64results about How to "Efficient thermal conductivity" patented technology

An electrical coil, particularly a gradient coil for a magnetic resonance apparatus, contains at least one electrical conductor, a carrier structure, at least one component of a cooling device and a heat insulator, which is arranged for at least one section of the conductor between the conductor and the carrier structure.

An optical device includes a base and an optical element. The base has a through hole in a center and includes leads and a resin. Each lead has an L-shaped cross-section and is formed by an inner lead extending from the center toward a peripheral edge and an outer lead connected to the inner lead and extending downward. The optical element is provided under the base so as to correspond to the through hole. Electrode pads of the optical element are connected to the leads of the base through bumps, respectively. The resin is formed so as to cover respective inner ends of the leads and respective front surfaces of the inner leads and to fill a gap between adjacent leads, and respective outer ends of the leads and respective front surfaces of the outer leads are exposed.

A process and apparatus for the treatment of septage, particularly grease trap waste, is disclosed. The inventive process will convert the septage into Biosolids (sludge) and water dischargeable to the environment. The treated septage achieves pathogen reduction, and reduced vector attraction. Treatment of septage by pasteurization causes the destruction of harmful pathogens. Pasteurization of septage having high water content provides for even temperature elevation and distribution of heat within the thermal mass of the septage allowing for consistent pathogen destruction. An alkaline compound is utilized to form a filter cake from the solids fraction of the pasteurized septage preventing vector attraction, while producing a beneficial bio-solid. The liquid fraction of the septage is treated by biological process allowing for its discharge into the environment.

A thermoelectric generator apparatus disposed on a high-temperature surface of an object (as a heat source), at least includes a heat concentrator, a thermoelectric module and a cold-side heat sink. The heat concentrator has a top surface and a bottom surface contacting a high-temperature surface of the object, and an area of the bottom surface is smaller than that of the high-temperature surface. The thermoelectric module is disposed on the top surface of the heat concentrator. The cold-side heat sink is disposed on the thermoelectric module. Heat generated by the heat source is concentrated on the heat concentrator and flows to the hot side of the thermoelectric module for increasing the heat flux (Q′) passing the thermoelectric module and the hot side temperature of the thermoelectric module. Consequently, the thermoelectric conversion efficiency (η) is improved, and the power generation of the thermoelectric module is increased.

The invention discloses a polymer-based insulating and heat conducting composite material with efficient heat conductivity and excellent mechanical properties. The composite material is characterized in that in the preparation process, through a specific biaxial tensile force field, high dispersion of fillers in a composite system and complete orientation of anisotropic fillers can be effectively achieved, the quantity of the fillers can be increased, the integral heat conductivity of the material can be improved and the excellent mechanical properties of the material can be ensured. The greatest advantages of the composite material are that high filling of electricity and heat conducting fillers can be achieved and the integral insulativity of the material can be still maintained, thus the limitation of lower electricity conducting percolation threshold to the additive amount of the electricity and heat conducting fillers in an insulation system can be broken through and the advantage of high heat conductivity of the electricity and heat conducting fillers can be given play to. Meanwhile, the composite material has the advantages of simplicity in operation, convenience in control, continuous production and stable quality, has good industrialization capacity and market prospect and can be widely applied to preparation of plates, sheets and membrane materials with excellent mechanical properties and efficient insulativity and heat conductivity.

The invention relates to a heat-conducting hot melt adhesive, which comprises the following components by weight percent: 1%-20% of silicon dioxide, 1%-10% of titanium dioxide, 1%-20% of zirconium silicate, 1%-10% of boron nitride, 1%-10% of aluminum oxide, 1%-10% of silicon carbide. 0.5%-5% of dispersant, 0.5%-5% of anti-sedimentation agent, 0.5%-5% of defoamer and the balance of synthetic resin. According to the invention, elements having excellent refractive index, high axial heat source absorption capability and fine thermal conductivity such as aluminum, boron, titanium, silicon and zirconium are processed into oxides, nitrides and carbides, and the oxides, the nitrides and the carbides are ground into powdery particles within the range from 10 nm to 25 microns; next, the powdery particles are mixed with hot melt adhesive resin in a certain ratio to obtain the hot melt adhesive; and the obtained hot melt adhesive has efficiency heat conductivity and is capable of quickly transferring heat in three ways of conduction, convection and radiation.

