Tough and high-elastic composite silicon-carbide-based ceramic circuit board base board material and preparation method thereof

Abstract

The invention discloses a tough and high-elastic composite silicon-carbide-based ceramic circuit board base board material. According to a silicon-carbide-based ceramic base board, micron-grade silicon carbide powder and nano-scale aluminum nitride powder are used in a composited mode, so that the base material can have more efficient thermal conductivity, polyethylene glycol composite solvent containing yttrium sol and nanometer ceramic powder transparent liquid is great in wettability and bonding capability for powder, all materials can be evenly dispersed and cladded, the effects of effective melting enhancement and strength improvement are achieved, the composite ceramic base board high in compactness, elasticity and strength can be obtained at the lower sintering temperature, and the material is good in electric insulating property, high in heat conduction and dissipation efficiency, safe and environment-friendly in production process and great in utilization potentiality.

Description

technical field [0001] The invention relates to the technical field of preparing silicon carbide ceramics, in particular to a tough and high-elastic composite silicon carbide-based ceramic circuit board substrate material and a preparation method thereof. Background technique [0002] As the power and density of electronic components increase, the calorific value per unit volume also increases, and the requirements for the comprehensive performance of circuit substrates are getting higher and higher. Among them, ceramic substrates have good comprehensive performance in terms of insulation, thermal conductivity and Thermal expansion, chemical stability and other aspects are outstanding, and are gradually widely used in substrate materials. Among them, alumina and beryllium oxide are mainly used as substrate materials for a long time. However, alumina ceramic sheets have low thermal conductivity and thermal expansion. The coefficient does not match with Si and other shortcomin...

AI Technical Summary

Problems solved by technology

[0002] As the power and density of electronic components increase, the calorific value per unit volume also increases, and the requirements for the comprehensive performance of circuit substrates are getting higher and higher. Among them, ceramic substrates have good comprehensive performance in terms of insulation, thermal conductivity and Thermal expansion, chemical stability and other aspects are outstanding, and are gradually widely used in substrate materials. Among them, alumina and beryllium oxide are mainly used as substrate materials for a long time. However, alumina ceramic sheets have low thermal conductivity and thermal expansion. The coefficient does not match with Si and other shortcomings. Although the comprehensive performance of beryllium oxide ceramics is relatively good, its production cost is high and toxic. Although the comprehensive performance of aluminum nitride ceramics is relatively good, the production cost is high and the application is also limited. Silicon carbide as a substrate material has obvious advantages in terms of performance

[0003] Although the application prospects of silicon carbide ceramic substrates are broad, in the actual production process, there are problems such as low sintering density, low utilization rate of raw materials, and insulation to be improved, which restrict the large-scale use of such materials. Further improvements in the production process