High thermal conductivity flexible printed circuit board

A flexible printing and circuit board technology, applied in the direction of circuit substrate materials, printed circuit components, etc., can solve the problems of reducing the power utilization rate of power components and affecting the service life of electronic products, so as to improve service life, avoid poor heat dissipation, The effect of improving the utilization rate of electric energy

Inactive Publication Date: 2014-03-26
SHANGHAI WLCP ELECTRICAL & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In actual use of this type of flexible printed circuit board, due to the heat insulation effect of the substrate and the adhesive, the heat generated by the electronic components in the copper foil layer circuit is not easy to be dissipated, and its thermal conductivity is only 0.3-0.4W / m·k , which reduces the power utilization rate of power components, such as LEDs, which are widely used at present, when using traditional flexible printed circuit boards, 20% of the input power is converted into light, and the remaining 80% is converted into heat energy
At the same time, it is not easy to dissipate heat, which may cause damage to electronic components or printed circuit boards, thereby affecting the service life of electronic products

Method used

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  • High thermal conductivity flexible printed circuit board

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Embodiment Construction

[0008] Such as figure 1 As shown, the high thermal conductivity flexible printed circuit board of the present invention includes a copper foil layer and a bonding layer, and also includes a bearing layer. The copper foil layer and the bearing layer are stacked and arranged through the copper foil layer and the bearing layer. The adhesive layer is bonded together, the adhesive layer is thermally conductive and insulating glue, and the carrying layer is a copper foil substrate or an aluminum foil substrate.

[0009] The structure of this circuit board is simple and easy to manufacture. Compared with traditional flexible printed circuit boards, the insulating layer of this circuit board is made of heat-conducting insulating glue. Embrittlement or cracking, removing polyimide (PI) or polyester plastic (PET) substrates in traditional flexible printed circuit boards, and using thermally conductive insulating adhesives instead of epoxy resins or polyester thermosetting adhesives to b...

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Abstract

The invention discloses a high thermal conductivity flexible printed circuit board which comprises a copper foil layer, an adherence layer and a bearing layer. The copper layer and the bearing layer are bonded together to form a whole body through the adherence layer. The adherence layer is thermal conductivity insulation rubber. The bearing layer is a copper foil substrate or an aluminum foil substrate. According to the circuit board, the highly efficient thermal conductivity performance can be provided, the heat radiation of electronic components on the circuit board is facilitated, especially the electric energy utilization rate is raised for a power element, the damage of the electronic components or the printed circuit board caused by poor heat radiation is avoided, and the service life of an electric product is raised.

Description

technical field [0001] The invention relates to a flexible printed circuit board with high thermal conductivity. Background technique [0002] Printed circuit boards are widely used in various electrical equipment, and are the substrates for electrical connection of various electronic components; ordinary printed circuit boards include an insulating base plate and a copper foil layer covering the surface of the insulating base plate, and traditional printed circuit boards are Unbendable rigid board. With the development of science and technology and the improvement of application requirements, flexible printed circuit boards have emerged as the times require, which are widely used in various electronic products such as mobile phones, notebook computers, PDAs, digital cameras, and liquid crystal displays. The board is mainly composed of five parts, the substrate, commonly used materials are polyimide (PI) or polyester plastic (PET); copper foil, divided into electrolytic cop...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03H05K1/02
Inventor 万海平
Owner SHANGHAI WLCP ELECTRICAL & TECH
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