High thermal conductivity flexible printed circuit board

Abstract

The invention discloses a high thermal conductivity flexible printed circuit board which comprises a copper foil layer, an adherence layer and a bearing layer. The copper layer and the bearing layer are bonded together to form a whole body through the adherence layer. The adherence layer is thermal conductivity insulation rubber. The bearing layer is a copper foil substrate or an aluminum foil substrate. According to the circuit board, the highly efficient thermal conductivity performance can be provided, the heat radiation of electronic components on the circuit board is facilitated, especially the electric energy utilization rate is raised for a power element, the damage of the electronic components or the printed circuit board caused by poor heat radiation is avoided, and the service life of an electric product is raised.

Description

technical field [0001] The invention relates to a flexible printed circuit board with high thermal conductivity. Background technique [0002] Printed circuit boards are widely used in various electrical equipment, and are the substrates for electrical connection of various electronic components; ordinary printed circuit boards include an insulating base plate and a copper foil layer covering the surface of the insulating base plate, and traditional printed circuit boards are Unbendable rigid board. With the development of science and technology and the improvement of application requirements, flexible printed circuit boards have emerged as the times require, which are widely used in various electronic products such as mobile phones, notebook computers, PDAs, digital cameras, and liquid crystal displays. The board is mainly composed of five parts, the substrate, commonly used materials are polyimide (PI) or polyester plastic (PET); copper foil, divided into electrolytic cop...

AI Technical Summary

Problems solved by technology

In actual use of this type of flexible printed circuit board, due to the heat insulation effect of the substrate and the adhesive, the heat generated by the electronic components in the copper foil layer circuit is not easy to be dissipated, and its thermal conductivity is only 0.3-0.4W / m·k , which reduces the power utilization rate of power components, such as LEDs, which are widely used at present, when using traditional flexible printed circuit boards, 20% of the input power is converted into light, and the remaining 80% is converted into heat energy

At the same time, it is not easy to dissipate heat, which may cause damage to electronic components or printed circuit boards, thereby affecting the service life of electronic products

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