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Manufacturing method for thick copper foil copper-clad plate

A manufacturing method and technology of copper-clad laminates, which are applied in chemical instruments and methods, synthetic resin layered products, lamination devices, etc., can solve the difficulties in making ultra-thick copper-clad copper-clad laminates, poor bonding strength between copper foil and internal materials, and board materials Poor flatness and other problems, to achieve the effect of solving the problem of rapid heat dissipation, good bonding strength, and efficient thermal conductivity

Inactive Publication Date: 2015-09-30
吴俊娟
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for manufacturing thick copper clad laminates for high-current PCBs (copper thickness ≥ 6OZ). Difficulty in making copper plates, poor plate flatness, poor bonding between copper foil and internal materials, and poor thermal conductivity

Method used

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  • Manufacturing method for thick copper foil copper-clad plate
  • Manufacturing method for thick copper foil copper-clad plate
  • Manufacturing method for thick copper foil copper-clad plate

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Embodiment Construction

[0022] The present invention will be further described in detail below through specific embodiments.

[0023] The manufacturing method of thick copper foil copper clad laminate provided by the present invention includes the following steps: preparing glue liquid-gluing-lamination and hot pressing.

[0024] S1: Preparation of glue

[0025] The glue includes the following components (parts by weight):

[0026]

[0027] According to the above ratio, the gelation time of the glue is 266S.

[0028] Among them, low bromine epoxy resin with epoxy equivalent of 420g / eq and Br content of 20% is used as the main resin;

[0029] Propylene glycol phenolic resin with epoxy equivalent of 195g / eq, its main function is to improve the heat resistance of the board and the adhesion of the substrate and the copper foil;

[0030] Phenolic resin with a hydroxyl equivalent of 110g / eq is used as a curing agent; it is recommended not to use latent curing agents, such as dicyandiamide, when making ultra-thick copp...

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Abstract

The invention discloses a manufacturing method for a thick copper foil copper-clad plate. The manufacturing method comprises the following steps: preparing a glue solution, gluing, overlapping and hot-pressing, wherein the glue solution comprises a low brominated epoxy resin / phenolic-cured system, a coupling agent, an imidazole curing catalyst and a nonorganic filler, and butanone is used as a solvent for preparation. Through the adjustment of the conditions of the production process, the problem that a super-thick copper-clad plate is difficult to manufacture is solved, the method is simple and quick, the manufactured super-thick copper-clad plate is better in smoothness, and the bonding force between super-thick copper foil and a substrate is better; besides, a large amount of excellent and efficient heat conducting fillers is added in the formula, so that the formed substrate has efficient heat conduction performance, the heat conduction rate of the formed substrate is larger than 1.6 W / mk, and a large current substrate can dissipate heat well; the manufactured super-thick and high-heat conductivity copper-clad plate has excellent heat resistance, T260 is longer than 30 min, and in addition, the requirement on the PCB lead-free process can also be met.

Description

Technical field [0001] The invention relates to the field of copper clad laminates, in particular to a method for manufacturing thick copper foil copper clad laminates for high-current PCBs. Background technique [0002] At present, improving the heat dissipation capacity of PCB components relies on wide wires, thick copper foils, thin plates or multi-layer structures, large-area copper or core layers with thick copper foil layers, adding metal bottom plates (such as the use of metal-based PCBs), and adding thermal holes And other design solutions; considering the development of electronic products toward thin, light, and miniaturization, and the development of high density, as well as the development of today's PCB manufacturing technology, more attention is paid to the use of thick copper foil to solve problems such as high-power PCB heat dissipation; large Current substrates are generally high-power, high-voltage substrates, which are mostly used in automotive electronics, com...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/04B32B27/18B32B17/02B32B37/12B32B37/10
CPCB32B27/18B32B17/02B32B37/10B32B37/1284B32B2037/1269B32B2260/02B32B2260/046
Inventor 吴俊娟
Owner 吴俊娟
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