The invention provides a diamond/graphene composite heat conduction film. The diamond/graphene composite heat conduction film comprises a micro-grain diamond thin film and a graphene layer arranged onthe surface of the micron-grain diamond thin film. The diamond and the graphene in the diamond/graphene composite heat conduction film form an excellent heat conduction structure, and the obtained composite heat conduction film has efficient heat conduction performance. The invention further provides a preparation method of the diamond/graphene composite heat conduction film. The preparation method comprises the following steps that a substrate is provided, and the micron-grain diamond thin film is deposited on the surface of the substrate; the substrate is corroded and removed, and the self-supported micron-grain diamond thin film is obtained; the self-supported micron-grain diamond thin film comprises a to-be-nucleated surface; and a transition metal layer is deposited on the to-be-nucleated surface, the self-supported micron-grain diamond thin film with the transition metal layer deposited is placed in a hot-filament vapor deposition chamber cavity for rapid annealing treatment toobtain the diamond/graphene composite heat conduction film, wherein the annealing temperature is 800-1100 DEG C, and the annealing time is 1-5 min. The invention further provides a heat dissipation system.

The invention discloses a semiconductor laser heat sink. The semiconductor laser heat sink has the characteristics of excellent heat-dissipation performance, difficult oxidation, long service life and stable heat dissipation. The semiconductor laser heat sink adopts a chemical vapor deposition (CVD) method to prepare a graphene thin-film layer with high thermal conductivity and low thermal expansion coefficient on the surface of a copper heat sink so as to realize coating of the copper heat sink. The semiconductor laser heat sink utilizes stable performance and high-efficiency heat-conducting performance of graphene materials to realize high-efficiency fast transmission of heat generated by a semiconductor laser chip to copper heat sink, and the heat transmitted from the graphene thin-film layer is dissipated into air or other cooling mediums by the copper heat sink. According to the semiconductor laser heat sink disclosed by the invention, the preparation process is simple, the cost is low, the heat dissipation performance is stable, the service life is long, the heat dissipation problem of the semiconductor laser can be effectively solved and the performance of a semiconductor laser device can be improved.

A composite plate comprising CNT bundles with high thermal conductivity is formed by the method comprising preparing a CNT growth substrate, depositing a CNT growth catalyst on the CNT growth substrate, preparing a wafer with etched through via arrays, placing the wafer with the etched through via arrays over the CNT growth substrate with the CNT growth catalyst, growing CNT bundles in the etched through via arrays on the wafer over the CNT growth substrate with the CNT growth catalyst in a CVD chamber to form a wafer matrix CNT composite structure; and removing the CNT growth substrate from the wafer matrix CNT composite structure. The formed composite plate comprising CNT bundles with high thermal conductivity has improved CTE silicon match, has a more effective thermal conductivity than a silicon matrix or Cu or Cu alloy substrate, and contains nanotubes that remain vertical.

The invention discloses an insulated efficient heat-conducting silicone grease and a preparation method thereof. The heat-conducting silicone grease comprises the following components in parts by weight: 80-100 parts of a composite spherical heat-conducting filler, 0.5-5 parts of a one-dimensional structure heat-conducting material, 0.5-5 parts of a two-dimensional structure heat-conducting material, 20-100 parts of liquid metal heat-conducting paste, 4-20 parts of silicone oil, 0.25-2 parts of a silane coupling agent and 0.1-1 part of an antioxidant. Tiny gaps on the surface of a composite spherical heat-conducting filler are filled with the liquid metal heat-conducting paste; the contact thermal resistance among filler particles is effectively reduced, the good insulating property of theheat-conducting silicone grease can still be kept while the efficient heat-conducting property is obtained, and meanwhile, by adopting the efficient heat-conducting silicone grease, the problems thattraditional heat-conducting silicone grease is low in filling amount, poor in heat-conducting effect, prone to dry cracking and prone to oil seepage are effectively solved.

The invention belongs to the technical field of electromagnetic noise absorption, and discloses a heat-conductive electromagnetic noise suppression sheet and a preparation method thereof, the heat-conductive electromagnetic noise suppression sheet comprises an organic silicon resin-based wave-absorbing medium top layer, an organic silicon resin-based wave-absorbing medium bottom layer, and an electromagnetic band gap structure layer embedded between the organic silicon resin-based wave-absorbing medium top layer and the organic silicon resin-based wave-absorbing medium bottom layer; each organic silicon resin-based wave-absorbing medium layer is an organic silicon resin and electromagnetic wave absorber composite; the electromagnetic band gap structure layer comprises a plurality of metalfoil grids and a wave-absorbing medium layer, the metal foil grids are uniformly distributed and fixed on the wave-absorbing medium layer; a heat conduction network is constructed in an organic silicon resin-based wave-absorbing medium by use of an electromagnetic band gap structure, by use of electromagnetic wave regulation characteristics, wave absorbing ability is enhanced, the thermal conductivity and the electromagnetic noise suppression capability of the heat-conductive electromagnetic noise suppression sheet can be significantly improved, and the wave-absorbing bandwidth and the centerfrequency loss intensity are significantly improved compared with the existing heat-conductive electromagnetic noise suppression sheet.

