A ground diffuser module and ground grounding device

Abstract

The present application relates to a ground current dissipation module and a ground grounding device, which include: a flexible conductive layer, which is used to be laid on the ground soil; a pressure plate, which is arranged above the flexible conductive layer and has conductivity, so as to press the flexible conductive layer to the soil layer close to the ground; and a power connection piece, which is arranged on the top surface of the pressure plate and electrically connected to the pressure plate, and is used to connect the equipotential connection line. The flexible conductive layer and the pressure plate both have good conductive effects. When the two are placed on the ground, they are electrically connected to each other and connected to the ground soil at the same time. In addition, the pressure-attached setting of the pressure plate enables the flexible conductive layer to be in close contact with the ground soil, ensuring that there is sufficient contact area between the pressure plate, the flexible conductive layer and the ground soil, thereby effectively improving the power connection effect with the ground soil and having a smaller contact resistance with the ground soil, so as to have a good grounding conductive effect.

Description

Technical Field

[0001] The present application relates to the technical field of electrical equipment grounding, and in particular to a ground current dispersion module and a ground grounding device. Background Art

[0002] Grounding device is also called grounding integrated device: a device that forms an electrical connection between electrical equipment or other objects and the ground. It is used to achieve the purpose of connecting the electrical system to the earth. The metal object that is in direct contact with the earth to achieve electrical connection is the grounding electrode. It can be an artificial grounding electrode or a natural grounding electrode. This grounding electrode can be given a certain electrical function, such as system grounding, protective grounding or signal grounding.

[0003] However, due to the high resistivity of the ground soil in some environments, the resistance between the grounding device and the ground soil is large, resulting in poor conductivity between the two. The grounding effect of electrical equipment will be difficult to guarantee, which will ultimately pose a safety hazard to the electrical equipment and needs further improvement. Summary of the invention

[0004] The embodiments of the present application provide a ground current diffusion module and a ground grounding device to solve the problem in the related art that the ground soil resistance is relatively large, resulting in poor grounding conductivity of the current diffusion module and the grounding device.

[0005] In the first aspect, a ground diffuser module is provided, which adopts the following technical solution:

[0006] A ground diffuser module, comprising:

[0007] A flexible conductive layer, which is used to be laid on the ground soil;

[0008] A pressure plate, which is arranged above the flexible conductive layer and has conductivity, and is used to press the flexible conductive layer against the soil layer on the ground;

[0009] The electrical connection piece is arranged on the top surface of the pressure plate and is electrically connected to the pressure plate and is used to connect the equipotential connection line.

[0010] In some embodiments, the bottom surface of the flexible conductive layer is provided with conductive slurry dispersed in the ground soil.

[0011] In some embodiments, the conductive paste is graphite paste.

[0012] In some embodiments, the electrical connection member includes an impact nail, which passes through the pressure plate and the flexible conductive layer and extends into the ground soil. The top of the impact nail presses against the pressure plate and is electrically connected to the equipotential connecting line and the pressure plate.

[0013] In some embodiments, the flexible conductive layer is a graphite cloth woven from graphite wires.

[0014] In some embodiments, the flexible conductive layer has an area larger than the pressure plate thereon.

[0015] The beneficial effects of the technical solution provided by this application include:

[0016] The embodiment of the present application provides a ground current dissipation module. Since both the flexible conductive layer and the pressure plate have good conductive effects, when the two are placed on the ground, they form an electrical connection with each other and are electrically connected to the ground soil. In addition, the pressure-attached setting of the pressure plate causes the flexible conductive layer to deform while in contact with the ground soil, thereby achieving close contact with the ground soil, effectively increasing the contact area between the two, and further reflecting that the electrical connection effect between the pressure plate, the flexible conductive layer and the ground soil is significantly improved. Therefore, when the local ground current dissipation module is used to perform grounding connection of electrical equipment, there is a small contact resistance between the ground soil, so that it has a better grounding conductive effect.

