Cleaning fluid guiding device of wet cleaning equipment
A technology for wet cleaning and diversion device, which is applied in the directions of cleaning methods, cleaning methods and utensils, chemical instruments and methods using liquids, etc., which can solve the problems of particle contamination of wafers and the difficulty of precise control of auxiliary structures, and reduce parts. The effect of loss, avoiding the risk of particle defects
Pending Publication Date: 2022-03-29
SHANGHAI HUALI INTEGRATED CIRCUTE MFG CO LTD
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Problems solved by technology
However, this method requires the continuous movement of the mechanical arm 140 and its auxiliary structure to change the position of the nozzle 120. The mechanical movement will cause component loss and cause particles to further contaminate the wafer, and the added auxiliary structure is not easy to accurately control.
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[0021] The technical solutions in the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0022] It should be understood that the invention can be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity, and like reference numerals designate like elements throughout. It will be understood ...
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The invention relates to a cleaning fluid guiding device of wet cleaning equipment, and relates to semiconductor integrated circuit manufacturing equipment, a positive voltage end and a negative voltage end are additionally arranged at two ends of a nozzle to apply an electric field to cleaning fluid sprayed out of the nozzle, the electric field guides the cleaning fluid, and an included angle theta is formed between the cleaning fluid and a wafer back. Therefore, the cleaning liquid is not always sprayed from the central position of the wafer back, so that the problem that the central position of the wafer back is thin and the edge position of the wafer back is thick after the wet cleaning process is repeated for multiple times is avoided, and the yield of semiconductor devices is improved.
Description
technical field [0001] The invention relates to semiconductor integrated circuit manufacturing equipment, in particular to a cleaning liquid guide device for wet cleaning equipment. Background technique [0002] In the manufacturing process of semiconductor integrated circuits, the back of the crystal is often contaminated with particles or metal ions. For example, after entering the back-end process, the back of the crystal is often contaminated with metal ions, and the back of the crystal needs to be cleaned to remove it. At present, wet methods are often used Clean to remove contamination. [0003] like figure 1 Shown is a schematic diagram of a device for cleaning a crystal back by a wet cleaning process according to an embodiment of the prior art, as figure 1 As shown, the device includes a wafer 100 supported by a supporting part 110 , and a nozzle 120 sprays a cleaning liquid 130 to clean the wafer back 101 . The cleaning solution 130 , such as a mixture of HF and ...
Claims
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IPC IPC(8): H01L21/67
CPCH01L21/67051H01L21/0209H01L21/02052B08B3/02B08B3/10H01L21/6715
Inventor 周健刚
Owner SHANGHAI HUALI INTEGRATED CIRCUTE MFG CO LTD