cards and other devices to work. The software runs on different systems and cannot be used on multiple platforms. It is also necessary to install a simulator, but the existing simulators cannot do it. The compatibility and stability of the real mobile phone, in addition, the display effect is poor when the graphics card is used to display the software applications of different systems, and the cost of the graphics card is high, which brings great inconvenience to the users

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Soc integrated mainboard switching method and device
  • Soc integrated mainboard switching method and device
  • Soc integrated mainboard switching method and device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the following will be combined with the appended Figure 1-3 , clearly and completely describe the technical solutions of the embodiments of the present invention. Apparently, the described embodiments are some, not all, embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention belong to the protection scope of the present invention.

[0027] like Figure 1-3 Shown: a Soc integrated mainboard transfer device, including an integrated mainboard body 1 and an adapter board body 2 installed on the integrated mainboard body 1, the four corners of the adapter board body 2 are fixedly connected to the integrated mainboard body 1 through fixing components, In addition, the integrated motherboard body 1 is electrically connected to the adapter board body 2 thro...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of electrical main boards, in particular to an Soc integrated main board switching method and device, which comprises an integrated main board body and a switching board body arranged on the integrated main board body, and four corners of the switching board body are fixedly connected with the integrated main board body through fixing components. In addition, the integrated mainboard body is electrically connected with the adapter plate body through the first connecting flat cable and the second connecting flat cable. By arranging the integrated mainboard body and the adapter plate body, on one hand, application software can be operated on multiple platforms or systems, meanwhile, cost can be reduced, good stability and compatibility are achieved, on the other hand, by arranging the fixing assembly between the integrated mainboard body and the adapter plate body, on the other hand, installation of the adapter plate body is facilitated, and on the other hand, when the adapter plate body is damaged, the adapter plate body is convenient to replace.

Description

technical field [0001] The invention relates to the technical field of electric main boards, in particular to a SoC integrated main board switching method and device. Background technique [0002] Most of the current electronic devices such as computers or mobile phones mostly use separate system graphics cards and other devices to work. The software runs on different systems and cannot be used on multiple platforms. It is also necessary to install a simulator, but the existing simulators cannot do it. The compatibility and stability of the real mobile phone, in addition, the display effect is poor when the graphics card is used to display the software applications of different systems, and the cost of the graphics card is relatively high, which brings great inconvenience to the users. Contents of the invention [0003] In view of this, the present invention provides a Soc integrated motherboard switching method and device, which are not only convenient to use, but also ha...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G01R31/28
Inventor 任吉昌任猛张仲燕张长喜贾东旭
Owner 河南仁之康医疗科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com