[0017] In a second aspect, a ground grounding device is provided, which adopts the following technical solution:

[0018] A grounding device, comprising:

[0019] At least one ground diffuser body, comprising a plurality of ground diffuser modules as described in any one of claims 1 to 6, wherein the plurality of ground diffuser modules are dispersedly laid on the ground, and the plurality of ground diffuser modules are connected by a first equipotential connection line.

[0020] In some embodiments, at least one second equipotential connection line connects each of the ground diffusers, and the distance between the ground diffusers is greater than the length of the diagonal of the ground diffuser module.

[0021] In some embodiments, a plurality of the ground diffusion modules are dispersedly arranged on the ground in a linear, radial or grid pattern.

[0022] In some embodiments, a plurality of the ground diffusers are dispersedly arranged on the ground in a linear, radial or grid pattern.

[0023] The beneficial effects of the technical solution provided by this application include:

[0024] The embodiment of the present application provides a ground diffusion module. Since multiple ground diffusion modules are arranged in one ground diffusion body, and multiple ground diffusion modules are dispersedly arranged on the ground soil, a larger contact area is achieved between the ground diffusion body and the ground soil, and the current entry point with good local soil resistivity in the area can be found more quickly. At the same time, since the overall device has multiple ground diffusion bodies, the current can be entered into the ground in a larger range, and the grounding resistance of the ground grounding device can be significantly reduced. Therefore, the grounding conductive effect of the electrical equipment is guaranteed, so that the electrical equipment has sufficient safety protection. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 A structural cross-sectional view of a ground diffuser module provided in an embodiment of the present application;

[0027] Figure 2 A top view of a ground diffuser module provided in an embodiment of the present application;

[0028] Figure 3 A schematic diagram of the layout of the ground diffuser provided in the embodiment of the present application;

[0029] Figure 4 A schematic diagram of the layout of the ground grounding device provided in an embodiment of the present application.

[0030] In the figure:

[0031] 1. Flexible conductive layer;

[0032] 2. Pressure plate;

[0033] 3. impact nail; 30. nail body; 31. nail cap;

[0034] 4. Ground diffuser; 40. Ground diffuser module; 41. First equipotential connection line;

[0035] 5. The second equipotential bonding line. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0037] The embodiments of the present application provide a ground current diffusion module and a ground grounding device, which can solve the problem in the related art that the resistivity of the ground soil is relatively large, resulting in poor grounding conductivity of the current diffusion module and the grounding device.

[0038] Reference Figure 1 In a first aspect, this embodiment provides a ground diffusion module 40, which includes:

[0039] A flexible conductive layer 1, which is used to be laid on the ground soil;

[0040] A pressure plate 2, which is arranged above the flexible conductive layer 1 and has conductivity, and is used to press the flexible conductive layer 1 against the soil on the ground;

[0041] The electrical connection piece is disposed on the top surface of the pressure plate 2 and is electrically connected to the pressure plate 2 and is used to connect an equipotential connection line.

[0042] The flexible conductive layer 1 and the pressure plate 2 are both made of materials with good conductivity, such as some metal materials or graphite materials, so that after being pressed tightly against the ground soil, they have a small contact resistance with the ground soil.

[0043] With such arrangement, since both the flexible conductive layer 1 and the pressure plate 2 have good conductive effects, when the two are placed on the ground, they form an electrical connection with each other and are electrically connected to the ground soil at the same time. In addition, the pressure-attached arrangement of the pressure plate 2 causes the flexible conductive layer 1 to deform while in contact with the ground soil, thereby achieving close contact with the ground soil and effectively increasing the contact area between the two, thereby significantly improving the electrical connection effect between the pressure plate 2, the flexible conductive layer 1 and the ground soil. Therefore, when the local ground scattering module 40 is used to ground the electrical equipment, there is a small contact resistance with the ground soil, resulting in a better grounding conductive effect.

[0044] Optionally, the bottom surface of the flexible conductive layer 1 is provided with conductive slurry (not shown in the figure) dispersed in the ground soil.

