Making method for super-thick copper foil and high heat-conducting copper clad laminate

Abstract

The invention discloses a making method for a super-thick copper foil and high heat-conducting copper clad laminate. The method includes the steps of: glue solution preparation, gluing, superposition and hot pressing. Specifically, the glue solution comprises: low-bromine epoxy resin/phenolic curing system, a coupling agent, an imidazole curing accelerator and an inorganic filler, and a solvent butanone. By adjusting the production technological conditions, the method provided by the invention solves the difficult making problem of super-thick copper clad laminates, and is simple and convenient. The prepared super-thick copper clad laminate has good flatness, and the bonding force between the super-thick copper foil and a base material is good. At the same time, by adding a lot of excellent and efficient heat-conducting filler to the formula, the molded base plate has efficient heat-conducting property, and the thermal conductivity is greater than 1.6W/mk, thus well solving the rapid heat dissipation problem of heavy current base plates. The prepared super-thick and high heat-conducting copper clad laminate also has excellent heat resistance, with T260 being greater than 30min. Meanwhile, the invention can also meet the demands of a PCB lead-free making process.

Description

technical field [0001] The invention relates to the field of copper-clad laminates, in particular to a method for manufacturing super-thick copper foil for high-current PCBs and high-thermal-conductivity copper-clad laminates. Background technique [0002] At present, improving the heat dissipation capacity of PCB components relies on wide wires, thick copper foil, thin plate or multi-layer structure, large-area copper laying or thick copper foil layer built into the core layer, adding metal bottom plate (such as the use of metal-based PCB), and increasing thermal conduction holes and other design schemes to achieve; considering the trend of electronic products towards thin, light, miniaturization, and high-density development and the development of today's PCB manufacturing technology, more attention is paid to the use of thick copper foil to solve the problems of high-power PCB heat dissipation; large Current substrates are generally high-power, high-voltage substrates, wh...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for making ultra-thick copper foil and high thermal conductivity copper clad laminate (copper thickness ≥ 6OZ) for high-current PCBs. By adjusting the formula, internal material structure, and production process conditions, etc. Difficulty in making thick copper clad laminates, poor flatness of the board, poor bonding strength between copper foil and internal materials, and poor thermal conductivity

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