There is provided a light-emitting device comprising a light-emitting element. The light-emitting device of the present invention comprises an electrode part for the light-emitting element; a reflective layer provided on the electrode part; and the light-emitting element provided on the reflective layer such that the light-emitting element is in contact with at least a part of the reflective layer, wherein the light-emitting element and the electrode part are in an electrical connection with each other by mutual surface contact via the at least a part of the reflective layer, wherein the electrode part serves as a supporting layer for supporting the light-emitting element, and wherein the electrode part extends toward the outside of the light-emitting element and beyond the light-emitting element.

The invention discloses a making method for a super-thick copper foil and high heat-conducting copper clad laminate. The method includes the steps of: glue solution preparation, gluing, superposition and hot pressing. Specifically, the glue solution comprises: low-bromine epoxy resin/phenolic curing system, a coupling agent, an imidazole curing accelerator and an inorganic filler, and a solvent butanone. By adjusting the production technological conditions, the method provided by the invention solves the difficult making problem of super-thick copper clad laminates, and is simple and convenient. The prepared super-thick copper clad laminate has good flatness, and the bonding force between the super-thick copper foil and a base material is good. At the same time, by adding a lot of excellent and efficient heat-conducting filler to the formula, the molded base plate has efficient heat-conducting property, and the thermal conductivity is greater than 1.6W/mk, thus well solving the rapid heat dissipation problem of heavy current base plates. The prepared super-thick and high heat-conducting copper clad laminate also has excellent heat resistance, with T260 being greater than 30min. Meanwhile, the invention can also meet the demands of a PCB lead-free making process.

An optical transceiver includes a transceiver housing configured to receive an optical sub-assembly insert. The optical sub-assembly insert includes duplex cavities configured to hold a transmit optical sub-assembly front end and a receive optical sub-assembly front end in a fixed spatial orientation for a given optical connector interface. The optical sub-assembly insert is configurable to fit inside a transceiver housing with a relatively wide range of X and Y dimensional tolerance. In one implementation, the X-Y position of the optical sub-assembly insert is dictated by the position of the transmit optical-sub assembly front end after its corresponding back end has been mounted to a heat dissipation element. Any gaps that form between the optical sub-assembly insert and the inside surface of the transceiver housing as a result of the transmit optical sub-assembly position can be accommodated with filler material.

The invention relates to a foamed aluminum material, in particular to high-impact-toughness foamed aluminum based on A356 aluminum alloy and a production process of the high-impact-toughness foamed aluminum. The production process comprises the steps that (1) 12-20 parts, by weight, of a foaming agent is ground and screened through a sieve with 100-180 meshes; (2) 100 parts, by weight, of A356 aluminum alloy ingots are crushed, ground into particles and then evenly mixed with 8-15 parts, by weight, of inorganic nano-whiskers and 10-12 parts, by weight, carbon nano-tubes, then a mixture is placed into a smelting furnace and completely molten in an inert gas atmosphere, afterwards, the foaming agent is sucked in to the smelting furnace under negative pressure, and a molten aluminum mixture is obtained after uniform mixing; (3) the molten aluminum mixture obtained in the step (2) is poured into a mold, the mold is then pushed into a foaming furnace, and heat preservation is conducted for1-2h at the temperature of 680-700 DEG C; and (4) the mold enters a cooling system to be cooled, and thus the foamed aluminum is obtained. According to the high-impact-toughness foamed aluminum basedon the A356 aluminum alloy and the production process of the high-impact-toughness foamed aluminum, the mixture of the inorganic nano-whiskers and the carbon nano-tubes is added in the forming processof the foamed aluminum, and thus the impact toughness of the aluminum is remarkably improved.

