Heat-conducting composite base material, preparation method and application thereof, electronic equipment, and heat dissipation device and method
A heat-conducting composite material and heat-conducting composite technology, which is applied in the field of heat-conducting composite substrates and preparations, can solve problems such as heat sinks that cannot heat components and efficiently transfer heat, and achieve the effects of reducing interface thermal resistance, stable thermal conductivity, and efficient transfer
Pending Publication Date: 2021-12-28
深圳热声智能科技有限公司
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Problems solved by technology
[0002] In recent years, with the rapid development of the 5G communication field, the operation of electronic equipment generates heat and the power consumption increases in response to the increasingly complex calculation process, but the current technology cannot efficiently transfer the heat of the heat-generating components to the radiator
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[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present disclosure with reference to the accompanying drawings in the embodiments of the present disclosure. Apparently, the described embodiments are part of the embodiments of the present disclosure, not all of them. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present disclosure.
[0027] Specific embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings.
[0028] The thermal conductivity coefficient of the thermal interface material is a fixed value that does not change with space. During the long-term research and development process, the applicant of the present invention found that the contact surface between the thermal interface material and the heating element and the c...
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Abstract
The invention relates to a heat-conducting composite base material, a preparation method and application thereof, electronic equipment, and a heat dissipation method. The heat-conducting composite base material comprises a first surface and a second surface which are oppositely arranged, the first surface is used for contacting a heat dissipation piece, and the second surface is used for contacting a heating piece; and the heat conduction coefficient of the heat conduction composite base material changes in the direction from the first surface to the second surface or in the direction from the second surface to the first surface, and the heat conduction coefficient of the first surface is larger than that of the second surface. By means of the mode, interface thermal resistance between a heat interface material and the heating piece and between the heat interface material and the heat dissipation piece can be reduced or even eliminated at the same time, and heat of the heating piece can be efficiently transmitted to the heat dissipation piece.
Description
technical field [0001] The invention belongs to the technical field of heat-conducting composite base material, and in particular relates to a heat-conducting composite base material and a preparation method, electronic equipment, application, heat dissipation device and heat dissipation method. Background technique [0002] In recent years, with the rapid development of the 5G communication field, the operation of electronic equipment generates heat and the power consumption increases in response to the increasingly complex calculation process, but the current technology cannot efficiently transfer the heat of the heat-generating components to the radiator . Contents of the invention [0003] The purpose of the embodiments of the present invention is to overcome the above-mentioned deficiencies in the prior art, and provide a heat-conducting composite base material and its preparation method, electronic equipment, application, and heat dissipation method, so as to solve t...
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Login to View More IPC IPC(8): H05K7/20
CPCH05K7/2039
Inventor朱桂妹郑泽宇程武玲高原
Owner深圳热声智能科技有限公司