[0045] Among them, when the ground soil is large in granularity and has many soil gaps, pouring conductive slurry on the ground soil can reduce the soil gaps in the area while effectively reducing the contact resistance of the ground soil. At the same time, it can also increase the contact area between the ground soil and the flexible conductive layer 1, thereby improving the conductive effect between the two.

[0046] Optionally, the conductive paste is graphite paste.

[0047] Among them, in this embodiment, the conductive paste is preferably graphite paste, and in other embodiments, conductive pastes of other material types can be selected according to environmental requirements, such as conductive paste made of conductive metal powder, mud doped with electrolyte, etc.

[0048] Optionally, refer to Figure 1 The electrical connection piece includes an impact nail 3, which passes through the pressure plate 2 and the flexible conductive layer 1 and extends into the ground soil. The top of the impact nail 3 is pressed against the pressure plate 2 and is electrically connected to the equipotential connecting line and the pressure plate 2.

[0049] The impact nail 3 includes a nail body 30 and a nail cap 31. The nail cap 31 is pressed against and electrically connected to the pressure plate 2. The bottom end of the nail body 30 passes through the pressure plate 2 and the flexible conductive layer 1 and is driven into the ground soil, so that the pressure plate 2 and the flexible conductive layer 1 are pressed against the ground soil, and the flexible conductive layer 1 is adaptively deformed according to the shape of the ground soil, thereby increasing the contact area between the ground scattering module 40 and the ground soil. At the same time, the equipotential bonding wire is connected to the nail cap 31 and electrically connected to the nail cap 31, thereby achieving electrical connection with the pressure plate 2.

[0050] With this arrangement, while achieving electrical connection between the equipotential connection line and the pressure plate 2 through the impact nail 3, the close relationship between the pressure plate 2, the flexible conductive layer 1 and the ground soil is further strengthened, thereby ensuring the electrical connection effect between the ground scattering module 40 and the ground when in use.

[0051] Optionally, the flexible conductive layer 1 is a graphite cloth woven from graphite wires.

[0052] In this embodiment, the flexible conductive layer 1 is preferably a graphite cloth woven from graphite wires. In other embodiments, a conductive plate with a certain deformation ability can be selected, such as a graphite sheet and a conductive metal plate with a thickness within a certain range that can be deformed. A conductive cloth layer woven from conductive wires can also be selected, such as a conductive metal layer woven from conductive metal wires.

[0053] In this way, the good softness and conductivity of the graphite cloth are utilized to make the flexible conductive layer 1 better contact with the ground soil. At the same time, because it is woven from graphite wires, each graphite wire has a certain deformation ability, so that after the graphite cloth is pressed, the deformation ability of the graphite wires inside it is stronger than that of the conductive plate structure, and thus the contact area between the flexible conductive layer 1 and the ground soil will be larger, so as to fully ensure the electrical contact area between the flexible conductive layer 1 and the ground soil, significantly enhance the electrical connection effect between the two, and reduce the contact resistance between the two.

[0054] Optionally, refer to Figure 1 , the flexible conductive layer 1 has an area larger than the pressure plate 2 above it.

[0055] Among them, the shapes of the flexible conductive layer 1 and the pressure plate 2 are square, circular or any polygonal shapes, and the specific selection depends on the environmental requirements, but satisfies that the area of ​​the flexible conductive layer 1 is larger than the pressure plate 2, and the edges of the pressure plate 2 are all inside the edges of the flexible conductive layer 1.

[0056] With this arrangement, the pressure plate 2 that first inputs current can fully and quickly communicate with the flexible conductive layer 1, thereby preventing the current on some pressure plates 2 from being hindered when flowing from the pressure plate 2 to the pressure layer due to the fact that some pressure plates 2 are not in contact with the flexible conductive layer 1, thereby ensuring the grounding and conductive effect of the electrical equipment.

[0057] Second, refer to Figure 3 and Figure 4 , this embodiment provides a ground grounding device, which includes:

[0058] At least one ground diffuser body 4 has a plurality of ground diffuser modules 40 as described above, wherein the plurality of ground diffuser modules 40 are dispersedly laid on the ground and connected by first equipotential connection lines 41 .