The invention provides a bearing with a graphite copper sleeve, an articulated frame and a sweeper. The bearing comprises a shaft sleeve, a connecting shaft, the graphite copper sleeve, a first planebearing, a first end cover, a second plane bearing and a second end cover, wherein the shaft sleeve is provided with a through hole along the axial direction in a penetrating way; the connecting shaftpenetrates through the through hole; the graphite copper sleeve is arranged in the through hole and sleeves outside the connecting shaft; the first plane bearing sleeves outside the connecting shaftand is arranged at the first axial end of the shaft sleeve; the connecting shaft penetrates through the first end cover; and the first end cover covers the outside of the first plane bearing and is fixed onto the first axial end of the shaft sleeve. The graphite copper sleeve is connected between the connecting shaft and the shaft sleeve, and a self-lubricating function of the graphite copper sleeve is utilized, so that the friction of the connecting shaft is effectively reduced; and meanwhile, the graphite copper sleeve has a high-efficiency heat-conducting performance, and the plane bearingsand the end covers are arranged at two axial end parts, so that the bearing is simple in structure.

The invention discloses a tough and high-elastic composite silicon-carbide-based ceramic circuit board base board material. According to a silicon-carbide-based ceramic base board, micron-grade silicon carbide powder and nano-scale aluminum nitride powder are used in a composited mode, so that the base material can have more efficient thermal conductivity, polyethylene glycol composite solvent containing yttrium sol and nanometer ceramic powder transparent liquid is great in wettability and bonding capability for powder, all materials can be evenly dispersed and cladded, the effects of effective melting enhancement and strength improvement are achieved, the composite ceramic base board high in compactness, elasticity and strength can be obtained at the lower sintering temperature, and the material is good in electric insulating property, high in heat conduction and dissipation efficiency, safe and environment-friendly in production process and great in utilization potentiality.

The invention discloses efficient water-cooling heat dissipation liquid for computers. The efficient water-cooling heat dissipation liquid is prepared from distilled water, benzotriazole, ethyl alcohol, potassium borate, triethanolamine, potassium phosphate, potassium permanganate, potassium carbonate, polymethylacrylic acid, trisodium phosphate, calcium chloride, potassium hydroxide and propyleneglycol. Compared with the prior art, the efficient water-cooling heat dissipation liquid prepared according to the formulation and the method has advantages of high efficiency in heat conduction, quickness in heat absorption and heat dissipation in radiators, improvement of water-cooling heat dissipation performances of the computers and high popularization and application values.

The invention discloses a high thermal conductivity flexible printed circuit board which comprises a copper foil layer, an adherence layer and a bearing layer. The copper layer and the bearing layer are bonded together to form a whole body through the adherence layer. The adherence layer is thermal conductivity insulation rubber. The bearing layer is a copper foil substrate or an aluminum foil substrate. According to the circuit board, the highly efficient thermal conductivity performance can be provided, the heat radiation of electronic components on the circuit board is facilitated, especially the electric energy utilization rate is raised for a power element, the damage of the electronic components or the printed circuit board caused by poor heat radiation is avoided, and the service life of an electric product is raised.

The invention relates to the technical field of power cabinets, in particular to an efficient heat dissipation device of an automatic power cabinet. The efficient heat dissipation device comprises a cabinet body, wherein transverse plates are arranged at the upper part of an inner cavity of the cabinet body; air inlets are uniformly formed in the surfaces of the transverse plates; a first air cylinder is arranged between fixed plates; the upper end of the first air cylinder is connected with a first push plate through the first air cylinder via a first supporting rod; one end, far away from the first supporting rod, of the first push plate is connected with a cover body; heat conduction pieces are arranged on one side, close to a mounting block, of each power cabinet control panel at equalintervals; second through holes are formed in the outer sides of the plurality of heat conduction pieces at equal intervals; inserting holes corresponding to the second through holes are formed in each mounting block; and the fixed plates are arranged on the upper parts of the outer sides of the power cabinet control panels. Compared with the prior art, the efficient heat dissipation device has the advantages of being high in advantages, better in heat dissipation effect and more automatic, so that the service life of equipment is prolonged consequently, the cost is lowered, faults are avoided, and the device is very practical and worthy of later popularization and use.

The invention discloses a polyimide double-sided flexible heat-conducting copper-clad plate as well as a preparation method and an application thereof. The preparation method comprises the following steps: coating sodium cholate modified hexagonal boron nitride nanosheets and a thermoplastic polyimide adhesive on the surfaces of copper foils in a patterning manner, filling and coating a polyimideacid solution containing dihydromyricetin modified hexagonal boron nitride micron sheets to obtain single-sided polyimide copper foils, superposing the two single-sided polyimide copper foils to obtain the copper-clad laminate, and carrying out hot pressing and thermal imidization to obtain the polyimide double-sided flexible heat-conducting copper-clad plate. The polyimide double-sided flexible heat-conducting copper-clad plate prepared by the method has efficient out-of-plane and in-plane heat-conducting passages, and is good in peel strength and heat resistance.