[0059] In this arrangement, since multiple ground diffusion modules 40 are arranged in one ground diffusion body 4, and multiple ground diffusion modules 40 are dispersedly arranged on the ground soil, a larger contact area is achieved between the ground diffusion body and the ground soil, and the current entry point with good local soil resistivity in the area can be found more quickly. At the same time, since the overall device has multiple ground diffusion bodies 4, the current can be entered into the ground in a larger range, and the grounding resistance of the ground grounding device can be significantly reduced. Therefore, the grounding conductive effect of the electrical equipment is guaranteed, so that the electrical equipment has sufficient safety protection.

[0060] Optionally, refer to Figure 4The ground grounding device provided in this embodiment also includes at least one second equipotential connecting line 5, which connects each of the ground diffusers 4, and the distance between the ground diffusers 4 is greater than the length of the diagonal of the ground diffuser module 40.

[0061] Among them, in this embodiment, the distance between the ground diffusion bodies 4 is greater than twice the diagonal length of the ground diffusion module 40, so that the ground diffusion modules 40 in each ground diffusion body 4 can be smoothly laid at intervals, and the device is guaranteed to have greater dispersion, thereby fully conducting grounding with the ground soil.

[0062] This arrangement ensures that each ground diffuser module 40 in the overall device has a larger laying range, thereby enabling the ground grounding device to have more current entry points with good local soil resistivity, thereby significantly reducing the grounding resistance of the ground grounding device.

[0063] Optionally, refer to Figure 3 The plurality of ground diffusion modules 40 are dispersedly arranged on the ground in a linear, radial or grid-like manner.

[0064] In this embodiment, the plurality of ground diffuser modules 40 are arranged in a cross-shaped reflective manner with one ground diffuser module 40 as the center, so that the entire device can be laid in a larger range. In other embodiments, the laying can be selected in a manner including but not limited to a linear type, a grid type, etc.

[0065] Optionally, refer to Figure 4 The plurality of ground diffusers 4 are dispersedly arranged on the ground in a linear, radial or grid-like manner.

[0066] In this embodiment, the ground grounding device is specifically a rectangular structure formed by a plurality of ground diffusers 4 arranged at intervals as the center, and the ground diffusers 4 are radially laid at intervals in a cross shape on four sides, so that the overall device can be laid in a larger range. In other embodiments, the plurality of ground diffusers 4 can be laid in a manner including but not limited to a linear type, a grid type, etc.

[0067] This arrangement enables rapid installation of multiple ground diffuser modules 40 according to the actual ground soil topography, ensuring that the overall device can fully reduce the grounding resistance between the ground grounding device and the ground soil after grounding in different ground environments.

[0068] In a third aspect, this embodiment further provides a method for installing a ground grounding device, comprising the following steps:

[0069] 1. Select a concentrated or multiple dispersed ground with relatively small soil resistivity near the grounding equipment for installing ground diffuser 4.

[0070] 2. Further, a concentrated or dispersed piece of ground with relatively small soil resistivity is selected near the ground diffuser 4 for installing the ground diffuser module 40.

[0071] 3. Installation of ground diffuser module 40,

[0072] (1) compacting and leveling the soil below the flexible conductive layer 1, and applying the flexible conductive layer 1 thereon;

[0073] (2) Sprinkling conductive slurry between the flexible conductive layer 1 and the soil;

[0074] (3) Covering the pressure plate 2 on the flexible conductive layer 1;

[0075] (4) driving the impact nail 3 through the pressure plate 2 and the flexible conductive layer 1 and into the soil, and ensuring that the impact nail 3 and the pressure plate 2 have a reliable electrical connection;

[0076] (5) Use the first equipotential connection line 41 to connect each ground diffuser module 40 to the same potential.

[0077] 4. Use the second equipotential connection line 5 to connect each ground bulk body 4 to the same potential.

[0078] The working principles and beneficial effects of the ground diffusion module 40 and the ground grounding device provided in the embodiment of the present application are as follows:

[0079] The flexible conductive layer 1 and the pressure plate 2 both have good conductive effects. When the two are placed on the ground, they are electrically connected to each other and electrically connected to the ground soil. In addition, the pressure plate 2 is pressed and attached so that the flexible conductive layer 1 can be in close contact with the ground soil after adaptive deformation, ensuring that the pressure plate 2, the flexible conductive layer 1 and the ground soil have sufficient contact areas, thereby effectively improving the electrical connection effect with the ground soil. Therefore, when the local ground scattering module 40 is used to ground the electrical equipment, there is a small contact resistance with the ground soil, so that it has a good grounding conductive effect.

[0080] In addition, multiple ground diffusion modules 40 are arranged in one ground diffusion body 4, and multiple ground diffusion modules 40 are dispersedly arranged on the ground soil, so that a larger contact area is achieved between the ground diffusion body and the ground soil, and the current entry point with good local soil resistivity in the area can be found more quickly. At the same time, since the overall device has multiple ground diffusion bodies 4, the current can be entered into the ground in a larger range, and the grounding resistance of the ground grounding device can be significantly reduced. Therefore, the grounding conductive effect of the electrical equipment is guaranteed, so that the electrical equipment has sufficient safety protection.

[0081] In the description of the present application, it should be understood that the positive direction of "X" in the drawings represents the right, and correspondingly, the reverse direction of "X" represents the left; the positive direction of "Y" represents the front, and correspondingly, the reverse direction of "Y" represents the back; the positive direction of "Z" represents the top, and correspondingly, the reverse direction of "Z" represents the bottom. The orientation or position relationship indicated by the terms "X", "Y", "Z", etc. is based on the orientation or position relationship shown in the drawings of the specification, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0082] In the description of the present application, it should be noted that the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0083] It should be noted that, in this application, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0084] The above description is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest range consistent with the principles and novel features applied for herein.

Claims

1. A ground diffuser module (40), characterized in that: It includes: A flexible conductive layer (1) for laying on the ground soil; A pressure plate (2) is arranged above the flexible conductive layer (1) and has conductivity, so as to press the flexible conductive layer (1) against the soil layer on the ground; An electrical connection piece, which is arranged on the top surface of the pressure plate (2) and is electrically connected to the pressure plate (2) and is used to connect an equipotential connection line; The electrical connection member comprises an impact nail (3), the impact nail (3) passes through the pressure plate (2) and the flexible conductive layer (1) and extends into the ground soil, the top end of the impact nail (3) is pressed against the pressure plate (2) and is electrically connected to the equipotential connection line and the pressure plate (2).

2. The ground diffusion module (40) according to claim 1, characterized in that: The bottom surface of the flexible conductive layer (1) is provided with conductive slurry dispersed in the ground soil.

3. The ground diffusion module (40) according to claim 2, characterized in that: The conductive paste is graphite paste.

4. The ground diffusion module (40) according to claim 1, characterized in that: The flexible conductive layer (1) is a graphite cloth woven from graphite wires.

5. The ground diffusion module (40) according to claim 1, characterized in that: The flexible conductive layer (1) has an area larger than the pressure plate (2) above it.

6. A ground grounding device, characterized in that: It includes: At least one ground diffuser (4) has a plurality of ground diffuser modules (40) as described in any one of claims 1 to 5, wherein the plurality of ground diffuser modules (40) are dispersedly laid on the ground, and the plurality of ground diffuser modules (40) are connected via a first equipotential connection line (41).

7. The ground grounding device according to claim 6, characterized in that: Also includes: At least one second equipotential connection line (5) is connected to each of the ground diffusers (4), and the distance between the ground diffusers (4) is greater than the length of the diagonal of the ground diffuser module (40).

8. The ground grounding device according to claim 6, characterized in that: The plurality of ground diffuser modules (40) are dispersedly arranged on the ground along a linear pattern, a radial pattern or a grid pattern.

9. The ground grounding device according to claim 6, characterized in that: A plurality of the ground diffusers (4) are dispersedly arranged on the ground along a straight line, a radial pattern or a grid pattern.

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